JP5945339B2 - 層状加熱体のための温度検出及び制御システム - Google Patents
層状加熱体のための温度検出及び制御システム Download PDFInfo
- Publication number
- JP5945339B2 JP5945339B2 JP2014558961A JP2014558961A JP5945339B2 JP 5945339 B2 JP5945339 B2 JP 5945339B2 JP 2014558961 A JP2014558961 A JP 2014558961A JP 2014558961 A JP2014558961 A JP 2014558961A JP 5945339 B2 JP5945339 B2 JP 5945339B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- sensor
- resistance
- sensor layer
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/0288—Applications for non specified applications
- H05B1/0294—Planar elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
Landscapes
- Control Of Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261603411P | 2012-02-27 | 2012-02-27 | |
| US61/603,411 | 2012-02-27 | ||
| PCT/US2013/028002 WO2013130593A1 (en) | 2012-02-27 | 2013-02-27 | Temperature detection and control system for layered heaters |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015513178A JP2015513178A (ja) | 2015-04-30 |
| JP2015513178A5 JP2015513178A5 (enExample) | 2016-02-18 |
| JP5945339B2 true JP5945339B2 (ja) | 2016-07-05 |
Family
ID=47997781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014558961A Active JP5945339B2 (ja) | 2012-02-27 | 2013-02-27 | 層状加熱体のための温度検出及び制御システム |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US9078293B2 (enExample) |
| EP (1) | EP2820915B1 (enExample) |
| JP (1) | JP5945339B2 (enExample) |
| WO (1) | WO2013130593A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8927909B2 (en) | 2010-10-11 | 2015-01-06 | Stmicroelectronics, Inc. | Closed loop temperature controlled circuit to improve device stability |
| TWI693638B (zh) | 2014-04-07 | 2020-05-11 | 美商蘭姆研究公司 | 獨立於配置的氣體輸送系統 |
| US10557197B2 (en) | 2014-10-17 | 2020-02-11 | Lam Research Corporation | Monolithic gas distribution manifold and various construction techniques and use cases therefor |
| US10022689B2 (en) | 2015-07-24 | 2018-07-17 | Lam Research Corporation | Fluid mixing hub for semiconductor processing tool |
| US9826574B2 (en) * | 2015-10-28 | 2017-11-21 | Watlow Electric Manufacturing Company | Integrated heater and sensor system |
| JP2017117525A (ja) * | 2015-12-21 | 2017-06-29 | 京セラ株式会社 | ヒータ |
| US10215317B2 (en) | 2016-01-15 | 2019-02-26 | Lam Research Corporation | Additively manufactured gas distribution manifold |
| US10188015B2 (en) * | 2016-09-20 | 2019-01-22 | Qualcomm Incorporated | Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement |
| GB2562075B (en) | 2017-05-03 | 2022-03-16 | Jemella Ltd | Barrel for hair styling appliance |
| DE102017213339A1 (de) | 2017-08-02 | 2018-08-23 | Continental Automotive Gmbh | Schaltungsanordnung und Verfahren zur Herstellung einer Schaltungsanordnung |
| US10655638B2 (en) * | 2018-03-15 | 2020-05-19 | Lam Research Corporation | Turbomolecular pump deposition control and particle management |
| GB2572388B (en) * | 2018-03-28 | 2020-04-22 | Suresensors Ltd | Integrated temperature control within a diagnostic test sensor |
| DE112020001843T5 (de) | 2019-04-09 | 2022-03-10 | Watlow Electric Manufacturing Company | Thermisches system mit einer temperaturbegrenzungsvorrichtung |
| KR102715319B1 (ko) * | 2019-05-21 | 2024-10-11 | 도카로 가부시키가이샤 | 온도조절유닛 |
| JP7433147B2 (ja) * | 2020-06-26 | 2024-02-19 | 東京エレクトロン株式会社 | 載置台及び検査装置 |
| CN112584561B (zh) * | 2020-12-03 | 2022-09-20 | 苏州捷迪纳米科技有限公司 | 可以适配多种电压的电加热系统及加热方法 |
| WO2023048644A2 (en) * | 2021-09-21 | 2023-03-30 | Aem Singapore Pte. Ltd. | Device and thermal tester for thermal testing dies of an integrated circuit |
| US11828796B1 (en) | 2023-05-02 | 2023-11-28 | AEM Holdings Ltd. | Integrated heater and temperature measurement |
| US12013432B1 (en) | 2023-08-23 | 2024-06-18 | Aem Singapore Pte. Ltd. | Thermal control wafer with integrated heating-sensing elements |
| US12085609B1 (en) | 2023-08-23 | 2024-09-10 | Aem Singapore Pte. Ltd. | Thermal control wafer with integrated heating-sensing elements |
| US12000885B1 (en) | 2023-12-20 | 2024-06-04 | Aem Singapore Pte. Ltd. | Multiplexed thermal control wafer and coldplate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1117843A (en) * | 1913-11-15 | 1914-11-17 | Gustav P Helfrich | Torpedo. |
| GB1117843A (en) * | 1966-02-25 | 1968-06-26 | Rolls Royce | Improvements relating to anti-icing heating apparatus |
| GB8704467D0 (en) * | 1987-02-25 | 1987-04-01 | Thorn Emi Appliances | Electrically resistive tracks |
| US5886860A (en) * | 1997-08-25 | 1999-03-23 | Square D Company | Circuit breakers with PTC (Positive Temperature Coefficient resistivity |
| DE10162276C5 (de) * | 2001-12-19 | 2019-03-14 | Watlow Electric Manufacturing Co. | Rohrförmiger Durchlauferhitzer und Heizplatte sowie Verfahren zu deren Herstellung |
| US20040222210A1 (en) * | 2003-05-08 | 2004-11-11 | Hongy Lin | Multi-zone ceramic heating system and method of manufacture thereof |
| NL1027571C2 (nl) * | 2004-11-23 | 2006-05-24 | Ferro Techniek Holding Bv | Emailsamenstelling voor toepassing als dielektricum, en gebruik van een dergelijke emailsamenstelling. |
| DE102010016501A1 (de) * | 2010-03-08 | 2011-09-08 | Rcs Gmbh Rail Components And Systems | Homogen beheizbarer Formkörper zur Herstellung von Formteilen aus faserverstärktem Kunststoff |
-
2013
- 2013-02-27 EP EP13711990.5A patent/EP2820915B1/en active Active
- 2013-02-27 WO PCT/US2013/028002 patent/WO2013130593A1/en not_active Ceased
- 2013-02-27 JP JP2014558961A patent/JP5945339B2/ja active Active
- 2013-02-27 US US13/779,182 patent/US9078293B2/en active Active
-
2015
- 2015-06-03 US US14/729,179 patent/US10104718B2/en active Active
-
2018
- 2018-09-21 US US16/138,620 patent/US11304264B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20130248511A1 (en) | 2013-09-26 |
| WO2013130593A1 (en) | 2013-09-06 |
| US11304264B2 (en) | 2022-04-12 |
| US10104718B2 (en) | 2018-10-16 |
| EP2820915B1 (en) | 2017-01-04 |
| US20150264746A1 (en) | 2015-09-17 |
| US9078293B2 (en) | 2015-07-07 |
| EP2820915A1 (en) | 2015-01-07 |
| US20190029076A1 (en) | 2019-01-24 |
| JP2015513178A (ja) | 2015-04-30 |
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