JP2016001158A5 - - Google Patents

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Publication number
JP2016001158A5
JP2016001158A5 JP2014121690A JP2014121690A JP2016001158A5 JP 2016001158 A5 JP2016001158 A5 JP 2016001158A5 JP 2014121690 A JP2014121690 A JP 2014121690A JP 2014121690 A JP2014121690 A JP 2014121690A JP 2016001158 A5 JP2016001158 A5 JP 2016001158A5
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JP
Japan
Prior art keywords
sensor
angular velocity
housing
acceleration
velocity sensor
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Application number
JP2014121690A
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English (en)
Japanese (ja)
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JP6409351B2 (ja
JP2016001158A (ja
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Priority to JP2014121690A priority Critical patent/JP6409351B2/ja
Priority claimed from JP2014121690A external-priority patent/JP6409351B2/ja
Priority to DE112015002785.8T priority patent/DE112015002785T5/de
Priority to US15/307,859 priority patent/US10393523B2/en
Priority to PCT/JP2015/002919 priority patent/WO2015190104A1/ja
Publication of JP2016001158A publication Critical patent/JP2016001158A/ja
Publication of JP2016001158A5 publication Critical patent/JP2016001158A5/ja
Application granted granted Critical
Publication of JP6409351B2 publication Critical patent/JP6409351B2/ja
Active legal-status Critical Current
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JP2014121690A 2014-06-12 2014-06-12 物理量センサ Active JP6409351B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014121690A JP6409351B2 (ja) 2014-06-12 2014-06-12 物理量センサ
DE112015002785.8T DE112015002785T5 (de) 2014-06-12 2015-06-11 Sensor für eine physikalische Grösse
US15/307,859 US10393523B2 (en) 2014-06-12 2015-06-11 Physical quantity sensor
PCT/JP2015/002919 WO2015190104A1 (ja) 2014-06-12 2015-06-11 物理量センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014121690A JP6409351B2 (ja) 2014-06-12 2014-06-12 物理量センサ

Publications (3)

Publication Number Publication Date
JP2016001158A JP2016001158A (ja) 2016-01-07
JP2016001158A5 true JP2016001158A5 (OSRAM) 2016-06-16
JP6409351B2 JP6409351B2 (ja) 2018-10-24

Family

ID=54833215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014121690A Active JP6409351B2 (ja) 2014-06-12 2014-06-12 物理量センサ

Country Status (4)

Country Link
US (1) US10393523B2 (OSRAM)
JP (1) JP6409351B2 (OSRAM)
DE (1) DE112015002785T5 (OSRAM)
WO (1) WO2015190104A1 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6492739B2 (ja) 2015-02-20 2019-04-03 セイコーエプソン株式会社 回路装置、物理量検出装置、電子機器及び移動体
JP6586735B2 (ja) * 2015-02-20 2019-10-09 セイコーエプソン株式会社 回路装置、物理量検出装置、電子機器及び移動体
KR102437764B1 (ko) 2017-12-20 2022-08-30 삼성전자주식회사 센서 패키지, 센서 패키지의 제조 방법, 및 리드 구조체의 제조 방법
JP6996344B2 (ja) * 2018-02-28 2022-01-17 セイコーエプソン株式会社 センサーデバイス、力検出装置およびロボット

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3123352B2 (ja) 1994-06-29 2001-01-09 株式会社デンソー 漏れ測定方法及びその装置
JPH10206273A (ja) * 1997-01-21 1998-08-07 Toyota Motor Corp 角速度センサの気密性確認方法及び装置
JPH1151802A (ja) * 1997-07-31 1999-02-26 River Eletec Kk 圧電素子用パッケージの気密検査方法
JP3435665B2 (ja) 2000-06-23 2003-08-11 株式会社村田製作所 複合センサ素子およびその製造方法
JP3512004B2 (ja) 2000-12-20 2004-03-29 トヨタ自動車株式会社 力学量検出装置
DE102004027501A1 (de) 2004-06-04 2005-12-22 Robert Bosch Gmbh Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren
JP2006010659A (ja) 2004-06-21 2006-01-12 Microstone Corp 振動ジャイロスコープ
JP4543869B2 (ja) 2004-10-15 2010-09-15 株式会社デンソー 振動型角速度センサにおけるセンサ回路
JP5222457B2 (ja) * 2005-09-26 2013-06-26 株式会社日立製作所 センサおよびセンサモジュール
DE102006016260B4 (de) 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements
CN101796374A (zh) * 2007-09-03 2010-08-04 松下电器产业株式会社 惯性力传感器
JP5319122B2 (ja) 2008-01-21 2013-10-16 日立オートモティブシステムズ株式会社 慣性センサ
US7800190B2 (en) * 2008-06-16 2010-09-21 Honeywell International Inc. Getter on die in an upper sense plate designed system
JP5321150B2 (ja) 2009-03-05 2013-10-23 セイコーエプソン株式会社 複合センサー
JP2010204061A (ja) * 2009-03-06 2010-09-16 Panasonic Corp 電子部品及びその製造方法
JP5316479B2 (ja) 2009-06-09 2013-10-16 株式会社デンソー 半導体力学量センサの製造方法及び半導体力学量センサ
JP5298047B2 (ja) * 2010-02-26 2013-09-25 日立オートモティブシステムズ株式会社 複合センサの製造方法
US20120142136A1 (en) 2010-12-01 2012-06-07 Honeywell International Inc. Wafer level packaging process for mems devices
US20140260612A1 (en) * 2011-11-28 2014-09-18 Hitachi Automotive Systems, Ltd. Composite Sensor and Method for Manufacturing The Same
JP2013120179A (ja) * 2011-12-09 2013-06-17 Panasonic Corp 角速度センサ
JP6435631B2 (ja) 2014-04-23 2018-12-12 株式会社デンソー 角速度センサ

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