Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B1/00—Details of electric heating devices
  • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
  • H05B1/0227—Applications
  • H05B1/0288—Applications for non specified applications
  • H05B1/0294—Planar elements
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
  • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
  • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base

Definitions

• the present disclosure relates to layered heaters, and in particular, systems for detecting and controlling temperature of layered heaters.
• a layered heater generally comprises layers of different materials, namely, a dielectric and a resistive material, which are applied to a substrate.
• the dielectric material is applied first to the substrate and provides electrical isolation between the substrate and the resistive material and also minimizes current leakage during operation.
• the resistive material is applied to the dielectric material in a predetermined pattern and provides a resistive heater circuit.
• the layered heater also includes leads that connect the resistive heater circuit to a heater controller and an over-mold material that protects the lead-to-resistive circuit interface. Accordingly, layered heaters are highly customizable for a variety of heating applications.
• Layered heaters may be "thick" film, “thin” film, or “thermally sprayed,” among others, wherein the primary difference between these types of layered heaters is the method in which the layers are formed.
• the layers for thick film heaters are typically formed using processes such as screen printing, decal application, or film printing heads, among others.
• the layers for thin film heaters are typically formed using deposition processes such as ion plating, sputtering, chemical vapor deposition (CVD), and physical vapor deposition (PVD), among others.
• thermal spraying which may include by way of example flame spraying, plasma spraying, wire arc spraying, and HVOF (High Velocity Oxygen Fuel), among others.
• thermocouples and RTDs have a relatively slow response time and often "overshoot" the desired temperature. Thermocouples and RTDs are also limited to only detecting an absolute temperature value and thus provide no other independent control.
• two-wire control in which a resistive heating element functions as both a heater and as a temperature sensor, thus eliminating the need for a separate temperature sensor such as a thermocouple or RTD.
• two-wire control systems can have certain disadvantages, such as TCR characteristics of the heating element causing higher wattage at ambient temperatures versus at a set point temperature.
• a heating cycle with two-wire control can be interrupted by the actual temperature detection, and if a short measurement pulse is used, the temperature of the heater may be undesirably increased.
• Certain heater systems also employ over-temperature protection, such as thermal switches or bimetallic switches. These systems can be relatively costly and often have a slow response time. Additionally, temperature detection is only local to the actual switch and thus these systems are somewhat limited in their accuracy.
• a system for detecting and controlling temperature of a layered heater comprises a substrate, a first dielectric layer disposed on the substrate, a sensor layer having a sensor termination and disposed on the first dielectric layer, a second dielectric layer disposed on the sensor layer, a resistive heating layer having a heater termination and disposed on the second dielectric layer, and a third dielectric layer disposed on the resistive heating layer.
• An overtemperature detection circuit is operatively connected to the resistive heating layer and comprises a resistor, the sensor layer, and an electromechanical relay in parallel with the sensor layer.
• the sensor layer defines a material having a relatively high TCR and the resistive heating layer defines a material having a relatively low TCR such that a response time of the control system is improved.
• a system for detecting and controlling temperature of a layered heater includes a layered heater comprising a substrate, a first dielectric layer disposed on the substrate, a sensor layer disposed on the first dielectric layer, the sensor layer defining a plurality of independently controllable zones, a second dielectric layer disposed on the sensor layer, a resistive heating layer disposed on the second dielectric layer, and a third dielectric layer disposed on the resistive heating layer.
• a system for detecting and controlling temperature of a layered heater includes a layered heater comprising a substrate, a first dielectric layer disposed on the substrate, a sensor layer disposed on the first dielectric layer, a second dielectric layer disposed on the sensor layer, a resistive heating layer disposed on the second dielectric layer, and a third dielectric layer disposed on the resistive heating layer.
• the sensor layer defines tracks oriented approximately perpendicular to tracks of the resistive heating layer, the tracks having a width that is narrower than a width of the resistive heating layer tracks and defining a low voltage and low amperage.
• the layered heater includes the sensor layer and resistive heating layer with other features such as the independently controllable zones, the overtemperature protection circuit, and sensor layer tracks.
• Various other functional layers may also be included, such as the different dielectric layers, or layers such as a graded layer, an EM I (electromagnetic interference) layer, a thermal standoff layer, or even a protective cover such as that disclosed in copending application serial number 12/270,773 titled "Moisture Resistant Layered Sleeve Heater and Method of Manufacturing Thereof," which is commonly assigned with the present application and the contents of which are incorporated by reference herein in their entirety.
• FIG. 1 is a cross-sectional view of a layered heater constructed in accordance with the teachings of the present disclosure
• FIG. 2 is a schematic circuit diagram of an overprotection circuit constructed in accordance with the teachings of the present disclosure and a sample calculation of resistance to set a limit or cut-off temperature;
• FIG. 3 is top plan view of a sensor layer having independently controllable zones and constructed in accordance with the teachings of the present disclosure.
• FIG. 4 is a top plan view of a sensor layer having tracks that are used to protect the resistive heating layer from inadvertent electrical arcs.
• layered heater should be construed to include heaters that comprise at least one functional layer (e.g., resistive layer, protective layer, dielectric layer, sensor layer, among others), wherein the layer is formed through application or accumulation of a material to a substrate or another layer using processes associated with thick film, thin film, thermal spraying, or sol-gel, among others. These processes are also referred to as “layered processes” or “layered heater processes.”
• functional layer e.g., resistive layer, protective layer, dielectric layer, sensor layer, among others
• a system for detecting and controlling temperature of a layered heater is illustrated and generally indicated by reference numeral 20.
• the system 20 comprises a layered heater 22 that includes, in one form, a substrate 24, a first dielectric layer 26 disposed on the substrate 24, a sensor layer 28 disposed on the first dielectric layer 26, a second dielectric layer 30 disposed on the sensor layer 28, a resistive heating layer 32 disposed on the second dielectric layer 30, and a third dielectric layer 34 disposed on the resistive heating layer 32.
• the sensor layer 28 is illustrated between the substrate 24 and the resistive heating layer 32, the sensor layer 28 may be disposed on top of the resistive heating layer 32, or in any location with the individual layers, while remaining with the scope of the present disclosure. Additionally, multiple sensor layers 28 may also be employed while remaining within the scope of the present disclosure.
• the individual dielectric layers 26, 30, and 34 are generally an electrically insulative material and are provided in a thickness that is commensurate with heat output requirements.
• Materials for the dielectric layers include but are not limited to those having a resistance of about greater than 1 x10 6 ohms, such as oxides (e.g., alumina, magnesia, zirconia, and combinations thereof), non-oxide ceramics (e.g., silicon nitride, aluminum nitride, boron carbide, boron nitride), silicate ceramics (e.g., porcelain, steatite, cordierite, mullite).
• oxides e.g., alumina, magnesia, zirconia, and combinations thereof
• non-oxide ceramics e.g., silicon nitride, aluminum nitride, boron carbide, boron nitride
• silicate ceramics e.g., porcelain, steatite,
• the sensor layer 28 defines a material having a TCR (temperature coefficient of resistance) from a relatively low value such as 500 ppm/°C to a relatively high value such as 10,000 ppm/°C. For more accurate temperature detection, the higher value TCR is used. It should also be understood that materials with a negative TCR, such as graphite by way of example, may also be used in accordance with the teachings of the present disclosure. Such TCR values range from about -500 ppm/°C to about -10,000 ppm/°C.
• the sensor layer 28 includes a sensor termination 29 that is connected to the resistive heating layer 32, which also includes a termination 33 as shown.
• the resistive heating layer 32 is comprised of a material that has a relatively low or even negative TCR such as -10,000 ppm/°C to about 1 ppm/°C to a relatively high TCR such as 1 ppm/°C to about 10,000 ppm/°C according the application requirements. In many forms, a relatively low TCR value is preferred with the relatively high TCR value for the sensor layer 28 as set forth above. Since the resistive heating layer 32 is a separate layer from the sensor layer 28, a variety of different layouts (e.g., trace geometry, width, thickness) for the resistive heating layer 32 can be used independent from the layout of the sensor layer 28, which is not possible with two-wire control systems. In addition to the layouts, different materials can be selected for each of the sensor layer 28 and the resistive heating layer 32, thus providing additional design flexibility in the overall system 10.
• a relatively low or even negative TCR such as -10,000 ppm/°C to about 1 ppm/°C to a relatively high TCR such as 1 ppm/°
• the system 10 can have a quick response time, such as less than about 5 seconds and more specifically less than about 500 milliseconds. Additionally, temperature detection can be across the entire layer or in discrete locations by tailoring the design of the sensor layer 28. Moreover, as opposed to two-wire control systems, a heating cycle is not influenced by measurement pulses, and thus a more responsive system is provided by the teachings of the present disclosure.
• an overtemperature detection circuit 50 is provided, which is operatively connected to the resistive heating layer 32.
• the overtemperature detection circuit 50 is generally a divider circuit that comprises a resistor R1 (or alternatively a potentiometer for variable adjustment of the switch of temperature) , the sensor layer 28 (R2.1 ), and an electromechanical relay R2.2 in parallel with the sensor layer R2.1 .
• R1 resistor
• R2.1 sensor layer 28
• R2.2 electromechanical relay
• overtemperature detection circuit 50 the need for software is eliminated, although software may still be employed while remaining within the scope of the present disclosure. Additionally, the overtemperature detection circuit 50 can function as a thermal cut-off, or as a thermal switch.
• the sensor layer 70 comprises a plurality of independently controllable zones as shown, 2.1 , 2.2, 2.3, ...2.15.
• a 3 x 5 grid of zones results in 15 independently controllable zones.
• any size grid and number of zones may be employed in accordance with the teachings of the present disclosure.
• different sizes of zones may be used rather than the uniform sizes as illustrated.
• the zones may be constructed of the same material, or they may be constructed of different materials from zone to zone.
• the materials may include, Nickel, Copper, and alloys thereof, Aluminum alloys, Tungsten, or Platinum, among others.
• these elements include a separate set of terminal leads (not shown), or the leads may be combined to activate individual rows and/or columns in order to reduce the complexity of the electrical connections. With this increased level of fidelity in the sensor layer 70, the overall system can be more responsive to a local over-temperature condition, or other unexpected operating conditions.
• the sensor layer 80 defines tracks 82 that are oriented approximately perpendicular to tracks 84 of the resistive heating layer 32.
• the tracks 82 of the sensor layer 80 have a width W s that is narrower than a width W r of the resistive heating layer tracks 84.
• the sensor layer tracks 82 are also low voltage and low amperage, for example, 12V DC and 100 mA. Accordingly, this form of the present disclosure is designed to detect cracks in one of the layers, for example, in one of the dielectric layers or the resistive heating layer.
• the sensor layer tracks 82 are designed to detect such cracks and prevent an inadvertent electrical arc from occurring by switching off power to the resistive heating layer 32. As long as the sensor layer tracks 82 cross the resistive heating layer tracks 84, such detection occurs. Accordingly, the tracks do not necessarily have to be perpendicular to one another, and thus the illustration included herein is merely exemplary.
• the sensor layer tracks 82 have a width W s of about 1 mm while the resistive heating layer tracks 84 have a width of W r of about 5mm, with voltages and amperages of about 230 VAC and 10A respectively.
• the layers are formed by a thermal spray process and the resistive heating layers and sensor layers are formed by a laser removal process, which are described in greater detail in U.S. Patent No. 7,361 ,869, which is commonly assigned with the present application and the contents of which are incorporated herein in their entirety. It should be understood, however, that other layered processes as set forth above may be used for one or more of the layers and that other methods to generate the traces can be used such as masking or water jet, among others.

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• 2013
  • 2013-02-27 WO PCT/US2013/028002 patent/WO2013130593A1/en not_active Ceased
  • 2013-02-27 JP JP2014558961A patent/JP5945339B2/ja active Active
  • 2013-02-27 EP EP13711990.5A patent/EP2820915B1/en active Active
  • 2013-02-27 US US13/779,182 patent/US9078293B2/en active Active
• 2015
  • 2015-06-03 US US14/729,179 patent/US10104718B2/en active Active
• 2018
  • 2018-09-21 US US16/138,620 patent/US11304264B2/en active Active

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