KR20170074274A

KR20170074274A - Semiconductor Inspection Device

Info

Publication number: KR20170074274A
Application number: KR1020150182888A
Authority: KR
Inventors: 이지형; 이은주
Original assignee: 주식회사 이노글로벌
Priority date: 2015-12-21
Filing date: 2015-12-21
Publication date: 2017-06-30
Also published as: KR101852864B1

Abstract

A semiconductor inspection device according to an embodiment of the present invention electrically connects a semiconductor to a test circuit substrate located under the semiconductor in order to test whether the semiconductor is good or bad, A body portion provided with a plurality of through holes perforated in a vertical direction; And an elastic connecting member which is respectively seated in the plurality of through holes and which has a first conductive contact member having a crown structure and a second conductive contact member connected to the second conductive contact member in a double spiral structure, And a plurality of conductive connecting portions electrically connecting the inspection circuit board to the inspection circuit board, wherein the plurality of through holes include a plurality of first terminals provided on the lower surface of the semiconductor, and a plurality of second terminals provided on the inspection circuit substrate at positions corresponding to the plurality of second terminals And the first conductive contact member and the second conductive contact member are electrically connected to the first terminal and the second terminal while moving up and down the through hole in the elastic movement of the conductive connection portion.

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor inspection device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device, and more particularly, to a semiconductor inspection device capable of inspecting a very small semiconductor.

Semiconductors are becoming more and more miniaturized due to the recent advancement of technology and popularization of mobile devices. Specifically, the average size of semiconductors was basically 8 × 8 m 2 or 7 × 7 m 2 only a few years ago, but recently, the size has been reduced to about 2 × 2 m 2 to 4 × 4 m 2. As the size of the semiconductor becomes smaller, the size of the semiconductor inspection device for testing the goodness or the badness of the semiconductor is getting smaller.

Semiconductors are subjected to a test to judge the performance of the electrical performance after the manufacturing process. A semiconductor inspection test is performed in a state where a semiconductor test socket formed so as to be in electrical contact with a terminal of a semiconductor is inserted between a semiconductor and an inspection circuit board. Semiconductor test sockets are used in the burn-in test process of the semiconductor manufacturing process as well as the final semiconductor test.

As the technology for integrating semiconductor devices has been developed and the size of semiconductor elements has become smaller, the size and spacing of the terminals of the semiconductor elements, that is, the solder balls, have been miniaturized, and accordingly, the method for miniaturizing the interval between the conductive patterns of the semiconductor inspection socket Is required.

A semiconductor inspection socket using a conventional Pogo-pin is provided with a conductive spring on the outside of the pogo pin in order to prevent breakage of the pogo pin and semiconductor when the semiconductor is put on the socket, Insertion method has been mainly used.

However, in the conventional pogo pin type, a hole is formed in a socket for a semiconductor inspection and a pogo pin having a spring is inserted into a hole formed in the housing. However, the interval between the solder balls is narrowed in units of micrometers, The size of the pogo pin and the spring must be reduced to several tens to several hundreds of micrometers in order to prevent an electrical short circuit caused by the interval of the solder balls. Therefore, there is a limitation in manufacturing a semiconductor inspection socket for testing integrated semiconductor devices there was.

In order to conform to the integration of such semiconductor devices, a semiconductor device for PCR (Pressure Conductive Ro semiconductor inspecting device er) type in which a conductive powder having conductivity is vertically arranged in a silicon body of an elastic material to form a plurality of conductive patterns Sockets have been proposed.

The PCR type semiconductor inspecting socket utilizes the characteristic that the conductive powder is conductive by pressure when the conductive powder is pressed by the solder ball of the semiconductor and has an advantage that it can be easily applied to the solder ball interval of the integrated semiconductor element, If the thickness is increased, the pressure caused by the semiconductor is not transmitted to the inside and the conductivity is not generated. Therefore, the PCR type can not be applied to the socket for semiconductor inspection having a certain thickness or more.

Also, as the PCR type semiconductor inspection socket is repeatedly tested, damage or breakage of the conductive powder is caused, and the semiconductor inspection socket in which the damage is caused has a loss of conductivity and its life is relatively short There was a problem of losing.

Therefore, there is a need for a semiconductor inspection socket that can be applied regardless of the length of the semiconductor inspection socket in the vertical direction, and can easily cope with integrated semiconductor devices.

Korean Patent Laid-Open No. 10-2009-0030190 discloses a socket for inspecting a semiconductor chip.

An object of the present invention is to provide a semiconductor inspection device capable of inspecting a very small semiconductor.

In addition, the present invention has an elastic function through a simple structure in which a pair of conductive contact members spaced apart from each other by a double helix structure are mutually connected to each other by a repetitive use of a pair of conductive contact members And it is an object of the present invention to provide a semiconductor inspection device capable of preventing the loss of conductivity.

In one embodiment of the present invention, a semiconductor inspection device for electrically connecting a semiconductor to a test circuit substrate located under the semiconductor, for testing whether the semiconductor is good or bad, is positioned between the semiconductor and the test circuit substrate A body portion provided with a plurality of through holes perforated in a vertical direction; And an elastic connecting member which is respectively seated in the plurality of through holes and which is connected to the first conductive contact member and the second conductive contact member by a double spiral structure or a multiple spiral structure, And a plurality of conductive connecting portions for electrically connecting the semiconductor and the inspection circuit board while moving, wherein the plurality of through holes include a plurality of first terminals provided on the lower surface of the semiconductor, and a plurality of second terminals provided on the upper surface of the inspection circuit board, And the first conductive contact member and the second conductive contact member are electrically connected to the first terminal and the second terminal while moving up and down the through hole in the elastic movement of the conductive connection portion.

In one embodiment of the present invention, the first conductive contact member is formed in a crown structure with a plurality of first tips having sharp projections at the top, and the second conductive contact member has a plurality of second tips Wherein the elastic connecting member is configured such that adjacent ones of the plurality of wires are connected in a double helical structure or a multiple helical structure so that the semiconductor is contracted when pressing the first conductive contact member, It is preferable to prevent the first conductive contact member and the second conductive contact member from being pressed by the pressing of the semiconductor by elastically moving back to the original position when being separated from the conductive contact member.

In one embodiment of the present invention, the plurality of wires include: a first wire having a lower end connected to the second conductive contact member at the A position and an upper end connected to the first conductive contact member at the B 'position; A second wire connected at the bottom position to the second conductive contact member, and having an upper end connected to the first conductive contact member at the C 'position; A third wire connected to the second conductive contact member at the C position and connected to the first conductive contact member at the D 'position, the lower end being connected to the second conductive contact member; And a fourth wire having a lower end connected to the second conductive contact member at the D position and an upper end connected to the first conductive contact member at the A 'position, wherein the A position is at the A' position, the B position is at the B ' The A position, the B position, the C position, and the D position are positioned clockwise or counterclockwise sequentially along the circumferential direction of the second conductive contact member And the first to fourth wires connect the first conductive contact member and the second conductive contact member in a multi-spiral structure.

In one embodiment of the present invention, the main body is made of an insulating engineering plastic material, and the elastic connecting member is preferably made of a conductive metal.

The present invention has an elastic function through a simple structure in which a pair of conductive contact members spaced apart from each other by a double helix structure are mutually connected to each other. By the repetitive use of a pair of conductive contact members by semiconductor double- Loss can be prevented.

The present invention provides an elastic force to the conductive connection portion and is electrically short-circuited or opened according to the pressing or depressurizing action of the conductive connection portion, so that a process for separate electrical conduction is not required, so that the present invention can be easily applied to a semiconductor inspection of a fine process.

Therefore, even if the semiconductor is repeatedly tested in a short cycle, the conductive connection part can be brought into contact with the semiconductor and the inspection circuit board while elastically moving, thereby preventing the electrical short circuit.

1 schematically shows an installation state of aa according to an embodiment of the present invention.
2 schematically shows an operational state diagram of aa according to an embodiment of the present invention.
3 schematically shows a perspective view of a semiconductor inspection device according to an embodiment of the present invention.
4 schematically shows the connection structure of the elastic connecting member.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, a semiconductor inspection device 100 according to an exemplary embodiment of the present invention includes a body 110 and a plurality of conductive connection portions 120. The semiconductor inspection device 100 according to an embodiment of the present invention is provided with a test circuit substrate 20 positioned below the semiconductor 10 and a test circuit substrate 20 placed under the semiconductor 10 to test whether the semiconductor 10 is good or bad. For example.

Here, as shown in FIGS. 1 and 2, the semiconductor 10 to be inspected is provided with a plurality of first terminals 11 on the lower surface of the semiconductor 10. Here, it is preferable that the plurality of first terminals 11 are arranged so as to be spaced apart from each other at a uniform interval. The first terminal 11 of the semiconductor 10 is provided in the form of a ball or a lead. The semiconductor 10 is electrically connected to the inspection circuit board 20 by the semiconductor inspection device 100.

1 and 2, a plurality of second terminals 22 are provided on the upper surface of the inspection circuit board 20. As shown in Fig. Here, the first terminal 11 and the second terminal 22, which correspond to each other, are electrically connected to each other by the semiconductor inspection device 100 according to the present invention, ) Can be carried out.

The main body 110 is positioned on the upper side of the inspection circuit board 20. A housing 30, which covers the main body 110, is positioned on the inspection circuit board 20. The housing 30 is provided with a housing opening 31 at an upper portion thereof. The housing opening 31 is a space through which the semiconductor 10 flows. Here, the housing 30 is for uniformly positioning the main body 110 and the semiconductor 10.

When the semiconductor inspection device 100 according to the present invention is fixed to the inspection circuit board 20 through the housing 30, the plurality of conductive connection portions 120 constituting the semiconductor inspection device 100 are electrically connected to the inspection circuit board 20, The second terminal 22 of the connector 20 is in electrical contact with the second terminal 22.

As described above, the body portion 110 is positioned between the semiconductor 10 and the inspection circuit board 20. The main body 110 is made of an insulating material. Specifically, the main body 110 may be made of an insulating engineering plastic material. Also, the main body 110 is formed to have a small elasticity, for example, a rigid material.

The main body 110 is provided with a plurality of through holes 111 bored in the vertical direction. Here, the through hole 111 is a space in which the conductive connection part 120 is seated. As described in the background of the invention, the semiconductor 10 may have an area of 2 x 2 m 2 to 4 x 4 m 2. The semiconductor 10 may have a plurality of first terminals 11 ) May have a diameter of several micro to several millimeters.

The plurality of through holes 111 are provided at positions corresponding to the plurality of first terminals 11 provided on the lower surface of the semiconductor 10 and the plurality of second terminals 22 provided on the upper surface of the inspection circuit board 20 do. The through hole 111 is coaxially positioned with respect to the first terminal 11 and the second terminal 22.

1 to 3, the conductive connection part 120 includes a first conductive contact member 121, a second conductive contact member 122, and an elastic connection member 123. [ The conductive connecting portion 120 is located in the through hole 111 so as to be movable up and down.

The first conductive contact member 121 is positioned in the through hole 111 toward the first terminal 11 of the semiconductor 10. [ The first conductive contact member 121 has a crown structure with a plurality of first tips 121a having sharp ends protruding. Here, the plurality of first tips 121a are portions that contact the first terminals 11.

The second conductive contact member 122 is positioned in the through hole 111 toward the second terminal 22 of the inspection circuit board 20. [ The second conductive contact member 122 is formed in a crown structure with a plurality of second hooks 122a whose lower ends are pointedly protruded. The plurality of second tips 122a is a portion in contact with the second terminal 22.

The elastic connecting member 123 connects the first conductive contact member 121 and the second conductive contact member 122 in a double spiral structure or a multiple spiral structure. The elastic connecting member 123 electrically connects the semiconductor 10 and the inspection circuit board 20 while elastically moving the semiconductor 10 while pressing the main body 110. The elastic connecting member 123 is retracted when the semiconductor 10 presses the first conductive contact member 121 and is returned to its original position when the semiconductor 10 is positioned apart from the first conductive contact member 121 Elastic movement.

Therefore, the semiconductor inspection device 100 is capable of performing the repetitive monofilament test of the semiconductor 10 by the elastic connecting member 123, unlike the conductive powder in the PCR method, by the first conductive contact member 121 and the second It is possible to prevent the conductive contact member 122 from being pressed into the through hole 111 by the pressing of the semiconductor 10. [

3 and 4, the elastic connecting member 123 is made of a plurality of wires.

If two wires are used, the plurality of wires connect the first conductive contact member 121 and the second conductive contact member 122 in a double spiral structure. Alternatively, when two or more wires are used, the plurality of wires may have a first helical contact member 121 and a second electrically conductive contact member 122 in a double spiral structure, as shown in FIGS. 3 and 4, Connect.

In this embodiment, for convenience of explanation, the first wire 123a, the second wire 123b, the third wire 123c and the fourth wire 123d are divided into a plurality of wires, It is needless to say that the number of the wires disclosed in the present specification is not particularly limited and that the number of wires can be changed within a range obvious to a person skilled in the art.

In the present embodiment, the mounting positions of the first wire 123a to the fourth nanowire are separately described as follows for convenience of explanation. A 'position, B' position, C 'position and D' position are positions sequentially arranged clockwise or counterclockwise along the circumferential direction of the first conductive contact member 121. The A position, the B position, the C position, and the D position are positions sequentially disposed clockwise or counterclockwise along the circumferential direction of the second conductive contact member 122. Here, the A position, the B position, the C position, and the D position are located apart from each other at a predetermined interval.

The first wire 123a has a lower end connected to the second conductive contact member 122 at the A position and an upper end spirally connected to the first conductive contact member 121 at the B ' The first wire 123a is disposed between the fourth wire 123d and the second wire 123b.

The lower end of the second wire 123b is connected to the second conductive contact member 122 at the position B and the upper end is helically connected to the first conductive contact member 121 at the position C '. Here, the second wire 123b is positioned adjacent to the first wire 123a, specifically, between the first wire 123a and the third wire 123c.

The lower end of the third wire 123c is connected to the second conductive contact member 122 at the position C and the upper end is helically connected to the first conductive contact member 121 at the position D '. Here, the third wire 123c is positioned adjacent to the second wire 123b.

The lower end of the fourth wire 123d is connected to the second conductive contact member 122 at the D position and the upper end is helically connected to the first conductive contact member 121 at the A 'position. The fourth wire 123d is positioned between the third wire 123c and the first wire 123a.

The first wire 123a to the fourth wire 123d connect the first conductive contact member 121 and the second conductive contact member 122 in a multi-spiral structure by the above-described connection structure. As shown in FIG. 4 (b), when the first wire 123a to the fourth wire 123d form a multi-spiral structure, the A 'position is coaxial with the A position and the B' position is B Position, the C 'position is coaxial with the C position, and the D' position is coaxial with the D position.

Hereinafter, a method of manufacturing the conductive connecting part 120 according to an embodiment of the present invention will be described with reference to FIGS. 3 and 4. FIG.

A first conductive contact member 121 and a second conductive contact member 122 having the same structure are provided. The first conductive contact member 121 and the second conductive contact member 122 are spaced apart from each other by a predetermined distance and the plurality of first contact bars 121a of the first conductive contact member 121 are located at the upper And the plurality of second tips 122a of the second conductive contact member 122 are positioned toward the lower side.

Thereafter, the first conductive contact member 121 and the second conductive contact member 123 are separated by the elastic connecting member 123 composed of the first wire 123a, the second wire 123b, the third wire 123c and the fourth wire 123d. The conductive contact member 122 is connected. In the present embodiment, four wires have been described as an example for convenience of explanation, but it is needless to say that the present invention is not limited thereto.

The first wire 123a at the A position, the second wire 123b at the B position, the third wire 123c at the C position, and the fourth wire 123d at the C position, as shown in Fig. 4 (a) Connects the first conductive contact member 121 and the second conductive contact member 122 at the D position. The first wire 123a to the fourth wire 123d are spaced apart from each other by a predetermined distance in the clockwise direction along the circumferential direction of the first conductive contact member 121 and the second conductive contact member 122. [ The first wire 123a to the fourth wire 123d are arranged side by side.

The conductive connecting portion 120 is configured such that the first conductive contact member 121 is rotated clockwise in a state in which the second conductive contact member 122 is fixed at a predetermined position in the state shown in Figures 3A and 4A, And the first wire 123a to the fourth wire 123d are twisted as shown in Figs. 3 (b) and 4 (b). At this time, the upper end of the first wire 123a is moved from the existing A position to the B position, the upper end of the second wire 123b is moved from the existing B position to the C position, and the upper end of the third wire 123c Is moved from the C position to the D position, and the upper end of the fourth wire 123d is moved from the D position to the A position.

Here, for convenience of explanation, the position where the upper end of the first wire 123a is moved to the position B ', the position where the upper end of the second wire 123b is moved to the position C' The position where the upper end of the fourth wire 123c is moved is referred to as the D 'position and the position where the upper end of the fourth wire 123d is moved is referred to as the A' position.

The conductive connection part 120 according to an embodiment of the present invention includes the first conductive contact member 121 and the second conductive contact member 122 in a state where the first conductive contact member 121 and the second conductive contact member 122 are connected by a plurality of wires, The plurality of wires are connected to each other in a double-spiral structure by a simple operation of biting clockwise or counterclockwise, so that elasticity can be given to a plurality of wires. The present invention can impart an elastic function to the conductive connecting portion 120 without using a conventional elastic spring.

When the conductive connection part 120 is manufactured by the above process, the conductive connection part 120 is inserted into the through hole 111 of the body part 110. When the conductive connection part 120 is inserted into the plurality of through holes 111 provided in the main body part 110, the main body part 110 is placed on the upper surface of the inspection circuit board 20.

At this time, the main body 110 is positioned so that the second conductive contact member 122 of the conductive connection portion 120 is in contact with the second terminal 22, as shown in an enlarged view A of FIG. The main body 110 is prevented from being detached from the inspection circuit board 20 by using the housing 30 after the position of the main body 110 is limited on the inspection circuit board 20. [

When the position of the main body 110 is limited by the housing 30, as shown in Figs. 1 and 2, the semiconductor 10 to be inspected is inserted into the housing opening 31 in the F1 direction. At this time, the semiconductor 10 inserted into the housing opening 31 is placed on the top of the main body 110 as shown in FIG.

In this state, as shown in the enlarged view B of FIG. 2, the semiconductor 10 is positioned so that the first terminal 11 is in contact with the first conductive contact member 121 of the conductive connection portion 120.

When the semiconductor 10, the semiconductor inspection device 100 and the inspection circuit board 20 are positioned so as to be connected to each other by the above process, a current is applied to the inspection circuit board 20, Flows into the terminal 22, the second conductive contact member 122, the elastic connecting member 123, the first conductive contact member 121 and the first terminal 11. [

Accordingly, the semiconductor inspection device 100 according to the present invention is a process of electrically connecting the inspection circuit board 20 and the semiconductor 10 to test whether the semiconductor 10 test equipment is good or bad of the semiconductor 10 Lt; / RTI >

The present invention can prevent a test error due to an electrical short circuit due to the pressing of the conductive powder when the semiconductor wafer 10 is repetitively tested using the PCR method described in the background of the invention .

The present invention is also applicable to a case where a plurality of wires that are members that connect the first conductive contact member 121 and the second conductive contact member 122 are used without using a component such as an elastic spring, A connecting member for connecting the first conductive contact member 121 and the second conductive contact member 122 used in manufacturing an existing pogo pin, a fixing member for preventing release of the elastic spring, and the like It is possible to realize the miniaturization of the device 100 for semiconductor inspection according to the miniaturization of the semiconductor 10.

The first conductive contact member 121 and the second conductive contact member 122 have a crown structure so that the first terminal 11 of the semiconductor 10, The contact frequency of the conductive connection portion 120 to the first terminal 11 and the second terminal 22 can be improved when the second terminals 22 of the first terminals 11 and 20 are connected to each other. At this time, the portion where the conductive connection portion 120 contacts the first terminal 11 is a plurality of first tips 121a as shown in an enlarged view B in Fig. 2, and a portion contacting the second terminal 22 Is a plurality of second tips 122a.

Although several embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various modifications may be made without departing from the principles and spirit of the invention . The scope of the invention will be determined by the appended claims and their equivalents.

100: semiconductor inspection device 110:
111: Through hole 120: Conductive connection
121: first conductive contact member 122: second conductive contact member
123: elastic connecting member 123a: first wire
123b: second wire 123c: third wire
123d: fourth wire

Claims

A semiconductor inspection device for electrically connecting a semiconductor substrate to a test circuit substrate positioned under the semiconductor to test whether the semiconductor is good or defective,
A main body portion positioned between the semiconductor and the inspection circuit board and having a plurality of through holes bored in a vertical direction; And
Wherein the first conductive contact member and the second conductive contact member are respectively disposed in the plurality of through holes and have a crown structure and an elastic connecting member connected to the second conductive contact member in a double spiral structure or a multiple spiral structure, And a plurality of conductive connecting portions for electrically connecting the semiconductor and the inspection circuit board while elastically moving the semiconductor,
Wherein the plurality of through holes are provided at a position corresponding to a plurality of second terminals provided on an upper surface of the inspection circuit board,
Wherein the first conductive contact member and the second conductive contact member are electrically connected to the first terminal and the second terminal while moving up and down the through hole at the time of elastic movement of the conductive connection portion.

The method according to claim 1,
Wherein the first conductive contact member is formed with a plurality of first tips whose tops are pointedly protruded into the crown structure,
Wherein the second conductive contact member has a plurality of second tips whose lower ends protrude in a pointed manner with the crown structure,
Wherein the elastic connecting member is configured such that adjacently located wires among a plurality of wires are connected by the double helical structure or the multiple helical structure so that the semiconductor is contracted when pressing the first conductive contact member, Wherein the first conductive contact member and the second conductive contact member are prevented from being pressed by the pressing of the semiconductor when the semiconductor contact member is separated from the conductive contact member, .

3. The method according to claim 2,
A first wire connected to the second conductive contact member at a lower position and connected to the first conductive contact member at an upper end at a position B ';
A second wire connected to the second conductive contact member at the bottom position B and connected to the first conductive contact member at the top end position C ';
A third wire having a lower end connected to the second conductive contact member at the C position and an upper end connected to the first conductive contact member at the D 'position; And
And a fourth wire connected to the second conductive contact member at the lower end in the D position and connected to the first conductive contact member at the upper end in the A 'position,
Wherein the A position is located at the A 'position, the B position is at the B' position, the C position is at the C 'position, the D position is coaxial with the D'
Wherein the A position, the B position, the C position, and the D position are sequentially spaced apart in a clockwise or counterclockwise direction along the circumferential direction of the second conductive contact member, Wherein the first conductive contact member and the second conductive contact member connect the first conductive contact member and the second conductive contact member in the multi-spiral structure.

3. The method of claim 2,
The body portion is made of an insulating engineering plastic material,
Wherein the elastic connecting member is made of a conductive metal material.