JP2016016458A - Drilling device and drilling method - Google Patents
Drilling device and drilling method Download PDFInfo
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- JP2016016458A JP2016016458A JP2014138369A JP2014138369A JP2016016458A JP 2016016458 A JP2016016458 A JP 2016016458A JP 2014138369 A JP2014138369 A JP 2014138369A JP 2014138369 A JP2014138369 A JP 2014138369A JP 2016016458 A JP2016016458 A JP 2016016458A
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- 238000005553 drilling Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 35
- 238000003754 machining Methods 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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Abstract
Description
本発明は、例えばプリント基板にドリルで穴明けを行うドリル加工装置及びドリル加工方法に関する。 The present invention relates to a drilling apparatus and a drilling method for drilling holes in, for example, a printed circuit board.
プリント基板のためのドリル加工装置においては、加工プログラムに従い、プリント基板を載置したテーブルをX軸、Y軸方向に駆動して、ドリルを加工位置に相対的に位置決めする。その後、所定の高さに退避させておいたドリルを下降させて穴明けを行うようになっている。
ところで、プリント基板は、通常、樹脂層と導体配線層を交互に加熱圧縮して形成されるため、図２に示すように、基板中央部が基板外縁領域より厚くなっていることが多い。なお図２は、この状態を誇張して示してある断面図である。
従来、ドリルの加工に関与しない上下方向の移動距離（エアカット）は、特許文献１（段落０００５）に開示されているように、プリント基板の厚さのばらつきを考慮してエアカットが最小限に設定され、ドリルの退避位置は常に一定になっている。
In a drill processing apparatus for a printed circuit board, a table on which the printed circuit board is mounted is driven in the X-axis and Y-axis directions according to a processing program, and the drill is positioned relative to the processing position. Thereafter, the drill that has been retracted to a predetermined height is lowered to perform drilling.
By the way, since a printed circuit board is usually formed by alternately heating and compressing a resin layer and a conductor wiring layer, as shown in FIG. 2, the central part of the board is often thicker than the outer edge region of the board. FIG. 2 is a cross-sectional view exaggerating this state.
Conventionally, the vertical movement distance (air cut) that is not involved in drilling is minimized by taking into account variations in the thickness of the printed circuit board as disclosed in Patent Document 1 (paragraph 0005). The retraction position of the drill is always constant.
しかしながら、上記のようにドリルを一定の高さに退避させておく従来技術においては、穴明け位置が、図２でのＰｍのように厚みが大きい位置の場合、X軸、Y軸方向の位置決めの静定前にドリルがプリント基板に突入することになり、加工精度が悪くなる問題点がある。また、このような事態を避けるため、退避位置をより高く設定すると、図２でのＰｎのように厚みが小さい位置の場合、ドリルがプリント基板に突入するまでに時間がかかり、加工に時間がかかり、生産性が悪くなる問題点がある。 However, in the conventional technique in which the drill is retracted to a certain height as described above, when the drilling position is a position where the thickness is large, such as Pm in FIG. 2, positioning in the X-axis and Y-axis directions is performed. There is a problem that the drill enters the printed circuit board before settling, and the processing accuracy deteriorates. In order to avoid such a situation, if the retraction position is set higher, in the case where the thickness is small, such as Pn in FIG. 2, it takes time until the drill enters the printed circuit board, and processing takes time. There is a problem that the productivity is lowered.
そこで本発明は、基板にドリルで穴明けを行うドリル加工において、基板の厚さにばらつきがあっても、ドリル加工の加工精度と生産性を確保することを目的とするものである。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to ensure drilling accuracy and productivity even when there is variation in the thickness of a substrate in drilling in which a substrate is drilled.
上記課題を解決するため、請求項１に記載のドリル加工装置においては、一つの加工位置を加工する毎にドリルを退避位置から基板に向けて降下させ、複数の加工位置を順次加工するようにしたドリル加工装置において、加工を行う際に基板の上面位置を検出する基板上面位置検出部と、加工が終了したら前記基板上面位置検出部で検出された基板上面位置から一定の距離だけ上昇させた位置まで次の加工位置の加工のためにドリルを退避させる制御部とを備え、当該退避位置を基板の厚みに追随させるようにしたことを特徴とする。 In order to solve the above-mentioned problem, in the drill processing apparatus according to claim 1, each time one processing position is processed, the drill is lowered from the retracted position toward the substrate, and a plurality of processing positions are sequentially processed. In the drilling apparatus, the substrate upper surface position detecting unit that detects the upper surface position of the substrate when processing is performed, and the substrate upper surface position detected by the substrate upper surface position detecting unit is raised by a certain distance when processing is completed. And a control unit that retracts the drill for processing at the next processing position up to the position, and the retracted position is made to follow the thickness of the substrate.
また請求項２に記載のドリル加工装置においては、前記制御部は、次の加工位置が今回の加工位置に対し基板上で予め決められた大きさよりも離れていない場合には、次の加工位置の加工のための退避位置は、今回の加工位置での退避位置と同じとすることを特徴とする。 Further, in the drill processing apparatus according to claim 2, the control unit determines that the next processing position is the next processing position when the next processing position is not separated from the current processing position by a predetermined size on the substrate. The retreat position for this machining is the same as the retreat position at the current machining position.
また請求項３に記載のドリル加工装置においては、請求項１あるいは２に記載のドリル加工装置において、前記制御部は、次の加工位置が今回の加工位置に対し基板上で予め決められた大きさよりも離れている場合、前記一定距離よりも離れた位置まで退避させることを特徴とする。 Further, in the drilling device according to claim 3, in the drilling device according to claim 1 or 2, the control unit is configured such that the next processing position is a predetermined size on the substrate with respect to the current processing position. When the distance is greater than the predetermined distance, the position is retracted to a position further away than the predetermined distance.
また請求項４に記載のドリル加工方法においては、一つの加工位置を加工する毎にドリルを退避位置から基板に向けて降下させ、複数の加工位置を順次加工するようにしたドリル加工方法において、加工を行う際に基板の上面位置を検出し、加工が終了したら前記基板上面位置から一定の距離だけ上昇させた位置まで次の加工位置の加工のためにドリルを退避させ、前記退避位置を基板の厚みに追随させるようにしたことを特徴とする。 Further, in the drilling method according to claim 4, in each drilling method in which a plurality of processing positions are sequentially processed by lowering the drill from the retracted position toward the substrate each time one processing position is processed. When processing, the upper surface position of the substrate is detected, and when the processing is completed, the drill is retracted for processing at the next processing position to a position raised by a certain distance from the upper surface position of the substrate, and the retracted position is set to the substrate It is characterized by following the thickness of the film.
また請求項５に記載のドリル加工方法においては、請求項４に記載の加工方法において、次の加工位置が今回の加工位置に対し基板上で予め決められた大きさよりも離れていない場合には、次の加工位置の加工のための退避位置を今回の加工位置での退避位置と同じとすることを特徴とする。 Further, in the drilling method according to claim 5, in the processing method according to claim 4, when the next processing position is not separated from a predetermined size on the substrate with respect to the current processing position. The retreat position for machining at the next machining position is the same as the retreat position at the current machining position.
また請求項６に記載のドリル加工方法においては、請求項４あるいは５に記載のドリル加工方法において、次の加工位置が今回の加工位置に対し基板上で予め決められた大きさよりも離れている場合、前記一定距離よりも離れた位置まで退避させることを特徴とする。 Further, in the drilling method according to claim 6, in the drilling method according to claim 4 or 5, the next machining position is separated from the current machining position by a predetermined size on the substrate. In this case, the vehicle is retracted to a position separated from the predetermined distance.
本発明によれば、基板にドリルで穴明けを行うドリル加工において、基板の厚さにばらつきがあっても、ドリル加工の加工精度と生産性を確保することが可能となる。 ADVANTAGE OF THE INVENTION According to this invention, in drill processing which drills a board | substrate with a drill, even if the thickness of a board | substrate varies, it becomes possible to ensure the processing precision and productivity of drill processing.
以下、本発明の一実施例について説明する。
図３は本発明の一実施例となるドリル加工装置の構成を示す図である。図３において、１は加工すべきプリント基板、２はプリント基板１を載置するテーブル、３はプリント基板１に穴を明けるためのドリル、４はドリル３を回転させるモータ内蔵型のスピンドル５を保持するスピンドルユニットである。テーブル２は、プリント基板１に穴を明けようとする位置にドリル３が向くよう、テーブル駆動部６によりＸ軸とＹ軸方向に駆動される。スピンドルユニット４は、スピンドル垂直駆動部７より垂直方向に駆動される。
Hereinafter, an embodiment of the present invention will be described.
FIG. 3 is a diagram showing a configuration of a drilling apparatus according to an embodiment of the present invention. In FIG. 3, 1 is a printed circuit board to be processed, 2 is a table on which the printed circuit board 1 is placed, 3 is a drill for making a hole in the printed circuit board 1, and 4 is a spindle 5 with a built-in motor for rotating the drill 3. It is a spindle unit to hold. The table 2 is driven in the X-axis and Y-axis directions by the table driving unit 6 so that the drill 3 faces a position where a hole is to be made in the printed circuit board 1. The spindle unit 4 is driven in the vertical direction by the spindle vertical drive unit 7.
スピンドル５の下方側には穴明け加工時にプリント基板１を押付けるためのプレッシャフット９が係合している。このプレッシャフット９はシリンダ８を介してスピンドルユニット４に連結されている。スピンドルユニット４とプレッシャフット９は互いに高さ方向に所定の間隔を保って係合していて、スピンドルユニット４が下降する場合、途中までは共に下降し、プレッシャフット９がプリント基板１の上面位置に当接すると、その後はプレッシャフット９がその位置にとどまり、スピンドルユニット４だけ独立に下降し、ドリル３で穴明けができるようになる。穴明けを終え、スピンドルユニット４を上昇させると、ある位置からプレッシャフット９も共に上昇するようになっている。 A pressure foot 9 for pressing the printed circuit board 1 at the time of drilling is engaged with the lower side of the spindle 5. The pressure foot 9 is connected to the spindle unit 4 via a cylinder 8. The spindle unit 4 and the pressure foot 9 are engaged with each other at a predetermined interval in the height direction. When the spindle unit 4 is lowered, the spindle unit 4 is lowered halfway, and the pressure foot 9 is positioned on the upper surface of the printed circuit board 1. After that, the pressure foot 9 stays at that position, and only the spindle unit 4 is lowered independently so that the drill 3 can make a hole. When the drilling is finished and the spindle unit 4 is lifted, the pressure foot 9 is also lifted from a certain position.
ドリル３が降下してプリント基板１の上面位置に当接すると、その検出位置が基板当接位置検出部１０で検出できるようになっている。基板当接位置検出部１０は、例えば特開2001-341052号公報で知られているような、ドリル３を回転駆動するためのロータシャフト（図示せず）に発生する軸電圧を利用するものである。 When the drill 3 is lowered and comes into contact with the upper surface position of the printed circuit board 1, the detected position can be detected by the board contact position detection unit 10. The substrate contact position detection unit 10 uses a shaft voltage generated in a rotor shaft (not shown) for rotationally driving the drill 3 as known in, for example, Japanese Patent Application Laid-Open No. 2001-341052. is there.
１１はスピンドル５の回転、テーブル駆動部６及びスピンドル垂直駆動部７を制御する全体制御部で、例えばプログラム制御の処理装置によって実現され、ここで説明する以外の制御機能を有し、図示されていないブロックにも接続されている。
全体制御部１１は、プリント基板１に対する穴明け位置情報を記憶しており、テーブル駆動部６の内部にある送り位置情報により、テーブル２の２次元位置情報を認識しながらテーブル駆動部６を制御するようになっている。またスピンドル垂直駆動部７の内部にある送り位置情報により、ドリル３の先端の現在の高さ位置情報を認識しながらスピンドル垂直駆動部７を制御するようになっている。
Reference numeral 11 denotes an overall control unit for controlling the rotation of the spindle 5, the table driving unit 6 and the spindle vertical driving unit 7, which is realized by, for example, a program control processing device and has a control function other than that described here, and is illustrated. Not connected to any block.
The overall control unit 11 stores the drilling position information for the printed circuit board 1 and controls the table driving unit 6 while recognizing the two-dimensional position information of the table 2 based on the feed position information inside the table driving unit 6. It is supposed to be. Further, the spindle vertical drive unit 7 is controlled while recognizing the current height position information of the tip of the drill 3 based on the feed position information inside the spindle vertical drive unit 7.
基板当接位置検出部１０の検出信号は全体制御部１１に入力され、全体制御部１１はスピンドル垂直駆動部７の内部にある送り位置情報とからドリル３がプリント基板１の上面位置に当接した位置の高さ情報を認識できるようになっている。 The detection signal of the substrate contact position detection unit 10 is input to the overall control unit 11, and the overall control unit 11 makes contact with the upper surface position of the printed circuit board 1 from the feed position information inside the spindle vertical drive unit 7. The height information of the selected position can be recognized.
図１は本発明の一実施例となるドリル加工装置の動作を説明するための図である。この動作は、図３における全体制御部１１による各部の制御により行われる。図１において、R１はプリント基板に対して最初の穴明けを行う際、ドリルを退避させておくドリルの先端位置の高さを示す。最初の穴明け位置は、プリント基板の厚みの大きい位置になるのかどうか不明なため、初期の高さとなるR1は、ある程度余裕のある高さに設定しておく。 FIG. 1 is a view for explaining the operation of a drilling apparatus according to an embodiment of the present invention. This operation is performed by the control of each unit by the overall control unit 11 in FIG. In FIG. 1, R1 indicates the height of the tip position of the drill in which the drill is retracted when the first drilling is performed on the printed circuit board. Since it is unclear whether the first drilling position is a position where the thickness of the printed circuit board is large, R1 which is the initial height is set to a height with some margin.
最初の穴明けにおいて、ドリルを下降させていきドリルの先端がプリント基板の上面位置Ｌ１に当接すると、図３における基板当接位置検出部１０から検出信号が得られる。最初の穴明けが終わった後は、上面位置Ｌ１を基準としてドリルを所定の長さｈだけ上昇させ、二番目の穴のために退避させる。Ｒ２はここでのドリルの先端位置の高さを示す。二番目の穴明けにおいては、再びドリルを下降させていきドリルの先端がプリント基板の上面位置Ｌ２に当接すると、前記基板当接位置検出部１０から検出信号が得られる。二番目の穴明けが終わった後は、前回と同様に、上面位置Ｌ２を基準としてドリルを所定の長さｈだけ上昇させ、三番目の穴のために退避させる。Ｒ３はここでのドリルの先端位置の高さを示す。 In the first drilling, when the drill is lowered and the tip of the drill comes into contact with the upper surface position L1 of the printed circuit board, a detection signal is obtained from the board contact position detection unit 10 in FIG. After the first drilling is finished, the drill is raised by a predetermined length h with respect to the upper surface position L1, and is retracted for the second hole. R2 indicates the height of the tip position of the drill here. In the second drilling, when the drill is lowered again and the tip of the drill comes into contact with the upper surface position L2 of the printed circuit board, a detection signal is obtained from the board contact position detection unit 10. After the second drilling is completed, the drill is raised by a predetermined length h with respect to the upper surface position L2 as in the previous time, and is retracted for the third hole. R3 indicates the height of the tip position of the drill here.
以下、三番目の穴明け以降、同様に繰り返すことで、穴明けを行ってから次の位置の穴明けを行う場合に、常に所定の高さｈだけドリルを上昇させる。
ここで、長さｈは、隣の位置の穴明けを行う場合のように、X軸、Y軸方向の移動が最短距離にある場合でも、X軸、Y軸方向の位置決めの静定前にドリルがプリント基板に突入することがないだけの余裕を持たせたうえで最小限の大きさに設定しておく。
Thereafter, by repeating the same process after the third drilling, the drill is always lifted by a predetermined height h when drilling the next position after drilling.
Here, the length h is set before the positioning in the X-axis and Y-axis directions is settled even when the movement in the X-axis and Y-axis directions is at the shortest distance as in the case of drilling the adjacent position. The drill should be set to a minimum size with enough room to prevent it from entering the printed circuit board.
以上によれば、プリント基板の厚みに変化があってもそれに追従し、できるだけ一様で無駄のない、最適化されたエアカットを確保できるようになる。従って、ドリル加工の加工精度と生産性を確保することが可能となる。 According to the above, even if there is a change in the thickness of the printed circuit board, it is possible to ensure an optimized air cut that is as uniform and lean as possible. Therefore, it is possible to ensure the drilling accuracy and productivity.
なお、以上の実施例においては、プリント基板の上面検出は、ドリルが降下してプリント基板の上面位置に当接することで実現しているが、他の方法で上面検出を行っても良い。
例えば、図３において、スピンドルユニット４を下降させた場合、プレッシャフット９がプリント基板１の上面位置に到達し、プレッシャフット９だけがそれ以上下降できなくなって、スピンドルユニット４とプレッシャフット９が垂直方向に互いにずれたことを検出するセンサを用いるようにしても良い。この場合、プレッシャフット９の先端部は、ドリルの場合に比べて面積が広いので、プリント基板の厚みへの追従は粗くなる。いずれの方法を採用するかは、エアカット量をどこまで最適化する必要があるかで決めれば良い。
In the above embodiment, the upper surface detection of the printed circuit board is realized by lowering the drill and contacting the upper surface position of the printed circuit board. However, the upper surface detection may be performed by other methods.
For example, in FIG. 3, when the spindle unit 4 is lowered, the pressure foot 9 reaches the upper surface position of the printed circuit board 1, and only the pressure foot 9 cannot be lowered any further, and the spindle unit 4 and the pressure foot 9 are vertical. You may make it use the sensor which detects having shifted | deviated to the direction mutually. In this case, since the tip end portion of the pressure foot 9 has a larger area than that of the drill, the follow-up to the thickness of the printed board becomes rough. Which method should be used can be determined by how much the air cut amount needs to be optimized.
また、以上の実施例においては、一つの穴明けを行う毎に退避位置を変化させることができるようにしたが、以下のようにして、必ずしも毎回変化させなくても良い。
図３において、穴明け位置情報を記憶している全体制御部１１は、次の加工位置が今回の加工位置に対しプリント基板１上で予め決められた大きさよりも離れているかどうかを常に監視し、それが所定値Ｄ１を越えていない場合には、次の加工位置の加工のための退避位置は、今回の加工位置での退避位置を変えずに同じとする。所定値Ｄ１を越えるような場合にだけ、プリント基板１の上面位置から所定の高さｈだけドリルを上昇させる。
このようにすることで、退避位置はプリント基板の厚みに粗く追従することになるが、プリント基板の厚みの変化がそれほど急勾配でなかったり、所定の高さｈに余裕を持たせてあったりする場合は、問題はない。
In the above embodiment, the retracted position can be changed every time one hole is made. However, it is not always necessary to change it every time as follows.
In FIG. 3, the overall control unit 11 storing the drilling position information always monitors whether or not the next processing position is separated from the current processing position by a predetermined size on the printed circuit board 1. If it does not exceed the predetermined value D1, the retreat position for machining at the next machining position is the same without changing the retreat position at the current machining position. Only when the predetermined value D1 is exceeded, the drill is raised from the upper surface position of the printed circuit board 1 by a predetermined height h.
By doing so, the retracted position roughly follows the thickness of the printed circuit board, but the change in the thickness of the printed circuit board is not so steep, or there is a margin for the predetermined height h. If you want, there is no problem.
また、以上の実施例において、図２に示すように、次の穴明け位置Ｐｍが今回の穴明け位置Ｐｎと大きく離れている場合、図２から理解されるように、プリント基板の厚みが大きく変化している可能性がある。この場合には、所定の高さｈの大きさにもよるが、所定の高さｈだけのドリルの上昇だけでは、エアカット量が不十分で、X軸、Y軸方向の位置決めの静定前にドリルがプリント基板に突入することもあり得る。
これを防止するため、図３における全体制御部１１は、前記と同様に、次の加工位置が今回の加工位置に対しプリント基板１上で予め決められた大きさよりも離れているかどうかを常に監視し、それが所定値Ｄ２を越えるような場合には、ドリルの先端位置をいったん余裕のある初期高さR1の高さまで上昇させてから次の加工位置の穴明けを行う。
Further, in the above embodiment, as shown in FIG. 2, when the next drilling position Pm is far away from the current drilling position Pn, the thickness of the printed circuit board is large as understood from FIG. It may have changed. In this case, although depending on the size of the predetermined height h, the amount of air cut is not sufficient only by raising the drill by the predetermined height h, and the positioning in the X-axis and Y-axis directions is static. It is possible for the drill to enter the printed circuit board before.
In order to prevent this, the overall control unit 11 in FIG. 3 always monitors whether or not the next processing position is farther than a predetermined size on the printed circuit board 1 with respect to the current processing position, as described above. However, if it exceeds the predetermined value D2, the drill tip position is once raised to a sufficient initial height R1, and then the next machining position is drilled.
１：プリント配線板、２：テーブル、３：ドリル、４：スピンドルユニット
５：スピンドル、６：テーブル駆動部、７：スピンドル垂直駆動部、８：シリンダ
９：プレッシャフット、１０：基板当接位置検出部、１１：全体制御部
1: printed wiring board, 2: table, 3: drill, 4: spindle unit 5: spindle, 6: table drive unit, 7: spindle vertical drive unit, 8: cylinder 9: pressure foot, 10: substrate contact position detection Part 11: Overall control part
Claims (6)
6. The drilling method according to claim 4 or 5, wherein when the next processing position is away from a predetermined size on the substrate with respect to the current processing position, the drilling method is retracted to a position separated from the predetermined distance. A drilling method characterized by that.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2019005892A (en) * | 2017-06-23 | 2019-01-17 | ビアメカニクス株式会社 | Drill processing device and drill processing method |
| JP2020157469A (en) * | 2019-03-22 | 2020-10-01 | ビアメカニクス株式会社 | Drilling device and drilling method |
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| JPH05261610A (en) * | 1992-03-17 | 1993-10-12 | O M Ltd | Drilling method of printed wiring board |
| JPH07290399A (en) * | 1994-04-21 | 1995-11-07 | Hitachi Seiko Ltd | Spindle lift end setting device for printed board machining device when machining position is moved |
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| JP7046684B2 (en) | 2017-06-23 | 2022-04-04 | ビアメカニクス株式会社 | Drilling equipment and drilling method |
| TWI770202B (en) * | 2017-06-23 | 2022-07-11 | 日商維亞機械股份有限公司 | Drilling machine processing device and drilling machine processing method |
| JP2020157469A (en) * | 2019-03-22 | 2020-10-01 | ビアメカニクス株式会社 | Drilling device and drilling method |
| JP7292186B2 (en) | 2019-03-22 | 2023-06-16 | ビアメカニクス株式会社 | Drilling device and drilling method |
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| JP6339428B2 (en) | 2018-06-06 |
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