TWI595974B - A jet processing apparatus for processing a peripheral portion of a substrate, and a jet processing method using the apparatus - Google Patents

Description

Injection processing device for processing peripheral portion of substrate, and jet processing method using the same

The present invention relates to a jet processing apparatus which is a processing apparatus for removing a thin film layer on a peripheral edge portion of a substrate on which a thin film layer is formed on a surface of a substrate, and a processing method of a substrate using the same.

When a thin film layer is formed on the surface of the substrate, the thickness of the thin film layer at the peripheral portion of the substrate may be thicker than the intermediate portion or the thin film layer may reach the back surface.

A thin film solar panel is taken as an example for description. In the thin film solar cell, a thin film layer in which a transparent electrode layer, a semiconductor layer, a metal layer or the like is laminated is formed on the surface of a light-transmitting substrate such as glass. The lamination step is carried out, for example, by a gas phase reaction, but in this case, the film layer reaches the back surface via the peripheral portion. Solar cell modules pursue insulation between the front and back. Therefore, the inventors of the present invention have proposed an apparatus for improving the above-described insulating property by removing the film layer on the peripheral edge portion of the thin film solar cell panel by a jet processing technique.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] WO2011/152073

The device described in Patent Document 1 can remove the thin film layer at the peripheral portion of the solar cell panel. However, in the current situation where solar cells are urgently needed as a power generating device with a small environmental load, Pursuit of processing equipment that can further improve productivity.

The present invention relates to a blasting apparatus for removing a film layer on a peripheral portion of a substrate in a substrate having a film layer formed thereon, and comprising: a substrate peripheral portion processing mechanism including the substrate a peripheral edge portion processing chamber of the substrate slack insertion portion in which the peripheral edge portion is loosely inserted, a tip end is inserted into the substrate peripheral edge processing chamber, and a nozzle for ejecting the ejection material is inserted into the substrate peripheral portion of the substrate slack insertion portion. a material supply mechanism that communicates with the nozzle and is disposed above the nozzle, and a dust collecting mechanism that communicates with the processing chamber of the substrate peripheral portion; and a substrate movement rotating mechanism that mounts the substrate and makes the substrate relative to the nozzle a mechanism for horizontally moving and rotating the substrate; a substrate transfer mechanism for transporting the substrate above an initial stop position of the substrate moving and rotating mechanism; and a lifting mechanism for lowering the substrate transfer mechanism The substrate is transferred to the substrate to move the rotating mechanism.

In the jet processing apparatus of the present invention, the substrate moving and rotating mechanism that horizontally moves the substrate relative to the nozzle is disposed in the previous processing apparatus (in the following description, the "previous processing apparatus" is used unless otherwise specified. Refers to the low position of the processing device of Patent Document 1. In other words, since the center of gravity of the substrate moving and rotating mechanism is lower than that of the conventional processing apparatus, even when the speed of horizontal movement of the substrate is increased in order to improve productivity, the movement can be stably performed without vibration. As described above, according to the present invention, even when the processing speed is increased, the ejection processing can be stably performed, whereby the thin film layer at the peripheral portion of the substrate can be removed.

Further, the jet processing apparatus of the present invention is characterized in that the nozzle is a structure that sucks the material by the suction force generated inside the nozzle.

Since the jet processing apparatus of the present invention has a nozzle disposed at a lower position than the conventional processing apparatus, the distance between the nozzle and the material supply mechanism becomes long, and the suction force of the suction material is reduced. That is, the ejection force of the gas-solid two-phase flow from the injection nozzle is relatively It becomes larger, so the processing capacity is improved.

Further, the jet processing apparatus according to the present invention may be characterized in that the nozzle includes an air nozzle that ejects compressed air, an injection material supply path that supplies a supply material, and is internally provided in communication with the supply path. a nozzle holder of the mixing chamber, and an injection nozzle that communicates with the mixing chamber and is provided in an extending direction of the air nozzle; and the injection material is sucked by the suction force generated in the mixing chamber.

The nozzle of the configuration of the present invention is configured to generate a negative pressure in a mixing chamber in the nozzle holder by the compressed air injected from the air nozzle, and suction the material into the mixing chamber by the negative pressure, in the mixing chamber A gas-solid two-phase flow is formed and the gas-solid two-phase flow is injected from the injection nozzle. The nozzle can continuously eject the spray material, and thus the productivity is good.

Further, in the jet processing apparatus according to the present invention, the injection material supply mechanism may further include a quantitative supply mechanism for continuously supplying a predetermined amount of the injection material to the nozzle. This makes it possible to perform stable jet processing, so that defective products are not generated due to insufficient processing.

Further, in the jet processing apparatus according to the present invention, the cleaning mechanism adjacent to the peripheral portion processing mechanism of the substrate may be further included.

Thereby, even if the injection material is adhered to the surface of the substrate by the substrate peripheral edge processing means, the cleaning means can be removed by the cleaning means.

Further, in the blasting apparatus according to the present invention, the cleaning mechanism may include a housing that is disposed opposite to the surface of the substrate and that is open at a lower end; the front end is inserted into the inside of the housing, and a cleaning nozzle that injects compressed air onto the substrate; and a suction member that is disposed in the casing and communicates with the dust collecting mechanism. The fine powder containing the spray material adhering to the surface of the substrate is peeled off by the compressed air jetted from the cleaning nozzle. The stripped fine powder floats in the space inside the casing. The suction member is coupled to the suction mechanism, and the suction mechanism abuts the space in the housing. Thereby, the spray material adhering (residual) to the surface of the substrate can be removed.

Moreover, the blasting apparatus according to the present invention may further include a housing that surrounds the substrate peripheral portion processing mechanism, the substrate movement rotating mechanism, and the substrate transfer mechanism from the outside. Further, the substrate transfer mechanism may further include a function of loading the substrate into the casing and a function of transporting the substrate from which the thin film layer of the peripheral portion of the substrate is removed to the outside of the casing. As a result, the substrate transfer mechanism is reduced as compared with the conventional processing device, so that the device can be manufactured at low cost.

Moreover, the blasting apparatus according to the present invention may further include a positioning mechanism for stopping the substrate conveyed above the substrate moving and rotating mechanism at a specific position. The substrate can be processed with high precision by such a positioning mechanism.

Further, in the jet processing apparatus according to the present invention, the pair of substrate peripheral portion processing mechanisms may be disposed, and the substrate peripheral portion processing means may be disposed such that the substrate slack insertion portions are opposed to each other with a predetermined interval therebetween. Since the peripheral portion of the substrate on both sides of the substrate parallel to each other can be simultaneously processed, the processing time can be shortened.

Further, in the blast processing apparatus according to the present invention, a substrate intermediate portion processing mechanism may be disposed, and the substrate intermediate portion processing mechanism includes a scattering prevention cover that is disposed opposite to the surface of the substrate and has a lower end opening, and is disposed at the front end a nozzle that is inserted into the scattering prevention cover and that ejects the injection material from a portion other than the peripheral edge portion of the substrate, and a suction member that is provided in the scattering prevention cover and that is coupled to the dust collecting mechanism. The scattering prevention cover and the dust collecting mechanism communicate by the suction member. The film layer of the portion other than the peripheral edge portion of the substrate (the intermediate portion of the substrate) is removed by the spray material ejected from the nozzle. Dust such as a spray material or fine particles (a spray material of a size that cannot be reused due to collision with the removed film layer or substrate) is sucked by the dust collecting means in the scattering prevention cover. In this manner, the film layer on the inner side of the substrate can be removed by the intermediate portion processing mechanism of the substrate. By cutting the substrate from the center of the portion removed by the substrate intermediate processing mechanism, a plurality of substrates having the peripheral portion removed can be obtained.

Further, in the jet processing apparatus according to the present invention, the substrate processed by the jet processing apparatus may be a light-transmitting substrate (glass or resin (for example, polyterephthalic acid). A thin film solar cell layer for forming a thin film layer (a transparent electrode layer, a photo-semiconductor layer, a metal layer, or the like) of a thin film solar cell panel is laminated on a plane of an ethylenediester resin or the like. According to the blast processing apparatus of the present invention, a solar cell panel having excellent insulation properties on the front side and the back side can be obtained.

Moreover, the present invention is directed to a jet processing method for removing a thin film layer on a peripheral portion of a substrate by a jet processing apparatus, and comprising: transporting the substrate to the substrate by the substrate transfer mechanism a step of positioning the substrate above the rotating mechanism to stop at a specific position; and lowering the substrate transfer mechanism to transfer the substrate to the substrate moving and rotating mechanism And a step of fixing the substrate to the substrate moving and rotating mechanism; and horizontally moving the substrate moving and rotating mechanism to loosely insert at least one side of the peripheral edge portion of the substrate into the substrate slack insertion portion of the substrate peripheral portion processing mechanism; The substrate moving and rotating mechanism further ejects the ejecting material from the nozzle while horizontally moving, and removes a film layer that is loosely inserted into the peripheral edge portion of the substrate in the substrate slack insertion portion, and sucks the ejecting material by the dust collecting mechanism.

Further, the blasting method according to the present invention may further include the step of rotating the substrate by 90 degrees by the substrate moving and rotating mechanism after removing the film layer on at least one side of the peripheral portion of the substrate; Moving the rotating mechanism to move at least one side adjacent to a side of the peripheral edge portion of the removed film layer to the substrate slack insertion portion; and moving the substrate moving and rotating mechanism further horizontally from the nozzle The ejecting material is ejected, and the step of relaxing the film layer inserted in the peripheral portion of the slack insertion portion of the substrate and sucking the ejecting material by the dust collecting mechanism is removed.

According to the blasting method of the present invention, the substrate moving and rotating mechanism that relatively moves the substrate relative to the nozzle is disposed at a position lower than that of the previous processing apparatus. In other words, since the center of gravity of the substrate moving and rotating mechanism is lowered, even when the speed of horizontal movement of the substrate is increased in order to improve productivity, the movement can be stably performed without vibration. As described above, according to the present invention, it is possible to stably perform the spraying even in the case of accelerating the processing speed. The film is processed so that the film layer on the peripheral portion of the substrate can be removed.

Moreover, the present invention is directed to a jet processing method for removing a film layer on a peripheral portion of a substrate by a jet processing apparatus, and comprising: transferring the substrate to the substrate moving rotating mechanism a positioning step for stopping the substrate conveyed by the substrate transfer mechanism to the upper side of the substrate moving and rotating mechanism at a specific position; lowering the substrate transfer mechanism to transfer the substrate to the substrate moving and rotating mechanism, and a step of fixing the substrate to the substrate moving and rotating mechanism; and horizontally moving the substrate moving and rotating mechanism to loosen and insert the first processed side of the substrate as a peripheral edge portion into the substrate slack insertion portion; The moving rotary mechanism further moves the ejection material from the nozzle to remove the thin film layer of the first processed side, and the dust collecting means sucks the dust generated inside the peripheral processing portion of the substrate.

Furthermore, the method further includes: a step of rotating the substrate on which the thin film layer of the first processed side is removed by the substrate moving and rotating mechanism by 90 degrees; and moving the substrate moving rotating mechanism horizontally to be adjacent to the first processed edge a step of loosely inserting the second processed side into the substrate slack insertion portion of the substrate peripheral portion processing means; and ejecting the spray material from the nozzle while moving the substrate moving and rotating mechanism to remove the film layer of the second processed side And the step of sucking dust generated inside the peripheral processing portion of the substrate by the dust collecting mechanism. Since the unnecessary film layer on the peripheral edge portions of the opposite and parallel sides can be simultaneously removed, the film layer on the peripheral edge portion of the substrate can be removed in a short time.

According to the present invention, it is possible to obtain an injection processing apparatus and an injection processing method which are shorter in processing time and more productive than conventional processing apparatuses.

10‧‧‧Jet processing equipment

11‧‧‧ frame

11a‧‧‧Substrate entrance

11b‧‧‧Substrate removal

12‧‧‧The peripheral processing part of the substrate

12a‧‧‧Upper casing

12b‧‧‧ Lower housing

12c‧‧‧ suction member

12d‧‧‧ spacers

12e‧‧‧Substrate slack insertion

12f‧‧‧Nozzle fixing member

13‧‧‧ Cleaning institutions

13a‧‧‧Shell

13b‧‧‧Clean nozzle

13c‧‧‧ suction member

14‧‧‧Substrate transport mechanism

14a‧‧‧Transport roller

14b‧‧‧Rack

14c‧‧‧roller components

14d‧‧‧Axis

14e‧‧‧ bearing

15‧‧‧ Lifting mechanism

16‧‧‧ Positioning agency

16a‧‧‧First fixed component

16b‧‧‧Second fixed component

16c‧‧‧Adjusting components

16d‧‧‧Adjustment agency

17‧‧‧Substrate moving rotating mechanism

17a‧‧‧ mounting table

17b‧‧‧Transition agency

17c‧‧‧Rotating mechanism

18‧‧‧Spray material supply mechanism

18a‧‧‧ hopper

18b‧‧‧Quantitative supply agency

19‧‧‧Substrate intermediate processing mechanism

19a‧‧‧Diffuse prevention cover

19b‧‧‧Nozzles

19c‧‧‧ suction member

F ₁ , F ₂ ‧‧‧Flange

H‧‧‧Hose

M‧‧‧Processing area

N‧‧‧ nozzle

Na‧‧ Air nozzle

Nb‧‧·jet nozzle

Nc‧‧‧ nozzle holder

Nd‧‧‧Spray supply path

Ne‧‧‧Mixed room

S‧‧‧Substrate

S'‧‧‧ (cut) substrate

U‧‧‧Surface peripheral processing unit

U'‧‧‧Substrate intermediate processing unit

Fig. 1 is an explanatory view for explaining a first embodiment of the present invention. Figure 1 (A) is a bow Referring to the cross-sectional view, Fig. 1(B) is a front cross-sectional view.

Fig. 2 is an explanatory view showing a peripheral portion processing mechanism of a substrate in the first embodiment of the present invention. 2(A) is a side view, FIG. 2(B) is a plan view, and FIG. 2(C) is a schematic view for explaining a configuration of a substrate peripheral portion processing mechanism, and FIG. 2(D) is FIG. 2(B) Longitudinal section view.

Fig. 3 is an explanatory view showing a nozzle in the first embodiment of the present invention. Fig. 3(A) is a front view, and Fig. 3(B) is a cross-sectional view taken along line A-A of Fig. 3(A).

Fig. 4 is a front cross-sectional view showing the cleaning mechanism in the first embodiment of the present invention.

Fig. 5 is an explanatory view for explaining a procedure of processing a substrate in the first embodiment of the present invention. Fig. 5(A) is a cross-sectional view of the step 1 as viewed from the front view, and Fig. 5(B) is a cross-sectional view of the step 2 as viewed from the front view.

Fig. 6 is an explanatory view for explaining a procedure of processing a substrate in the first embodiment of the present invention. Fig. 6(A) is a cross-sectional view showing the step 3 in a front view direction, and Fig. 6(B) is a cross-sectional view showing the step 4 in a front view direction.

Fig. 7 is an explanatory view for explaining a procedure of processing a substrate in the first embodiment of the present invention. Fig. 7(A) is a cross-sectional view of the step 5 as viewed from the front view, and Fig. 7(B) is a cross-sectional view of the step 6 as viewed from the front view.

Fig. 8 is an explanatory view showing a substrate intermediate portion processing mechanism in a second embodiment of the present invention. 8(A) is a front cross-sectional view showing a substrate intermediate portion processing mechanism, and FIG. 8(B) is a plan cross-sectional view for explaining a jet processing device in which a substrate intermediate portion processing mechanism is disposed.

9(A) to 9(D) are explanatory views for explaining a state of a substrate processed by the jet processing apparatus according to the second embodiment of the present invention.

An example of the jet processing apparatus of the present invention will be described with reference to the drawings. In addition, unless otherwise indicated, the "up-and-down direction" in the description of an embodiment means the direction in the figure.

As shown in Fig. 1 (A) and Fig. 1 (B), the jet processing apparatus 10 of the first embodiment includes a pair of substrate peripheral portion processing unit U, a substrate transfer mechanism 14, a lifting mechanism 15, a positioning mechanism 16, and substrate movement. The rotating mechanism 17, the injection material supply mechanism 18, the casing 11 that surrounds the same from the outside, and a control device (not shown) that controls the operations of the mechanisms and the like. The substrate peripheral portion processing unit U includes a substrate peripheral portion processing mechanism 12 and a cleaning mechanism 13 adjacent to the left and right (the traveling direction of the substrate S) of the substrate peripheral portion processing mechanism 12. Further, on the frame body 11, on the wall surfaces of the upper portion and the lower portion of the drawing, a substrate loading port 11a for opening the substrate S into the jet processing apparatus 10, and a substrate S for ending the ejection process are formed. The substrate transfer port 11b which is an opening which is ejected from the jet processing apparatus 10.

As shown in Fig. 2, the substrate peripheral portion processing mechanism 12 includes a substrate peripheral portion processing chamber and a nozzle N that ejects a spray material onto the substrate S. The substrate peripheral portion processing chamber includes an upper casing 12a and an upper surface, which are open to the bottom surface. a hollow lower casing 12b that is open and has a cross-sectional area that is reduced from the upper end portion toward the lower side, a hollow suction member 12c coupled to the bottom of the lower casing 12b, and the upper casing 12a and the above The lower casing 12b is spaced apart from the spacer 12d. The lower end surface of the upper casing 12a has the same shape as the upper end surface of the lower casing 12b, and is disposed apart from each other.

The lower end of the upper housing 12a and the upper end of the lower housing 12b are respectively provided The flange portions F ₁ and F _{2 having} substantially the same shape and shape. And, on the spacer 12d and the lower end surface of the end face of the flange F _1, F ₂ is substantially the same shape. By connecting the flanges F ₁ and F ₂ via the spacer 12d, the upper casing 12a and the lower casing 12b are coupled to each other, and the substrate slack insertion portion 12e for loosely inserting the peripheral portion of the substrate S is formed. The interval between the substrate slack insertion portions 12e (the length in the upper and lower directions in FIG. 2(A)) must be selected such that at least a proper gap in the vertical direction is formed between the substrate S and the open end when the substrate S is loosely inserted. That is, the substrate S is not brought into contact with the substrate slack insertion portion. If the gap is too small, the substrate S is in contact with the open end, and the substrate S is damaged. When the gap is too large, the wind speed of the suction outside air is small, so that it is not possible to sufficiently suck the dust (the particles ejected from the nozzle N and the fine particles such as the cutting powder of the substrate S generated by the collision of the material with the substrate S). As a result, the dust leaks to the outside of the substrate peripheral portion processing mechanism 12. Since the interval between the substrate slack insertion portions 12e is determined by the thickness of the spacer 12d, the thickness of the spacer 12d can be appropriately selected in accordance with the thickness of the substrate S. In the present embodiment, the spacer is selected such that the distance between the front surface and the back surface of the substrate S and the end surface of the substrate slack insertion portion 12e is 1.0 to 5.0 mm.

In the nozzle N, the lower end, that is, the injection port, is inserted into the upper casing 12a and fixed. Further, a dust collecting means (not shown) for sucking and collecting dust generated inside the peripheral portion processing means 12 of the substrate is connected to the suction member 12c. The dust is sucked and recovered by the dust collecting means via the suction member 12c. The outside air is sucked from the substrate slack insertion portion 12e by the suction force of the dust collecting means, so that the airflow flowing from the outside to the inside is generated in the vicinity of the substrate slack insertion portion 12e. Thereby, the dust does not leak from the substrate slack insertion portion 12e to the outside of the substrate peripheral portion processing mechanism 12.

The shape of the ejection opening of the nozzle N is not particularly limited, and is formed in a rectangular shape and arranged such that the long side is orthogonal to the processed side of the substrate S, whereby the width of the processing region M can be enlarged. Since the airflow flowing in the direction of the suction member 12c is generated inside the substrate peripheral portion processing mechanism 12, the ejection material can be inclined by ejecting the ejection direction from the nozzle N toward the peripheral edge portion side of the substrate. The member 12c sucks dust efficiently. Regarding this angle, the center line of the nozzle N may be 30 to 70 degrees with respect to the substrate S. In the case where the nozzle N is disposed obliquely, a member that can tilt the nozzle N is provided. For example, as shown in FIG. 2, a nozzle fixing member 12f having a triangular column shape having a specific angle of a slope, or a polygonal fixing member such as a pentagon may be used.

The structure of the nozzle N is not particularly limited, and may be a structure in which the spray material is sucked by the negative pressure generated inside the nozzle N and mixed with the compressed air inside, and is injected as a gas-solid two-phase flow from the injection port. As a specific example, as shown in FIG. 3, the nozzle N includes an air nozzle Na for introducing compressed air into the nozzle N, an injection nozzle Nb for ejecting the injection material as a gas-solid two-phase flow, and the air nozzle Na Inserted and fitted from the top and connected at the bottom The nozzle holder Nc of the above-described ejection nozzle Nb is junctioned. The air nozzle Na has a hollow shape with both ends open, and the inner diameter becomes smaller toward the direction in which the compressed air flows (lower in Fig. 3). The injection nozzle Nb is provided with a flow path cross section having the same shape from the upper end toward the lower end. The inside of the nozzle holder Nc may be configured to include a mixing chamber Ne and a material supply path (supply hole) Nd that communicates with the mixing chamber Ne.

The shot material supply path Nd is coupled to the shot material supply mechanism 18 disposed above the nozzle N via the hose H. The shot material supply mechanism 18 includes a hopper 18a for storing the spray material, and a quantitative supply mechanism 18b for continuously taking out (cutting out) a specific amount from the hopper. If the specific amount of the spray material can be stably taken out only by the hopper 18a, the quantitative supply mechanism 18b may not be provided. The dosing mechanism 18b may be selected from known methods such as a table feeder or a screw feeder. In the present embodiment, a screw feeder is used.

A compressed air supply mechanism (not shown) is connected to the upper end of the air nozzle Na via a hose (not shown). When the compressed air supply mechanism is actuated to inject compressed air into the mixing chamber Ne, which is a space inside the nozzle N, a negative pressure is generated in the mixing chamber Ne. The injection material taken out from the above-described injection material supply mechanism 18 disposed above the nozzle N is sucked into the mixing chamber Ne by the injection material supply path Nd by the above-described negative pressure. The sucked spray material is mixed with the compressed air in the mixing chamber Ne, and is injected as a gas-solid two-phase flow from the injection nozzle Nb.

The shape of the lower end of the injection nozzle Nb, that is, the ejection opening, may be circular or rectangular. In the present embodiment, the shape of the ejection opening is a rectangle, and the long side is disposed so as to be orthogonal to the processing side. Thereby, a wider width can be processed.

The blasting apparatus (so-called pressurized type) for storing the shot material in the pressurized tank and feeding the shot material to the nozzle by pressurizing the press tank, the time during which the jet processing can be continuously performed is pressurized The capacity of the tank is limited. On the other hand, the jet processing apparatus using the nozzle N of the present embodiment does not require the above-described pressurized tank, and can store the spray material under atmospheric pressure and supply it to the nozzle N. The ejected shot material can be reused (sprayed) by being separated by a separating mechanism as will be described later. That is, the spray material can be sprayed continuously, so that the jet processing can be continuously performed. Further, the injection material supply mechanism 18 can stably and continuously supply a specific amount of the injection material, so that stable injection processing can be performed. Further, in the present embodiment, since the nozzle N can be disposed at a position lower than that of the prior art jet processing apparatus, the processing capability can be made higher than that of the prior art jet processing apparatus. The pressure of the compressed air supplied from the air nozzle Na to the inside of the nozzle N is decomposed into the generating force of the ejection force from the ejection nozzle Nb and the suction force of the ejection material. When the shot material supply mechanism 18 is disposed above the nozzle N and the distance between the shot material supply mechanism 18 and the nozzle N is extended, the suction force of the spray material becomes small. As a result, since the ejection force from the ejection nozzle Nb is increased, the processing capability is improved.

The shot material and the ejection pressure are selected in such a manner that the unnecessary film layer can be well removed without damaging the film layer other than the film layer. The material to be sprayed is not particularly limited as long as it is generally used for jet processing. For example, it may be selected from ceramic-based abrasive grains or sand grains (alumina type, tantalum carbide type, zirconia type, etc.), metal type pellets, cut pellets or sand grains (iron type, stainless steel type, non-ferrous type, etc.), Glass-based beads or powders, resin-based pellets (nylon resin, melamine resin, urea resin, etc.), and plant-based pellets (walnut, peach, apricot, etc.). In addition, the particle diameter of the material to be sprayed may be stably injected from the nozzle N without pulsation or the like, and may be, for example, selected from the range of 0.01 to 0.6 mm, preferably 0.02 to 0.06 mm. The injection pressure may be selected from the range of 0.2 to 0.8 MPa, preferably 0.3 to 0.6 MPa.

Two of the substrate peripheral portion processing mechanisms 12 are disposed so that the opposite sides (the upper and lower sides in FIG. 1(A)) of the substrate S are loosely inserted. Specifically, the substrate slack insertion portions 12e of the substrate peripheral portion processing mechanism 12 are disposed to face each other. An interval adjusting mechanism (not shown) for adjusting the interval between the peripheral edge portion processing mechanisms 12 of the substrate is coupled to the substrate peripheral portion processing mechanism 12, and the peripheral peripheral portion processing mechanism can be formed by the interval adjusting mechanism. 12 moves in the up and down direction of Fig. 1(A).

The cleaning mechanism 13 coupled to the peripheral edge portion processing mechanism 12 will be further described with reference to Fig. 4 . In FIG. 4, the traveling direction of the substrate S is the left-right direction. The cleaning mechanism 13 includes a casing 13a that is a casing that is open at the lower end, a cleaning nozzle 13b that is disposed at a central portion of the top surface, and A cylindrical suction member 13c that is open at both ends. The cleaning nozzle 13b is coupled to the compressed air supply mechanism, and the lower end (front end), that is, the injection port, is inserted into the casing 13a and fixed. The suction member 13c is connected to the top surface of the casing 13a so that one end thereof is located on the left and right sides of the cleaning nozzle 13b (that is, the traveling direction of the substrate S), and the other end is coupled to the dust collecting mechanism via a hose. Thereby, the inner space of the casing 13a communicates with the dust collecting means.

The cleaning mechanism 13 is disposed such that a moderate gap is formed between the lower end of the casing 13a and the substrate S when the substrate S passes below. When the substrate S to which the dust adheres passes under the cleaning mechanism 13, the self-cleaning nozzle 13b blows compressed air to the substrate S to cause the dust to be detached from the surface of the substrate S and lifted, and is sucked by the suction member 13c. The dust is removed while the dust on the surface of the substrate S is removed. In the vicinity of the lower end portion of the casing 13a, the outside air is sucked from the gap provided between the casing 13a and the substrate S, so that the airflow flowing from the outer side to the inner side of the casing 13a is generated. Therefore, the dust does not leak to the outside of the cleaning mechanism 13. However, if the gap between the lower end of the casing 13a and the substrate S is too small, the substrate S comes into contact with the lower end of the casing 13a, and the substrate S is damaged. If the interval is too large, the wind speed at which the outside air is sucked becomes small, so that the dust scattered inside the cleaning mechanism 13 cannot be sufficiently sucked. As a result, the dust leaks to the outside of the cleaning mechanism 13. Therefore, the above gap must be set in a range in which the substrate S is not in contact with the casing 13a and the suction force is not impaired. In the present embodiment, the distance (gap) between the surface of the substrate S and the lower end of the casing 13a is set to 0.5 to 4.5 mm.

In order to efficiently remove the dust adhering to the surface of the substrate S, a substance (a little water, an electrostatic remover, ions, radicals, or the like) which weakens the adhesion may be ejected from the cleaning nozzle 13b together with the compressed air. Alternatively, high-speed pulsed air (ultrasonic blast) may be blown from the cleaning nozzle 13b. Ultrasonic blast is used in the present embodiment.

The shape of the ejection opening of the cleaning nozzle 13b is not particularly limited, and a circular shape, a rectangular shape, or the like can be appropriately selected.

The substrate transport mechanism 14 includes a plurality of transport rollers 14a that are arranged at equal intervals and in parallel, and a gantry 14b that supports the transport roller 14a. The conveying roller 14a includes a roller member 14c for conveying the substrate S, and a shaft 14d serving as a rotating shaft of the roller member 14c. The roller member 14c is disposed at a specific interval along the longitudinal direction of the shaft 14d except for being disposed at the outermost portion. In addition, the roller member 14c is disposed so as to be in a zigzag shape with respect to the conveyance direction (the downward direction in FIG. 1(A)) of the roller member 14c of the adjacent conveyance roller 14a. By arranging the roller member 14c in a zigzag shape, the straightness is improved when the substrate S is conveyed.

The shaft 14d of each of the conveying rollers 14a is rotatably supported by the gantry 14b via a bearing 14e. Further, the shaft 14d is coupled to a rotating mechanism (not shown) such as a motor. By rotating the rotation mechanism, the conveyance roller 14a can be rotationally driven (the upper surface is rotated in the downward direction in FIG. 1(A)), so that the conveyance force can be transmitted to the substrate S by the roller member 14c and conveyed.

The abutting member of the roller member 14c that abuts against the substrate S and transmits the conveying force to the substrate S is preferably a urethane resin using a closed cell structure, and further preferably the urethane resin. The hardness is set to a hardness of about 50 to 60 (specified in JIS K6253) in JIS-A. For example, when the substrate S is a easily damaged material such as glass or resin, if the dust enters between the substrate S and the transfer roller 14c, the substrate S may be damaged by the dust when the substrate S is transferred. As described above, when the contact member is a urethane resin having a closed cell structure, even if dust enters between the substrate S and the transfer roller 14c, it is possible to prevent the dust from being excessively pressed against the substrate S, thereby preventing the dust from being excessively pressed against the substrate S. The substrate S is damaged.

The elevating mechanism 15 is coupled to the gantry 14b, and the transporting roller 14a can be moved up and down by the elevating mechanism 15 (the vertical direction with respect to the paper surface in FIG. 1(A) and the vertical direction in FIG. 1(B)) . The elevating mechanism may be selected from a known method such as a cylinder that is driven by hydraulic pressure, air pressure, or electric power, an electric slider including a ball screw or a belt, and a rack pinion. In the present embodiment, a cylinder (cylinder) that is driven by air pressure is used.

The positioning mechanism 16 includes a first fixing member 16a disposed on the transport direction side (lower in FIG. 1(A)) with respect to the transported substrate S, and is disposed adjacent to the side on the transport direction side. The second fixing member 16b on the side of one side (leftward in FIG. 1(A)) and the adjusting member 16c disposed on the other side (in the right direction in FIG. 1(A)). The first fixing member 16a is fixed at a position where the lower side of the substrate S is set, and the second fixing member 16b is fixed at a position to the left of the setting substrate S. The adjustment member 16c is coupled to the advancement mechanism 16d, and is advanced in the left direction of the figure by the advancement mechanism 16d. The substrate S which is loosely inserted from the substrate carrying-in port 11a and is in contact with the upper surface of the conveying roller 14a is conveyed to the lower side in FIG. 1(A) by the substrate conveying mechanism 14. When being transported to a specific position, the lower side of the substrate S collides with the first fixing member 16a, so that it does not advance further. Then, the adjustment member 16c advances to the left and comes into contact with the right side of the substrate S. By advancing and pressing the adjustment member 16c, the substrate S is moved to the left, and the left side of the substrate S is in contact with the second fixing member 16b. By the above steps, the substrate S is positioned above the mounting table 17a which is stopped after the initial stop position, and the center point of the substrate S is located on the extension line of the axis on which the mounting table 17a is rotated. Way to locate. Since the first fixing member 16a, the second fixing member 16b, and the adjustment member 16c are preferably made of a soft material because they are in contact with the substrate S, if the hardness is too low, the positioning accuracy is deteriorated, and therefore it is necessary to set the degree of damage to the substrate S. Hardness. In the present embodiment, polyethylene terephthalate (PET) resin is used. Further, the forward mechanism 16d may be selected from a known method such as a cylinder that is driven by hydraulic pressure, air pressure, or electric power, an electric slider including a ball screw or a belt, and a rack pinion. In the present embodiment, a cylinder is used.

The substrate moving and rotating mechanism 17 includes a mounting table 17a on which the substrate S is placed and fixed, a moving mechanism 17b that moves the mounting table 17a in the left-right direction, and a rotating mechanism 17c that rotates the mounting table 17a. The mounting table 17a only needs to be able to mount the substrate S, and the substrate S does not move on the mounting table 17a when moving by the moving mechanism 17b. Therefore, the substrate can be selected from a mechanically fixed structure or a sheet having a high coefficient of friction. And other known methods. In the present embodiment, a plurality of adsorption pads connected to a suction mechanism (not shown) such as a vacuum pump are disposed on the flat plate, and the suction mechanism is activated by placing the substrate S on the adsorption pad. The substrate S is adhered to the adsorption pad by suction. Moreover, the mounting table 17a is used by When the substrate transfer mechanism 14 transports the substrate S, it is disposed below the conveyance roller 14a. As will be described later, in order to mount the substrate S on the mounting table 17a, the conveying roller 14a is lowered. Therefore, the mounting table 17a is configured so as not to come into contact with the conveying roller 14a when it is lowered.

The transfer mechanism 17b can move the mounting table 17a on which the substrate S is placed in the left-right direction to process the substrate S. When the substrate S is moved, the substrate S must be moved so as not to come into contact with the end portion of the substrate slack insertion portion 12e of the substrate peripheral portion processing mechanism 12 and the lower end of the cleaning mechanism 13. Further, if the substrate S is not moved at a constant speed, processing unevenness occurs. The structure of the transition mechanism 17b is not particularly limited as long as the substrate S can be prevented from vibrating in the vertical direction of FIG. 1(B) and the substrate S can be moved in the left-right direction at a fixed speed when passing through the substrate peripheral portion processing mechanism 12. For example, it can be selected from known methods such as an electric slider including a ball screw or a belt, a rack pinion, and a self-propelled trolley. In the present embodiment, an electric slider including a belt is used. Further, when an unnecessary impact is applied to the substrate S at the time of starting from the initial stop position and at the time of stopping, it is preferable to adjust the moving speed using an inverter or the like to control the speed at the start and stop.

The rotating mechanism 17c rotates the mounting table 17a by 90 degrees with the center of the upper surface of the mounting table 17a in Fig. 1(A) as an axis. Further, since the substrate S is placed on the mounting table 17a, when a strong vibration or centrifugal force is applied to the substrate S when the mounting table 17a is rotated, the position of the substrate S is shifted from the mounting table 17a. As described above, the rotation mechanism 17c is not particularly limited as long as it can be rotated without applying a strong vibration or impact force to the substrate S. For example, it can be selected from known methods such as a motor or a cylinder. Further, when an unnecessary impact is applied to the substrate S at the start of the rotation and at the time of the stop, it is preferable to use the adjustable rotational speed to control the speed at the start and stop. In this case, for example, a known method such as a direct drive motor, a servo motor, or a cylinder (for example, a servo cylinder) that can adjust the speed of expansion and contraction can be selected. In the present embodiment, a direct drive motor is used.

Next, the procedure of removing the thin film layer on the peripheral edge portion of the substrate S by the jet processing apparatus of the present embodiment will be further described with reference to FIGS. 5 to 7. Figure 4 to Figure 6 show A cross-sectional view of the front view. Here, a case where a substrate for a rectangular thin film solar cell panel is processed will be described as an example.

(preparation step)

The conditions for well-processing the substrate S (the size of the substrate S, the moving speed of the substrate S, the ejection pressure, the number of scans, the processing width, and the like) are input to the above-described control device. After the input, the machining start button is turned ON, and the machining is started under the condition of the input, and the machining is automatically completed. Here, the control device can input and control the operation of the jet processing apparatus 10, for example, a motion controller such as a programmable logic controller (PLC) or a digital signal processor (DSP) can be used. High-performance mobile terminals, high-performance mobile phones, etc.

(Step 1: Move in step)

After the substrate transfer mechanism 14 is actuated, the substrate S is loosely inserted from the substrate transfer inlet 11a. Here, a case where the insertion is slack from the longitudinal direction will be described as an example. The substrate S that has been loosely inserted from the substrate carrying-in port 11a advances by the substrate transfer mechanism 14. Then, the first fixing member 16a is collided, so that the positioning of the conveying direction end is completed. Thereafter, the adjustment member 16c advances to move the substrate S to the left. Thereafter, the left side of the substrate S collides with the second fixing member 16b, so that the positioning in the left-right direction is completed. When the positioning of the substrate S is completed, the substrate transfer mechanism 14 is stopped. Further, the first fixing member 16a is disposed such that the distance between the first fixing members 16a is equal to or longer than the length of the short side of the substrate so as not to collide with the substrate S after the processing is completed. (Refer to Figure 5 (A))

(Step 2: Loading step)

When the elevating mechanism 15 is actuated, the substrate transport mechanism 14 is lowered. The mounting table 17a of the substrate moving and rotating mechanism 17 is stopped below the substrate S (initial stop position). When the substrate transfer mechanism 14 is positioned below the mounting table 17a, the substrate S is transferred from the substrate transfer mechanism 14 to the mounting table 17a. When the substrate S is placed on the mounting table 17a, the suction mechanism is actuated, and the substrate S is fixed to the mounting table 17a. Thus, the substrate S is opposite to each other, that is, the first processed side The center of the plane of the substrate S is placed in the vertical direction and is placed on the mounting table 17a so as to match the axis of the mounting table 17a. (Refer to Figure 5(B))

(Step 3: Processing steps of the first processing edge)

The interval adjusting mechanism is actuated to match the pair of substrate peripheral edge processing units U (the substrate peripheral edge processing mechanism 12 and the cleaning mechanism 13 adjacent to the left and right sides of the substrate peripheral edge processing mechanism 12) with respect to the first processed edges. 1 (A) moves up and down. Thereby, the interval between the peripheral portions of the substrate processing units U is adjusted. Then, the dust collecting mechanism is actuated to suction the inside of the substrate peripheral portion processing mechanism 12 and the cleaning mechanism 13. Further, the compressed air supply means and the injection material supply means 18 are actuated to eject the injection material from the nozzle N and to eject the compressed air from the cleaning nozzle 13b. Thereafter, the moving mechanism 17b is actuated, and the mounting table 17a is moved in the right direction. Then, the first processed side of the substrate S is loosely inserted and passed through the substrate slack insertion portion 12e of the substrate peripheral portion processing mechanism 12. The film layer of the first processed side is removed by loosely inserting the first processed side of the substrate slack insertion portion 12e below the nozzle N. On the surface of the substrate S that has passed through the substrate peripheral portion processing mechanism 12, dust may remain without being sucked clean. This dust is removed by passing under the cleaning mechanism 13 adjacent to the right side of the substrate peripheral edge processing mechanism 12. Further, since the center of gravity of the substrate S can be moved lower than that of the conventional jet processing apparatus as described above, the vibration in the vertical direction is reduced, and the movement can be stably performed. (Refer to Figure 6(A))

(Step 4: Turn the step)

When the entire length of the first processed side passes through the substrate peripheral portion processing unit U and the substrate S advances to a specific position on the right side (outward stop position), the operation of the transition mechanism 17b is stopped. After the stop, the rotating mechanism 17c operates to move the substrate S by 90 degrees so that the second processed edges (the short sides facing each other) adjacent to the first machined edge are positioned in the vertical direction. Further, the interval adjusting mechanism is actuated to move the one-substrate peripheral portion processing unit U in the vertical direction of FIG. 1(A). Thereby, the interval between the peripheral portions of the substrate processing units U is adjusted. (Refer to Figure 6(B))

(Step 5: Processing steps of the second processing side)

When the transition mechanism 17b is actuated, the substrate S and the mounting table 17a move in the left direction. Then, the second processed side is loosely inserted and passed through the substrate slack insertion portion 12e of the substrate peripheral portion processing mechanism 12. The thin film layer of the second processed side is removed by loosely inserting the second processed side of the substrate slack insertion portion 12e below the nozzle N. On the surface of the substrate S that has passed through the substrate peripheral portion processing mechanism 12, dust may remain without being sucked clean. This dust is removed by passing under the cleaning mechanism 13 adjacent to the left side of the substrate peripheral edge processing mechanism 12. Then, when the entire length of the second processed side passes through the substrate peripheral portion processing unit U, and the mounting table 17a advances to a specific position (initial stop position) on the left side, the operation of the transition mechanism 17b is stopped. (Refer to Figure 7(A))

(Step 6: Move out step)

After the operation of the moving mechanism 17b is stopped, the operation of the injection material supply mechanism 18 and the compressed air supply mechanism is stopped, and the ejection of the injection material and the compressed air is stopped. Thereafter, the operation of the dust collecting mechanism is stopped. Further, the operation of the suction mechanism is stopped, and the fixation of the substrate S is released. Then, the elevating mechanism 15 is actuated, the substrate transport mechanism 14 is raised, and the substrate S is transferred to the transport roller 14a. When the substrate transfer mechanism 14 is raised to a specific position, the operation of the lift mechanism 15 is stopped. Thereafter, the substrate transfer mechanism 14 is actuated by the operation of the rotating mechanism, whereby the substrate S advances. Then, it is carried out from the substrate discharge port 11b. In this manner, since the substrate S can be carried in and out by the same substrate transfer mechanism 14, the jet processing apparatus can be manufactured at a lower cost than the conventional jet processing apparatus.

(Refer to Figure 7(B))

The plurality of substrates S can be continuously processed by repeating steps 1 to 5. In the case where the plurality of substrates S are continuously processed, the operation of the shot material supply mechanism 18, the compressed air supply mechanism, and the dust collecting mechanism may not be stopped in step 5.

When the film layer of the substrate S is hard, and the film layer cannot be completely removed by one process, the scanning may be further performed by repeating steps 3 to 5. frequency. When the number of scans is increased, the rotation mechanism 17c may be actuated to rotate the substrate S by 90 degrees before the step 3 is performed again.

The sprayed material sucked and recovered by the dust collecting device is sent to a separating mechanism (not shown) such as a cyclone, and is separated into a reusable sprayed material and powders other than the above, which can be reused. The shot material is sent to the shot material supply mechanism 18 and ejected again from the nozzle N.

Although the jet processing apparatus 10 of the present embodiment includes a pair of substrate peripheral portion processing mechanisms 12, the number of substrate peripheral portion processing mechanisms 12 can be increased or decreased depending on the desired processing time. For example, when a substrate peripheral portion processing mechanism 12 is disposed (for example, only disposed above FIG. 1(A)), the number of scans (the number of steps 3 to 5) can be made twice or more. Finished processing. In this configuration, although the processing time of the substrate is long, the manufacturing cost of the jet processing apparatus can be made inexpensive. Moreover, when the number of the peripheral portion processing means 12 of the substrate is increased, the processing capability is improved, so that the moving speed of the substrate S can be increased. As a result, the processing time of the substrate S can be shortened, and productivity is improved.

In the present embodiment, one nozzle N is disposed in one substrate peripheral portion processing mechanism 12, but a plurality of nozzles may be disposed. By increasing the number of nozzles, the processing capability is improved, so that the processing time can be shortened.

[Examples]

The result of removing the unnecessary thin film layer of the peripheral edge portion of the substrate S by the jet processing apparatus of the first embodiment will be described as an example. In the examples, for a thin film solar cell panel of 1100 mm × 1400 mm × 3 mm in thickness, an unnecessary film layer of the peripheral portion was removed under the conditions of Table 1 using the jet processing apparatus of the first embodiment. The thin film solar cell panel used in the embodiment is laminated on a plane of a light-transmitting substrate (in the present embodiment, a glass substrate) to form a film layer (formed as a panel) required for forming a thin film solar cell panel (hereinafter referred to as a panel) (transparent Electrode layer, or optical semiconductor layer, or metal layer, etc.). In addition, an example in which the same processing is performed using the jet processing apparatus (previously the jet processing apparatus) described in Patent Document 1 is Comparative Example 1, and the moving speed of the panel is set to 200 mm/sec and the other conditions are the same as in Comparative Example 1. An example of the ground processing panel is described in Comparative Example 2. Further, the target processing width (the width from which the film layer was removed from the peripheral edge) was set to 16 mm.

The processed panels were observed by a scanning electron microscope (SEM) and evaluated. In the examples, no film layer remained in the processing region M, and no damage was observed in the film layer except the processing region M. In Comparative Example 1, a film layer remained in the processed region M. Further, in Comparative Example 2, no film layer remained in the processed region, and no damage was observed in the film layer other than the processed region. As a result, it has been found that the prior art jet processing apparatus cannot sufficiently remove the unnecessary film layer on the panel under the same conditions as the jet processing apparatus of the present embodiment, that is, the jet processing apparatus of the present embodiment is different from the previous jet processing apparatus. It has higher processing capacity and can process at 1.25 times its processing speed.

Then, a case where the substrate intermediate portion processing unit 19 and the substrate intermediate portion processing unit U' of the cleaning mechanism 13 adjacent to the substrate intermediate portion processing unit 19 are disposed between the pair of substrate peripheral portion processing mechanisms 12 The second embodiment will be described. Here, a case where the substrate intermediate portion processing unit U' is provided in the center of the pair of substrate peripheral portion processing units U, and the substrate S is processed by the substrate peripheral portion processing unit U and the substrate intermediate portion processing unit U'. Be explained. According to this configuration, the substrate S after the blast processing is formed on the first processed side, the second processed side, and the first processed side and the second processed side. A processing region M is formed on the side between the sides. Further, by cutting the center of the processing region M formed by the substrate intermediate portion processing mechanism 19, four substrates S' having the unnecessary thin film layers removed from the peripheral portion can be obtained. Further, the jet processing apparatus according to the second embodiment differs only in the case where the substrate intermediate portion processing unit is disposed. Therefore, only differences from the first embodiment will be described herein.

As shown in Fig. 8(A), the intermediate portion processing mechanism 19 includes a scattering prevention cover 19a which is a lower opening, a nozzle 19b which is disposed at a central portion of the top surface, and a cylindrical suction which is open at both ends. Member 19c. The lower end of the nozzle 19b, that is, the injection port is fixed inside the scattering prevention cover 19a, and is coupled to the injection material supply mechanism 18 and the compressed air supply mechanism. The suction member 19c is connected to the top surface of the scattering prevention cover 19a so as to be positioned on the right and left sides of the nozzle 19b (that is, the traveling direction of the substrate S), and the other end is coupled to the dust collecting mechanism via a hose. Thereby, the space inside the scattering prevention cover 19a communicates with the dust collecting means. Further, the cross-sectional shape of the scattering preventing cover 19a is not particularly limited, and may be a polygon such as a quadrangle or a circular shape.

The nozzle 19b is preferably configured similarly to the nozzle N described above. However, the width of the ejection opening of the nozzle 19b is preferably wider than the width of the ejection opening of the nozzle N described above. As described above, in the processed substrate S, the center of the processing region M processed by the substrate intermediate portion processing mechanism 19 is cut, so that the width of the processing region of the substrate intermediate portion processing mechanism 19 is preferably wider than the first processing. The processing width of the edge and the second machined edge. For example, the width of the ejection opening of the nozzle 19b is selected such that the width of the processing region M of the substrate intermediate portion processing mechanism 19 is about twice the width of the first processed edge and the second processed edge. The nozzle 19b is disposed opposite to the surface without coming into contact with the surface of the substrate S.

The substrate intermediate portion processing mechanism 19 is disposed such that an appropriate gap is formed between the lower end of the scattering preventing cover 19a and the substrate S when the substrate S passes downward. That is, the lower end of the scattering preventing cover 19a is disposed so as not to be in contact with the substrate S. In the vicinity of the lower end portion of the scattering preventing cover 19a, the space is externally provided between the scattering preventing cover 19a and the substrate S. The gas thus generates a flow of air flowing from the outside to the outside of the scattering preventing cover 19a. Therefore, the dust does not leak to the outside of the substrate intermediate portion processing mechanism 19. However, if the distance between the lower end of the scattering preventing cover 19a and the substrate S is too small, the substrate S may be damaged by contact with the lower end of the scattering preventing cover 19a. If the interval is too large, the wind speed at which the outside air is sucked becomes small, so that the dust scattered inside the processing portion 19 of the intermediate portion of the substrate cannot be sufficiently sucked. As a result, the dust leaks to the outside of the substrate intermediate portion processing mechanism 19. When the gap is too narrow, the substrate S is in contact with the lower end of the scattering preventing cover 19a and is damaged. Therefore, the above-described gap must be set in a range in which the substrate S is not in contact with the scattering prevention cover 19a and the suction force is not impaired. In the second embodiment, the distance between the surface of the substrate S and the lower end of the scattering preventing cover 19a (gap) is set to 1.0 to 5.0 mm.

The cleaning mechanism 13 is adjacent to the substrate peripheral portion processing mechanism 12 on the left and right sides of the substrate intermediate portion processing mechanism 19. When dust adheres to the surface of the substrate S after passing through the substrate intermediate portion processing mechanism 19, the dust can be removed by the cleaning mechanism 13.

As shown in Fig. 8(B), the substrate intermediate portion processing unit U' including the substrate intermediate portion processing mechanism 19 and the cleaning mechanism 13 adjacent to the central processing chamber 19 is located at the center of each of the pair of substrate peripheral portion processing units U. Configured in a way. Further, when the substrate is processed in the steps 1 to 6 described in the first embodiment, the scattering preventing cover 19a and the inside of the cleaning mechanism 13 of the substrate intermediate portion processing unit U' are sucked by the dust collecting means, and The nozzle 19b ejects an injection material, and ejects compressed air from the cleaning nozzle 13b to process the substrate S. By this processing, the processing of the unnecessary thin film layer which removes the peripheral portion of the four sides and the two straight lines which are located at the center of the sides and the four sides is completed (see FIG. 9(A)). After the completion of the processing, the center of the processing region processed by the substrate intermediate portion processing mechanism 19 is cut, whereby the four substrates S' having the unnecessary thin film layers removed from the peripheral portion can be obtained (see FIG. 9(B)). .

A plurality of substrate intermediate portion processing mechanisms 19 may also be disposed. For example, two substrate intermediate portion processing mechanisms 19 are disposed between the pair of substrate peripheral portion processing units U, and the same processing is performed, whereby the substrate S as shown in FIG. 9(C) can be obtained. Moreover, the processing mechanism with the intermediate portion of the substrate Regardless of the number of the steps of 19, it can be processed by the substrate intermediate processing mechanism 19 only in the case of either step 3 or step 5, whereby the substrate S as shown in Fig. 9(D) can be obtained. In Fig. 9(D), only in the step 5, the spray material is ejected from the nozzle 19b of the intermediate portion processing mechanism 19 of the substrate and processed.

[Industrial availability]

In the embodiment, the processed thin film solar cell panel has been described, but the jet processing apparatus of the present invention can be preferably used instead of the thin film solar panel as long as it is used for removing the unnecessary thin film layer on the peripheral portion of the substrate. .

10‧‧‧Jet processing equipment

11‧‧‧ frame

11a‧‧‧Substrate entrance

11b‧‧‧Substrate removal

12‧‧‧The peripheral processing part of the substrate

13‧‧‧ Cleaning institutions

14‧‧‧Substrate transport mechanism

14a‧‧‧Transport roller

14b‧‧‧Rack

14c‧‧‧roller components

14d‧‧‧Axis

14e‧‧‧ bearing

15‧‧‧ Lifting mechanism

16‧‧‧ Positioning agency

16a‧‧‧First fixed component

16b‧‧‧Second fixed component

16c‧‧‧Adjusting components

16d‧‧‧Adjustment agency

17‧‧‧Substrate moving rotating mechanism

17a‧‧‧ mounting table

17b‧‧‧Transition agency

17c‧‧‧Rotating mechanism

18‧‧‧Spray material supply mechanism

18a‧‧‧ hopper

18b‧‧‧Quantitative supply agency

H‧‧‧Hose

S‧‧‧Substrate

U‧‧‧Surface peripheral processing unit

Claims (15)

A jet processing apparatus for removing a film layer on a peripheral portion of a substrate in a substrate having a thin film layer formed thereon, and comprising: a peripheral portion processing mechanism for forming a substrate, wherein the peripheral portion of the substrate is formed to be relaxed a substrate peripheral portion processing chamber of the inserted substrate slack insertion portion, a nozzle that is inserted into the peripheral portion of the substrate peripheral processing chamber, and a nozzle that ejects the ejection material into the substrate peripheral portion of the substrate slack insertion portion, and the nozzle a spray material supply mechanism that communicates with and is disposed above the nozzle, and a dust collection mechanism that communicates with the processing chamber of the peripheral portion of the substrate; and a substrate moving and rotating mechanism that mounts the substrate and horizontally positions the substrate relative to the nozzle a mechanism for moving the substrate to rotate, a substrate transfer mechanism for transporting the substrate above an initial stop position of the substrate moving and rotating mechanism, and a lifting mechanism coupled to the substrate transfer mechanism for causing the substrate transfer mechanism The substrate is transferred to the substrate moving rotary mechanism by lowering. The jet processing apparatus of claim 1, wherein the nozzle is a constructor that sucks the spray material by a suction force generated inside the nozzle. The jet processing apparatus according to claim 1 or 2, wherein the nozzle is a structure including an air nozzle that injects compressed air, a spray material supply path provided with a supply of the spray material, and a mixing chamber that is internally connected to the supply path. a nozzle holder, and an injection nozzle that communicates with the mixing chamber and is provided in an extending direction of the air nozzle; and suctions the material by a suction force generated in the mixing chamber. The jet processing apparatus according to claim 1 or 2, wherein the injection material supply mechanism further includes a quantitative supply mechanism for continuously supplying a predetermined amount of the injection material to the nozzle. The blasting apparatus of claim 1 or 2, further comprising a cleaning mechanism adjacent to the peripheral processing portion of the substrate. The blasting apparatus according to claim 5, wherein the cleaning means includes: a housing that is disposed to face the surface of the substrate and has a lower end; the front end is inserted into the inside of the housing, and is disposed to the substrate a cleaning nozzle that sprays compressed air; and a suction member that is disposed in the casing and communicates with the dust collecting mechanism. The blasting apparatus according to claim 1 or 2, further comprising a frame that surrounds the substrate peripheral portion processing mechanism, the substrate movement rotation mechanism, and the substrate transfer mechanism from the outside, the substrate transfer mechanism further comprising: loading the substrate The function in the inside of the casing and the function of removing the substrate after removing the thin film layer on the peripheral portion of the substrate to the outside of the casing. The jet processing apparatus according to claim 1 or 2, further comprising: a positioning mechanism for stopping the substrate conveyed above the substrate moving and rotating mechanism at a specific position. The jet processing apparatus according to claim 1 or 2, further comprising a pair of the substrate peripheral portion processing means, wherein the substrate peripheral edge processing means is disposed such that the respective substrate slack insertion portions face each other with a predetermined interval therebetween. The blasting apparatus according to claim 1 or 2, further comprising: a substrate intermediate portion processing mechanism including: a scattering prevention cover disposed at a position opposite to a surface of the substrate and having a lower end opening A nozzle that is inserted into the inside of the scattering prevention cover and that ejects the injection material from a portion other than the peripheral edge portion of the substrate, and a suction member that is provided in the scattering prevention cover and that is coupled to the dust collecting mechanism. The blasting apparatus according to claim 1 or 2, wherein the substrate processed by the blasting apparatus is a thin film solar panel in which a thin film layer for forming a thin film solar cell is laminated on a plane of the light-transmitting substrate. A blast processing method for removing a film layer of a peripheral portion of the substrate by the blast processing apparatus according to any one of claims 1 to 11, and comprising: by the substrate transfer mechanism a step of transporting the substrate to the upper side of the substrate moving and rotating mechanism; a positioning step for stopping the substrate conveyed to the upper side of the substrate moving and rotating mechanism at a specific position; and lowering the substrate carrying mechanism to transpose the substrate a step of moving the rotation mechanism to the substrate, and fixing the substrate to the substrate moving and rotating mechanism; and horizontally moving the substrate moving and rotating mechanism to loosely insert at least one side of the peripheral edge portion of the substrate into the substrate slack insertion mechanism of the substrate peripheral portion processing mechanism And a step of ejecting the ejecting material from the nozzle while moving the substrate moving and rotating mechanism further horizontally, and removing the thin film layer that is loosely inserted into the peripheral edge portion of the substrate in the substrate slack insertion portion, and is pumped by the dust collecting mechanism The step of sucking the spray material. The blasting method according to claim 12, further comprising: a step of rotating the substrate by 90 degrees by the substrate moving and rotating mechanism after removing the film layer on at least one side of the peripheral portion of the substrate; and moving the substrate moving rotating mechanism And inserting at least one side of the substrate adjacent to a side of the peripheral edge portion of the removed film layer into the substrate slack insertion portion; and ejecting the spray material from the nozzle while moving the substrate moving and rotating mechanism horizontally The step of relaxing the film layer inserted in the peripheral portion of the slack insertion portion of the substrate and sucking the spray material by the dust collecting mechanism is removed. A jet processing method characterized in that it is used by claim 10 The blasting apparatus removes the thin film layer on the peripheral edge portion of the substrate, and includes: a step of transporting the substrate above the substrate moving and rotating mechanism; and a substrate for transporting the substrate transfer mechanism to the substrate moving rotating mechanism a positioning step of stopping at a specific position; a step of lowering the substrate transfer mechanism to transfer the substrate to the substrate moving and rotating mechanism, and fixing the substrate to the substrate moving rotating mechanism; and moving the substrate moving rotating mechanism horizontally a step of loosely inserting the first processed side of the substrate as a peripheral edge portion into the substrate slack insertion portion; and ejecting the spray material from the nozzle while moving the substrate moving and rotating mechanism horizontally to remove the first A step of processing the film layer on the side and sucking the dust generated inside the peripheral processing portion of the substrate by the dust collecting means. The blasting method of claim 14, further comprising: a step of rotating the substrate on which the film layer of the first processed edge is removed by the substrate moving rotation mechanism by 90 degrees; and moving the substrate moving rotating mechanism horizontally a step of loosely inserting the second processed edge adjacent to the first processed edge into the substrate slack insertion portion of the substrate peripheral edge processing mechanism; and ejecting the sprayed material from the nozzle while moving the substrate moving and rotating mechanism horizontally And a step of sucking dust generated inside the peripheral processing portion of the substrate by the dust collecting means by the dust collecting means.