JP2002166396A - Printed board punching method and printed board punching machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board punching method and a printed board punching machine capable of enhancing processing position accuracy and processing efficiency. SOLUTION: A lowering starting time of a drill 4 is determined on the basis of an ending time point of a movement command to an X axis movement means 3 and/or a Y axis movement means 7 from setting times Kx and Ky from ending of the moving command with respect to the X axis movement means 3 and/or the Y axis movement means 7 along X axis direction and Y axis direction to setting of the X axis movement means 3 and/or the Y axis movement mechanism 7 into a processing position, and a movement time t1 from starting of the lowering of the drill 4 to arrival of the drill 4 at a top surface of a printed board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board drilling method and a printed circuit board drilling machine for drilling a printed circuit board at a predetermined position.

[0002]

2. Description of the Related Art FIG. 3 is a block diagram of a conventional printed circuit board drilling machine.

A table 2 on which a printed circuit board 1 to be processed is placed on the upper surface is movable in an X-axis direction (front-back direction) by an X-axis moving device 3. The spindle 5 holding the drill 4 can be moved in the Z-axis direction (vertical direction) by a Z-axis moving device 6. The Z-axis moving device 6 is movable in the Y-axis direction (left-right direction) by the Y-axis moving device 7. The NC control device 9 controls operations of the X-axis moving device 3, the Y-axis moving device 7, and the Z-axis moving device 6.

In the above configuration, the NC control device 9
According to a machining program input in advance, the X-axis moving device 3
And the Y-axis moving device 7 are operated to position the drill 4 at the processing position 8 on the printed circuit board 1. Next, the Z-axis moving device 6 is operated, the spindle 5 is lowered to a predetermined position, and a hole is formed in the printed circuit board 1. After the processing is completed, the spindle 5 is raised, the drill 4 is extracted from the printed circuit board 1, and the X-axis moving device 3 and the Y-axis moving device 7
Is operated to position the drill 4 at the next processing position 8. Hereinafter, the above operation is repeated until the machining program ends.

[0005] The processing time is determined by the processing time for each hole. Therefore, the height of the tip of the drill 4 when the drill 4 is moved to the next processing position 8 after processing one hole is set to the minimum height in consideration of variations in the thickness of the printed circuit board 1. In addition, the vertical movement distance (air cut amount) in which the drill 4 is not involved in the processing is reduced.

FIG. 4 is a diagram for explaining the technique disclosed in Japanese Patent Application Laid-Open No. H11-305819. The upper part of FIG. 4 is a speed command line for the X-axis moving device 3, and the lower part is a speed command line for the Z-axis moving device 6. FIG. If the air cut amount is determined in advance, the movement time t1 during which the Z-axis moving device 6 moves the air cut amount can be immediately obtained. Therefore, the movement time t2 is calculated based on the movement amount of the X-axis movement device 3 to the next processing position, and the Z-axis movement device 6 is moved when the movement time to the target position reaches the remaining time t1.

According to this technique, since the drill 4 is cut into the printed circuit board 1 at the same time when the table 2 reaches the target position, the processing efficiency can be improved.

[0008]

In recent years, high-speed rotating spindles have been developed to enable a drill to be cut at a high speed and to process a small-diameter hole.
Small diameter drills have become available.

[0009] However, when drilling is performed by using the above-mentioned conventional technique, the positional accuracy of the drilled hole is reduced, or the small diameter drill is broken, thereby reducing the processing efficiency.

An object of the present invention is to provide a printed circuit board drilling method and a printed circuit board drilling machine which can solve the problems in the prior art and can improve the processing position accuracy and the processing efficiency.

[0011]

In order to achieve the above object, according to the first aspect of the present invention, a printed board and a drill are connected by X,
A method of boring a printed circuit board, comprising: moving a drill relatively in a Y direction and lowering a drill in a vertical direction at a processing position to form a hole in the printed circuit board;
The time from the end of the direction movement command to the time when the printed board or / and the drill is settled at the processing position, and the time from when the drill starts descending to when the drill reaches the upper surface of the printed board. Thus, the descent start timing of the drill is determined.

Further, according to the present invention, an X-axis moving means and a Y-axis moving means for relatively moving the printed board and the drill in the X and Y directions, and a Z-axis moving means for moving the drill in a vertical direction. Means for making a hole in the printed circuit board by lowering the drill vertically in a processing position.
X for the axis moving means and / or the Y axis moving means
The time from when the movement command in the Y direction is completed to when the X-axis movement means and / or the Y-axis movement means settles at the processing position, and when the drill starts descending and reaches the upper surface of the printed circuit board. The timing of starting the descent of the drill is determined from the time until the drilling.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment. Note that the entire configuration is the same as that of FIG. 3 except for the NC control device, so that the illustration is omitted.

FIG. 1 shows an X-axis moving device 3 according to the present invention and Z
It is a figure explaining operation of axis movement device 6, (a) shows a speed command and a speed response to X-axis movement device 3, (b)
Represents a position command and a position response to the X-axis moving device 3,
(C) shows a speed command to the Z-axis moving device 6, respectively.

As shown in FIG. 1A, the X-axis moving device 3
Has a large mass, the response to the command is delayed, and the target position is reached (time j2) after time Tm (time j1) after the end of the speed command (time j2), but the inertia force causes overrun. After the displacement is corrected, the vehicle stops at the target position (time j4).

For example, if the positional tolerance is ± α, the drill 4 is cut into the printed circuit board 1 between the time j1 and the time j3 as shown in FIG. Not only does the position shift, but in the case of a small-diameter drill, the printed board 1 may be broken due to movement.

On the other hand, since the Z-axis moving device 6 has a small mass, there is almost no delay in the position response to the position command.
It is negligible. Further, since the acceleration time is short, it can be regarded as a constant speed movement. Therefore, Z
Assuming that the moving speed (processing speed) of the shaft moving device 6 is Vz and the air cut amount is Da, the moving time t1 from when the drill 4 starts moving to when the drill 4 reaches the upper surface of the substrate can be expressed by Expression 1.

T1 = Da / Vz (1) Then, if the drill 4 is cut after the time j3, the processing accuracy is improved, and the breakage of the small diameter drill is prevented to improve the work efficiency. Can be. Hereinafter, the time from time j1 to time j3 is referred to as the settling time Kx of the X-axis moving device 3. The settling time of the Y-axis moving device 7 is called a settling time Ky. The settling time Kx and the settling time Ky are determined by the NC controller 9
By adjusting these control parameters, any of them can be fixed (for example, 20 ms) below a certain value.

FIG. 2 is a flowchart showing the operation procedure of the spindle when the drill 4 is moved to the next machining position after machining one hole according to the present invention. In this example, the settling time Kx and the settling time Ky are shown. Are approximately equal.

The NC controller 9 refers to the machining program to determine the moving distances Lx and Ly in the X-axis direction and the Y-axis direction to the next machining position (step S100 in FIG. 2).
The movement times Tx and Ty are obtained (procedure S110). Then, the travel time Tx and the travel time Ty are compared, and Tx ≧ T
If y, the process of step S130 is performed, and if Tx <Ty, the process of step S200 is performed (step S120). In step S130, the settling time Kx is compared with the moving time t1,
If Kx ≧ t1, the movement start time T of the Z-axis moving device 6
zs is set to Tzs = (Kx-t1), that is, after the movement command to the X-axis moving device 3 is completed (Kx-t1) (step S140), the process ends, and when Kx <t1, the movement start time Tzs is set to Tzs. =-(T1-Kx), that is, before the end of the movement command to the X-axis moving device 3 (t1-Kx)
And the process ends.

In step 200, the settling time Ky is compared with the moving time t1, and if Ky ≧ t1, the Z-axis moving device 6
Is set to Tzs = (Ky-t1), that is, after the end of the movement command to the Y-axis moving device 7 (Ky−t1).
At t1) (step S210), the process ends, and Ky <t
In the case of 1, the movement start time Tzs is set to Tzs =-(t1-
Ky), that is, before the end of the movement command for the Y-axis moving device 7 (t1-Kx) (step S220), the process ends.

In this embodiment, not only the settling time Kx of the X-axis moving device 3 but also the settling time Ky of the Y-axis moving device 7
In consideration of this, the drill 4 is cut into the printed circuit board 1, so that the processing accuracy is improved, and the breakage of the small-diameter drill can be prevented to improve the work efficiency.

If the settling time Ky is sufficiently short, it may be ignored.

[0024]

As described above, according to the present invention,
The time from the end of the XY direction movement command to the printed circuit board or / and the drill until the printed circuit board or / and the drill settles to the processing position, and the time from when the drill starts descending to when it reaches the upper surface of the printed circuit board From the travel time of the drill, the descent start time of the drill is determined.
The working accuracy can be improved, and the breakage of the small diameter drill can be prevented to improve the work efficiency.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating the operation of an X-axis moving device and a Z-axis moving device according to the present invention.

FIG. 2 is a flowchart showing an operation procedure of the present invention.

FIG. 3 is a configuration diagram of a printed board drilling machine.

FIG. 4 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 3 X-axis movement means 4 Drill 7 Y-axis movement means Kx Settling time of X-axis movement means Ky Settling time of Y-axis movement means t1 Air cut amount movement time of drill Tzs Movement start time

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuo Watanabe 2100 Kamiimaizumi, Ebina-shi, Kanagawa F-term in Hitachi Via Mechanics Co., Ltd. 3C036 AA01 3C060 AA11 BA05 BG13 BH02

Claims (2)

[Claims] 1. A method for boring a printed circuit board, comprising: moving a printed circuit board and a drill relatively in X and Y directions, and lowering the drill vertically in a processing position to form a hole in the printed circuit board. The time from the end of the XY movement command to the printed circuit board or / and the drill until the printed circuit board or / and the drill is settled at the processing position, and A method of drilling a printed circuit board, comprising determining a descent start time of the drill from a time until the drill reaches the upper surface of the printed circuit board. 2. A processing position comprising: an X-axis moving unit and a Y-axis moving unit for relatively moving a printed board and a drill in X and Y directions; and a Z-axis moving unit for moving the drill in a vertical direction. In the printed circuit board drilling machine for making a hole in the printed circuit board by lowering the drill in the vertical direction, after the movement command in the XY direction to the X-axis moving means and / or the Y-axis moving means is completed. The time required for the X-axis moving means and / or the Y-axis moving means to settle to the processing position and the time required for the drill to start moving down and reach the upper surface of the printed circuit board are determined by A printed circuit board drilling machine, which determines the descent start time.