JP2015513178A5 - - Google Patents

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Publication number
JP2015513178A5
JP2015513178A5 JP2014558961A JP2014558961A JP2015513178A5 JP 2015513178 A5 JP2015513178 A5 JP 2015513178A5 JP 2014558961 A JP2014558961 A JP 2014558961A JP 2014558961 A JP2014558961 A JP 2014558961A JP 2015513178 A5 JP2015513178 A5 JP 2015513178A5
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JP
Japan
Prior art keywords
layer
sensor
track
resistance
sensor layer
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Application number
JP2014558961A
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English (en)
Japanese (ja)
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JP5945339B2 (ja
JP2015513178A (ja
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Priority claimed from PCT/US2013/028002 external-priority patent/WO2013130593A1/en
Publication of JP2015513178A publication Critical patent/JP2015513178A/ja
Publication of JP2015513178A5 publication Critical patent/JP2015513178A5/ja
Application granted granted Critical
Publication of JP5945339B2 publication Critical patent/JP5945339B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014558961A 2012-02-27 2013-02-27 層状加熱体のための温度検出及び制御システム Active JP5945339B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261603411P 2012-02-27 2012-02-27
US61/603,411 2012-02-27
PCT/US2013/028002 WO2013130593A1 (en) 2012-02-27 2013-02-27 Temperature detection and control system for layered heaters

Publications (3)

Publication Number Publication Date
JP2015513178A JP2015513178A (ja) 2015-04-30
JP2015513178A5 true JP2015513178A5 (enExample) 2016-02-18
JP5945339B2 JP5945339B2 (ja) 2016-07-05

Family

ID=47997781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014558961A Active JP5945339B2 (ja) 2012-02-27 2013-02-27 層状加熱体のための温度検出及び制御システム

Country Status (4)

Country Link
US (3) US9078293B2 (enExample)
EP (1) EP2820915B1 (enExample)
JP (1) JP5945339B2 (enExample)
WO (1) WO2013130593A1 (enExample)

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Publication number Priority date Publication date Assignee Title
US8927909B2 (en) * 2010-10-11 2015-01-06 Stmicroelectronics, Inc. Closed loop temperature controlled circuit to improve device stability
JP2015201646A (ja) 2014-04-07 2015-11-12 ラム リサーチ コーポレーションLam Research Corporation 構成独立型のガス供給システム
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US9826574B2 (en) * 2015-10-28 2017-11-21 Watlow Electric Manufacturing Company Integrated heater and sensor system
JP2017117525A (ja) * 2015-12-21 2017-06-29 京セラ株式会社 ヒータ
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
US10188015B2 (en) * 2016-09-20 2019-01-22 Qualcomm Incorporated Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement
GB2562075B (en) * 2017-05-03 2022-03-16 Jemella Ltd Barrel for hair styling appliance
DE102017213339A1 (de) 2017-08-02 2018-08-23 Continental Automotive Gmbh Schaltungsanordnung und Verfahren zur Herstellung einer Schaltungsanordnung
US10655638B2 (en) * 2018-03-15 2020-05-19 Lam Research Corporation Turbomolecular pump deposition control and particle management
GB2572388B (en) 2018-03-28 2020-04-22 Suresensors Ltd Integrated temperature control within a diagnostic test sensor
TWI743739B (zh) * 2019-04-09 2021-10-21 美商瓦特洛威電子製造公司 具備溫度限制裝置之熱系統
JP7360458B2 (ja) * 2019-05-21 2023-10-12 トーカロ株式会社 温調ユニット
JP7433147B2 (ja) * 2020-06-26 2024-02-19 東京エレクトロン株式会社 載置台及び検査装置
CN112584561B (zh) * 2020-12-03 2022-09-20 苏州捷迪纳米科技有限公司 可以适配多种电压的电加热系统及加热方法
KR20240088736A (ko) * 2021-09-21 2024-06-20 에이이엠 싱가포르 피티이. 엘티디. 집적 회로의 열 테스트 다이를 위한 장치 및 열 테스터
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement
US12013432B1 (en) 2023-08-23 2024-06-18 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12085609B1 (en) 2023-08-23 2024-09-10 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12000885B1 (en) 2023-12-20 2024-06-04 Aem Singapore Pte. Ltd. Multiplexed thermal control wafer and coldplate

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
US1117843A (en) * 1913-11-15 1914-11-17 Gustav P Helfrich Torpedo.
GB1117843A (en) * 1966-02-25 1968-06-26 Rolls Royce Improvements relating to anti-icing heating apparatus
GB8704467D0 (en) * 1987-02-25 1987-04-01 Thorn Emi Appliances Electrically resistive tracks
US5886860A (en) * 1997-08-25 1999-03-23 Square D Company Circuit breakers with PTC (Positive Temperature Coefficient resistivity
DE10162276C5 (de) * 2001-12-19 2019-03-14 Watlow Electric Manufacturing Co. Rohrförmiger Durchlauferhitzer und Heizplatte sowie Verfahren zu deren Herstellung
US20040222210A1 (en) * 2003-05-08 2004-11-11 Hongy Lin Multi-zone ceramic heating system and method of manufacture thereof
NL1027571C2 (nl) * 2004-11-23 2006-05-24 Ferro Techniek Holding Bv Emailsamenstelling voor toepassing als dielektricum, en gebruik van een dergelijke emailsamenstelling.
DE102010016501A1 (de) * 2010-03-08 2011-09-08 Rcs Gmbh Rail Components And Systems Homogen beheizbarer Formkörper zur Herstellung von Formteilen aus faserverstärktem Kunststoff

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