JP2015529934A - 有機電子的装置をカプセル化するための接着テープ - Google Patents

有機電子的装置をカプセル化するための接着テープ Download PDF

Info

Publication number
JP2015529934A
JP2015529934A JP2015518932A JP2015518932A JP2015529934A JP 2015529934 A JP2015529934 A JP 2015529934A JP 2015518932 A JP2015518932 A JP 2015518932A JP 2015518932 A JP2015518932 A JP 2015518932A JP 2015529934 A JP2015529934 A JP 2015529934A
Authority
JP
Japan
Prior art keywords
adhesive
getter material
electronic device
adhesive tape
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015518932A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015529934A5 (OSRAM
Inventor
バイ・ミニョン
エリンガー・ヤン
グリューナウアー・ユーディト
カイテ−テルゲンビューシャー・クラウス
ペーターゼン・アニカ
Original Assignee
テーザ・ソシエタス・ヨーロピア
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テーザ・ソシエタス・ヨーロピア filed Critical テーザ・ソシエタス・ヨーロピア
Publication of JP2015529934A publication Critical patent/JP2015529934A/ja
Publication of JP2015529934A5 publication Critical patent/JP2015529934A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Photovoltaic Devices (AREA)
  • Packages (AREA)
JP2015518932A 2012-06-29 2013-05-27 有機電子的装置をカプセル化するための接着テープ Pending JP2015529934A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012211335.5A DE102012211335A1 (de) 2012-06-29 2012-06-29 Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102012211335.5 2012-06-29
PCT/EP2013/060895 WO2014001005A1 (de) 2012-06-29 2013-05-27 Klebeband für die kapselung einer organischen elektronischen anordnung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018145579A Division JP2018199821A (ja) 2012-06-29 2018-08-02 有機電子的装置をカプセル化するための接着テープ

Publications (2)

Publication Number Publication Date
JP2015529934A true JP2015529934A (ja) 2015-10-08
JP2015529934A5 JP2015529934A5 (OSRAM) 2017-05-25

Family

ID=48579029

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015518932A Pending JP2015529934A (ja) 2012-06-29 2013-05-27 有機電子的装置をカプセル化するための接着テープ
JP2018145579A Withdrawn JP2018199821A (ja) 2012-06-29 2018-08-02 有機電子的装置をカプセル化するための接着テープ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018145579A Withdrawn JP2018199821A (ja) 2012-06-29 2018-08-02 有機電子的装置をカプセル化するための接着テープ

Country Status (8)

Country Link
US (1) US9543549B2 (OSRAM)
EP (1) EP2867318B1 (OSRAM)
JP (2) JP2015529934A (OSRAM)
KR (1) KR102013435B1 (OSRAM)
CN (1) CN104508063B (OSRAM)
DE (1) DE102012211335A1 (OSRAM)
TW (1) TWI580756B (OSRAM)
WO (1) WO2014001005A1 (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018510449A (ja) * 2014-12-18 2018-04-12 ロリク アーゲーＲｏｌｉｃ Ａｇ 親水性ナノ粒子を含む放射線硬化性組成物
JP2019501237A (ja) * 2015-11-09 2019-01-17 テーザ・ソシエタス・ヨーロピア ポリマーゲッター材料を有するバリア接着剤
JP2020188006A (ja) * 2014-11-26 2020-11-19 株式会社半導体エネルギー研究所 表示装置

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201436855A (zh) * 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
JP6273858B2 (ja) * 2014-01-24 2018-02-07 三菱ケミカル株式会社 湿度感受性部材の封止体
KR20150097359A (ko) 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
DE102014207074A1 (de) * 2014-04-11 2015-10-15 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207792A1 (de) * 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
CN103956435A (zh) * 2014-04-28 2014-07-30 上海大学 一种有机发光二极管的胶带封装结构
DE102014208111A1 (de) * 2014-04-29 2015-10-29 Tesa Se Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen
CN106663750A (zh) 2014-06-23 2017-05-10 肖特股份有限公司 包含片状不连续元件的蓄电系统、片状不连续元件及其制造方法和应用
US10626305B2 (en) 2014-10-29 2020-04-21 Tesa Se OLED-compatible adhesive masses having silane water scavengers
EP3212728B1 (de) * 2014-10-29 2018-10-03 tesa SE Klebemassen mit multifunktionellen siloxanwasserfängern
JP6474489B2 (ja) * 2014-10-29 2019-02-27 テーザ・ソシエタス・ヨーロピア 活性化可能なゲッター材料を含む接着剤
US20160137889A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Bondply adhesive composition
WO2016087311A2 (de) 2014-12-01 2016-06-09 Schott Ag Elektrisches speichersystem mit einem scheibenförmigen diskreten element, diskretes scheibenförmiges element, verfahren zu dessen herstellung sowie dessen verwendung
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
JP2016160343A (ja) * 2015-03-02 2016-09-05 富士フイルム株式会社 粘着シート、粘着フィルム、有機発光装置、および、粘着剤組成物
US20190106331A1 (en) * 2016-04-04 2019-04-11 Disruptive Materials Ab Getter material comprising intrinsic composite nanoparticles and method of production thereof
DE102016207075A1 (de) 2016-04-26 2017-10-26 Tesa Se Repositionierbares feuchtigkeitshärtendes Klebeband
JP6887490B2 (ja) * 2016-04-27 2021-06-16 ソン，キョン−グン 包装材保安封止装置
EP3258515A1 (de) 2016-06-15 2017-12-20 odelo GmbH Leuchteinheit mit organischer leuchtdiode (oled) für fahrzeuganwendungen sowie verfahren zu deren herstellung
EP3258516A1 (de) 2016-06-15 2017-12-20 odelo GmbH Leuchteinheit mit organischer leuchtdiode (oled) sowie verfahren zu deren herstellung
KR102406867B1 (ko) 2016-06-16 2022-06-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노입자 충전된 배리어 접착제 조성물
KR102407014B1 (ko) 2016-06-16 2022-06-10 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노입자 충전된 배리어 접착제 조성물
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
TWI627764B (zh) * 2016-12-02 2018-06-21 Mitsubishi Electric Corp Solar battery module and solar battery module manufacturing method
KR102671369B1 (ko) 2016-12-02 2024-06-04 삼성디스플레이 주식회사 플렉시블 유기 발광 표시 장치 및 그 제조방법
US10902310B2 (en) 2016-12-14 2021-01-26 Trackonomy Systems, Inc. Wireless communications and transducer based event detection platform
US11138490B2 (en) 2016-12-14 2021-10-05 Ajay Khoche Hierarchical combination of distributed statistics in a monitoring network
US11003978B2 (en) 2016-12-14 2021-05-11 Ajay Khoche Programmable network node roles in hierarchical communications network
US10885420B2 (en) 2016-12-14 2021-01-05 Ajay Khoche Package sealing tape types with varied transducer sampling densities
US10445634B2 (en) 2016-12-14 2019-10-15 Trackonomy Systems, Inc. Fabricating multifunction adhesive product for ubiquitous realtime tracking
TWI649392B (zh) * 2016-12-21 2019-02-01 住華科技股份有限公司 黏著劑薄片以及偏光板組件
EP3339388B1 (en) * 2016-12-22 2022-01-26 3M Innovative Properties Company Pressure-sensitive adhesive compositions for manufacturing electronic devices
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
WO2018204693A2 (en) * 2017-05-05 2018-11-08 3M Innovative Properties Company Polymeric films and display devices containing such films
KR102316563B1 (ko) 2017-05-22 2021-10-25 엘지디스플레이 주식회사 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법
JP6873280B2 (ja) * 2017-05-24 2021-05-19 エルジー・ケム・リミテッド 有機電子装置
CN107331787B (zh) * 2017-06-26 2019-06-21 京东方科技集团股份有限公司 封装盖板、有机发光显示器及其制备方法
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
DE102018203276A1 (de) 2018-03-06 2019-09-12 Tesa Se Indikatortape
DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
CN110783492A (zh) * 2018-07-27 2020-02-11 株式会社日本有机雷特显示器 发光显示装置及其制造方法
CN109679510B (zh) * 2018-12-25 2021-04-27 广州市隆创新材料有限公司 一种适合全自动贴合的热熔光学胶膜及其制备方法
US20220091080A1 (en) * 2019-01-18 2022-03-24 Nitto Denko Corporation Gas and/or chemical liquid indicator
WO2020247354A1 (en) 2019-06-05 2020-12-10 Trackonomy Systems, Inc. Temperature monitoring in cold supply chains
US11317516B2 (en) 2019-09-13 2022-04-26 Trackonomy Systems, Inc. Roll-to-roll additive manufacturing method and device
TWI780494B (zh) * 2019-10-09 2022-10-11 德商卡爾科德寶兩合公司 複合材料在主動和/或被動冷卻的通電系統中用於吸收和分配液體的應用
US11864058B1 (en) 2020-10-04 2024-01-02 Trackonomy Systems, Inc. Flexible tracking device for cables and equipment
EP4186053A4 (en) 2020-07-24 2024-09-04 Trackonomy Systems, Inc. TEAR TO ACTIVATE A WIRELESS NODE WITH MULTIPLE CUTOUTS ALLOWING REUSE
US12124904B2 (en) 2020-09-05 2024-10-22 Trackonomy Systems, Inc. Wireless sensor device with an attachable external sensor probe
US12047841B2 (en) 2020-09-21 2024-07-23 Trackonomy Systems, Inc. Detecting special events and strategically important areas in an IoT tracking system
WO2022072948A1 (en) 2020-10-03 2022-04-07 Trackonomy Systems, Inc. System and method of generating environmental profiles for determining logistics of assets
US11527148B1 (en) 2020-10-04 2022-12-13 Trackonomy Systems, Inc. Augmented reality for guiding users to assets in IOT applications
US12051916B1 (en) 2020-10-05 2024-07-30 Trackonomy Systems, Inc. Method for recharging wireless IOT devices and system thereof
TW202221082A (zh) * 2020-11-17 2022-06-01 明基材料股份有限公司 一種矽膠阻氣膜
CN112322233A (zh) * 2020-11-23 2021-02-05 广东能辉新材料科技有限公司 含改性sis热塑性弹性体的热熔压敏胶及其制备方法
WO2022126020A1 (en) 2020-12-12 2022-06-16 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device
CN113437242B (zh) * 2021-06-29 2023-06-20 固安翌光科技有限公司 一种封装结构以及光电器件
CN114224306B (zh) * 2021-11-11 2024-03-22 煤炭科学研究总院有限公司 心率检测传感器、防护服和传感器的制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03127488A (ja) * 1989-10-12 1991-05-30 Teijin Ltd 電場発光素子
JP2008065994A (ja) * 2006-09-04 2008-03-21 Seiko Epson Corp エレクトロルミネッセンス装置、エレクトロルミネッセンス装置の製造方法並びに電子機器
JP2010080293A (ja) * 2008-09-26 2010-04-08 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子封止用粘着フィルム
WO2010061634A1 (ja) * 2008-11-28 2010-06-03 三井化学株式会社 有機ｅｌ素子の面封止剤、表示装置の製造方法および表示装置
US20110036496A1 (en) * 2009-08-12 2011-02-17 Tesa Se Method of encapsulating an electronic arrangement
WO2012077431A1 (ja) * 2010-12-08 2012-06-14 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
DE69627715T2 (de) 1996-11-12 2004-03-04 Minnesota Mining And Manufacturing Co., St. Paul Ein thermostatoplastischer vorläufer für einen druckempfindlichen klebstoff
JP2000208252A (ja) 1999-01-14 2000-07-28 Tdk Corp 有機ｅｌ素子
US6803081B2 (en) 2001-06-26 2004-10-12 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
AU2003261188A1 (en) 2002-07-24 2004-02-09 Adhesives Research, Inc. Transformable pressure sensitive adhesive tape and use thereof in display screens
US7449629B2 (en) 2002-08-21 2008-11-11 Truseal Technologies, Inc. Solar panel including a low moisture vapor transmission rate adhesive composition
JP2005298703A (ja) 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
US20060087230A1 (en) 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP2006228519A (ja) * 2005-02-16 2006-08-31 Canon Inc 有機エレクトロルミネッセンス素子及びその製造方法
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
ATE469440T1 (de) 2006-09-20 2010-06-15 Dow Global Technologies Inc Modul einer elektronischen vorrichtung mit einem ethylen-multiblock-copolymer
DE102006047739A1 (de) 2006-10-06 2008-04-17 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102008003546A1 (de) 2008-01-09 2009-07-16 Tesa Ag Liner mit einer Barriereschicht
JP2009259656A (ja) * 2008-04-18 2009-11-05 Toyo Ink Mfg Co Ltd 封止剤
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP5201347B2 (ja) 2008-11-28 2013-06-05 株式会社スリーボンド 有機ｅｌ素子封止用光硬化性樹脂組成物
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008062130A1 (de) 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP2010182449A (ja) * 2009-02-03 2010-08-19 Fujifilm Corp 有機ｅｌ表示装置
DE102009036986B4 (de) 2009-08-12 2011-07-07 Volkswagen AG, 38440 Ausgleichsgetriebe
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
EP2644677B1 (en) * 2010-11-23 2020-11-04 LG Chem, Ltd. Adhesive composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03127488A (ja) * 1989-10-12 1991-05-30 Teijin Ltd 電場発光素子
JP2008065994A (ja) * 2006-09-04 2008-03-21 Seiko Epson Corp エレクトロルミネッセンス装置、エレクトロルミネッセンス装置の製造方法並びに電子機器
JP2010080293A (ja) * 2008-09-26 2010-04-08 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子封止用粘着フィルム
WO2010061634A1 (ja) * 2008-11-28 2010-06-03 三井化学株式会社 有機ｅｌ素子の面封止剤、表示装置の製造方法および表示装置
US20110036496A1 (en) * 2009-08-12 2011-02-17 Tesa Se Method of encapsulating an electronic arrangement
WO2012077431A1 (ja) * 2010-12-08 2012-06-14 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020188006A (ja) * 2014-11-26 2020-11-19 株式会社半導体エネルギー研究所 表示装置
US11372276B2 (en) 2014-11-26 2022-06-28 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US11635648B2 (en) 2014-11-26 2023-04-25 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US12153298B2 (en) 2014-11-26 2024-11-26 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
JP2018510449A (ja) * 2014-12-18 2018-04-12 ロリク アーゲーＲｏｌｉｃ Ａｇ 親水性ナノ粒子を含む放射線硬化性組成物
JP2019501237A (ja) * 2015-11-09 2019-01-17 テーザ・ソシエタス・ヨーロピア ポリマーゲッター材料を有するバリア接着剤
US10633563B2 (en) 2015-11-09 2020-04-28 Tesa Se Barrier adhesive mass with polymer getter material

Also Published As

Publication number Publication date
US20150162568A1 (en) 2015-06-11
WO2014001005A1 (de) 2014-01-03
US9543549B2 (en) 2017-01-10
KR102013435B1 (ko) 2019-08-22
CN104508063A (zh) 2015-04-08
EP2867318A1 (de) 2015-05-06
CN104508063B (zh) 2017-07-21
JP2018199821A (ja) 2018-12-20
DE102012211335A1 (de) 2014-01-02
TWI580756B (zh) 2017-05-01
EP2867318B1 (de) 2022-01-12
TW201402766A (zh) 2014-01-16
KR20150032569A (ko) 2015-03-26

Similar Documents

Publication Publication Date Title
JP2018199821A (ja) 有機電子的装置をカプセル化するための接着テープ
TWI663242B (zh) 用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法
CN108264860B (zh) 用于保护粘合剂化合物的衬垫
KR102230136B1 (ko) 게터 물질을 함유하는 접착 테이프
JP2017515935A5 (OSRAM)
JP6494661B2 (ja) 平坦形成物から浸透物を除去する方法
KR20160146918A (ko) 얇은 유리 복합체 및 얇은 유리 필름을 저장하는 방법
CN105073930B (zh) 从平面结构体移除渗透物的方法及相应胶带

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160517

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170123

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170201

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20170405

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170406

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170824

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180226

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180404

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20180803

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190926