JP2011014837A5 - - Google Patents
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- Publication number
- JP2011014837A5 JP2011014837A5 JP2009159953A JP2009159953A JP2011014837A5 JP 2011014837 A5 JP2011014837 A5 JP 2011014837A5 JP 2009159953 A JP2009159953 A JP 2009159953A JP 2009159953 A JP2009159953 A JP 2009159953A JP 2011014837 A5 JP2011014837 A5 JP 2011014837A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating component
- electronic device
- heat sink
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 10
- 239000003507 refrigerant Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009159953A JP2011014837A (ja) | 2009-07-06 | 2009-07-06 | 電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009159953A JP2011014837A (ja) | 2009-07-06 | 2009-07-06 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011014837A JP2011014837A (ja) | 2011-01-20 |
JP2011014837A5 true JP2011014837A5 (enrdf_load_stackoverflow) | 2012-05-10 |
Family
ID=43593420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009159953A Pending JP2011014837A (ja) | 2009-07-06 | 2009-07-06 | 電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2011014837A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106793693B (zh) * | 2016-12-22 | 2019-01-18 | 广东技术师范学院 | 一种智能伺服驱动器系统散热装置 |
CN106654645A (zh) * | 2016-12-30 | 2017-05-10 | 上海航天科工电器研究院有限公司 | 一种互联转接的板卡集成与散热一体化控制盒 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11354955A (ja) * | 1998-06-11 | 1999-12-24 | Mitsubishi Electric Corp | 電子機器の冷却構造 |
JP4196214B2 (ja) * | 2005-07-08 | 2008-12-17 | 日本電気株式会社 | 放熱構造、パッケージ組立体、及び放熱用シート |
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2009
- 2009-07-06 JP JP2009159953A patent/JP2011014837A/ja active Pending
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