JP2016024575A5 - - Google Patents

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Publication number
JP2016024575A5
JP2016024575A5 JP2014147442A JP2014147442A JP2016024575A5 JP 2016024575 A5 JP2016024575 A5 JP 2016024575A5 JP 2014147442 A JP2014147442 A JP 2014147442A JP 2014147442 A JP2014147442 A JP 2014147442A JP 2016024575 A5 JP2016024575 A5 JP 2016024575A5
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JP
Japan
Prior art keywords
heat
bottom wall
heating element
absorbing member
circuit component
Prior art date
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Application number
JP2014147442A
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English (en)
Japanese (ja)
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JP6392015B2 (ja
JP2016024575A (ja
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Publication date
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Priority to JP2014147442A priority Critical patent/JP6392015B2/ja
Priority claimed from JP2014147442A external-priority patent/JP6392015B2/ja
Priority to US14/688,850 priority patent/US20160021786A1/en
Publication of JP2016024575A publication Critical patent/JP2016024575A/ja
Publication of JP2016024575A5 publication Critical patent/JP2016024575A5/ja
Application granted granted Critical
Publication of JP6392015B2 publication Critical patent/JP6392015B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014147442A 2014-07-18 2014-07-18 電子機器 Active JP6392015B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014147442A JP6392015B2 (ja) 2014-07-18 2014-07-18 電子機器
US14/688,850 US20160021786A1 (en) 2014-07-18 2015-04-16 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014147442A JP6392015B2 (ja) 2014-07-18 2014-07-18 電子機器

Publications (3)

Publication Number Publication Date
JP2016024575A JP2016024575A (ja) 2016-02-08
JP2016024575A5 true JP2016024575A5 (enrdf_load_stackoverflow) 2017-08-24
JP6392015B2 JP6392015B2 (ja) 2018-09-19

Family

ID=55075845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014147442A Active JP6392015B2 (ja) 2014-07-18 2014-07-18 電子機器

Country Status (2)

Country Link
US (1) US20160021786A1 (enrdf_load_stackoverflow)
JP (1) JP6392015B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9965003B2 (en) * 2015-07-09 2018-05-08 Htc Corporation Electronic assembly and electronic device
CN110121925B (zh) * 2016-12-29 2021-04-09 华为技术有限公司 散热装置及其终端设备
TWI626877B (zh) * 2017-04-28 2018-06-11 廣達電腦股份有限公司 電子裝置及其散熱模組
US10276248B1 (en) 2017-12-20 2019-04-30 Sandisk Technologies Llc Early ramp down of dummy word line voltage during read to suppress select gate transistor downshift
JP2020030694A (ja) * 2018-08-23 2020-02-27 レノボ・シンガポール・プライベート・リミテッド 電子機器
US20200236806A1 (en) * 2019-01-18 2020-07-23 United Arab Emirates University Heat sink with internal chamber for phase change material
CN110267499B (zh) * 2019-06-28 2020-12-15 Oppo广东移动通信有限公司 壳体组件及其制备方法以及电子设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202739B1 (en) * 1998-11-25 2001-03-20 Motorola, Inc. Apparatus including a heat-dissipating apparatus, and method for forming same
FR2803166B1 (fr) * 1999-12-28 2002-05-31 Thomson Csf Sextant Module electronique a haut pouvoir de refroidissement
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
TW537436U (en) * 2002-05-31 2003-06-11 Quanta Comp Inc Three-phase variable heat conducting structure
TW540989U (en) * 2002-10-04 2003-07-01 Via Tech Inc Thin planar heat distributor
JP2004152895A (ja) * 2002-10-29 2004-05-27 Sony Corp 冷却装置および冷却装置を有する電子機器
TW200532422A (en) * 2004-03-16 2005-10-01 Ind Tech Res Inst Thermal module with heat reservoir and method of applying the same on electronic products
KR100659582B1 (ko) * 2004-12-10 2006-12-20 한국전자통신연구원 루프형 마이크로 열이송 장치
JPWO2007020697A1 (ja) * 2005-08-18 2009-02-19 日立プラズマディスプレイ株式会社 フラットディスプレイ装置
FR2907634B1 (fr) * 2006-10-24 2016-08-19 Thales Sa Boitier electrique a cartes electroniques comportant des caloducs
FR2977121B1 (fr) * 2011-06-22 2014-04-25 Commissariat Energie Atomique Systeme de gestion thermique a materiau a volume variable
JP5895444B2 (ja) * 2011-10-20 2016-03-30 セイコーエプソン株式会社 印刷装置
JP2014041553A (ja) * 2012-08-23 2014-03-06 Toshiba Corp 電子機器
US9277676B2 (en) * 2012-08-23 2016-03-01 Kabushiki Kaisha Toshiba Electronic apparatus
CN103796481B (zh) * 2012-10-31 2016-07-13 英业达科技有限公司 电子装置
JP2014109387A (ja) * 2012-11-30 2014-06-12 Toshiba Corp 冷却装置、およびこの冷却装置を備えた電子機器
JP6311222B2 (ja) * 2013-04-30 2018-04-18 日本電気株式会社 電子機器及び放熱方法

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