JP2016024257A - Exposure method and apparatus, and method of producing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus which decreases exposure amount unevenness of joint parts when scanning to expose a substrate using a plurality of exposure regions.SOLUTION: An exposure apparatus scans a mask M and a plate P in synchronization with a projection system while exposing the plate P with an emitted light from a lighting system through a pattern of the mask M and the lighting system. The projection system exposes a plurality of respectively different exposure regions PRA, PRD which are arranged so as to form joint parts on the plate P by doubly exposing end parts in a non-scanning direction of two adjacent exposure regions when scanning the plate P in a scanning direction, and is provided with a control member 17A and the like, which are disposed between a pattern surface Ma of the mask M and pupil surfaces PPA, PPD and the like, to adjust a light intensity distribution of the end parts of the exposure regions.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an exposure technique for exposing a substrate through a projection optical system, and a device manufacturing technique using this exposure technique.

  During the manufacturing process of display devices such as liquid crystal displays, organic EL (Electro-Luminescence) displays, and plasma displays, a mask and a substrate for exposing a mask pattern image to a panel-like photosensitive substrate such as a glass plate And an exposure apparatus (hereinafter, referred to as a panel exposure apparatus) that scans and exposes a substrate by moving them in synchronization with the projection optical system. A conventional panel exposure apparatus includes a multi-lens type projection optical system composed of a plurality of partial projection optical systems in order to efficiently expose a pattern of a large area while suppressing an increase in the size of the projection optical system, In order to connect the patterns exposed in the exposure areas of the plurality of partial projection optical systems with high accuracy on the substrate, double exposure is performed at the ends of the two exposure areas inclined with respect to the scanning direction. Are provided (see, for example, Patent Document 1).

JP 2001-330964 A

  In a panel exposure apparatus, there may be slight exposure unevenness at the joint portion of the surface of the substrate, but such exposure unevenness is not a problem with the number of layers required in current display devices. It is about. However, when the number of layers required on the substrate increases in the future, if the same exposure apparatus is used to expose the plurality of layers, the effect of slight exposure unevenness at the joints (for example, joints) The line width of the transparent circuit pattern in the area is slightly different from the line width of the pattern in the other areas), and there is a risk that subtle luminance unevenness will appear on the screen of the display device to be finally manufactured. There is.

  In view of such circumstances, an aspect of the present invention aims to reduce unevenness in the exposure amount of a joint portion when a substrate is scanned and exposed using a plurality of exposure regions.

  According to the first aspect of the present invention, the mask and the substrate are synchronized with the projection optical system while exposing the substrate with the exposure light from the illumination optical system through the mask pattern and the projection optical system. In the exposure apparatus that scans, the projection optical system exposes a plurality of different exposure areas on the substrate, and the plurality of exposure areas correspond to two adjacent areas when the substrate is scanned in the scanning direction. A double exposure at the end of the exposure area in the non-scanning direction that intersects the scanning direction is arranged to form a joint on the substrate, and in order to control the exposure amount of the joint, An exposure apparatus is provided that includes an adjusting member that is installed between the pattern surface of the mask and the pupil plane of the illumination optical system and adjusts the light intensity distribution at the end of the exposure region.

  According to the second aspect, the mask and the substrate are scanned synchronously with respect to the projection optical system while exposing the substrate with the exposure light from the illumination optical system through the mask pattern and the projection optical system. In the exposure method, while exposing a plurality of different exposure regions on the substrate, the substrate is scanned in the scanning direction, and the end portions of the adjacent two exposure regions in the non-scanning direction intersecting the scanning direction are scanned. An adjustment placed between the pattern surface of the mask and the pupil plane of the illumination optics to form a joint on the substrate by double exposure and to control the exposure of the joint An exposure method is provided that uses a member to adjust the light intensity distribution at the end of at least one of the exposure regions.

  According to a third aspect, the method includes forming a pattern of a photosensitive layer on a substrate using the exposure apparatus or the exposure method according to the aspect of the present invention, and processing the substrate on which the pattern is formed. A device manufacturing method is provided.

  According to the aspect of the present invention, when performing scanning exposure of a substrate using a plurality of exposure regions, it is possible to reduce the uneven exposure amount of the joint portion.

1 is a perspective view showing a schematic configuration of an exposure apparatus according to an example of an embodiment. It is a block diagram which shows the control system of the exposure apparatus of FIG. FIG. 2 is a side view showing a part of two partial illumination systems and two partial projection optical systems in FIG. 1 in cross section. (A), (B), and (C) are the top views which show the adjustment part of the 1st, 2nd, and 3rd transmittance | permeability distribution, respectively. (A) is a top view which shows an example of arrangement | positioning of several illumination area | region, (B) is a top view which shows an example of arrangement | positioning of several exposure area | region. (A) And (B) is a figure which shows the example of the principal part of a partial illumination system, an example of illuminance distribution, and another example, respectively. It is a flowchart which shows an example of the exposure method. (A) is a figure which shows an example of the integrated exposure amount distribution before correction | amendment, (B) is a figure which shows an example of arrangement | positioning of the adjustment part of the transmittance | permeability distribution, (C) shows an example of the correction amount of integrated exposure amount distribution. (D) is a figure which shows the integrated exposure amount distribution after correction | amendment, (E) is a figure which shows the deviation and correction amount before correction | amendment of integrated exposure amount distribution. (A) is a figure which shows the other example of the integrated exposure amount distribution before correction | amendment, (B) is a figure which shows the other example of arrangement | positioning of the adjustment part of the transmittance | permeability distribution, (C) is the correction amount of integrated exposure amount distribution. FIG. 6D is a diagram showing the integrated exposure amount distribution after correction, and FIG. 8E is a diagram showing the deviation and correction amount before correction of the integrated exposure amount distribution. It is a top view which shows the adjustment part of the transmittance | permeability distribution of a modification. (A) is a diagram showing the integrated exposure dose distribution before correction of the modification, (B) is a diagram showing the arrangement of the adjustment unit of the transmittance distribution, (C) is a diagram showing the correction amount of the integrated exposure dose distribution, (D) is a diagram showing the corrected integrated exposure distribution, and (E) is a diagram showing the deviation and correction amount of the integrated exposure distribution before correction. (A), (B), (C), (D), (E), and (F) are the figures which show the modification of a control member, respectively. It is a flowchart which shows an example of the manufacturing process of an electronic device.

  An example of an embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a schematic configuration of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX is a scanning exposure type panel exposure apparatus that exposes an image of a pattern of a mask M onto a plate P (photosensitive substrate) made of rectangular flat glass coated with a photoresist (photosensitive material). As an example, the plate P exposed by the exposure apparatus EX is used to manufacture a panel which is a display unit of a display device such as a liquid crystal display or an organic EL display. The exposure apparatus EX includes a plurality of (seven as an example in the present embodiment) partial projection optical systems PLA, PLB, PLC, PLD, PLE, PLF, and PLG (in this embodiment) that project the image of the pattern of the mask M onto the surface of the plate P. A multi-lens type projection system PS (projection optical system) having (see FIG. 5A) is provided. Hereinafter, the mask M at the time of scanning exposure in a plane (substantially a horizontal plane in the present embodiment) which takes the Z axis perpendicular to the surface of the plate P when focused on the projection system PS, and is parallel to the surface (in the present embodiment). The description will be made by taking the X axis along the scanning direction of the plate P and the Y axis along the direction orthogonal to the X axis (non-scanning direction).

  In FIG. 1, an exposure apparatus EX includes a light source 10 including, for example, an ultra-high pressure mercury lamp that generates illumination light (exposure light) EL for exposure, and partial projection optical systems PLA to PLG on a pattern surface of a mask M using the illumination light EL. Illumination system IS for illuminating the same number of illumination areas IRA, IRB, IRC, IRD, IRE, IRF, IRG (see FIG. 5A) with a uniform illuminance distribution, and mask M as a mask holder (not shown) And a plate stage 22 that moves while being held parallel to the XY plane, and a plate stage 22 that holds and moves the plate P. As an example, the illumination areas IRA to IRC in the first row are arranged at regular intervals in the Y direction, and the illumination areas IRD to IRG in the second row are predetermined in the −X direction with respect to the illumination areas IRA to IRC in the first row. When viewed in the X direction at a distance, the first row illumination areas IRA to IRC are arranged so as to be sandwiched therebetween (see FIG. 5A).

  Further, the exposure apparatus EX measures the position information of the mask stage 21 by irradiating the measuring laser beam to the X-axis moving mirror 23MX and the Y-axis moving mirror 23MY provided at the end of the mask stage 21. The laser beam for measurement is irradiated to the multi-axis laser interferometer 23A and the X-axis movable mirror 23PX and the Y-axis movable mirror 23PY provided at the end of the plate stage 22, and the position information of the plate stage 22 is obtained. A multi-axis laser interferometer 23B for measurement is provided. Further, the exposure apparatus EX includes a mask stage drive system 25 and a plate stage drive system 26 (see FIG. 2) each including a linear motor or the like for driving the mask stage 21 and the plate stage 22 based on the measurement results of the laser interferometers 23A and 23B. And a main controller 20 (see FIG. 2) including a computer that controls the overall operation of the apparatus.

  The mask stage drive system 25 controls the position and speed in the scanning direction (X direction) of the mask stage 21 during scanning exposure, and rotates around an axis parallel to the Z axis of the mask stage 21 as necessary (hereinafter referred to as θz direction). The rotation angle can be adjusted within a predetermined range. The plate stage drive system 26 controls the position and speed of the plate stage 22 in the X direction in synchronization with the mask stage 21 during scanning exposure, and during the scanning exposure (step movement), the X of the plate stage 22 is controlled. Control the position in the direction and / or Y direction. As an example, the mask M is a rectangular flat plate having a width in the X direction of about 1 to 2 m and a width in the Y direction of about 1 to 1.5 m, and the plate P has a width of 2 to 2 in the X direction. The mask stage 21 and the plate stage 22 are set to sizes that can hold the mask M and the plate P, respectively, in a rectangular flat plate shape having a width of about 5 m and a width in the Y direction of about 2 to 3 m. Further, a pattern image of the mask M is exposed to a plurality of pattern formation regions (not shown) of the plate P, respectively.

  Next, the illumination system IS and the projection system PS will be described. First, the illumination light EL emitted from the light source 10 enters the condensing optical system 11 via an elliptical mirror, a mirror, a shutter (not shown), and a wavelength selection filter (not shown). The illumination light EL that has passed through the condensing optical system 11 is incident on the incident end 12 of the branch optical system 13 and is emitted from the exit ends 14A to 14G of the branch optical system 13 that is the same number as the partial projection optical systems PLA to PLG. The illumination light EL illuminates the trapezoidal illumination areas IRA to IRG via the corresponding partial illumination systems ILA to ILG. In the present embodiment, the field planes on the object plane side of the partial projection optical systems PLA to PLG are defined by the field stop 35 (see FIG. 3) in the partial projection optical systems PLA to PLG. Therefore, the illumination areas IRA to IRG mean areas that are optically conjugate with the opening 35a of the field stop 35, and the partial illumination systems ILA to ILG include the illumination areas IRA to IRG, respectively. Illuminates a slightly wider area than the IRG. Partial illumination systems ILA to ILG having substantially the same configuration have collimating lenses, fly-eye integrators (optical integrators), condenser lens systems, and the like. An illumination system IS is configured including optical members from the condensing optical system 11 to the partial illumination systems ILA to ILG.

  FIG. 3 shows the configuration from the fly eye integrator 15 of the two partial illumination systems ILA and ILD to the pattern surface Ma (irradiated surface) of the mask M, and the partial projection optical systems PLA and PLD corresponding to the partial illumination systems ILA and ILD. The structure of is shown. In FIG. 3, the illumination light EL emitted from the fly eye integrator 15 of the partial illumination system ILA includes a first condenser lens 16a, a disc-shaped control member 17A for controlling or adjusting the transmittance distribution, and a second condenser. The illumination area IRA (actually wider area) of the pattern surface Ma is illuminated via the lens 16b. A condenser lens system 16 is composed of the condenser lenses 16a and 16b.

The exit surface of the fly eye integrator 15 (or the rear focal plane of each lens element constituting the fly eye integrator 15) is the pupil plane PPA of the partial illumination system ILA (an optical Fourier transform plane with respect to the pattern surface Ma). It is.
Further, an aperture stop may be provided in a part of the partial illumination system ILA, and the installation surface of the aperture stop may be used as the pupil plane PPA. Further, the pupil plane PPA is not limited to one location, and a plurality of pupil planes can be provided in a conjugate relationship with each other.

The control member 17A is held by the holding mechanism 18 on the installation surface SPA that is between the first condenser lens 16a and the second condenser lens 16b (in the present embodiment, substantially in the middle between the pupil plane PPA and the pattern plane Ma). Has been. The control member 17A can be installed at an arbitrary position between the pupil plane PPA (or a plane optically conjugate with the pupil plane PPA) and the pattern plane Ma.
When a plurality of pupil planes PPA are provided in the partial illumination system ILA, at least one control member 17A can be installed at an arbitrary position between each pupil plane PPA and the pattern plane Ma.

  The holding mechanism 18 presses the peripheral portion of the control member 17A against the rotary portion 44 and the ring-shaped rotary portion 44 on which the peripheral portion of the control member 17A (the frame portion 17Ac in FIG. 4A) is placed. A ring-shaped fixing portion 43 and a rotating portion 44 are mounted so as to be rotatable about an axis parallel to the optical axis AXA of the partial illumination system ILA, and an opening through which the illumination light EL passes is formed. And a support portion 46 on which the slide portion 45 is placed and an opening through which the illumination light EL passes is formed. The fixed portion 43 is fixed to the rotating portion 44 by a bolt 47, and the slide portion 45 is fixed to the support portion 46 by the bolt 47 through a slit 45 a provided in the slide portion 45 parallel to the X direction. A pin-shaped lever (not shown) for rotating the rotating unit 44 is provided on a side surface of the rotating unit 44. The holding mechanism 18 can adjust the rotation angle of the control member 17A to an arbitrary angle, and can adjust the position of the control member 17A in the X direction. Note that the configuration of the holding mechanism 18 is arbitrary. For example, a mechanism for moving the control member 17A from the holding mechanism 18 in the X direction can be omitted.

  As shown in FIG. 4A, the control member 17A includes a mesh-type filter formed by arranging a large number of randomly shaped meshes in a substantially semicircular region in a ring-shaped frame portion 17Ac. The portion 17Aa is held, and the other region is the opening 17Ab (transmittance 100%). The mesh type filter unit 17Aa can also be called a random walk type filter unit. The frame portion 17Ac of the control member 17A is held by the holding mechanism 18. Usually, the control member 17A is positioned so that the center of the frame portion 17Ac substantially coincides with the optical axis AXA, and inside the frame portion 17Ac and the filter portion. The illumination light EL passes through a region including a part of 17Aa and a part of the opening 17Ab. The linear edge portion of the filter portion 17Aa is parallel to the Y axis and is shifted by a predetermined offset δx1 in the + X direction with respect to a straight line passing through the center of the frame portion 17Ac and parallel to the Y axis. As an example, the average transmittance of the filter portion 17Aa is 90%, and the offset δx1 is about 5% of the inner diameter of the member 17Ac. However, when the holding mechanism 18 includes a mechanism for adjusting the position of the control member 17A in the X direction, the holding mechanism 18 can also adjust the position of the control member 17A in the X direction.

  The control member 17A can be formed relatively easily by removing the mesh in a substantially semicircular shape from a large number of randomly shaped meshes arranged in a substantially circular region, for example. For this reason, as an example, the adjustment member 17A is attached to the partial illumination system ILA via the holding mechanism 18, and the two integrated exposure amounts (or averages) after being exposed at the joint portion of the two exposure regions and the other regions are exposed. The case is assumed where the difference between the two integrated exposure amounts does not fall within the allowable range even if adjustment is made so that the illuminance is as equal as possible. Even in such a case, by removing a part of the mesh type filter portion 17Aa of the adjustment member 17A using a cutting tool such as scissors, the exposure apparatus can be easily installed in a short time. Thus, the readjustment can be performed so that the integrated exposure amount (or average illuminance) after the exposure at the joint and other regions becomes as equal as possible.

  In addition to the control member 17A, there are prepared a plurality of control members (not shown) in which the offset δx1 is set to 0, or several times the case of FIG. 4A, etc. Exchangeable with control member. In FIG. 3, the filter portion 17Aa of the control member 17A is disposed on the + X direction side, and the rotation angle of the control member 17A at this time is 0 degree. It is also possible to rotate the control member 17A 180 degrees by the holding mechanism 18 and arrange the filter portion 17Aa on the −X direction side (or in any direction with respect to the optical axis AXA). Furthermore, instead of the control member 17A, the control member 17B in FIG. 4B, the control member 17C in FIG. 4C, or a control member having any other configuration can be used. The control member 17B holds a semicircular mesh type filter portion 17Ba having a transmittance of about 95% in the frame portion 17Bc, and the other region is the opening portion 17Bb. The control member 17C holds a semicircular mesh type filter portion 17Ca having a transmittance of about 97.5% and an offset δx2 (approximately the same as δx1) in the frame portion 17Cc. The region is the opening 17Cb. Instead of the mesh-type filter units 17Aa, 17Ba, 17Ca, etc., an ND filter (neutral density filter) having the same (or uniform) transmittance can be used.

  In FIG. 3, the control member 17 </ b> A (or other member) is also provided on the installation surface SPD between the exit surface (pupil surface PPD) of the fly eye integrator 15 of the partial illumination system ILD and the pattern surface Ma by the holding mechanism 18 (not shown). Control member 17B etc.) are held. In FIG. 3, as an example, the rotation angle around the axis parallel to the optical axis AXD of the control member 17A in the partial illumination system ILD is 180 degrees different from that of the control member 17A in the partial illumination system ILA. . Similarly, control members 17A, 17B and the like are also installed in partial illumination systems that illuminate other illumination areas IRB, IRC, IRE to IRG (see FIG. 5A). However, when the control member 17A is installed in the partial illumination system ILA, a different control member 17A is provided for each of the partial illumination systems ILA to ILG such that another control member 17B is installed in the other partial illumination system ILD. , 17B, etc. may be installed. Further, when the control member 17A (or 17B, etc.) is installed in one partial illumination system (for example, the partial illumination system ILA), the control members 17A, 17B, etc. may not be installed in the other partial illumination system. .

  Next, the operation of the control member 17A and the like will be described with reference to FIGS. 6A and 6B, which are explanatory diagrams of the partial illumination system ILA. First, in FIG. 6A, the illuminance distribution in the X direction of the illumination light EL on the pattern surface Ma when the control member 17A is not installed is constant (value a2) as shown by the dotted line. And On the other hand, in the partial illumination system ILA, the transmittance distribution is such that the filter portion 17Aa is on the −X direction side and the edge portion of the control member 17Aa matches a straight line passing through the optical axis AXA and parallel to the Y axis. It is assumed that the control member 17A is installed. At this time, of the illumination light EL emitted from the fly-eye integrator 15 of FIG. 3 and passing through the condenser lens 16a, most of the luminous flux EL1 that is tilted to the maximum in the −X direction indicated by the dotted line is transmitted through the filter portion 17Aa. Then, in a state where the illuminance is lowered, the light enters the position farthest in the −X direction with respect to the optical axis AXA of the pattern surface Ma via the condenser lens 16b. In addition, almost half of the light beam EL2 parallel to the optical axis AXA indicated by the solid line is transmitted through the filter portion 17Aa, so that the amount of decrease in illuminance is substantially half that of the light beam EL1 on the optical axis AXA of the pattern surface Ma. Most of the light beam EL3 that is incident and tilted to the maximum in the + X direction indicated by the broken line is incident at a position farthest from the optical axis AXA of the pattern surface Ma in the + X direction in a state in which the illuminance does not decrease compared to the light beam EL2. To do.

  As a result, the illuminance of the light beam EL1 on the pattern surface Ma is the minimum value a1 (illuminance when the filter portion having the same transmittance as the filter portion 17Aa is on the entire surface of the optical path of the illumination light EL), and the illuminance of the light beam EL3 is the maximum value a2. The illuminance of the luminous flux EL2 is an intermediate value between the minimum value a1 and the maximum value a2. Further, when the tilt angle of the light beam passing through the condenser lens 16a gradually changes from the tilt angle of the light beam EL1 to the tilt angle of the light beam EL2, the ratio of the portion of the light beam that passes through the filter portion 17Aa gradually decreases. The illuminance on the pattern surface Ma of the light flux gradually increases from the minimum value a1 to the maximum value a2, as indicated by a straight line A1 indicating the illuminance ICE in FIG. Since the illumination area IRA of this embodiment is the central part of the area where the illumination light EL is incident on the pattern surface Ma, the illuminance distribution in the X direction of the illumination area IRA is from the minimum value (value greater than the value a1) to the maximum value. The inclination is gradually increased to a3 (a value smaller than the value a2). In other words, by installing the control member 17A between the pupil plane and the pattern plane in the partial illumination system ILA, the illuminance distribution of the illumination area IRA can be tilted in the X direction (scanning direction).

  Furthermore, by rotating the control member 17A so that the filter unit 17Aa is on the + X direction side with respect to the optical axis AXA, the sign of the inclination angle of the illuminance distribution in the illumination area IRA can be reversed. Moreover, since the value of the minimum value a1 of the illuminance distribution changes by installing the control members 17B and 17C having the filter portions 17Ba and 17Ca having different average transmittances instead of the control member 17A, the illuminance distribution The tilt angle can be controlled.

  Further, as shown in FIG. 6B, when an offset δxa with respect to the −X direction is given to the position of the edge portion of the filter portion 17Aa of the control member 17A, the light beam EL2 parallel to the optical axis AXA is transmitted through the filter portion 17Aa. The ratio to do decreases, and the illuminance on the pattern surface Ma increases. Similarly, even with other light fluxes, the rate of transmission through the filter portion 17Aa decreases, and the illuminance on the pattern surface Ma increases, so that the illuminance distribution on the pattern surface Ma is as shown by the broken line A2 in FIG. 6B. It rises as a whole, but saturates when the maximum value a2 is reached. For this reason, the maximum value a4 of the illuminance distribution in the illumination area IRA becomes a value close to the maximum value a2, and the average value of the illuminance in the illumination area IRA can be increased to effectively use the illumination light EL.

  In the partial illumination system ILA of FIG. 3, when the installation surface SPA of the control member 17A is in the vicinity of the pupil plane PPA (or in the vicinity of a plane conjugate with the pupil plane PPA), the light flux that has passed through the filter portion 17Aa of the control member 17A. Are incident almost uniformly on the region of the pattern surface Ma in the X direction, so that the illuminance distribution in the X direction on the pattern surface Ma only decreases uniformly and does not tilt. On the other hand, if the installation surface SPA of the control member 17A is in the vicinity of the pattern surface Ma (or in the vicinity of a surface conjugate with the pattern surface Ma), the illuminance of only the portion of the pattern surface Ma that faces the filter portion 17Aa decreases. The illuminance distribution in the X direction on the pattern surface Ma changes stepwise. On the other hand, since the installation surface SPA of the control member 17A of the present embodiment is at a substantially intermediate position between the pupil plane PPA and the pattern surface Ma, the filter portion 17Aa of the control member 17A causes the pattern surface Ma to The illuminance distribution in the X direction of the illumination area IRA can be tilted at a desired tilt angle and offset. By tilting the illuminance distribution in this way, the distribution of the integrated exposure amount on the plate P can be controlled with high accuracy (details will be described later). Further, since the installation accuracy of the control member 17A may be low and the positioning accuracy when the control member 17A is replaced with another control member 17B may be low, the installation and replacement of the control members 17A, 17B, etc. are easy. is there.

  Next, in FIG. 1, illumination light from illumination areas IRA to IRG of mask M is emitted from a plurality of partial projection optical systems PLA to PLG arranged in two rows along the Y direction so as to correspond to each illumination area. Is incident on the projection system PS. The partial projection optical systems PLA to PLG form pattern images in the illumination areas IRA to IRG in the corresponding trapezoidal exposure areas PRA, PRB, PRC, PRD, PRE, PRF, and PRG (see FIG. 3C). . The partial projection optical systems PLA to PLG are telecentric and high-resolution imaging optical systems having substantially the same configuration and two-stage catadioptric systems arranged in the Z direction as an example. In addition, the partial projection optical systems PLA to PLG perform intermediate imaging as an example, and form an erect image at the same magnification as the mask pattern on the plate P.

  As an example, the partial projection optical system PLA includes an image shifter 31A that shifts light from the mask M, a first refractive system 33A and a concave mirror 34A that form a first catadioptric system that forms a primary image of the pattern of the mask M, , A first right-angle prism 32A for directing light from the mask M toward the first catadioptric system and directing light from the first catadioptric system in the -Z direction, and a field stop 35 disposed in the vicinity of the primary image. A second refraction system 33B and a concave mirror 34B constituting a second catadioptric system for forming a secondary image of the primary image on the plate P, and directing light from the primary image to the second catadioptric system, A second rectangular prism 32B for directing light from the second catadioptric system toward the plate P and an image shifter 31B for shifting light incident on the plate P are provided (see FIG. 3). The image shifters 31A and 31B are made of, for example, a plurality of parallel flat plates. The partial projection optical system PLD is configured symmetrically with respect to the partial projection optical system PLA in the X direction. An example of a detailed configuration of the multi-lens type projection system is disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-330964.

Further, the number of partial projection optical systems PLA to PLG constituting the projection system PS increases as the mask M to be exposed increases, and the projection system PS includes, for example, 11 partial projection optical systems (5 in the first column and 5 6 in the second row). As described above, the number of the partial projection optical systems PLA and the like is arbitrary, and the configuration of the partial projection optical systems PLA and the like is arbitrary.
As shown in FIG. 5A, the partial projection optical systems PLA to PLG are arranged so as to face the three partial projection optical systems PLA, PLB, and PLC in the first row arranged in the Y direction. Divided into four partial projection optical systems PLD, PLE, PLF, PLG arranged in the X direction and shifted by a half cycle in the Y direction, and supported by an optical system frame (not shown) Has been. Further, an exposure area PRA is formed by a trapezoidal opening 35a having an edge portion parallel to the Y direction provided on a field stop 35 disposed in the vicinity of an intermediate image plane of the partial projection optical systems PLA to PLG and having an upper side and a bottom side. ~ Basic shape of PRG is defined.

  As shown in FIG. 5B, the exposure regions PRD to PRG of the second column of the partial projection optical systems PLD to PLG have a trapezoidal shape with the −X direction side as the base, and the first column of the partial projection optical system. The exposure areas PRA to PRC of PLA to PLC are located between the exposure areas PRD to PRG with respect to the Y direction, and the exposure areas PRA to PRC have a trapezoidal shape with the + X direction side as the base. Further, for example, when all exposure areas PRA to PRG are viewed in the + X direction, two edge portions (hereinafter referred to as inclined portions) that are inclined with respect to the scanning direction (X direction) of the exposure regions PRA to PRC in the first row. ) Respectively overlap the corresponding inclined portions of the exposure regions PRD to PRG in the second row. In FIG. 5B, the outer edge portions of the two exposure regions PRD, PRG outside the second row are, for example, light shielding bands (not shown) surrounding the pattern region PA of the mask M (see FIG. 5A). The outer edge portions of the exposure regions PRD and PRG are parallel to the X axis.

  In addition, since the partial projection optical systems PLA to PLG form, as an example, erect images that are the same size as the mask pattern on the plate P, the shapes and arrangements of the illumination areas IRA to IRG are the shapes of the exposure areas PRA to PRG. And the same as the sequence. For this reason, for example, when viewed in the + X direction, the exposure areas PRA to PRG (illumination areas IRA to IRG) are arranged without gaps in the Y direction. Accordingly, the mask M is moved in the + X direction (or -X direction) with respect to the illumination areas IRA to IRG by the mask stage 21 (scanning) while exposing the plate P with the image of the projection system PS of the patterns of the illumination areas IRA to IRG. ) And the movement (scanning) of the plate P in the + X direction (or -X direction) with respect to the exposure areas PRA to PRG by the plate stage 22 are performed in synchronization with each other. Can be exposed to one pattern formation region 53A of the plate P without a gap by one scanning exposure.

  Further, in the pattern formation region 53A, one inclined portion of the exposure regions PRA to PRC and a corresponding inclined portion of the exposure regions PRD to PRG (an inclined portion having a shape symmetrical to the inclined portion of the exposure regions PRA to PRC in the Y direction). In the joint portions 54A, 54B, 54C, 54D, 54E, and 54F that are double-exposed, the design exposure amount after the double exposure becomes substantially the same as the design exposure amount in other regions. Patterns exposed in the exposure areas PRA to PRG are connected with high accuracy in the Y direction. When the width in the Y direction of the inclined portions of the exposure areas PRA to PRG is d, the width in the Y direction of the joint portions 54A to 54F is also d.

  First, in FIG. 1, four mask-side blinds 41A, 41B, 41C, and 41D made of flat light-shielding members that are elongated in the Y direction are provided above the illumination areas IRA to IRG of the mask M. They are arranged so that they do not overlap and can move in the X direction independently of each other. The ends of the blinds 41A to 41D in the -Y direction are connected to a drive unit 42A that individually controls the positions and speeds of the blinds 41A to 41D in the X direction by, for example, a linear motor method, and the blinds 41A to 41D have + Y directions. Is connected to the guide portion 42B. As an example, the drive part 42A and the guide part 42B are supported by a frame (not shown) that holds the illumination system IS. By opening and closing the illumination areas IRA to IRG with the blinds 41A to 41D at the start and end of each scanning exposure, it is possible to prevent unnecessary patterns from being exposed on the plate P.

  In addition, the exposure apparatus EX is provided on the plate stage 22 to measure the illuminance distribution in the Y direction of the exposure areas PRA to PRG, and provided on the plate stage 22, for example, an alignment mark (not shown) of the mask M. The aerial image measuring unit 28 (see FIG. 2) for measuring the position information of the image of), the alignment system AL (see FIG. 2) for measuring the position information of the alignment marks (not shown) of the plate P, various data, etc. And a storage unit 29 for storing. Further, the exposure apparatus EX has an interface unit (not shown) for exchanging various types of information between the main controller 20 and a host computer (not shown), and an input for the operator to input various control information and the like to the main controller 20. A device (not shown) and a display device (not shown) on which the main control device 20 displays measurement results and the like are provided. The light quantity measuring unit 24 has a plurality of minute light receiving elements arranged in the Y direction as an example, and the illuminance (unit time per unit area) detected by the light quantity measuring unit 24 when the plate P is scanned in the X direction. The distribution of the accumulated exposure amount with respect to the plate P in the Y direction can be measured by integrating the (energy per hit). Further, the mask M and the plate P can be aligned based on the measurement results of the aerial image measurement unit and the alignment system AL, respectively.

  Next, an example of an exposure method by the exposure apparatus EX of the present embodiment will be described with reference to the flowchart of FIG. This exposure method is controlled by the main controller 20. First, it is assumed that the mask M and the plate P are not loaded on the mask stage 21 and the plate stage 22 of the exposure apparatus EX, respectively, and the control member 17A and the like are not installed in the partial illumination systems ILA to ILG. In step 102 in FIG. 7, the operator inputs control information to the main controller 20 so as to measure the integrated exposure amount distribution. In response to this, the illumination light EL from the light source 10 is irradiated, and the plate stage 22 is stepped in the Y direction in a state where the exposure areas PRA to PRG are illuminated via the illumination areas IRA to IRG with the illumination light EL. After that, the operation of moving a predetermined distance in the X direction is repeated, and the light amount measuring unit 24 sequentially scans the exposure areas PRA to PRG in the X direction. Then, in main controller 20, a plurality of illuminances detected by light quantity measuring unit 24 are integrated in the X direction to obtain an integrated exposure amount distribution in Y direction on plate P when exposed in exposure areas PRA to PRG. .

  Thereafter, in step 104, the main controller 20 determines that the average value of the exposure values measured by the joint portions 54A to 54F in FIG. It is determined whether the exposure value is within an allowable range. The measurement result of the integrated exposure amount distribution and information on deviations from the target values of the exposure amounts of the joint portions 54A to 54F are displayed on a display device (not shown). In the following, for convenience of explanation, two joint portions 54A and 54B formed by exposure areas PRD, PRA, and PRE are shown in FIGS. 8B and 9B, respectively, and the exposure amounts of the two joint portions 54A and 54B are shown. An explanation will be given for the case of adjusting. In FIG. 8B and the like, for convenience of explanation, the edge portion in the −Y direction of the exposure region PRD at the end portion in the −Y direction is also represented as an inclined portion. The exposure amounts of the other joint portions 54C to 54F are similarly adjusted.

  Further, as an example, in the distribution of the cumulative exposure amount ΣE in the Y direction first measured in step 102, as shown in FIG. 8A, the average value of the exposure amounts of the joint portions 54A and 54B is the other region. Assume that the exposure amount is smaller than the allowable range for the average value (target value). In this case, the operation shifts from step 104 to step 106, and the transmittance distribution control member 17A and the like are provided on the above-described installation surfaces SPA and SPD of the partial illumination systems ILA, ILD, and ILE corresponding to the joint portions 54A and 54B. Check if it is installed. If the control member 17A or the like is not installed, the process proceeds to step 108, and the main controller 20 determines the exposure amount of the joint portions 54A and 54B from the measured value of the integrated exposure amount distribution measured in step 102. The control member 17A and the like (herein referred to as the control member 17A) installed in order to be as close as possible to the target value, and the target value of the rotation angle and the X direction (scanning direction) of the control member 17A are obtained (these target values). The value calculation method will be described later), and the obtained result information is recorded in a file in the storage unit 29 and provided to the operator via the display device. In response to this, the operator installs the control member 17A on the installation surface SPA, SPD, etc. via the holding mechanism 18, and also exchanges the control member 17A etc. with the main controller 20 (the initial value is 0). The control information is input so that 1 is added to the parameter indicating).

  In step 110, the main controller 20 determines whether or not the control member 17A or the like has been installed or replaced a predetermined number of times (for example, three times or more). The predetermined number of times is equal to or less than the type of control member 17A or the like that can be installed. Here, since the installation or replacement is performed once, the operation proceeds to step 112, and it is determined whether or not the control member 17A or the like is to be replaced. The replacement of the control member 17A or the like is performed when the adjustment of the rotation angle or the like of the control member 17A currently installed on the installation surface SPA, SPD or the like has been completed. Here, since the adjustment of the rotation angle or the like of the control member 17A has not been completed, the operation shifts to step 114, and the main controller 20 is installed on the installation surface SPA, SPD, etc. by the operator via the display device. The control member 17A is instructed to set the rotation angle of the control member 17A to the target value. Here, the target value of the rotation angle of the control member 17A in the partial illumination system ILA corresponding to the exposure area PRA is 180 degrees, the target value of the position offset is 0, and the partial illumination systems IRD, IRD, corresponding to the exposure areas PRD, PRE It is assumed that the target value of the rotation angle of the control member 17A during IRE is 0 degree, and the target value of the position offset is 0. In response to this, as shown in FIG. 8B, the filter unit 17Aa of the control member 17A for the exposure area PRA is set in the −X direction via the holding mechanism 18 corresponding to the operator, and the exposure areas PRD, The filter portion 17Aa of the control member 17A for PRE is set in the + X direction.

  In the present embodiment, since the partial projection optical systems PLA to PLG each form an equal-size erect image, the positional relationship between the trapezoidal exposure areas PRA to PRG and the control member 17A is controlled by the illumination areas IRA to IRG. The positional relationship with the member 17A is the same. As a result, as described with reference to FIG. 6A, the illuminance distribution in the X direction of the illumination light EL in the exposure area PRA is inclined so that the illuminance in the + X direction becomes high, and in the exposure areas PRD and PRE. The illuminance distribution in the X direction of the illumination light EL is inclined so that the illuminance in the + X direction becomes low. Further, since the exposure area PRA has a trapezoidal shape with a long side in the + X direction, and the exposure areas PRD and PRE have a trapezoidal shape with a long side in the −X direction, the average value of the illuminance of the exposure areas PRA, PRD, and PRE is Compared to the amount of decrease in the portion forming the joint portions 54A and 54B (the inclined portion of the trapezoidal region), the portion other than the joint portions 54A and 54B (the portion sandwiched between two parallel sides of the trapezoidal region) ) Decreases.

  Therefore, the illuminance change amount (correction amount) En (n = 1 to 7) of the exposure areas PRA, PRD, PRE due to the installation of the control member 17A is, as shown in FIG. , 54B becomes smaller. The distribution in the Y direction of the total illuminance correction amount (amount corresponding to the integrated exposure amount) obtained by adding the correction amount En is as shown by a dotted curve 56B in FIG. Further, since the integrated exposure amount before installing the control member 17A is the dotted curve 56A in FIG. 8E, the distribution in the Y direction of the integrated exposure amount ΣE after installing the control member 17A is shown in FIG. As shown in (D), it becomes flat and the exposure amount of the joint portions 54A and 54B becomes the same as the target value. Therefore, as shown in FIG. 8A, when the exposure amount of the joint portions 54A and 54B before the control member 17A is installed is lower than the target value, the rotation angle of the control member 17A for the exposure area PRA It can be seen that the rotation angle of the control member 17A for the exposure regions PRD and PRE may be set to 0 degree at 0 degree.

  Further, when the deviation between the exposure amount of the joint portions 54A and 54B before the control member 17A is installed and the target value is smaller, the inclination angle of the illuminance in the exposure regions PRA to PRG may be small, so the control member 17A. Instead, the control member 17B or 17C having a higher average transmittance may be used. As described above, which control member 17A to 17C should be used in accordance with the deviation between the exposure amount of the joint portions 54A and 54B and the target value is recorded in the file of the storage unit 29, and the main controller 20 Selects the control member 17A or the like to be used according to the deviation. Further, when it is desired to increase the use efficiency of the illumination light EL, as described with reference to FIG. 6B, the control member 17A or the like (control member 17Aa or the like) within the range in which the illuminance can be controlled with high accuracy. ) In the X direction may be set.

  On the contrary, as shown in FIG. 9A, when the exposure amount of the joint portions 54A and 54B is higher than the target value with respect to the distribution in the Y direction of the integrated exposure amount ΣE before installing the control member 17A and the like. 9B, the filter part 17Aa of the control member 17A for the exposure area PRA is set in the + X direction, and the filter part 17Aa of the control member 17A for the exposure areas PRD and PRE is set in the −X direction. do it. As a result, as described with reference to FIG. 6A, the illuminance distribution in the X direction of the illumination light EL in the exposure area PRA is inclined so that the illuminance in the −X direction becomes high, and the exposure areas PRD, PRE. The illuminance distribution in the X direction of the illumination light EL is inclined so that the illuminance in the -X direction is low. For this reason, the average value of the illuminance in the exposure areas PRA, PRD, and PRE is such that the amount of decrease in the portion forming the joint portions 54A and 54B (the inclined portion of the trapezoidal region) is the portion other than the joint portions 54A and 54B ( This is larger than the amount of decrease in the portion between the two parallel sides of the trapezoidal region.

  For this reason, the illuminance change amount (correction amount) En in the exposure areas PRA, PRD, PRE due to the installation of the control member 17A is a portion corresponding to the joint portions 54A, 54B, as shown in FIG. 9C. growing. The distribution in the Y direction of the total illuminance correction amount (amount corresponding to the integrated exposure amount) obtained by adding the correction amount En is as shown by a dotted curve 57B in FIG. Further, since the integrated exposure amount before installing the control member 17A is the dotted curve 57A in FIG. 9E, the distribution in the Y direction of the integrated exposure amount ΣE after installing the control member 17A is shown in FIG. As shown in (D), it becomes flat and the exposure amount of the joint portions 54A and 54B becomes the same as the target value. Therefore, when the exposure amount of the joint portions 54A and 54B before the control member 17A is installed is lower than the target value, the rotation angle of the control member 17A for the exposure area PRA is set to 0 degree, and the exposure areas PRD and PRE are used. It can be seen that the rotation angle of the control member 17A may be 180 degrees.

  Thereafter, when the operator inputs control information indicating that the rotation angle of the control member 17A has been adjusted to the main controller 20, the operation returns to step 102, and the exposure areas PRA to PRG are again used using the light quantity measuring unit 24. In step 104, it is determined whether or not the exposure amount at the joint portion is within an allowable range with respect to the target value. When the exposure amount of the joint portion is within the allowable range with respect to the target value, the main controller 20 provides information indicating that the adjustment of the illumination system IS is completed to the operator, and the adjustment of the illumination system IS is completed. To do. Thereafter, the operation shifts to step 120, the mask M is loaded onto the mask stage 21, the plate P is loaded onto the plate stage 22 (step 122), and the scanning exposure of the pattern of the mask M onto the plate P is performed. Done.

  On the other hand, if the exposure amount of the joint portion is not within the allowable range with respect to the target value in step 104, the transmittance distribution is controlled on the installation surfaces SPA, SPD, etc. of the partial illumination systems ILA, ILD, ILE in step 106. It is confirmed whether the member 17A etc. are installed. Since the control member 17A is installed this time, the operation proceeds to step 110, and the main controller 20 determines whether or not the control member 17A or the like has been installed or replaced a predetermined number of times. When the number of installations or replacements reaches the predetermined number, the operation proceeds to step 118, and the main controller 20 adjusts the illumination system IS to the operator to adjust the light amount distribution in the illumination areas IRA to IRG. A command is issued to make adjustments.

  In step 110, if the number of installations or replacements has not reached the predetermined number, the process proceeds to step 112 to determine whether or not to replace the control member 17A and the like. Here, since the control member 17A is installed on the installation surfaces SPA, SPD, etc., the operation shifts to step 116, and the main controller 20 sends an exchange control member (control member) to the operator via the display device. 17B) and target value information such as the rotation angle of the control member 17B is supplied. In response to this, the operator replaces the control member 17A such as the installation surface SPA or SPD with the control member 17B, and adds 1 to the parameter indicating the number of times the control member 17A or the like has been exchanged. Enter control information.

  Thereafter, the operation proceeds to step 114, and the main controller 20 sets the rotation angle of the control member 17B installed on the installation surface SPA, SPD, etc. to the target value via the display device to the operator. Give instructions. In this way, on the installation surfaces of the illumination areas IRA to IRG, the control member 17A and the like are installed so that the exposure amount corresponding to the joint portion 54A and the like in the integrated exposure amount distribution approaches the target value.

According to this exposure method, the exposure amount of the joints 54A to 54F approaches the target value, and the distribution in the Y direction of the integrated exposure amount after the scanning exposure is uniform. Therefore, the uneven exposure amount on the plate P is reduced. Exposure with high accuracy.
Further, the operations in steps 102 to 114 may be executed during maintenance of the exposure apparatus EX. As a result, even when the illuminance distribution in the illumination areas IRA to IRG is gradually changed due to a change with time or the like, and the integrated exposure amount distribution is changed, the uneven exposure amount can be easily obtained only by replacing the control member 17A or the like. Can be reduced.

  As described above, the exposure method and the exposure apparatus EX of the present embodiment use the illumination light EL (exposure light) for exposure from the illumination system IS (illumination optical system) and the pattern of the mask M and the projection system PS (projection optical system). The exposure method and apparatus for scanning the mask M and the plate P synchronously with respect to the projection system PS while exposing the plate P (substrate) through the projection system PS. In the exposure apparatus EX, the projection system PS exposes a plurality of different exposure areas PRA to PRG on the plate P, and the exposure areas PRA to PRG scan the plate P in the X direction (scanning direction). In addition, the joint portions 54A to 54F are formed on the plate P by double exposure at the end portions in the Y direction (non-scanning direction) orthogonal to the X direction of the two adjacent exposure regions. The exposure apparatus EX is installed between the pattern surface Ma of the mask M and the pupil planes PPA, PPD, etc. of the illumination system IS in order to control the exposure amounts of the joint portions 54A to 54F, and at least one exposure is performed. Control members 17A and the like (adjustment members) for adjusting the light intensity distribution at the ends of the regions PRA to PRG are provided.

  Further, in the exposure method using the exposure apparatus EX, the plate P is scanned in the X direction while exposing the plurality of exposure areas PRA to PRG on the plate P, and end portions in the non-scanning direction of two adjacent exposure areas are exposed. In order to control the exposure amount of the joint portions 54A to 54F in the step 124 for forming the joint portions 54A to 54F on the plate P by the double exposure, the space between the pattern surface Ma and the pupil plane of the illumination system IS is controlled. And a step 108 of installing the installed control member 17A and the like.

According to the exposure apparatus EX or the exposure method of the present embodiment, the exposure amount of the joint portions 54A to 54F can be set with high accuracy with respect to the target value by installing the control member 17A and the like, and thus a plurality of exposure regions PRA to PRG. When the plate P is subjected to scanning exposure using the, the exposure amount unevenness of the joint portions 54A to 54F can be reduced and exposure can be performed with high accuracy.
Further, since the control member 17A and the like are installed between the pattern surface Ma of the mask M and the pupil planes PPA and PPD of the illumination system IS, even if the installation accuracy of the control member 17A or the like is set low, The exposure amounts of the portions 54A to 54F can be controlled with high accuracy, and the control member 17A and the like can be easily installed and replaced.

  In the above-described embodiment, as shown in FIGS. 4A to 4C, the control member 17A having a semicircular filter portion 17Aa or the like is used, but as shown in FIG. A transmittance distribution control member 17D having an annular mesh-type filter portion 17Da disposed so as to surround the opening portion 17Db may be used. The average transmittance of the filter portion 17Da is, for example, about 70% to 90%, and the inner diameter of the filter portion 17Da is about the diameter near the center of the inclined portion of the trapezoidal exposure areas PRA to PRG. The control member 17D can be installed on the installation surfaces SPA and SPD of the partial illumination systems ILA and ILD via the holding mechanism 18 instead of the control member 17A and the like.

  For example, as shown in FIG. 11A, when the exposure amount of the joint portions 54A and 54B is higher than the target value with respect to the distribution in the Y direction of the integrated exposure amount ΣE before installing the control member 17A or the like, As shown in FIG. 10B, control members 17D are installed in the partial illumination systems ILA, ILD, and ILE for the exposure areas PRA, PRD, and PRE, respectively. In this case, the illuminance of the illumination light EL at the Y-direction ends (tip portions of the inclined portions) of the exposure areas PRA, PRD, PRE is reduced by the ring-shaped filter portion 17Da of the control member 17D.

  For this reason, the illuminance change amount (correction amount) En of the exposure areas PRA, PRD, PRE due to the installation of the control member 17D is a portion corresponding to the joint portions 54A, 54B as shown in FIG. growing. The distribution in the Y direction of the overall illuminance correction amount (amount corresponding to the integrated exposure amount) obtained by adding the correction amount En is as shown by a dotted curve 58B in FIG. Further, since the integrated exposure amount before installing the control member 17D is the dotted curve 58A in FIG. 10E, the distribution in the Y direction of the integrated exposure amount ΣE after installing the control member 17D is shown in FIG. As shown in (D), it becomes flat and the exposure amount of the joint portions 54A and 54B becomes the same as the target value.

Thus, even when the control member 17D having the ring-shaped filter portion 17Da is disposed between the pattern surface Ma of the mask M and the pupil planes PPA, PPD, etc. of the illumination system IS, the exposure amount unevenness in the joint portions 54A to 54F is uneven. Can be reduced.
Further, as an alternative to the control member 17A or the like having a mesh type (or ND filter type) filter unit, FIGS. 12 (A), (B), (C), (D), (E), and (F) are used. As shown, control members 17F, 17G, 17H, 17I, 17J, and 17K each having a filter portion in which linear members are arranged in a predetermined shape may be used. A plurality of openings 17Fh are formed in the ring-shaped frame portion 17Fa of the control member 17F so as to be fixed with bolts, for example. The same applies to the other control members 17G to 17K.

Further, the filter portions 17Fa, 17Ga, and 17Ha of the control members 17F, 17G, and 17H are grid-like patterns parallel to the X direction and the Y direction, respectively, in linear regions in the region on the half surface side in the scanning direction (X direction). A lattice-like pattern inclined so as to intersect with the X direction at about 45 degrees and a number of regular hexagonal patterns are formed.
Also, the filter parts 17Ia, 17Ja, and 17Ka of the control members 17I, 17J, and 17K in FIGS. 12D, 12E, and 12F are each two straight lines parallel to the longitudinal direction of the trapezoidal field stop. And a linear member parallel to the longitudinal direction of the trapezoidal field stop, and a linear member inclined with respect to the longitudinal direction of the trapezoidal field stop. When the control members 17I, 17J, and 17K are used, a linear member that is parallel to the Y direction is not used. Therefore, the unevenness in the accumulated exposure amount in the Y direction (non-scanning direction) after scanning exposure (or in the Y direction) (Illuminance unevenness) can be reduced.

Further, in the above-described control members 17A to 17D and control members 17F to 17K, the transmittance distribution is adjusted by adjusting the thickness of the linear member constituting the filter portion as a whole or partially. You can also
Further, in the above-described embodiment, the multi-lens-type projection system PS is used. However, when a single projection optical system is used as the projection system PS, for example, the substrate is exposed by the stitching method. The present invention can also be applied to. Furthermore, the present invention can also be applied when the projection magnification of the projection optical system is enlarged or reduced.

In addition, by using the exposure apparatus EX or the exposure method of each of the above embodiments to form a predetermined pattern (TFT pattern or the like) on the substrate, a liquid crystal display panel (liquid crystal) as an electronic device (micro device) is formed. Display panel). Hereinafter, an example of this manufacturing method will be described with reference to the flowchart of FIG.
In step S401 (pattern formation process) in FIG. 13, first, a coating process for preparing a photosensitive substrate (plate P) by applying a photoresist on a substrate to be exposed, and a panel mask (using the above exposure apparatus) For example, an exposure process for exposing a pattern (including a mask M) to a plurality of pattern formation regions on the photosensitive substrate and a developing process for developing the photosensitive substrate are performed. A predetermined resist pattern is formed on the substrate by a lithography process including the coating process, the exposure process, and the development process. Following this lithography process, a predetermined pattern is formed on the substrate through an etching process using the resist pattern as a mask, a resist stripping process, and the like. The lithography process or the like is executed a plurality of times according to the number of layers on the substrate.

  In the next step S402 (color filter forming step), a large number of three fine filter sets corresponding to red R, green G, and blue B are arranged in a matrix, or red R, green G, and blue B are arranged. A color filter is formed by arranging a set of three stripe-shaped filters in the horizontal scanning line direction. In the next step S403 (cell assembly process), for example, a liquid crystal cell is manufactured by injecting liquid crystal between the substrate having the predetermined pattern obtained in step S401 and the color filter obtained in step S402. .

In subsequent step S404 (module assembling step), an electric circuit for causing the liquid crystal cell thus assembled to perform a display operation and components such as a backlight are attached to complete a liquid crystal display panel.
According to the above-described electronic device manufacturing method, the mask pattern is transferred to the substrate using the exposure apparatus or exposure method of the above-described embodiment (part of step S401), and the pattern is transferred by this step. And a step of processing (developing, etching, etc.) the substrate based on the pattern (the other part of step S401).

According to this manufacturing method, the mask pattern can be efficiently exposed to the substrate with high accuracy while reducing the influence of uneven exposure, and thus the liquid crystal display panel can be manufactured efficiently and with high accuracy.
The above-described method for manufacturing an electronic device can also be applied to the case of manufacturing an organic EL (Electro-Luminescence) display, or another display panel such as a plasma display.

  In addition, this invention is not limited to the above-mentioned embodiment, A various structure can be taken in the range which does not deviate from the summary of this invention.

  EX ... exposure apparatus, PS ... projection system, PLA-PLG ... partial projection optical system, M ... mask, P ... plate, PRA-PRG ... exposure area, 17A-17D ... control member, 18 ... holding mechanism, 21 ... mask stage , 22 ... Plate stage, 35 ... Field stop, 53A ... Pattern formation region, 54A-54F ... Joint

Claims (17)

In an exposure apparatus that scans the mask and the substrate synchronously with respect to the projection optical system while exposing the substrate with the exposure light from the illumination optical system via the mask pattern and the projection optical system,
The projection optical system exposes a plurality of different exposure regions on the substrate, and the plurality of exposure regions are scanned in the scanning direction of two adjacent exposure regions when the substrate is scanned in the scanning direction. Is arranged so that a joint is formed on the substrate by double exposure at the end in the non-scanning direction intersecting with
In order to control the exposure amount of the joint, the light intensity distribution is adjusted between the pattern surface of the mask and the pupil surface of the illumination optical system and adjusts the light intensity distribution at the end of at least one of the exposure regions. An exposure apparatus comprising an adjustment member.   2. The field stop unit that sets at least one end portion of each of the plurality of exposure regions in the non-scanning direction to an inclined portion having a shape in which the width in the scanning direction is gradually narrowed. The exposure apparatus described.   The exposure apparatus according to claim 1, wherein the adjustment member adjusts the light intensity distribution in the exposure region so as to be non-uniform with respect to the scanning direction. The adjustment member has a semicircular mesh type filter portion having an edge portion parallel to a direction corresponding to the non-scanning direction,
The exposure apparatus according to claim 3, wherein the filter unit is disposed so as to block a part of the exposure light.   The exposure apparatus according to claim 1, wherein the adjustment member adjusts the light intensity distribution of the exposure region so as to be non-uniform in a radial direction with respect to a center of the exposure region. The adjustment member has a ring-shaped mesh-type filter portion centered on a point corresponding to the center of the exposure region,
6. The exposure apparatus according to claim 5, wherein the filter unit is disposed so as to block a part of the exposure light.   The exposure apparatus according to claim 4, wherein the adjustment member includes a ring-shaped frame member that holds the mesh-type filter unit. The illumination optical system has a plurality of partial illumination systems that illuminate a plurality of illumination areas on the pattern surface of the mask corresponding to the plurality of exposure areas,
The exposure apparatus according to claim 1, wherein the adjustment member is provided in each of the plurality of partial illumination systems. In an exposure method of scanning the mask and the substrate synchronously with respect to the projection optical system while exposing the substrate through a mask pattern and the projection optical system with exposure light from an illumination optical system,
While exposing a plurality of different exposure areas on the substrate, the substrate is scanned in the scanning direction, and double exposure at the end in the non-scanning direction intersecting the scanning direction of the two adjacent exposure areas Forming a joint on the substrate;
In order to control the exposure amount of the joint, an adjustment member installed between the pattern surface of the mask and the pupil surface of the illumination optical system is used, and the light at the end of at least one of the exposure regions An exposure method comprising adjusting an intensity distribution.   10. The exposure according to claim 9, wherein at least one end in the non-scanning direction of each of the plurality of exposure regions is set to an inclined portion having a shape in which a width in the scanning direction is gradually narrowed. Method.   11. The light intensity distribution in the exposure area is adjusted to be non-uniform with respect to the scanning direction in order to adjust the light intensity distribution at the end of the exposure area. The exposure method as described. The adjustment member has a semicircular mesh type filter portion having an edge portion parallel to a direction corresponding to the non-scanning direction,
The exposure method according to claim 11, wherein the filter unit is disposed so as to block a part of the exposure light.   The light intensity distribution of the exposure region is adjusted so as to be non-uniform in the radial direction with respect to the center of the exposure region in order to adjust the light intensity distribution at the end of the exposure region. Item 11. The exposure method according to Item 9 or 10. The adjustment member has a ring-shaped mesh-type filter portion centered on a point corresponding to the center of the exposure region,
The exposure method according to claim 13, wherein the filter unit is disposed so as to block a part of the exposure light. The illumination optical system has a plurality of partial illumination systems that illuminate a plurality of illumination areas on the pattern surface of the mask corresponding to the plurality of exposure areas,
The exposure method according to claim 9, wherein the adjustment member is provided in each of the plurality of partial illumination systems. Forming a pattern of a photosensitive layer on a substrate using the exposure apparatus according to claim 1;
Processing the substrate on which the pattern is formed;
A device manufacturing method including: Forming a pattern of a photosensitive layer on a substrate using the exposure method according to any one of claims 9 to 15,
Processing the substrate on which the pattern is formed;
A device manufacturing method including:

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