JP2015513617A - 非導電性プラスチック表面の金属化方法 - Google Patents
非導電性プラスチック表面の金属化方法 Download PDFInfo
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- JP2015513617A JP2015513617A JP2014561461A JP2014561461A JP2015513617A JP 2015513617 A JP2015513617 A JP 2015513617A JP 2014561461 A JP2014561461 A JP 2014561461A JP 2014561461 A JP2014561461 A JP 2014561461A JP 2015513617 A JP2015513617 A JP 2015513617A
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- Prior art keywords
- jig
- solution
- metal
- iodate
- treatment
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 196
- 229920003023 plastic Polymers 0.000 title claims abstract description 111
- 239000004033 plastic Substances 0.000 title claims abstract description 111
- 229910052751 metal Inorganic materials 0.000 claims abstract description 87
- 239000002184 metal Substances 0.000 claims abstract description 87
- 239000000243 solution Substances 0.000 claims description 143
- -1 iodate ions Chemical class 0.000 claims description 64
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 54
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 35
- 239000000084 colloidal system Substances 0.000 claims description 34
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 32
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 29
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 29
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 28
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 24
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 22
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- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 claims description 9
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- 239000004417 polycarbonate Substances 0.000 claims description 9
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- 150000003624 transition metals Chemical class 0.000 claims description 9
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- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 6
- 239000001230 potassium iodate Substances 0.000 claims description 6
- 235000006666 potassium iodate Nutrition 0.000 claims description 6
- 229940093930 potassium iodate Drugs 0.000 claims description 6
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 6
- 230000000737 periodic effect Effects 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- VGYYSIDKAKXZEE-UHFFFAOYSA-L hydroxylammonium sulfate Chemical compound O[NH3+].O[NH3+].[O-]S([O-])(=O)=O VGYYSIDKAKXZEE-UHFFFAOYSA-L 0.000 claims description 3
- 229910000378 hydroxylammonium sulfate Inorganic materials 0.000 claims description 3
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- 239000004151 Calcium iodate Substances 0.000 claims description 2
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- 235000019390 calcium iodate Nutrition 0.000 claims description 2
- 150000004677 hydrates Chemical class 0.000 claims description 2
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- 229940005633 iodate ion Drugs 0.000 claims description 2
- UYNRPXVNKVAGAN-UHFFFAOYSA-L magnesium;diiodate Chemical compound [Mg+2].[O-]I(=O)=O.[O-]I(=O)=O UYNRPXVNKVAGAN-UHFFFAOYSA-L 0.000 claims description 2
- NALMPLUMOWIVJC-UHFFFAOYSA-N n,n,4-trimethylbenzeneamine oxide Chemical compound CC1=CC=C([N+](C)(C)[O-])C=C1 NALMPLUMOWIVJC-UHFFFAOYSA-N 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
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- 239000011697 sodium iodate Substances 0.000 claims description 2
- 229940032753 sodium iodate Drugs 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 abstract description 62
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 43
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- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
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- 229910052783 alkali metal Inorganic materials 0.000 description 6
- 150000001340 alkali metals Chemical class 0.000 description 6
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- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical group Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 6
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- 239000011248 coating agent Substances 0.000 description 5
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- 238000006243 chemical reaction Methods 0.000 description 4
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- 101710190443 Acetyl-CoA carboxylase 1 Proteins 0.000 description 3
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- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1621—Protection of inner surfaces of the apparatus
- C23C18/1625—Protection of inner surfaces of the apparatus through chemical processes
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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Abstract
Description
物品の電気的非導電性プラスチック表面の金属化方法であって、以下の工程段階:
A)前記物品を治具に固定する工程、
B)前記プラスチック表面をエッチング液でエッチングする工程、
C)前記プラスチック表面を金属コロイド溶液または金属化合物溶液で処理する工程、この金属は、元素周期表の第I族遷移金属および元素周期表の第VIII族遷移金属から選択される、および
D)前記プラスチック表面を金属化溶液で金属化する工程、
を含む前記方法において、前記治具が、ヨウ素酸イオンを含む溶液で処理されることを特徴とする前記方法。
Ai)前記プラスチック表面を少なくとも1種のグリコール化合物を含む水溶液中で処理する工程
が、工程段階A)とB)との間に実施される。
nは、1から4までの整数であり、
R1およびR2は、それぞれ独立して、−H、−CH3、−CH2−CH3、−CH2−CH2−CH3、−CH(CH3)−CH3、−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH3、−CH2−CH(CH3)−CH3、−CH2−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH2−CH3、−CH2−CH(CH3)−CH2−CH3、−CH2−CH2−CH(CH3)−CH3、−CH(CH2−CH3)−CH2−CH3、−CH2−CH(CH2−CH3)−CH3、−CO−CH3、−CO−CH2−CH3、−CO−CH2−CH2−CH3、−CO−CH(CH3)−CH3、−CO−CH(CH3)−CH2−CH3、−CO−CH2−CH(CH3)−CH3、−CO−CH2−CH2−CH2−CH3である]
の化合物を意味すると理解される。
Bi)前記プラスチック表面を二酸化マンガンのための還元剤を含む溶液中で処理する工程
が、工程段階B)とC)との間に実施される。
工程段階A)よりも前に行われてよい、または
工程段階A)とB)との間に行われてよい、または
工程段階B)とC)との間に行われてよい。
Bii)前記プラスチック表面を酸性水溶液中で処理する工程
が、実施されてよい。
Ci)前記プラスチック表面を酸性水溶液中で処理する工程、および
Cii)前記プラスチック表面を金属化溶液中で無電解金属化する工程
が、工程段階C)とD)との間に実施される。
Di)金属化されたプラスチック表面を高温で保管する工程
が実施される。
以下の実施例は、本発明を詳細に説明することを目的とするものである。
ABS成形品(シャワーヘッド)をPVCコーティングされた保持治具に固定した(工程段階A))。この例では、治具の金属化の傾向が特に強い使用済みの保持治具を選択した。リン酸カリウム緩衝剤でpH7に調節して、サーモスタット内で45℃に保たれた2−(2−エトキシエトキシ)エチルアセテート15%およびブトキシエタノール10%の溶液に、前記成形品を10分間浸漬させた(工程段階Ai))。続いて、前記成形品を、流水下で1分間洗浄して、次に、70℃に保たれた過マンガン酸ナトリウム100g/lおよび96%硫酸10g/lの浴中で処理した(工程段階B))。10分間の処理に続いて再び、水で洗浄して、付着している二酸化マンガンを、96%硫酸50g/lおよび30%過酸化水素30ml/lの溶液中で除去した(工程段階Bi)、第2表参照)。この反応後、前記ABS成形品を備える前記治具を、96%硫酸50g/l中の種々の濃度のヨウ素酸カリウム(0、5、10、20、40g/l)の溶液中で、50℃で10分間処理した(前記治具の保護)。
プラスチックのNovodur P2MC(ABS)から作られた、2つのいわゆるバルブキャップ(直径約7cmの円形の成形品)を1つの保持治具に固定して、例1の記載通りに処理する。例1と比べて、工程段階Ai)において、エチレングリコールジアセテート10%およびエチレングリコールモノブチルエーテル10%の溶液を使用した。前記溶液を45℃に保ち、前記バルブキャップを、この溶液中で5分間処理した。続いて、例1のすべての工程段階を実施した。還元(工程段階Bi))後、前記バルブキャップを備える治具を、96%硫酸50g/l中にヨウ素酸カリウム20g/lを有する溶液中で、50℃で10分間処理した。
設けられた金属の接着強度に対するグリコール処理の影響
Bayblend T45(ABS/PC混合物)の複数のパネルを、リン酸カリウム緩衝剤によりpH7に調節した2−(2−エトキシエトキシ)−エチルアセテートおよびブトキシエタノール10%の15%溶液中で、45℃で種々の時間で処理した。続いて、前記パネルを、流水下に約1分間洗浄して、次に、70℃に保たれた過マンガン酸ナトリウム100g/lおよび96%硫酸10g/lの浴に導入した。10分間の処理に続いて再び、水で1分間洗浄して、この時点で暗褐色のパネルを、析出された二酸化マンガンを除去するために、96%硫酸50g/lおよび30%過酸化水素30ml/lの溶液中で洗浄した。その後の洗浄および36%塩酸300ml/l溶液への短時間浸漬の後、前記パネルを、パラジウムコロイドをベースとするコロイド活性剤(Atotech社Adhemax Aktivator PL、パラジウム25ppm)中で、45℃で3分間活性化した。
設けられた金属層の接着強度に対するグリコール処理の影響
ABSプラスチック(Novodur P2MC)の複数のパネルを、例3の記載通りに、2−(2−エトキシエトキシ)エチルアセテートおよびブトキシエタノール10%の15%溶液中で異なる時間で処理し、さらなる金属化法に供して、設けられた金属層の接着強度を測定した。
設けられた金属の接着強度に対するグリコール処理の影響
Bayblend T45(5.2×14.9×0.3cm、ABS/PC混合物)の2つのパネルを、2−(2−エトキシエトキシ)エチルアセテート40%溶液中で、室温で10分間処理した。洗浄後、例3の記載通りに、前記パネルをさらなる金属化方法に供して、設けられた金属層の接着強度を測定した。
パネル1 前面:1.09N/mm 裏面:1.27N/mm
パネル2 前面:1.30N/mm 裏面:1.32N/mm。
2つのABSパネル(寸法:15.0cm×5.1cm×0.3cm)を2つのPVCコーティングされた保持治具に固定した(工程段階A))。この例では、治具の金属化の傾向が特に強い使用済みの保持治具を選択した。リン酸カリウム緩衝剤でpH7に調節して、サーモスタット内で45℃に保たれた2−(2−エトキシエトキシ)エチルアセテート15%およびブトキシエタノール10%の溶液に、前記パネルを10分間浸漬させた(工程段階Ai))。続いて、前記パネルを、流水下で1分間洗浄して、次に、70℃に保たれた過マンガン酸ナトリウム100g/lおよび96%硫酸10g/lの浴中で処理した(工程段階B))。10分間の処理後に続いて再び、水で洗浄して、付着している二酸化マンガンを、96%硫酸25ml/lおよび30%過酸化水素30ml/lの溶液中で除去した(工程段階Bi)、第6表参照)。この反応後、ABSパネルを備える前記治具のうちの1つの治具を、96%硫酸10ml/l中のヨウ素酸カリウム20g/lの溶液中で、60℃で10分間処理した(治具の保護、パネル1を備える治具1)。パネルを備える別の治具の場合、ヨウ素酸溶液による処理を省いた(パネル2を備える治具2)。
1つのABSパネル(例6と同じ寸法)を、例6の記載通りに処理した。例6とは異なり、エッチング段階(段階B)および還元段階(段階Bi)を省いて、ヨウ素酸溶液による処理(段階:治具の保護)に代えた。例7における工程段階の順序を、第7表にまとめる。
治具:治具の全面積がニッケルコーティングされた。
パネル:パネルの全面積が、ニッケルでめっきされた。ニッケル層は、パネル表面に付着しなかった。
1つのABSパネル(例6と同じ寸法)を、例6の記載通りに処理した。例6とは異なり、ヨウ素酸溶液による処理(段階:治具の保護)を、活性化段階(段階C)の後に実施した。例8における工程段階の順序の概要を、第7表に示す。
治具:ニッケル析出が全くない。
パネル:ニッケル析出が全くない。
1つのABSパネル(例6と同じ寸法)を、例6の記載通りに処理した。例6とは異なり、促進段階(段階Ci)を省いて、ヨウ素酸溶液による処理(段階:治具の保護)に代えた。例9における工程段階の順序を、第7表にまとめる。
治具:ニッケル析出が全くない。
パネル:ニッケル析出が全くない。
Claims (15)
- 物品の電気的非導電性プラスチック表面を金属化する方法であって、以下の工程段階:
A)前記物品を治具に固定する工程、
B)前記プラスチック表面をエッチング液でエッチングする工程、
C)前記プラスチック表面を金属コロイド溶液または金属化合物溶液で処理する工程、該金属は、元素周期表の第I族遷移金属および元素周期表の第VIII族遷移金属から選択される、および
D)前記プラスチック表面を金属化溶液で金属化する工程、
を含む前記方法において、前記治具が、ヨウ素酸イオンを含む溶液で処理されることを特徴とする前記方法。 - ヨウ素酸イオンを含む溶液による前記治具の処理が、工程段階C)よりも前に実施されることを特徴とする、請求項1に記載の方法。
- 以下のさらなる工程段階:
Ai)前記プラスチック表面を少なくとも1種のグリコール化合物を含む水溶液中で処理する工程
が、工程段階A)とB)との間に実施されることを特徴とする、請求項1または2に記載の方法。 - 前記少なくとも1種のグリコール化合物が、一般式(I)
nは、1から4までの整数であり、
R1およびR2は、それぞれ独立して、−H、−CH3、−CH2−CH3、−CH2−CH2−CH3、−CH(CH3)−CH3、−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH3、−CH2−CH(CH3)−CH3、−CH2−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH2−CH3、−CH2−CH(CH3)−CH2−CH3、−CH2−CH2−CH(CH3)−CH3、−CH(CH2−CH3)−CH2−CH3、−CH2−CH(CH2−CH3)−CH3、−CO−CH3、−CO−CH2−CH3、−CO−CH2−CH2−CH3、−CO−CH(CH3)−CH3、−CO−CH(CH3)−CH2−CH3、−CO−CH2−CH(CH3)−CH3、−CO−CH2−CH2−CH2−CH3である]
の化合物から選択されることを特徴とする、請求項3に記載の方法。 - 前記プラスチック表面が、少なくとも1種の電気的非導電性プラスチックから製造されており、該少なくとも1種の電気的非導電性プラスチックが、アクリロニトリルブタジエンスチレンコポリマー、ポリアミド、ポリカーボネート、およびアクリロニトリルブタジエンスチレンコポリマーと少なくとも1種のさらなるポリマーとの混合物を含む群から選択されることを特徴とする、請求項1から4までのいずれか1項に記載の方法。
- 以下のさらなる工程段階:
Bi)前記プラスチック表面を二酸化マンガンのための還元剤を含む溶液中で処理する工程
が、工程段階B)とC)との間に実施されることを特徴とする、請求項1から5までのいずれか1項に記載の方法。 - 前記二酸化マンガンのための還元剤が、硫酸ヒドロキシルアンモニウム、塩化ヒドロキシルアンモニウム、および過酸化水素を含む群から選択されることを特徴とする、請求項6に記載の方法。
- 前記ヨウ素酸イオンが、金属ヨウ素酸塩の形であることを特徴とする、請求項1から7までのいずれか1項に記載の方法。
- 前記金属ヨウ素酸塩が、ヨウ素酸ナトリウム、ヨウ素酸カリウム、ヨウ素酸マグネシウム、ヨウ素酸カルシウム、およびこれらの水和物を含む群から選択されることを特徴とする、請求項8に記載の方法。
- 前記金属ヨウ素酸塩の濃度が、5g/l〜50g/lであることを特徴とする、請求項8または9に記載の方法。
- 前記ヨウ素酸イオンを含む溶液が、さらに無機酸を含んでいることを特徴とする、請求項1から10までのいずれか1項に記載の方法。
- 前記無機酸が、硫酸およびリン酸を含む群から選択されることを特徴とする、請求項11に記載の方法。
- 前記無機酸が、一塩基酸に対して0.02mol/l〜2.0mol/lの範囲の濃度であることを特徴とする、請求項11または12に記載の方法。
- ヨウ素酸イオンを含む溶液による前記治具の処理が、1〜20分間行われることを特徴とする、請求項1から13までのいずれか1項に記載の方法。
- ヨウ素酸イオンを含む溶液による前記治具の処理が、20℃〜70℃の温度で実施されることを特徴とする、請求項1から14までのいずれか1項に記載の方法。
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JP2018513267A (ja) * | 2015-02-23 | 2018-05-24 | マクダーミッド エンソン インコーポレイテッド | プラスチックにめっきするプロセスにおいてクロムフリーエッチングを使用する際のラックのための阻害剤組成物 |
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ES2828459T5 (es) | 2014-07-10 | 2024-04-30 | Okuno Chem Ind Co | Método de galvanización de resina |
US9506150B2 (en) | 2014-10-13 | 2016-11-29 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
EP3181726A1 (en) | 2015-12-18 | 2017-06-21 | ATOTECH Deutschland GmbH | Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces |
EP3228729A1 (en) * | 2016-04-04 | 2017-10-11 | COVENTYA S.p.A. | Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath |
GB2587662A (en) * | 2019-10-04 | 2021-04-07 | Macdermid Inc | Prevention of unwanted plating on rack coatings for electrodeposition |
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CA2866766C (en) | 2020-03-10 |
KR20140138286A (ko) | 2014-12-03 |
PL2825690T3 (pl) | 2016-11-30 |
BR112014021995B1 (pt) | 2020-12-15 |
EP2639332A1 (de) | 2013-09-18 |
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JP6150822B2 (ja) | 2017-06-21 |
US20150001177A1 (en) | 2015-01-01 |
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