JP2016025266A - Mounting device and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve production efficiency of a mounting device that collects a component and places it on a circuit board.SOLUTION: A mounting device 11 comprises a collection part 21 for performing mounting processing of collecting a component and placing it on a circuit board 70, a mark camera 34 arranged on the collection part 21 for photographing a reference mark of the circuit board 70, and a control device 60 for controlling the mark camera 34 and the collection part 21 to place the component on the circuit board 70 and photograph the reference mark in an area where the component is not placed. The control device 60 may be the one that causes the mark camera 34 to photograph one or more reference marks before placing the component, and then causes the collection part 21 to place the component on a position based on the reference mark in the photographed image and causes the mark camera 34 to photograph the reference mark in the area where the component is not placed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mounting apparatus and a mounting method.

  Conventionally, as a mounting device, the range of camera fields of a plurality of substrate recognition cameras based on the position of each reference mark, the distance between the cameras between the plurality of substrate recognition cameras, and the width of the camera field of each substrate recognition camera It is determined whether or not a plurality of fiducial marks can be accommodated at the same time, and if a plurality of fiducial marks are simultaneously within the camera field of view of the plurality of substrate recognition cameras, a plurality of substrate recognition cameras can be used. There has been proposed one that photographs a plurality of fiducial marks simultaneously (see, for example, Patent Document 1). In this apparatus, each reference mark is recognized based on the obtained image data, and an electronic component is mounted on the substrate on the base by the suction head according to the recognized information. The tact time can be shortened.

JP 2009-170516 A

  However, in the apparatus of Patent Document 1 described above, the tact time is shortened by photographing a plurality of reference marks at the same time. Also, in the mounting device, after moving the camera over the reference mark and shooting it, the nozzle is moved to the position where the part is picked up, the part is picked up, and then the part is placed near the reference mark. In some cases, the process was repeated. In such a case, the mounting process takes longer, and further reduction in production time has been desired.

  This invention is made | formed in view of such a subject, and it aims at providing the mounting apparatus and mounting method which can raise production efficiency more.

  The present invention adopts the following means in order to achieve the main object described above.

The mounting apparatus of the present invention is
A sampling unit that performs mounting processing to collect components and place them on the board;
An imaging unit that is disposed in the sampling unit and images the reference mark of the substrate on which the reference mark is arranged;
A control unit that controls the imaging unit and the sampling unit so that the component is placed on the substrate and the reference mark is imaged in a region where the component is not placed;
It is equipped with.

  In this apparatus, a mounting process for placing a component on a substrate and a process for imaging a reference mark in an area where no component is placed are performed in parallel. For this reason, the movement of an imaging part etc. can be reduced more compared with the case where a mounting process and an imaging process are performed separately, for example. Therefore, production efficiency can be further increased. Here, the “region where the component is not placed” refers to a region different from the region where the component is to be placed on the substrate.

  In the mounting apparatus according to the aspect of the invention, the control unit causes the imaging unit to capture one or more reference marks before placing the component, and then causes the sampling unit to take a position based on the reference mark of the captured image. The component is placed and the reference mark in an area where the component is not placed is imaged by the imaging unit, and then the component is placed by the sampling unit at a position based on the reference mark of the captured image. At the same time, the reference mark in the area where the component is not placed may be imaged by the imaging unit. In this way, it is possible to further increase production efficiency while using the captured image for subsequent component placement.

  In the mounting apparatus of the present invention, the imaging unit is disposed in the sampling unit so as to be movable with respect to the sampling unit, and the control unit is configured to determine the position of the component sampled in the sampling unit and the imaging unit. The image pickup unit may be moved so that the position of the image pickup unit is aligned in a predetermined arrangement direction. In this way, the position where the component is collected and the imaging position are arranged in a predetermined direction, so that it is easy to image the reference mark and place the component. In the mounting apparatus of the present invention, the imaging unit is disposed in the sampling unit so as to be movable with respect to the sampling unit, and the control unit moves the sampling unit to a placement position of the component. Then, it is good also as what moves the said imaging part so that the reference mark of the area | region in which the said components are not mounted in the imaging range at that time. By doing so, it is possible to more reliably perform the imaging of the reference mark and the placement of the components in parallel. Alternatively, in the mounting apparatus of the present invention, the imaging unit may be fixed at a predetermined position with respect to a sampling member that collects a component by the sampling unit. In this way, the configuration can be further simplified.

  In the mounting apparatus of the present invention, the substrate may be a block substrate on which the reference mark is formed for each component mounting position. By doing so, it is possible to further increase the production efficiency of the block substrate in which many reference marks are formed on the substrate.

The mounting method of the present invention is:
By a mounting apparatus comprising: a sampling unit that performs a mounting process of sampling a component and placing the component on a substrate; and an imaging unit that images the reference mark of the substrate that is arranged in the sampling unit and has a reference mark arranged thereon An implementation method,
Controlling the imaging unit and the sampling unit to place the component on the substrate and image the reference mark in a region where the component is not placed;
Is included.

  In this mounting method, the mounting process for placing the component on the substrate and the process for imaging the reference mark in the area where the component is not placed are performed in parallel, as in the mounting apparatus described above. Movement and the like can be further reduced. Therefore, production efficiency can be further increased. In this mounting method, various aspects of the mounting apparatus described above may be adopted, and a configuration that realizes each function of the mounting apparatus described above may be added.

1 is a schematic explanatory diagram of a mounting system 10. FIG. Explanatory drawing of the mounting head 24 with which the nozzle holding body 42A was mounted | worn. Explanatory drawing of the mounting head 24 with which the nozzle holding body 42B was mounted | worn. An explanatory view showing an example of substrate 70. FIG. The flowchart which shows an example of a mounting process routine. Explanatory drawing of imaging of the reference mark 72 on the board | substrate 70, and mounting of the components P. FIG. Explanatory drawing of imaging of the reference mark 72 on the board | substrate 70, and mounting of the components P. FIG. Explanatory drawing of imaging of the reference mark 72 on the board | substrate 70, and mounting of the components P. FIG.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. 2A and 2B are explanatory diagrams of the mounting head 24 to which the nozzle holding body 42A is mounted. FIG. 2A is a diagram of the lower surface side of the mounting head 24, and FIG. 2B is a diagram of the side surface side. 3A and 3B are explanatory views of the mounting head 24 to which the nozzle holding body 42B is mounted. FIG. 3A is a diagram of the lower surface side of the mounting head 24, and FIG. 3B is a diagram of the side surface side. FIG. 4 is an explanatory diagram illustrating an example of the substrate 70. The mounting system 10 according to the present embodiment includes a mounting apparatus 11 that mounts a component P on a board 70, and a mounting management computer 80 that manages and sets information related to the mounting process. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. In addition, the mounting process includes a process of placing, placing, mounting, inserting, joining, and bonding components on a substrate.

  As shown in FIG. 1, the mounting apparatus 11 includes a transport unit 18 that transports a substrate, a sampling unit 21 that performs a mounting process of sampling components and placing them on the substrate 70, and a substrate 70 disposed in the sampling unit 21. And a control device 60 for controlling the entire apparatus such as the collection unit 21 and the mark camera 34. The transport unit 18 includes support plates 20 and 20 that are provided at intervals in the front and rear direction in FIG. 1 and extend in the left-right direction, and conveyor belts 22 and 22 that are provided on the surfaces of the support plates 20 and 20 that face each other. ing. The conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. A substrate 70 including a plurality of substrates is placed on the upper surfaces of the pair of conveyor belts 22 and 22 and conveyed from left to right. The substrate 70 is supported from the back side thereof by a large number of support pins 23 erected.

  The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the mounting apparatus 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26 and 30 is driven by a drive motor (not shown).

  The mounting head 24 includes a nozzle 40 that picks up and collects the component P, and a nozzle holder 42 that can be attached and detached with one or more nozzles 40. For example, the mounting head 24 can be attached to and detached from three types of nozzle holders 42A to 42C. The nozzle holders 42A to 42C are collectively referred to as the nozzle holder 42. As shown in FIG. 2, the nozzle holding body 42 </ b> A includes twelve nozzle holders and can be equipped with twelve nozzles 40. The nozzle holder 42A is held by the mounting head 24 in a state where it can rotate intermittently, and the nozzle 40 is moved to the X axis at one position (the position of the nozzle 40a) located on the tip side of the mounting head 24 in the Y axis direction. And it goes up and down in the Z-axis direction (vertical direction) orthogonal to the Y-axis direction. As shown in FIG. 3, the nozzle holder 42 </ b> B includes four nozzle holders, and can be equipped with four nozzles 40. The nozzle holder 42B itself does not rotate, and each nozzle 40 is mounted so as to be movable up and down in the Z-axis direction at that position. The nozzle holder 42C can be mounted with one nozzle 40, and the nozzle 40 is mounted so as to be movable up and down in the Z-axis direction. The nozzle 40 uses pressure to adsorb the component P at the nozzle tip or release the component P adsorbed at the nozzle tip. The nozzle 40 is moved up and down in the Z-axis direction by a holder lifting device using a Z-axis motor 45 as a drive source. The collecting member that collects the component P is described as the nozzle 40 here, but is not particularly limited as long as the component P can be collected, and may be a mechanical chuck that clamps and collects the component P.

  Further, the mounting head 24 is provided with a mark camera 34 for photographing the substrate from above. The mark camera 34 is a camera that reads a reference mark 72 (see FIG. 4) attached to the substrate 70 indicating a reference position of the substrate 70, a reference position on which the component P is placed, and the like. The mark camera 34 moves in the XY direction as the mounting head 24 moves. 2 and 3, the mark camera 34 is fixed to an arm-shaped moving member 35 disposed on the mounting head 24 so as to be movable in the XY direction with respect to the mounting head 24. In the mark camera 34, a predetermined position at the center of the Y axis of the mounting head 24 is set as an initial position (see a solid line in FIG. 3A). The moving member 35 is moved in the XY direction with respect to the mounting head 24 by a moving motor 36 disposed on the mounting head 24. The position of the mark camera 34 is managed by a position sensor (not shown).

  The reel unit 56 includes a plurality of reels 57 around which a tape on which a component P is stored is wound, and is detachably attached to the front side of the mounting apparatus 11. This tape is unwound from the reel 57 and sent out by the feeder unit 58 to a collection position where the tape is collected by the mounting head 24. The parts camera 54 is disposed in front of the support plate 20 on the front side of the transport unit 18. The imaging range of the parts camera 54 is above the parts camera 54. When the nozzle 40 that sucks the part P passes above the part camera 54, the parts camera 54 captures the state of the part P sucked by the nozzle 40 and outputs the image to the control device 60. The nozzle stocker 55 is a box that stocks a plurality of types of nozzles 40 suitable for the type of component P. The nozzle 40 is detachably attached to the nozzle holder 42 of the mounting head 24.

  As shown in FIG. 1, the control device 60 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62 for storing processing programs, an HDD 63 for storing various data, a RAM 64 used as a work area, an external device and an electric device. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66. The control device 60 is connected to the transport unit 18, the sampling unit 21, the mark camera 34, the parts camera 54, the reel unit 56, and the like so as to be capable of bidirectional communication, and receives image signals from the mark camera 34 and the parts camera 54. To do. Each slider 26 and 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motor of each slider 26 and 30 while inputting position information from these position sensors.

  As shown in FIG. 4, a plurality of placement parts 71 on which the component P is placed are formed on the substrate 70 that is a production object, and a reference mark 72 that indicates the position of the placement part 71 is placed on each of the placement parts 71. The block substrate is formed in the vicinity of the portion 71. One reference mark 72 is provided in the vicinity of the four corners of the placement portion 71. In the mounting apparatus 11, after confirming the four positions of the reference mark 72, the component P is placed on the placement portion 71 located in the center thereof.

  As shown in FIG. 1, the management computer 80 is a PC that manages information related to mounting processing, and includes an input device 87 such as a mouse and a keyboard, a display 88, and the like. In the management computer 80, which nozzle holder 42 and nozzle 40 are used in the mounting apparatus 11, which component P is mounted on which substrate 70, and how many substrates 70 on which the component P is mounted are produced. Production job data in which the above is determined is stored in an HDD (not shown). This production job data also includes information regarding the range that can be imaged by the mark camera 34, and information such as the position of the mounting portion 71 of the substrate 70 and the position of the reference mark 72.

  Next, the operation of the mounting system 10 of the present embodiment configured as described above, first, the mounting process of the mounting apparatus 11 will be described. FIG. 5 is a flowchart illustrating an example of a mounting process routine executed by the CPU 61 of the control device 60. This routine is stored in the HDD 63 of the mounting apparatus 11 and executed according to a start instruction by the worker. Here, a case where the component P is arranged on the substrate 70 will be mainly described. When this routine is executed, the CPU 61 of the control device 60 acquires production job data (step S100). The production job data may be obtained by reading from the HDD 63 and storing it previously received from the management computer 80, or may be obtained by receiving it directly from the management computer 80.

  Next, the CPU 61 performs a transporting and fixing process for the substrate 70 (step S110). In this process, the substrate 70 is conveyed by the conveyor belt 22 of the conveyance unit 18, and the process of fixing the substrate 70 at a predetermined mounting position where the process of placing the component P is performed is performed. Next, the CPU 61 sets the component P to be placed on the substrate 70 based on the mounting order included in the production job data (step S120), and the nozzle holder 42 and the nozzle 40 for collecting the component P are mounted on the mounting head 24. It is determined whether or not it is attached to the device (step S130). When the nozzle holding body 42 and the nozzle 40 are not mounted on the mounting head 24, the CPU 61 performs a process of mounting the nozzle holding body 42 and the nozzle 40 designated for collecting the component P based on the production job data. Execute (Step S140).

After step S140, or when the nozzle holder 42 and the nozzle 40 are attached to the mounting head 24 in step S130, the CPU 61 determines the imaging range of the mark camera 34 and the arrangement of the reference marks 72 on the substrate 70 from the production job data. Information such as the position is acquired (step S150). Next, the CPU 61 drives the movement motor 36 based on the imaging range of the mark camera 34 and the arrangement position of the reference mark 72, and moves the mark camera 34 to a predetermined position and fixes it at the predetermined position (step S160). ). That is, the CPU 61 positions the mark camera 34 with respect to the nozzle 40 (nozzle holding body 42). Here, it is assumed that the CPU 61 does not move the mark camera 34 relative to the nozzle 40 when the component P is placed by the nozzle 40.

In this process, when the nozzle 40 is positioned on the placement unit 71, the CPU 61 obtains a position where the reference mark 72 corresponding to the other placement unit 71 can be imaged by the mark camera 34, and determines the position as a predetermined position. The mark camera 34 is moved and fixed as follows. If the current position of the mark camera 34 is acceptable, the CPU 61 omits the movement process of the mark camera 34. Here, it is assumed that the CPU 61 moves and fixes the mounting nozzle 40 and the lens center of the mark camera 34 so that they are arranged in the Y-axis direction (see dotted lines in FIGS. 2 and 3). In this way, it is easy to image another reference mark 72 with the mark camera 34 when the component P is placed on the nozzle 40.

  Next, the CPU 61 performs a process for collecting the component P to be placed (step S170). At this time, when a plurality of nozzles 40 are mounted on the nozzle holder 42, the CPU 61 may collect the component P with each nozzle 40. In this case, the CPU 61 repeats the following steps S180 to S210 in accordance with the number of parts P collected. Subsequently, the CPU 61 determines whether or not the reference mark 72 corresponding to the placement position (placement unit 71) on which the component P is placed has been imaged (step S180). This determination can be made based on whether or not information corresponding to the stored mark position information is included in the imaging process of the reference mark 72 described later. This mark position information includes the position (XY coordinate value) of the reference mark 72 obtained by analyzing the captured image. Here, an affirmative determination is made when the four mark positions of the corresponding placement portion 71 are included in the mark position information. When the mounting position reference mark 72 has not been imaged, the CPU 61 performs an imaging process of the mounting position reference mark 72 (step S190).

  FIG. 6 is an explanatory diagram of the imaging of the reference mark 72 on the substrate 70 and the placement of the component P. FIG. 6A shows the imaging processing of the reference mark 72 before the placement of the component P, FIG. ) Is an explanatory diagram of the subsequent component P placement processing and reference mark 72 imaging processing. 6 to 8, for convenience of explanation, the non-imaged reference mark 72 is outlined, and the imaged reference mark 72 is painted black. The case where the placement units 71 in two rows with respect to the positions of the nozzles 40 enter the imaging range 38 of the mark camera 34 here will be described as a specific example. Before the component P is placed, the CPU 61 places the mark camera 34 immediately above the placement portion 71 and moves the mounting head 24 to a position where the reference mark 72 enters the imaging range 38 of the mark camera 34 (FIG. 6). (A)). Subsequently, the CPU 61 causes the mark camera 34 to capture an image, analyzes the captured image, uses the current coordinate value of the mounting head 24, and uses the coordinate values of the four reference marks 72 corresponding to the placement unit 71. The coordinate value is included in the mark position information and stored in the RAM 64.

  After performing the imaging process of the reference mark 72 in step S190 or when the reference mark 72 at the mounting position has been imaged in step S180, the CPU 61 determines the position of the component P based on the acquired position of the reference mark 72. The placement process is performed, and the imaging process of the reference mark 72 (corresponding to the other placement unit 71) in the area where the component P is not placed is performed (step S200). Subsequently, the CPU 61 obtains the mark position (coordinate value) of the reference mark 72, and stores this coordinate value in the mark position information (step S210). As shown in FIG. 6B, the CPU 61 places the component P on the placement unit 71 to be processed and images the reference mark 72 included in the imaging range 38 of the mark camera 34. Further, the CPU 61 analyzes the captured image of the reference mark 72 to obtain the coordinate value of each reference mark 72 and includes the coordinate value in the mark position information and stores it in the RAM 64.

  Subsequently, the CPU 61 determines whether or not the mounting process of the current board has been completed (step S220). If the mounting process of the current board has not been completed, the process after step S120 is executed. That is, the CPU 61 sets the component P to be placed, and collects the component P by changing the nozzle holder 42 and the nozzle 40 as necessary. Then, the CPU 61 places the component P at the set placement position, and images the reference mark 72 corresponding to the placement portion 71 other than the set placement position and where the component P is not placed. The process is executed in parallel. As described above, the CPU 61 causes the mark camera 34 to image one or more reference marks 72 before placing the component P, and then uses the sampling unit 21 to place the component P at the placement position based on the reference mark 72 of the captured image. The mark camera 34 causes the mark camera 34 to image the reference mark 72 in the region where the component P is not placed, and then places the component P on the placement position based on the reference mark 72 of the captured image. At the same time, the process of causing the mark camera 34 to image the reference mark 72 in the area where the component P is not placed is repeated. 7 and 8 are explanatory diagrams of imaging of the reference mark 72 on the substrate 70 and placement of the component P. FIG. After the CPU 61 images the reference mark 72 at the placement position of the component P (FIG. 6A), the placement processing of the component P and the imaging processing of the other reference mark 72 are performed in parallel (FIG. 7 ( a)). The CPU 61 repeats this process over one row of the placement unit 71 (FIG. 7B). Then, as shown in the placement unit 71 in the third row from the bottom of FIG. 7B, the substrate 70 has a region where the mark position has been acquired in advance. Subsequently, in the same manner as described above, when the component P is placed on the placement portion 71 in the second row from the bottom, a region where the mark position has been obtained in advance is further present on the substrate 70 (FIG. 8). (A)). By repeating such processing, the mounting apparatus 11 can omit the movement (FIG. 6A) of the mounting head 24 only to image the reference mark 72, and the mounting process of the component P and other reference The mounting head 24 that performs the imaging of the mark 72 in parallel may be moved (FIG. 8B).

  On the other hand, when the mounting process of the current board is completed in step S220, the CPU 61 ejects the board 70 that has been mounted (step S230), and determines whether or not the production has been completed based on the number of boards that have been mounted (step S230). S240). When the production is not completed, the CPU 61 repeatedly executes the processes after step S110. That is, the CPU 61 performs the conveyance fixing process of the substrate 70, sets the component P to be placed, changes the nozzle holder 42 and the nozzle 40 as necessary, collects the component P, and performs the component placement process. The imaging process of the reference mark 72 is executed in parallel. On the other hand, when the production is completed, the CPU 61 returns the nozzle holder 42 and the nozzle 40 (step S250), and ends this routine as it is.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The sampling unit 21 of the present embodiment corresponds to the sampling unit of the present invention, the mark camera 34 corresponds to the imaging unit, and the control device 60 corresponds to the control unit of the present invention. In the present embodiment, an example of the mounting method of the present invention is also clarified by describing the operation of the mounting apparatus 11.

  According to the mounting system 10 described above, the CPU 61 performs in parallel the mounting process for placing the component P on the substrate 70 and the process for imaging the reference mark 72 in another area where the component P is not placed. Do. For this reason, for example, the movement of the mark camera 34 can be further reduced as compared with the case where the mounting process and the imaging process are performed separately. Therefore, production efficiency can be further increased. Further, the CPU 61 places the component P on the placement position based on the reference mark 72 of the captured image, and causes the mark camera 34 to pick up the reference mark 72 in an area where the component P is not placed. The production efficiency can be further increased while using the captured image for subsequent component placement.

  Further, the mark camera 34 is disposed on the mounting head 24 so as to be movable with respect to the sampling unit 21 (nozzle 40), and the CPU 61 positions the component P collected by the sampling unit 21 (position of the nozzle 40). The mark camera 34 is moved so that the position of the mark camera 34 is aligned in the Y-axis direction (predetermined arrangement direction). Thus, since the position where the component P is collected and the imaging position are arranged in a predetermined direction, it is easy to image the reference mark 72 and place the component P. Furthermore, the CPU 61 moves the mark camera 34 so that the reference mark 72 in the area where the component P is not placed when entering the imaging range when the sampling unit 21 is moved to the placement position of the component P. Imaging of the reference mark 72 and placement of the component P can be more reliably performed in parallel. Further, since the substrate 70 is a block substrate in which the reference mark 72 is formed for each mounting position of the component P, the CPU 61 increases the production efficiency of the block substrate in which many reference marks 72 are formed on the substrate. Can be increased.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, as illustrated in FIGS. 6 to 8, the component P is described as being placed in the lateral direction (left-right direction) with respect to the mounting head 24, but is not particularly limited thereto. The component P may be placed in the vertical direction (vertical direction) with respect to the mounting head 24. In the above-described embodiment, after imaging the reference marks 72 for the first and second rows in the horizontal direction, the placement of the component P and the imaging of the reference marks 72 are performed in parallel. The mounting and the imaging of the reference mark 72 are performed in parallel. When placing the component P in the vertical direction on the mounting head 24, the CPU 61 images the reference mark 72 for the first and second times, then places the component P, and performs the reference for the third and subsequent times. The imaging of the mark 72 and the placement of the component P can be performed in parallel. Even in this case, the production efficiency can be further increased as compared with the case where the mounting process and the imaging process are performed separately.

  In the above-described embodiment, the CPU 61 moves and fixes the mark camera 34 so that the center of the mark camera 34 and the nozzle 40 on which the component P is placed are arranged in the Y-axis direction. It does not have to be arranged in the Y-axis direction. For example, the CPU 61 may move the mark camera 34 to a more efficient position so that more unimaged reference marks 72 are included in the imaging range 38. In this way, production efficiency can be further increased. Alternatively, the CPU 61 may move the mark camera 34 and perform imaging a plurality of times when placing one component P on the placement unit 71. Even in this case, the production efficiency can be further increased.

  In the above-described embodiment, the mark camera 34 has been described as being movable with respect to the nozzle 40 by the moving member 35 and the moving motor 36. However, the mark camera 34 is not limited to this, and the mark camera 34 is attached to the nozzle 40. On the other hand, it may be fixed to the collection unit 21 at a predetermined position. For example, as in the case of the nozzle holder 42B shown in FIG. 3, even when the position where the component P is disposed and the center of the mark camera 34 are not arranged in the Y-axis direction, the mounting on which the component P is not mounted. It is possible to image another reference mark 72 corresponding to the placement unit 71. Therefore, the CPU 61 may grasp the position of the reference mark 72 in consideration of the deviation in the Y-axis direction.

  In the embodiment described above, the substrate 70 is a block substrate in which the reference mark 72 is formed for each placement position of the component P, but is not particularly limited thereto. For example, the substrate has a reference mark 72 corresponding to the placement position of the component P, and the board may have a plurality of placement positions and reference marks 72.

  In the above-described embodiment, the CPU 61 has been described as imaging the fiducial marks 72 (four places) corresponding to one placement unit 71 at a time. However, the present invention is not particularly limited to this, and a plurality of placement units is provided. The reference mark 72 corresponding to 71 may be imaged at a time. Further, the CPU 61 may take an image of a part of the reference marks 72 corresponding to the placement part 71 and a part of the reference marks 72 corresponding to the other placement parts 71 at a time. That is, the CPU 61 may capture all of the reference marks 72 corresponding to one placement unit 71 by a plurality of imaging processes.

  The present invention can be used in the technical field of mounting components on a board.

DESCRIPTION OF SYMBOLS 10 mounting system, 11 mounting apparatus, 18 conveyance part, 21 sampling part, 20 support plate, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X axis slider, 28 guide rail, 30 Y axis slider, 32 guide rail, 34 Mark camera, 35 Moving member, 36 Moving motor, 38 Imaging range, 40, 40a Nozzle, 42, 42A to 42C Nozzle holder, 45 Z-axis motor, 54 Parts camera, 55 Nozzle stocker, 56 Reel unit, 57 Reel, 58 Feeder Unit, 60 Control Device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 Input / Output Interface, 66 Bus, 70 Substrate, 71 Placement Unit, 72 Reference Mark, 80 Management Computer, 87 Input Device, 88 Display , P parts.

Claims (6)

A sampling unit that performs mounting processing to collect components and place them on the board;
An imaging unit that is disposed in the sampling unit and images the reference mark of the substrate on which the reference mark is arranged;
A control unit that controls the imaging unit and the sampling unit so that the component is placed on the substrate and the reference mark is imaged in a region where the component is not placed;
Mounting device.   The control unit causes the imaging unit to image one or more reference marks before placing the component, and then causes the sampling unit to place the component at a position based on the reference mark of the captured image. The imaging unit picks up the reference mark in an area where the component is not placed, and then places the component on the position based on the reference mark in the picked-up image and places the component on the image pickup unit. The mounting apparatus according to claim 1, wherein the imaging unit picks up an image of the reference mark in an unoccupied region. The imaging unit is disposed in the sampling unit so as to be movable with respect to the sampling unit,
The mounting apparatus according to claim 1, wherein the control unit moves the imaging unit so that a position of a component collected by the sampling unit and a position of the imaging unit are aligned in a predetermined arrangement direction. The imaging unit is disposed in the sampling unit so as to be movable with respect to the sampling unit,
The control unit moves the imaging unit so that a reference mark in an area where the component is not placed falls within an imaging range when the sampling unit is moved to the placement position of the component. The mounting apparatus of any one of -3.   The mounting device according to claim 1, wherein the substrate is a block substrate on which the reference mark is formed for each component mounting position. By a mounting apparatus comprising: a sampling unit that performs a mounting process of sampling a component and placing the component on a substrate; and an imaging unit that images the reference mark of the substrate that is arranged in the sampling unit and has a reference mark arranged thereon An implementation method,
Controlling the imaging unit and the sampling unit to place the component on the substrate and image the reference mark in a region where the component is not placed;
Implementation method including

Images