JP2015532779A - 高精細導電性パターンのフレキソ印刷向けのインク組成 - Google Patents
高精細導電性パターンのフレキソ印刷向けのインク組成 Download PDFInfo
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
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Abstract
Description
ビスフェノールAジアクリラート:22.4重量%
ポリエチレングリコールジアクリラート:22.4重量%
メタクリル酸ヒドロキシエチル:29.9重量%
ペンタエリスリトールテトラアクリレート:14.9重量%
1−ヒドロキシシクロヘキシルフェニルケトン:4.5重量%
2,2−ジメチル−1,2−ジフェニルエタン−1−オン:2.2重量%
酢酸パラジウム:3.6重量%
ポリ(ビニルアルコール),N−メトキシ−4−(4’−ホルミルスチリル)ピリジニウムメトスルファートアセタール溶液(固形分13.3重量%):26.3重量%
ポリビニルピロリドン:4.1重量%
酢酸パラジウム:2.1重量%
1−メトキシ−2−プロパノール:67.5重量%
Claims (20)
- 高精細導電性パターンをフレキソ印刷で製造する方法であって、
複数の線を含みその複数の線を構成する各線の幅が1ミクロンから25ミクロンの間である最初のパターンを、水に相溶性のあるポリマーとめっき触媒とを含むインクを用いて基板にフレキソ印刷で印刷し、
印刷されたパターンを少なくとも半凝固させることで最初のパターンを硬化させ、
最初のパターンをめっきして導電性パターンを形成する方法。 - 請求項1の方法であって、高極性のポリマーが、ビスフェノールAジアクリラート、ポリエチレングリコールジアクリラート、メタクリル酸ヒドロキシエチルモノマー、ペンタエリスリトールテトラアクリラートのうち少なくとも一つを含むもの。
- 請求項1の方法であって、インクはさらに光開始剤を含み、その光開始剤は、1−ヒドロキシシクロエチルフェニルケトン、2,2−ジメチル−1,2−ジフェニルエタン−1−オン、アセトフェノン、アニソイン、アントラキノン、アントラキノン−2−スルホン酸のナトリウム塩一水和物、(ベンゼン)トリカルボニルクロム、ベンジル、ベンゾインエチルエーテル、ベンゾインイソブチルエーテル、ベンゾインメチルエーテル、ベンゾフェノン、ベンゾフェノン/1−ヒドロキシシクロヘキシルフェニルケトンの等量混合物、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物、4−ベンゾイルビフェニル、2−ベンジル−2−(ジメチルアミノ)−4’−モルホリノブチロフェノン、4,4’−ビス(ジエチルアミノ)ベンゾフェノン、4,4’−ビス(ジメチルアミノ)ベンゾフェノン、4,4’−ビス(ジメチルアミノ)ベンゾフェノン、カンファーキノン、2−クロロ−チオキサンテン−9−オン、(クメン)シクロペンタジエニル鉄(II)ヘキサフルオロリン酸、ジンベンゾスベレノン、2,2−ジエトキシアセトフェノン、4,4’−ジヒドロキシベンゾフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、4−(ジメチルアミノ)ベンゾフェノン、4,4’−ジメチルベンジル、2,5−ジメチルベンゾフェノン、3,4−ジメチルベンゾフェノン、ジフェニル(2,4,6−トリメチルベンゾイル)ホスフィンオキシドと2−ヒドロキシ−2−メチルプロピオフェノンの等量混合物、4’−エトキシアセトフェノン、2−エチルアントラキノン、フェロセン、3’−ヒドロキシアセトフェノン、4’−ヒドロキシアセトフェノン、3−ヒドロキシベンゾフェノン、4−ヒドロキシベンゾフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、2−ヒドロキシ−2−メチルプロピオフェノン、2−メチルベンゾフェノン、3−メチルベンゾフェノン、ベンゾイルぎ酸メチル、2−メチル−4’−(メチルチオ)−2−モルホリノプロピオフェノン、フェナントレンキノン、4’−フェノキシアセトフェノン、チオキサンテン−9−オンのうち少なくとも一つを含むもの。
- 請求項1の方法であって、めっき触媒が、酢酸パラジウム、2,4−ペンタンジオナトパラジウム、銀(Ag)、白金(Pt)、金(Au)、エルビウム(Er)とそれらの組み合わせであるもの。
- 請求項1の方法であって、めっき触媒が複数のナノ粒子を含み、その複数のナノ粒子を構成する各ナノ粒子が10nmから5ミクロンの間であるもの。
- 請求項1の方法であって、インクがさらに複数のナノ繊維を含むもの。
- 請求項6の方法であって、複数のナノ繊維を構成する各ナノ繊維の直径が少なくとも20nmから200nmであり、長さが少なくとも2ミクロンから10ミクロンであるもの。
- 請求項1の方法であって、インクが、ビスフェノールAジアクリラート5重量%から80重量%、ポリエチレングリコールジアクリラート10重量%から80重量%、メタクリル酸ヒドロキシエチル5重量%から50重量%、ペンタエリスリトールテトラアクリラート5重量%から50重量%、1−ヒドロキシシクロヘキシルフェニルケトン1重量%から10重量%、2,2−ジメチル−1,2−ジフェニルエタン−1−オン1重量%から10重量%、酢酸パラジウム0.1重量%から20重量%を含むもの。
- 請求項1の方法であって、最初のパターンを基板の第一面に印刷し、さらに基板の第一面とは反対側の面か、基板の第一面の最初のパターンの隣か、別の基板の少なくともいずれかに二番目のパターンを印刷するもの。
- 請求項1の方法であって、めっきが、銅(Cu)、ニッケル(Ni)、スズ(Sn)、金(Au)、銀(Ag)、エルビウム(Er)かそれらの組み合わせのうち、少なくとも一つを用いた無電解めっきであるもの。
- 高精細導電性パターンをフレキソ印刷によって製造する方法であって、
複数の線を含みその複数の線を構成する各線の幅が1ミクロンから25ミクロンであるパターンを、水に相溶性のあるポリマーとめっき触媒とを含むインクを用いて基板にフレキソ印刷で印刷し、
印刷されたパターンを少なくとも半凝固させることでパターンを硬化させ、
印刷されたパターンをめっきして高精細導電性パターンを形成する方法。 - 請求項11の方法であって、その高精細導電性パターンは、タッチスクリーンセンサーのパターンか、RFアンテナのパターンの一方であるもの。
- 請求項11の方法であって、高極性ポリマーが、ポリ(ビニルアルコール)、N−メチル−4−(4’−ホルミルスチリル)ピリジニウムメトスルファートアセタール溶液の一方であるもの。
- 請求項11の方法であって、めっき触媒が酢酸パラジウムを含むもの。
- 請求項11の方法であって、めっき触媒が、パラジウムか第VII族の金属いずれかの有機金属塩を含むもの。
- 高精細導電性パターンをフレキソ印刷によって製造する方法であって、
複数の線を含みその複数の線の各線の幅が1ミクロンから25ミクロンの間である少なくとも一つのパターンを、少なくとも一つのポリマーと、テトラキス(トリフェニルホスフィン)パラジウム(0)を含む少なくとも一つのめっき触媒とを含むインクを用いて基板に印刷し、
印刷されたパターンを少なくとも半凝固させる過程を含む硬化によって、印刷された少なくとも一つのパターンを硬化させ、
この少なくとも一つのパターンをめっきすることで導電性パターンを形成する方法。 - 請求項16の方法であって、重合触媒が、トリメチロールプロパントリアクリラート、2,2’−(メチルアミノ)ジエタノールベンゾフェノン、ベンゾフェノンのうち少なくとも一つであるもの。
- 請求項16の方法であって、インクが、10重量%から20重量%のトリメチロールプロパントリアクリラート、5重量%から10重量%の2,2’−(メチルイミノ)ジエタノールベンゾフェノン、1重量%から5重量%のベンゾフェノンを含む複数の重合触媒を含むもの。
- 請求項16の方法であって、高精細導電性パターンが、タッチスクリーンセンサーパターンかRFアンテナパターンの少なくとも一方であるもの。
- 請求項16の方法であって、インクの粘性が少なくとも50cpsから10000cpsであるもの。
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TWI602885B (zh) | 2017-10-21 |
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TW201404835A (zh) | 2014-02-01 |
EP2880680A4 (en) | 2016-11-16 |
KR20150038411A (ko) | 2015-04-08 |
US9511582B2 (en) | 2016-12-06 |
US20150165755A1 (en) | 2015-06-18 |
CN104508794A (zh) | 2015-04-08 |
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