JP2016002639A - Surface processing apparatus, surface processing facility, and surface processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface processing apparatus for suppressing the density change of abrasive grains to be used in circulation at the surface processing of a wet blast.SOLUTION: A surface processing apparatus comprises: a nozzle part 5 for mixing a slurry prepared by dispersing abrasive grains into a liquid, to inject the mixture onto the surface of a working object 2; a nozzle moving part for moving the nozzle part 5 in a main scanning direction; a working object transportation part 4 for step-transporting the working object 2 in an auxiliary scanning direction perpendicular to said main scanning direction; a slurry circulation feed section 8 for recovering the slurry injected from the nozzle part 5 thereby to circulate and feed the slurry to the nozzle part 5; and a nozzle cover part 6 for regulating the outflow direction of the slurry injected from the nozzle part 5 toward the working object 2, thereby to discharge the slurry to said slurry circulation feed section.

Description

  The present invention relates to a technique for processing the surface of an object to be processed by wet blasting.

  In the surface treatment technology by wet blasting, a slurry in which abrasive grains are dispersed in a liquid and a high-pressure gas are mixed in a blast nozzle, and the slurry accelerated by the high-pressure gas is sprayed onto the surface of the workpiece to be processed. Processing is performed while crushing the surface (Patent Documents 1 and 2).

  In general, in a surface processing apparatus using wet blasting, slurry in a slurry reservoir is supplied to a blast nozzle by a pump and sprayed onto a workpiece, and the slurry sprayed on the workpiece is collected again in the slurry reservoir.

  When surface processing is performed on a workpiece by numerical control with a surface processing apparatus using wet blasting, the surface of the workpiece is measured in advance, a removal amount serving as a target value is obtained, and a blast nozzle and a workpiece are connected to a predetermined target. Move relative to speed. At that time, if the concentration of the slurry changes, the surface of the object to be processed cannot be processed with the target value. When the abrasive grains settle on the surface of the workpiece, the concentration of the abrasive grains in the recovered slurry decreases. In particular, when the size of the object to be processed increases, the surface area of the object to be processed increases, the amount of settling of abrasive grains increases, and the concentration of abrasive grains in the slurry decreases greatly.

  In addition, in the surface treatment by wet blasting, angular abrasive grains may pierce the surface of the workpiece, and chips of the pierced abrasive grains may remain. If abrasive chips remaining on the surface of the object to be processed remain, the surface processing to be performed next on the object to be processed may be affected.

Japanese Patent No. 4969839 JP 2005-262432 A

  An object of the present invention is to provide a surface processing apparatus and a surface processing method that can suppress a change in the concentration of abrasive grains in a circulating slurry.

  Another object of the present invention is to provide a surface processing facility and a surface processing method capable of removing chips of abrasive grains remaining on the surface of an object to be processed.

The structure of the surface processing apparatus which implement | achieves the objective of this invention is related with the surface processing apparatus which processes the surface of a workpiece by wet blasting.
The surface processing apparatus includes a nozzle unit that mixes a slurry in which abrasive grains are dispersed in a liquid with a high-pressure gas and jets the slurry onto the surface of a workpiece, and a nozzle moving unit that moves the nozzle unit in the main scanning direction. A processing object conveyance unit that step-conveys the processing object in a sub-scanning direction orthogonal to the main scanning direction, and a slurry circulation supply that collects slurry sprayed from the nozzle unit and circulates it to the nozzle unit And a nozzle cover part that regulates the outflow direction of the slurry sprayed from the nozzle part toward the workpiece and discharges it to the slurry circulation supply part.

In the surface processing method for realizing the object of the present invention, the slurry mixed with the high pressure gas at the nozzle portion is sprayed onto the surface of the workpiece to be conveyed stepwise in the sub scanning direction while moving the nozzle portion in the main scanning direction. The present invention relates to a surface processing method using wet blasting.
In this surface processing method, the flow direction of the slurry sprayed from the nozzle portion toward the object to be processed is regulated and discharged in a predetermined direction, and the discharged slurry is collected and supplied to the nozzle portion.

  The structure of the surface processing equipment that realizes the object of the present invention is a surface processing apparatus by wet blasting that processes by jetting slurry from the nozzle part while moving the nozzle part in the main scanning direction with respect to the surface of the workpiece. The present invention relates to a surface processing facility arranged in plural along the sub-scanning direction of the processing object.

  The surface processing equipment is arranged in plural along the sub-transport direction of the processing object and the processing object transport unit for step-conveying the processing object in the sub-scanning direction. A plurality of surface processing devices, the first surface processing device and the second surface processing device from the upstream side to the downstream side in the transport direction of the workpiece. The first abrasive grains in the slurry of the slurry circulation supply unit of the first surface processing apparatus are coarsened, and the first abrasive grains in the slurry of the slurry circulation supply unit of the second surface processing apparatus are arranged in order. The grain size of 2 abrasive grains was made finer than the grain size of the first abrasive grains.

  In another surface processing method that realizes the object of the present invention, the outflow direction of the first slurry that is jetted toward the workpiece to be transported stepwise from the first nozzle portion that moves in the main scanning direction is regulated to a predetermined direction. A first step of collecting the discharged first slurry and supplying the discharged first slurry to the first nozzle portion; and a processing region of the workpiece to be surface-treated in the first step, in a main scanning direction. The flow direction of the second slurry sprayed from the moving second nozzle portion toward the workpiece is regulated and discharged in a predetermined direction, and the discharged second slurry is collected and supplied to the second nozzle portion. A second step, wherein the first abrasive grains in the first slurry have a coarse particle diameter, and the second abrasive grains in the second slurry have a finer particle diameter than the first abrasive grains. It is characterized by.

  According to the inventions according to claims 1 to 16, since the concentration change of the abrasive grains in the slurry can be suppressed and maintained substantially constant from the start to the end of the surface treatment work, the actual surface removal of the workpiece The amount can be made to coincide with the target removal amount, and high-precision surface processing can be performed.

  According to the invention which concerns on Claims 17-23, the residue of the abrasive grain in the slurry which remained on the surface of the target object in the first surface processing process is surface-processed again by the fine abrasive grains in the next surface processing process. So it is removed. For this reason, high planarization and residue removal can be performed simultaneously. In addition, cleaning can be performed at the same time, the processing capability is improved, and the introduction of foreign matters to the subsequent process can be reduced.

The surface processing apparatus by 1st Embodiment of this invention is shown, (a) is a perspective view which shows schematic structure of the whole apparatus, (b) is a figure which shows the distance between a nozzle and a cover. The schematic front view of the surface processing apparatus shown in FIG. Diagram showing the relationship between slurry concentration and processing speed The figure which shows the time-dependent change of a slurry density | concentration. The top view which shows the outline of the whole structure of the surface processing equipment by 2nd Embodiment of this invention.

  Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

1 to 4 show a first embodiment of the present invention, FIG. 1 shows a surface processing apparatus, (a) is a perspective view showing a schematic configuration of the whole apparatus, (b) is a nozzle and a cover. FIG. 2 is a schematic front view of the surface processing apparatus shown in FIG. FIG. 3 is a diagram showing the relationship between the slurry concentration and the processing speed, and FIG. 4 is a diagram showing the change of the slurry concentration with time.

  In FIG. 1 and FIG. 2, directions orthogonal to each other in the horizontal plane are defined as an X-axis direction and a Y-axis direction. The wet blast surface processing apparatus 1 includes a workpiece transfer unit 4 having a moving table 3 on which a workpiece (hereinafter referred to as a workpiece) 2 is placed, a nozzle unit 5 for wet blasting, and a nozzle unit 5 as an X axis. A nozzle moving unit (not shown) that moves in the main scanning direction along the direction, a nozzle cover unit 6, a slurry circulation supply unit 8 that circulates and supplies slurry to the nozzle unit 5, and a nozzle unit 5 from a high-pressure air source (not shown). And a high-pressure air supply unit 9 for supplying high-pressure air to the unit.

  The work transport unit 4 moves the moving table 3 on which a nut portion (not shown) screwed to, for example, a screw shaft 4a rotated by a table driving unit (not shown) is fixed along the Y-axis direction that is the sub-scanning direction. Step scan. The table driving unit is driven and controlled by a controller that performs numerical control (NC) (not shown). A glass substrate made of, for example, quartz glass is placed horizontally on the moving table 3 as the work 2. As this glass substrate, for example, a product cut out with a predetermined width from a rectangular ingot of synthetic quartz glass by a wire saw can be exemplified. The glass substrate is used, for example, as a photomask for an exposure apparatus used for producing a substrate for a liquid crystal panel.

  Generally, a glass substrate cut out by a wire saw has poor flatness, and surface processing such as surface grinding using a grindstone is performed. In this processing method, since the workpiece is flattened while being fixed to the table of the surface grinder, the flatness of the front surface follows the flatness of the back surface after the processing is finished, and the flatness of the back surface does not come out. There is a problem that the flatness is not improved.

  In the present embodiment, in such a glass substrate, surface processing can be effectively performed on a large-sized glass substrate, for example, one having a side of 300 mm square or more.

  The nozzle unit 5 mixes slurry and high-pressure air, and sprays the slurry toward the surface of the work 2 from a slit-like nozzle opening formed in the Y-axis direction formed at the nozzle end. The abrasive grains in the slurry sprayed at a high speed crush the surface of the workpiece 2 and perform the processing. Further, the nozzle end of the nozzle portion 5 is formed in a rectangular shape in which the length along the X-axis direction is shorter than the length along the Y-axis direction.

  Therefore, when the nozzle unit 5 moves in the main scanning direction along the X-axis direction, the nozzle unit 5 sprays slurry onto the surface of the workpiece 2 with the nozzle opening length along the Y-axis direction.

  The nozzle unit 5 includes a slurry supply port (not shown) to which the pipe end of the slurry supply pipe 8a of the slurry circulation supply unit 8 is connected and a pipe end of the high pressure air pipe 9a of the high pressure air supply unit 9 (not shown). It has an air supply port, high-pressure air and slurry are mixed in a mixing chamber (not shown), and the slurry is ejected from the slit-shaped nozzle opening.

  The nozzle moving unit suspends and holds the nozzle unit 5, is driven and controlled by the controller, and moves the nozzle unit 5 in the main scanning direction at the calculated main scanning speed in the case of surface processing by numerical control. Further, in the case of surface processing not based on numerical control, the nozzle moving unit moves the nozzle unit 5 in the main scanning direction at a predetermined main scanning speed.

  The nozzle cover part 6 is opposed to both ends along the X-axis direction of the pair of partition plates 61, 62 disposed opposite to both ends in the Y-axis direction of the nozzle part 5 at a predetermined distance. It has a rectangular frame 65 formed by a pair of short side plates 63 and 64 that are arranged and extend along the Y-axis direction. The nozzle unit 5 is accommodated in the frame body 65 and allows movement in the main scanning direction (X-axis direction).

  The frame 65 has a pair of partition plates 61 and 62 extending outward from both ends of the moving table 3 in the X-axis direction, and portions extending from the moving table 3 are connected to slurry receiving portions 81 described later. The Since the slurry receiver 81 is fixed to a base (not shown) of the entire apparatus, the frame body 65 is fixed.

  The partition plates 61 and 62 of the frame 65 have a gap with the surface of the work 2 placed on the movable table 3, and a seal member 66 that prevents the slurry from leaking into the gap is provided in the partition plates 61 and 62. It is attached to the lower end of the. That is, the tip of the seal member 66 attached to the bottom opening side of the frame 65 comes into contact with the surface of the work 2, and the work 2 moves while sliding on the seal member 66 as the moving table 3 moves. Examples of the sealing member 66 include elastic members such as sponges and rubber plates.

  That is, the slurry sprayed onto the work 2 from the nozzle end of the nozzle portion 5 is regulated in the outflow direction by the frame body 65 and the seal member 66 and does not leak out from the inside of the frame body 65 to the slurry receiving portion 81. Discharged. The slurry sprayed from the nozzle portion 5 into the frame body 65 is discharged to the slurry receiving portion 81 without staying in the frame body 65, so that abrasive grains in the slurry may settle on the surface of the workpiece 2. Is prevented. If there is no frame 65, the slurry sprayed from the nozzle unit 5 spreads over the entire surface of the workpiece 2 and is guided to the slurry receiving unit 81. In this case, when the glass substrate which is the workpiece 2 is increased in size and the surface area is increased, the flow rate (flow rate) until the sprayed slurry reaches the end surface of the glass substrate is reduced, and the abrasive grains which have settled in the middle become the slurry receiving portion 81. It may remain without being washed away.

  As described above, when the abrasive grains remain on the glass substrate, the concentration of the abrasive grains of the slurry recovered from the slurry receiving portion 81 is lowered. As shown in FIG. 3, the relationship between the concentration of abrasive grains in the slurry and the processing speed increases the processing speed as the concentration increases.

  In FIG. 3, as processing conditions, abrasive grains are WA # 800, the length in the longitudinal direction of the rectangular nozzle formed in the slit-like opening of the nozzle portion 5 is the nozzle width, and the length in the short direction is the nozzle gap. The nozzle width was 25 mm, the nozzle gap was 2 mm, the gap was 20 mm, and the air pressure was 0.25 MPa.

  On the other hand, since the injection of the slurry by the nozzle portion 5 is performed only in the frame body 65, the slurry receiving portion 81 is at a high speed without changing the flow rate (flow rate) of the slurry in the frame body 65. So that the abrasive grains do not remain on the surface of the workpiece 2.

  On the other hand, it is desirable to prevent the slurry, which has been sprayed from the nozzle portion 5 in the frame body 65 and soared, from scattering from the upper opening of the frame body 65 to the outside. In the present embodiment, as a measure for preventing slurry scattering, a movable ceiling portion 67 such as a shutter structure or a bellows structure is provided, for example, and the upper opening of the frame body 65 is not obstructed by the nozzle portion 5 moving in the main scanning direction. Can be blocked at all times. The ceiling portion 67 shown in FIGS. 1 and 2 overlaps a plurality of top plates 67a and allows the overlapping ceiling plates 67a to move along the X-axis direction.

  In this embodiment, as shown in FIG.1 (b), distance w is 5 mm-20 mm from a pair of partition plates 61 and 62 and the nozzle end (both ends of nozzle opening) of the nozzle part 5. As shown in FIG. If the distance w is shorter than 5 mm, it will affect the ejection of the slurry by the nozzle part 5 and cause a change in the removal amount. If the distance w is longer than 20 mm, there will be a place where the settling of abrasive grains in the slurry occurs.

  The slurry circulation supply unit 8 is a pair of slurry receiving portions 81 arranged opposite to each other along the X-axis direction connected to the lower end of the frame at both ends of the frame 65, and the slurry collected by the pair of slurry receiving portions 81 And a liquid feed pump 83 for feeding the slurry in the slurry tank 82 to the slurry pipe 8c. The tip of the slurry pipe 8c is connected to the slurry supply port of the nozzle unit 5. Connected to the slurry supply pipe 8a. As the slurry supply pipe 8a, a flexible vinyl pipe or the like is used in order to follow the movement of the nozzle portion 5 in the main scanning direction. For the same reason, a flexible vinyl pipe or the like is used as the high-pressure air pipe 9a of the high-pressure air supply unit 9.

  Since the slurry circulation supply part 8 of this embodiment collects the slurry injected into the frame body 65 of the nozzle cover part 6 without leaving the slurry receiving part 81, there is little change in the abrasive grain concentration in the slurry. For this reason, the slurry concentration retransmitted to the nozzle unit 5 can always be kept constant, and the influence on the surface processing on the workpiece 2 is small.

  FIG. 4 shows the change over time in the slurry concentration (processing time during surface processing). A case where the nozzle cover portion 6 is not provided is indicated by a circle, and a case where the nozzle cover portion 6 is not provided is indicated by a rhombus. Processing conditions are: abrasive grains; WA # 800, slurry concentration: 20 wt%, nozzle: 25 mm width, gap: 2 mm, gap between nozzle end and workpiece surface: 20 mm, air pressure: 0.25 MPa, slurry flow rate: 1.7 L / min, nozzle scanning method: raster scan with a pitch of 2 mm, nozzle scanning speed: 1000 mm / min, workpiece: quartz glass of 350 mm × 350 mm. As a method for measuring the concentration, the slurry was extracted from the slurry tank during and at the end of processing, and the concentration was measured.

  When the slurry concentration is measured with reference to the processing start time, the slurry concentration greatly changes as the processing time elapses when the nozzle cover portion 6 is not provided. On the other hand, when the nozzle cover portion 6 is provided, the slurry concentration hardly changes.

  Therefore, in the present embodiment, the change in slurry concentration can be avoided, so that there is no change in the processing speed, and high-accuracy processing can be realized.

  In the present embodiment, examples of the abrasive grains include alumina, ceria, and zirconia ceramics, but are not particularly limited thereto.

  The abrasive grain size can be exemplified by # 600 to 6000. When the abrasive grain size is smaller than # 600, cracking of the abrasive grains tends to occur, and the processing speed tends to decrease. When it is larger than # 6000, the processing speed is slowed, which affects the processing capacity.

  The air pressure varies depending on the slurry concentration and the abrasive grain type, but is preferably 0.15 to 0.3 MPa in consideration of processing stability.

  The distance (gap) between the nozzle end of the nozzle portion 5 and the surface of the workpiece 2 is preferably 5 to 50 mm. If it is smaller than 5 mm, abrasion of the nozzle tip (nozzle end face) of the nozzle portion 5 is likely to occur due to rebound of the abrasive grains. When it is larger than 50 mm, the processing speed becomes slow.

  The slurry concentration (concentration of abrasive grains in the slurry) is preferably 15 to 30 wt% in consideration of processing efficiency.

Second Embodiment FIG. 5 is a top view schematically showing the overall configuration of a surface processing facility according to a second embodiment of the present invention.

  The surface processing equipment 10 of the present embodiment has a configuration in which three surface processing apparatuses shown in FIG. 1 are arranged independently along the conveyance direction of the workpiece 2.

  A first surface processing device 11, a second surface processing device 12, and a third surface processing device 13 are arranged in order from the upstream side to the downstream side in the conveyance direction of the workpiece 2 by the workpiece conveyance unit 4. The first surface processing device 11, the second surface processing device 12, and the third surface processing device 13 are controlled by the controller described in the first embodiment. Further, the first surface processing device 11, the second surface processing device 12, and the third surface processing device 13 each have an independent slurry circulation supply unit 8.

  The slurry circulation supply unit 8 of the first surface processing apparatus 11 uses larger abrasive grains having a size of WA # 600 to 1500 as abrasive grains. Then, numerical control (NC) processing is performed by the controller, and a first step is performed which is a flattening processing of a quartz glass substrate as the work 2. In this first step, chips of abrasive grains stuck on the surface of the glass substrate that is the workpiece 2 may remain.

  The abrasive circulation supply unit 8 of the second surface processing apparatus 12 uses smaller abrasive grains having a size of WA # 2000 to 6000 as abrasive grains. Then, the controller moves the nozzle portion 5 at a constant speed in the main scanning direction to process the first processed region in the workpiece 2, and the abrasive remaining on the surface of the glass substrate that is the workpiece 2 in the first step. A second step of removing the grain chips is performed. Since the abrasive grain size in the second step is small, not only the abrasive grains are not pierced, but also the abrasive residue remaining in the first step can be removed.

  A third step of a cleaning scan is performed in which only the water is recirculated without adding abrasive grains to the slurry circulation supply unit 8 of the third surface processing apparatus 13, and the region where the second step is completed is washed with water. In the third step, the surface of the glass substrate that is the workpiece 2 can be cleaned.

  The controller step-drives the work transport unit 4 and moves the moving table 3 on which the work 2 is placed by a predetermined distance in the Y-axis direction. Moreover, the said controller is the workpiece conveyance part 4 at the timing when each nozzle part 5 of the 1st surface processing apparatus 11, the 2nd surface processing apparatus 12, and the 3rd surface processing apparatus 13 was located in the movement end of the main scanning direction. And the workpiece 2 is step-scanned (moved) by a predetermined distance in the Y-axis direction.

  First, the workpiece 2 is flattened by numerical control by the first surface processing apparatus 11, and surface processing is performed by a raster scan method (first step). Next, when the workpiece 2 reaches the arrangement position of the second surface processing apparatus 12, the second surface processing apparatus 12 has an abrasive grain size larger than that of the first process with respect to the processed surface that has been flattened in the first process. Surface processing is performed by constant speed scanning with a slurry having small abrasive grains (second step), and the residue generated in the first step is removed. During the second step, the work 2 is subjected to the flattening process in the first step.

  Subsequently, when the processed surface that has undergone the surface processing in the second step reaches the arrangement position of the third surface processing apparatus 13, a cleaning step by high-pressure injection of water is executed (third step). During the execution of the third process, the first process and the second process described above are performed on the workpiece 2.

  As described above, according to the first and second embodiments described above, the surface processing without changing the concentration of the slurry can be realized, so that the removal amount can be adjusted with high reproducibility. That is, the removal amount used for the calculation and the removal amount at the time of actual machining coincide with each other, and high flattening by correction processing is possible.

  The device is inexpensive and can be made compact.

  In particular, according to the second embodiment, high flattening processing, residue removal, and cleaning can be performed at the same time, the processing capability is improved, and it is possible to reduce the introduction of foreign matters into subsequent processes such as machining using a grindstone.

  In each of the embodiments described above, the workpiece 2 is placed on the moving table 3 in a horizontal state and step-scanned in a predetermined direction. However, the workpiece 2 is moved with the moving table standing in the vertical direction. May be.

DESCRIPTION OF SYMBOLS 1 Surface processing apparatus 2 Work 3 Moving table 4 Work conveyance part 5 Nozzle part 6 Work cover part 61, 62 Partition plate 63, 64 Short side plate 65 Frame 66 Seal member 8 Slurry circulation supply part 9 High pressure air supply part

Claims (28)

A surface processing apparatus for processing the surface of an object to be processed by wet blasting,
A nozzle unit that mixes a slurry in which abrasive grains are dispersed in a liquid with a high-pressure gas and injects the slurry onto the surface of the workpiece;
A nozzle moving section for moving the nozzle section in the main scanning direction;
A processing object transport unit for step-transporting the processing object in a sub-scanning direction orthogonal to the main scanning direction;
A slurry circulation supply unit that collects slurry sprayed from the nozzle unit and circulates and supplies the slurry to the nozzle unit;
A nozzle cover part that regulates the outflow direction of the slurry sprayed from the nozzle part toward the workpiece and discharges it to the slurry circulation supply part;
A surface processing apparatus.   The nozzle cover portion accommodates the nozzle portion so as to be movable in the main scanning direction, extends along the main scanning direction, and is provided on the frame body side with a gap between the processing object and the frame body. The surface processing apparatus according to claim 1, further comprising: a seal member that is disposed in the gap and prevents leakage of slurry in the frame.   The surface processing apparatus according to claim 2, wherein the nozzle cover includes a ceiling portion that closes a top surface opening of the frame body while allowing the nozzle portion to move in a main scanning direction.   4. The surface processing apparatus according to claim 2, wherein the nozzle cover portion has the seal member attached to a lower end side of a pair of partition plates facing in the sub-scanning direction constituting the frame body. .   5. The nozzle cover part according to claim 1, wherein a distance between the nozzle part and a position that regulates the outflow of the slurry in the sub-scanning direction is in a range of 5 mm to 20 mm. Surface processing equipment.   The surface processing apparatus according to any one of claims 1 to 5, wherein a gap between a nozzle end of the nozzle portion and the surface of the processing object is in a range of 5 mm to 50 mm.   The surface processing apparatus according to claim 1, wherein the slurry has an abrasive concentration of 15 to 30 wt%. A surface processing method by wet blasting, in which a slurry mixed with high-pressure gas in the nozzle portion is sprayed and processed on the surface of a workpiece to be step-conveyed in the sub-scanning direction while moving the nozzle portion in the main scanning direction,
A surface processing method for regulating the outflow direction of slurry sprayed from the nozzle portion toward the object to be processed, discharging the slurry in a predetermined direction, collecting the discharged slurry, and supplying the recovered slurry to the nozzle portion.   The surface processing method according to claim 8, wherein the restriction of the outflow direction of the slurry is a front-rear direction of the sub-scanning direction with respect to the nozzle portion.   10. The surface processing method according to claim 8, wherein a distance between the nozzle portion and a position for regulating the outflow of the slurry in the sub-scanning direction is in a range of 5 mm to 20 mm.   11. The surface processing method according to claim 8, wherein the nozzle portion is moved in a main scanning direction while preventing scattering of the slurry sprayed from the nozzle portion.   The surface processing method according to any one of claims 8 to 11, wherein a gap between a nozzle end of the nozzle portion and a surface of the processing object is in a range of 5 mm to 50 mm.   The surface treatment method according to claim 8, wherein the slurry has an abrasive concentration of 15 to 30 wt%.   The surface processing method according to claim 8, wherein the object to be processed is a flat-plate-shaped synthetic quartz glass.   The surface processing method according to claim 14, wherein the synthetic quartz glass is a glass substrate for a photomask.   The surface processing method according to claim 15, wherein one side of the glass substrate for the photomask is 300 mm square or more.   Based on the measurement data of the surface shape of the workpiece to be measured in advance, the relative movement speed of the nozzle portion and the workpiece in the main scanning direction is determined and flattened so as to match the target surface shape. The surface processing method according to claim 8, wherein processing is performed.   18. The surface processing method according to claim 8, wherein the nozzle portion has an injection nozzle formed in a slit-like opening. A plurality of wet-blasting surface processing apparatuses are arranged along the sub-scanning direction of the processing object to be processed by spraying slurry from the nozzle part while moving the nozzle part in the main scanning direction with respect to the surface of the processing object. Surface processing equipment,
A processing object transport unit for step-transporting the processing object in the sub-scanning direction;
A plurality of the surface processing devices arranged along the sub-transport direction of the processing object, according to any one of claims 1 to 7, and a surface processing apparatus having a configuration excluding the processing object transport unit from the description of claim 1,
Have
In the plurality of surface processing apparatuses, a first surface processing apparatus and a second surface processing apparatus are sequentially arranged from the upstream side to the downstream side in the conveyance direction of the processing object, and the first surface processing apparatus includes the first surface processing apparatus. The particle size of the first abrasive grains in the slurry circulation supply unit slurry is increased, and the particle size of the second abrasive grains in the slurry of the slurry circulation supply unit of the second surface processing apparatus is set to the first abrasive particle size. Surface processing equipment characterized by being finer than the diameter.   20. The surface processing according to claim 19, wherein a cleaning device for cleaning a processing surface of the processing target object by spraying a liquid is disposed downstream of the second surface processing apparatus in the conveying direction of the processing target object. Facility.   The cleaning device according to any one of claims 1 to 7, wherein the surface processing is configured to circulate a liquid instead of the slurry of the slurry circulation supply unit while excluding the workpiece transfer unit from the description of claim 1. Surface processing equipment characterized by being an apparatus.   The surface processing according to any one of claims 19 to 21, wherein the particle diameter of the first abrasive grains is # 600 to # 1500, and the particle diameter of the second abrasive grains is # 2000 to 6000. Facility. The flow direction of the first slurry sprayed from the first nozzle portion moving in the main scanning direction toward the workpiece to be conveyed stepwise is regulated and discharged in a predetermined direction, and the discharged first slurry is recovered. A first step of supplying the first nozzle part;
Regulating the outflow direction of the second slurry sprayed from the second nozzle portion moving in the main scanning direction toward the processing object with respect to the processing region of the processing object surface-treated in the first step. A second step of discharging in a predetermined direction, collecting the discharged second slurry and supplying the second slurry to the second nozzle portion;
Have
A surface processing method, wherein the first abrasive grains in the first slurry have a coarse particle diameter, and the second abrasive grains in the second slurry have a particle diameter finer than the first abrasive grains.   24. The surface processing method according to claim 23, further comprising a cleaning step of cleaning the processing region of the processing object after the second step by spraying a liquid.   The cleaning step regulates the outflow direction of the liquid ejected from the third nozzle portion moving in the main scanning direction toward the workpiece, discharges the liquid in a predetermined direction, collects the discharged liquid, and The surface processing method according to claim 24, wherein the surface processing method is supplied to three nozzle portions.   The first step is based on the measurement data of the surface shape of the processing object measured in advance, so that the first nozzle portion and the processing object in the main scanning direction match the target surface shape. The surface processing method according to any one of claims 23 to 25, wherein flattening is performed by determining a relative movement speed.   27. The surface processing method according to claim 23, wherein the first nozzle portion and the second nozzle portion are formed such that an injection nozzle is formed in a slit-like opening. 26. The surface processing method according to claim 25, wherein the third nozzle part has an injection nozzle formed in a slit-like opening.