JP2015534703A - アレイベースの電子素子のための配線板 - Google Patents

アレイベースの電子素子のための配線板 Download PDF

Info

Publication number
JP2015534703A
JP2015534703A JP2015531116A JP2015531116A JP2015534703A JP 2015534703 A JP2015534703 A JP 2015534703A JP 2015531116 A JP2015531116 A JP 2015531116A JP 2015531116 A JP2015531116 A JP 2015531116A JP 2015534703 A JP2015534703 A JP 2015534703A
Authority
JP
Japan
Prior art keywords
light
light emitting
lighting system
column
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015531116A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015534703A5 (enExample
Inventor
マイケル エー． ティシュラー，
マイケル エー． ティシュラー，
ポール パルフレイマン，
ポール パルフレイマン，
フィリップ エム． シック，
フィリップ エム． シック，
ポール ユングビルト，
ポール ユングビルト，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/799,807 external-priority patent/US8947001B2/en
Application filed by Individual filed Critical Individual
Publication of JP2015534703A publication Critical patent/JP2015534703A/ja
Publication of JP2015534703A5 publication Critical patent/JP2015534703A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/46—Details of LED load circuits with an active control inside an LED matrix having LEDs disposed in parallel lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
JP2015531116A 2012-09-06 2013-08-26 アレイベースの電子素子のための配線板 Pending JP2015534703A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261697411P 2012-09-06 2012-09-06
US61/697,411 2012-09-06
US13/799,807 US8947001B2 (en) 2012-09-06 2013-03-13 Wiring boards for array-based electronic devices
US13/799,807 2013-03-13
US13/970,027 US8704448B2 (en) 2012-09-06 2013-08-19 Wiring boards for array-based electronic devices
US13/970,027 2013-08-19
PCT/US2013/056567 WO2014039298A1 (en) 2012-09-06 2013-08-26 Wiring boards for array-based electronic devices

Publications (2)

Publication Number Publication Date
JP2015534703A true JP2015534703A (ja) 2015-12-03
JP2015534703A5 JP2015534703A5 (enExample) 2017-10-05

Family

ID=50186556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015531116A Pending JP2015534703A (ja) 2012-09-06 2013-08-26 アレイベースの電子素子のための配線板

Country Status (5)

Country Link
US (7) US8704448B2 (enExample)
EP (1) EP2893253B1 (enExample)
JP (1) JP2015534703A (enExample)
CN (1) CN104755835A (enExample)
WO (1) WO2014039298A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101852068B1 (ko) * 2017-11-29 2018-04-27 주식회사 바른신호 횡단보도 신호등과 연동 제어되는 바닥신호등
KR101905794B1 (ko) * 2018-03-14 2018-12-05 주식회사 바른신호 횡단보도 신호등과 연동 제어되는 바닥신호등
JP2020198346A (ja) * 2019-05-31 2020-12-10 エイテックス株式会社 面発光装置用プリント配線基板および面発光装置
JP2023515725A (ja) * 2020-05-07 2023-04-13 シグニファイ ホールディング ビー ヴィ Ｌｅｄフィラメント及びランプ
JP2023543322A (ja) * 2020-10-19 2023-10-13 シグニファイ ホールディング ビー ヴィ 接続されるライトストリップを有する、寸法に合わせて切断される発光アセンブリ

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
CN102959708B (zh) 2010-06-29 2016-05-04 柯立芝照明有限公司 具有易弯曲基板的电子装置
WO2012119109A1 (en) 2011-03-02 2012-09-07 Stratacache, Inc. Translucent digital display system
US9881528B2 (en) 2011-10-13 2018-01-30 Manufacturing Resources International, Inc. Transparent liquid crystal display on display case
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods
US8947001B2 (en) 2012-09-06 2015-02-03 Cooledge Lighting Inc. Wiring boards for array-based electronic devices
US8704448B2 (en) 2012-09-06 2014-04-22 Cooledge Lighting Inc. Wiring boards for array-based electronic devices
US9506633B2 (en) 2012-09-06 2016-11-29 Cooledge Lighting Inc. Sealed and sealable lighting systems incorporating flexible light sheets and related methods
US9696019B2 (en) * 2012-09-06 2017-07-04 Cooledge Lighting Inc. LED lighting structure
US9468062B2 (en) * 2013-01-02 2016-10-11 Austin Ip Partners Light emitting diode light structures
US9903574B2 (en) * 2013-10-23 2018-02-27 Heilux, Llc High powered LED light module with a balanced matrix circuit
US20150115817A1 (en) * 2013-10-28 2015-04-30 Yau-Chin Peng Construction improvement of led light set
US10194503B2 (en) 2014-04-02 2019-01-29 Abl Ip Holding Llc Composite light source systems and methods
US9633366B2 (en) 2014-06-16 2017-04-25 Manufacturing Resources International, Inc. System for tracking and analyzing display case usage
US9535293B2 (en) 2014-06-16 2017-01-03 Manufacturing Resources International, Inc. Sealed transparent liquid crystal display assembly
US9500896B2 (en) 2014-06-16 2016-11-22 Manufacturing Resources International, Inc. Cooling system for liquid crystal display
US9596950B2 (en) * 2014-09-03 2017-03-21 Amstore Corporation Display lighting system
US20170307150A1 (en) * 2014-09-23 2017-10-26 Osram Sylvania Inc. Formable three-dimensional lighting devices
US9853197B2 (en) * 2014-09-29 2017-12-26 Bridgelux, Inc. Light emitting diode package having series connected LEDs
US10649273B2 (en) 2014-10-08 2020-05-12 Manufacturing Resources International, Inc. LED assembly for transparent liquid crystal display and static graphic
US9832847B2 (en) 2014-10-09 2017-11-28 Manufacturing Resources International, Inc. System for decreasing energy usage of a transparent LCD display case
US10182665B2 (en) 2014-10-15 2019-01-22 Manufacturing Resources International, Inc. System and method for preventing damage to products
US9939137B2 (en) * 2014-10-17 2018-04-10 2C Products, LLC Foldable utility lighting
JP6458493B2 (ja) * 2014-12-25 2019-01-30 大日本印刷株式会社 Ｌｅｄ素子用基板、及びそれを用いたｌｅｄ実装モジュールの製造方法
JP6458492B2 (ja) * 2014-12-25 2019-01-30 大日本印刷株式会社 Ｌｅｄ素子用基板、及びそれを用いたｌｅｄ実装モジュールの製造方法
JP6447116B2 (ja) * 2014-12-25 2019-01-09 大日本印刷株式会社 Ｌｅｄ素子用基板及びｌｅｄ表示装置
US10980121B2 (en) * 2015-02-16 2021-04-13 Nthdegree Technologies Worldwide Inc. Printed LED driver circuit
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
CN104864310A (zh) * 2015-04-15 2015-08-26 京东方科技集团股份有限公司 发光装置及背光源
EP3295770B1 (en) 2015-05-08 2020-12-23 Signify Holding B.V. Led light strip and method for manufacturing the same
FR3046294A1 (fr) * 2015-12-29 2017-06-30 Aledia Circuit optoelectronique a diodes electroluminescentes
US10801705B2 (en) * 2016-01-15 2020-10-13 Vosla Gmbh LED light emitting strip and arrangement of LED light emitting strips
US10746358B1 (en) 2016-03-02 2020-08-18 Cooledge Lighting Inc. Lighting systems incorporating connections for signal and power transmission
US11274823B1 (en) 2016-03-02 2022-03-15 Cooledge Lighting, Inc. Lighting systems incorporating connections for signal and power transmission
US10344954B1 (en) 2016-03-02 2019-07-09 Cooledge Lighting Inc. Lighting systems incorporating connections for signal and power transmission
WO2017151934A1 (en) 2016-03-02 2017-09-08 Manufacturing Resources International, Inc. Vending machine having a transparent display
US10667362B1 (en) * 2016-03-30 2020-05-26 Cooledge Lighting Inc. Methods of operating lighting systems with controllable illumination
JP6664481B2 (ja) * 2016-06-24 2020-03-13 シャープ株式会社 光照射用基板
AU2017293369B2 (en) 2016-07-08 2019-11-28 Manufacturing Resources International, Inc. Mirror having an integrated electronic display
US10132453B2 (en) * 2016-08-23 2018-11-20 Orsam Sylvania Inc. Flexible light engine with bus bars and interconnectors
CA3032714A1 (en) * 2016-10-07 2018-04-12 Grote Industries, Llc Thin film sheet including power lines, lights, and sensors
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
EP3337302B1 (en) 2016-12-14 2021-09-29 OSRAM GmbH A support structure for lighting devices, corresponding lighting device and method
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
US10166914B2 (en) * 2017-02-27 2019-01-01 GM Global Technology Operations LLC Separable display article
JP6685470B2 (ja) * 2017-03-30 2020-04-22 三菱電機株式会社 半導体装置およびその製造方法、ならびに電力変換装置
US10400979B2 (en) * 2017-04-27 2019-09-03 Lg Electronics Inc. Vehicle lamp using semiconductor light emitting device
US11812525B2 (en) 2017-06-27 2023-11-07 Wangs Alliance Corporation Methods and apparatus for controlling the current supplied to light emitting diodes
JP6937429B2 (ja) * 2017-08-22 2021-09-22 ヴァーダント ライティング テクノロジー インコーポレイテッドＶｅｒｄａｎｔ Ｌｉｇｈｔｉｎｇ Ｔｅｃｈｎｏｌｏｇｙ， Ｉｎｃ． 調整可能な光スタック
KR102236384B1 (ko) 2017-10-27 2021-04-05 주식회사 엘지화학 배터리 밸런싱을 위한 장치 및 그것을 포함하는 배터리팩
CN107911939B (zh) * 2017-11-24 2024-05-10 惠州市鹏程电子科技有限公司 一种柔性印刷电路板
EP3531805A1 (en) * 2018-02-27 2019-08-28 OSRAM GmbH A method for manufacturing a lighting device and corresponding device
EP3537041A1 (en) 2018-03-08 2019-09-11 Lumileds Holding B.V. Lighting device comprising connection element with spring section
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11042062B2 (en) * 2018-10-04 2021-06-22 Innolux Corporation Electronic device
TWI835978B (zh) * 2020-01-22 2024-03-21 晶元光電股份有限公司 發光裝置
US11788717B2 (en) 2020-05-11 2023-10-17 Wangs Alliance Corporation Fixtures, power and control systems for same
CN115867747A (zh) 2020-05-22 2023-03-28 亮锐有限责任公司 Led照明模块
US11125399B1 (en) 2020-06-01 2021-09-21 Apogee Lighting Holdings, Llc Connection for scalable LED luminaire tape
CN112533374B (zh) * 2020-11-09 2024-03-01 安徽芯瑞达科技股份有限公司 一种平衡显示用背光pcb板线路电压损耗电路设计方法
IT202100025865A1 (it) * 2021-10-08 2023-04-08 Powerglax S R L Sistema fotovoltaico
US11802682B1 (en) 2022-08-29 2023-10-31 Wangs Alliance Corporation Modular articulating lighting
TWI817684B (zh) * 2022-08-30 2023-10-01 電威電機工廠股份有限公司 均壓配電式燈條裝置及其佈線方法
US12156314B2 (en) * 2022-10-21 2024-11-26 Vernon L. Walker Eight-zone controller
USD1046579S1 (en) 2023-01-06 2024-10-15 Milwaukee Electric Tool Corporation Chisel
USD1045551S1 (en) 2023-01-06 2024-10-08 Milwaukee Electric Tool Corporation Chisel
IT202300013146A1 (it) * 2023-06-26 2024-12-26 Moritz Waldemeyer Dispositivo elettro-ottico
US12292169B1 (en) 2024-07-10 2025-05-06 Wangs Alliance Corporation Shadowless connector

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09185911A (ja) * 1995-08-28 1997-07-15 Stantech 発光ダイオードを備えた一体成形の線形光ストリップ
JP2004006724A (ja) * 2002-03-28 2004-01-08 Seiko Epson Corp 半導体装置およびその製造方法、電気光学装置、液晶表示装置、電子機器
JP2006221966A (ja) * 2005-02-10 2006-08-24 Nec Lighting Ltd 面状光源装置、面状光源集合体、および面状光源装置の製造方法
WO2011098135A1 (en) * 2010-02-09 2011-08-18 United Luminous International (Holdings) Limited Integrally formed light emitting diode light wire and uses thereof
JP2012038654A (ja) * 2010-08-10 2012-02-23 Toshiba Lighting & Technology Corp Ｌｅｄ照明器具

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1005837A (en) 1911-02-10 1911-10-17 John Hoffer Safety-stop for elevators.
US5848837A (en) * 1995-08-28 1998-12-15 Stantech Integrally formed linear light strip with light emitting diodes
US5597070A (en) * 1995-11-27 1997-01-28 Wu; Gordon K. H. Lamp string holding container structure
WO2003056633A1 (fr) 2001-12-25 2003-07-10 Josuke Nakata Appareil semi-conducteur d'emission et de reception de lumiere
US6591530B1 (en) * 2002-02-07 2003-07-15 Ching-Shin Liao Dynamic picture set
US8845434B2 (en) 2002-12-10 2014-09-30 Ol2, Inc. System and method for improving the graphics performance of hosted applications
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7858994B2 (en) 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US7997771B2 (en) 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
CN100365810C (zh) * 2005-03-15 2008-01-30 李奕权 漫射和镭射光电偶合的集成电路信号线
JP5166278B2 (ja) 2005-11-18 2013-03-21 クリー インコーポレイテッド 固体素子照明タイル
US7777166B2 (en) * 2006-04-21 2010-08-17 Cree, Inc. Solid state luminaires for general illumination including closed loop feedback control
TW200802928A (en) 2006-06-13 2008-01-01 Bright View Electronics Co Ltd A flexible ribbon illumination device and manufacture method thereof
EP1928026A1 (en) 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Illumination device with semiconductor light-emitting elements
TW200843135A (en) 2007-04-23 2008-11-01 Augux Co Ltd Method of packaging light emitting diode with high heat-dissipating efficiency and the structure thereof
CN101680604B (zh) * 2007-05-08 2013-05-08 科锐公司 照明装置和照明方法
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
TWI391028B (zh) 2008-04-18 2013-03-21 Novatek Microelectronics Corp 發光二極體驅動模組
US8461613B2 (en) 2008-05-27 2013-06-11 Interlight Optotech Corporation Light emitting device
US20100031996A1 (en) * 2008-08-11 2010-02-11 Basol Bulent M Structure and method of manufacturing thin film photovoltaic modules
TW201036183A (en) * 2008-12-16 2010-10-01 Solopower Inc Thin film photovoltaic module manufacturing methods and structures
US7982409B2 (en) * 2009-02-26 2011-07-19 Bridgelux, Inc. Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs
KR20120018369A (ko) * 2009-05-25 2012-03-02 데이4 에너지 인코포레이티드 광전도 모듈 스트링 배열 및 그 쉐이딩 보호
KR20100129414A (ko) * 2009-06-01 2010-12-09 진승섭 발광시트
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8648546B2 (en) 2009-08-14 2014-02-11 Cree, Inc. High efficiency lighting device including one or more saturated light emitters, and method of lighting
US8493000B2 (en) * 2010-01-04 2013-07-23 Cooledge Lighting Inc. Method and system for driving light emitting elements
JP5600304B2 (ja) * 2010-03-03 2014-10-01 富士フイルム株式会社 光散乱シート及びその製造方法
JP5853374B2 (ja) 2010-03-12 2016-02-09 オムロン株式会社 照明装置
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
JP2012049367A (ja) * 2010-08-27 2012-03-08 Kyocera Elco Corp 半導体発光素子取付用モジュール、半導体発光素子モジュール、半導体発光素子照明器具、及び、半導体発光素子取付用モジュールの製造方法
US8210716B2 (en) 2010-08-27 2012-07-03 Quarkstar Llc Solid state bidirectional light sheet for general illumination
US8575639B2 (en) 2011-02-16 2013-11-05 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
GB2484152B (en) * 2010-12-03 2015-03-25 Zeta Specialist Lighting Methods of manufacturing electrical devices such as electric lamps
US9410687B2 (en) * 2012-04-13 2016-08-09 Cree, Inc. LED lamp with filament style LED assembly
US9506633B2 (en) 2012-09-06 2016-11-29 Cooledge Lighting Inc. Sealed and sealable lighting systems incorporating flexible light sheets and related methods
US8947001B2 (en) 2012-09-06 2015-02-03 Cooledge Lighting Inc. Wiring boards for array-based electronic devices
US8704448B2 (en) 2012-09-06 2014-04-22 Cooledge Lighting Inc. Wiring boards for array-based electronic devices
US9076950B2 (en) * 2012-09-14 2015-07-07 Tsmc Solid State Lighting Ltd. High voltage LED with improved heat dissipation and light extraction

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09185911A (ja) * 1995-08-28 1997-07-15 Stantech 発光ダイオードを備えた一体成形の線形光ストリップ
JP2004006724A (ja) * 2002-03-28 2004-01-08 Seiko Epson Corp 半導体装置およびその製造方法、電気光学装置、液晶表示装置、電子機器
JP2006221966A (ja) * 2005-02-10 2006-08-24 Nec Lighting Ltd 面状光源装置、面状光源集合体、および面状光源装置の製造方法
WO2011098135A1 (en) * 2010-02-09 2011-08-18 United Luminous International (Holdings) Limited Integrally formed light emitting diode light wire and uses thereof
JP2012038654A (ja) * 2010-08-10 2012-02-23 Toshiba Lighting & Technology Corp Ｌｅｄ照明器具

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101852068B1 (ko) * 2017-11-29 2018-04-27 주식회사 바른신호 횡단보도 신호등과 연동 제어되는 바닥신호등
KR101905794B1 (ko) * 2018-03-14 2018-12-05 주식회사 바른신호 횡단보도 신호등과 연동 제어되는 바닥신호등
JP2020198346A (ja) * 2019-05-31 2020-12-10 エイテックス株式会社 面発光装置用プリント配線基板および面発光装置
JP2023515725A (ja) * 2020-05-07 2023-04-13 シグニファイ ホールディング ビー ヴィ Ｌｅｄフィラメント及びランプ
JP7362948B2 (ja) 2020-05-07 2023-10-17 シグニファイ ホールディング ビー ヴィ Ｌｅｄフィラメント及びランプ
JP2023543322A (ja) * 2020-10-19 2023-10-13 シグニファイ ホールディング ビー ヴィ 接続されるライトストリップを有する、寸法に合わせて切断される発光アセンブリ
JP7398599B2 (ja) 2020-10-19 2023-12-14 シグニファイ ホールディング ビー ヴィ 接続されるライトストリップを有する、寸法に合わせて切断される発光アセンブリ

Also Published As

Publication number Publication date
EP2893253B1 (en) 2018-02-28
US9526132B2 (en) 2016-12-20
EP2893253A1 (en) 2015-07-15
US20200263844A1 (en) 2020-08-20
US20170059100A1 (en) 2017-03-02
US11950337B2 (en) 2024-04-02
US20140062316A1 (en) 2014-03-06
EP2893253A4 (en) 2016-06-08
US20170059099A1 (en) 2017-03-02
US8884534B2 (en) 2014-11-11
US20150077991A1 (en) 2015-03-19
CN104755835A (zh) 2015-07-01
US20140175993A1 (en) 2014-06-26
US8704448B2 (en) 2014-04-22
US20150108907A1 (en) 2015-04-23
WO2014039298A1 (en) 2014-03-13
US9797561B2 (en) 2017-10-24
US9089018B2 (en) 2015-07-21
US10578259B2 (en) 2020-03-03

Similar Documents

Publication Publication Date Title
US11950337B2 (en) Wiring boards for array-based electronic devices
US8947001B2 (en) Wiring boards for array-based electronic devices
US9426860B2 (en) Electronic devices with yielding substrates
US20210231271A1 (en) Rugged flexible led lighting panel
CN105870312B (zh) 具有易弯曲基板的电子装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160824

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160824

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170524

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170529

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20170828

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171124

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180628