JP2015534279A5 - - Google Patents

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Publication number
JP2015534279A5
JP2015534279A5 JP2015537703A JP2015537703A JP2015534279A5 JP 2015534279 A5 JP2015534279 A5 JP 2015534279A5 JP 2015537703 A JP2015537703 A JP 2015537703A JP 2015537703 A JP2015537703 A JP 2015537703A JP 2015534279 A5 JP2015534279 A5 JP 2015534279A5
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JP
Japan
Prior art keywords
electromagnetic energy
controlling
source
emission
parameters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2015537703A
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English (en)
Japanese (ja)
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JP2015534279A (ja
JP6203855B2 (ja
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Publication date
Priority claimed from US13/656,293 external-priority patent/US9532463B2/en
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Publication of JP2015534279A publication Critical patent/JP2015534279A/ja
Publication of JP2015534279A5 publication Critical patent/JP2015534279A5/ja
Application granted granted Critical
Publication of JP6203855B2 publication Critical patent/JP6203855B2/ja
Active legal-status Critical Current
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JP2015537703A 2012-10-19 2013-08-30 金属ウィスカーの発生を低減するための方法及び装置 Active JP6203855B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/656,293 US9532463B2 (en) 2012-10-19 2012-10-19 Methods and apparatus for reducing the occurrence of metal whiskers
US13/656,293 2012-10-19
PCT/US2013/057489 WO2014062301A1 (en) 2012-10-19 2013-08-30 Methods and apparatus for reducing the occurrence of metal whiskers

Publications (3)

Publication Number Publication Date
JP2015534279A JP2015534279A (ja) 2015-11-26
JP2015534279A5 true JP2015534279A5 (enExample) 2016-03-31
JP6203855B2 JP6203855B2 (ja) 2017-09-27

Family

ID=49263427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015537703A Active JP6203855B2 (ja) 2012-10-19 2013-08-30 金属ウィスカーの発生を低減するための方法及び装置

Country Status (4)

Country Link
US (1) US9532463B2 (enExample)
EP (1) EP2910094B1 (enExample)
JP (1) JP6203855B2 (enExample)
WO (1) WO2014062301A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014116537B4 (de) * 2014-11-12 2024-05-29 Infineon Technologies Ag Funktionales Hautpflaster sowie System zum Überwachen eines Körpergesundheitsparameters
KR102277371B1 (ko) * 2019-03-26 2021-07-14 (주)앨트론 위스커 성장 방지를 위한 전자빔 조사 방법
CN110512244B (zh) * 2019-09-19 2021-03-09 昆山一鼎工业科技有限公司 电镀雾锡产品的表面处理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008048214A2 (en) * 2005-07-19 2008-04-24 The Trustees Of Dartmouth College Free electron pumped terahertz laser with double grating horn arrangement for collimated free wave emission
GB0307096D0 (en) * 2003-03-27 2003-04-30 Univ Cambridge Tech Terahertz radiation sources and methods
JP2006196323A (ja) * 2005-01-14 2006-07-27 Takamatsu Mekki:Kk 接続端子およびその製造方法
JP2006216474A (ja) * 2005-02-07 2006-08-17 Sony Chem Corp 配線体、電子機器、配線体の製造方法、および電子機器の製造方法
JP4654741B2 (ja) 2005-04-08 2011-03-23 澁谷工業株式会社 ウィスカ防止方法
JP2007090354A (ja) * 2005-09-26 2007-04-12 Fuji Xerox Co Ltd 電気回路装置
JP2007297668A (ja) * 2006-04-28 2007-11-15 Om Sangyo Kk メッキ製品の製造方法
US20070275262A1 (en) 2006-05-23 2007-11-29 Dechao Lin Reducing formation of tin whiskers on a tin plating layer
US7848835B2 (en) * 2006-06-02 2010-12-07 Cymer, Inc. High power laser flat panel workpiece treatment system controller
US8617913B2 (en) * 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
JP4986141B2 (ja) 2007-05-08 2012-07-25 国立大学法人秋田大学 錫メッキの針状ウィスカの発生を抑制する方法
US8071931B2 (en) * 2007-11-13 2011-12-06 Battelle Energy Alliance, Llc Structures, systems and methods for harvesting energy from electromagnetic radiation
JP5388324B2 (ja) * 2008-02-22 2014-01-15 日本圧着端子製造株式会社 めっき層の熱処理方法
JP2010256254A (ja) * 2009-04-27 2010-11-11 Panasonic Corp 電磁波検出装置、それを備えた加熱装置および冷凍装置
JP2011198683A (ja) * 2010-03-23 2011-10-06 Mitsubishi Materials Corp コネクタ用接続端子及びその製造方法

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