JP2015511404A - 熱電気素子 - Google Patents

熱電気素子 Download PDF

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Publication number
JP2015511404A
JP2015511404A JP2014558042A JP2014558042A JP2015511404A JP 2015511404 A JP2015511404 A JP 2015511404A JP 2014558042 A JP2014558042 A JP 2014558042A JP 2014558042 A JP2014558042 A JP 2014558042A JP 2015511404 A JP2015511404 A JP 2015511404A
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Japan
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thermoelectric
substrate
contact
layer
contacts
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JP2014558042A
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English (en)
Japanese (ja)
Inventor
シュパン・ゲルハルト
ジークロッホ・アルヴェート
ハーファーカンプ・ユルゲン
イオザート・ニコライ
Original Assignee
オー−フレックス・テクノロジーズ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
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Publication of JP2015511404A publication Critical patent/JP2015511404A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2014558042A 2012-02-24 2013-01-17 熱電気素子 Pending JP2015511404A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102012101492 2012-02-24
DE102012101492.2 2012-02-24
DE102012105373.1 2012-06-20
DE102012105373.1A DE102012105373B4 (de) 2012-02-24 2012-06-20 Thermoelektrisches Element sowie Verfahren zu dessen Herstellung
PCT/EP2013/050802 WO2013124095A1 (de) 2012-02-24 2013-01-17 Thermoelektrisches element

Publications (1)

Publication Number Publication Date
JP2015511404A true JP2015511404A (ja) 2015-04-16

Family

ID=48950712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014558042A Pending JP2015511404A (ja) 2012-02-24 2013-01-17 熱電気素子

Country Status (7)

Country Link
US (1) US9899588B2 (de)
EP (1) EP2805360B1 (de)
JP (1) JP2015511404A (de)
CN (1) CN104137283B (de)
DE (2) DE102012105373B4 (de)
RU (1) RU2606250C2 (de)
WO (2) WO2013124094A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10267545B2 (en) 2016-03-30 2019-04-23 Qualcomm Incorporated In-plane active cooling device for mobile electronics
US20170337269A1 (en) * 2016-05-17 2017-11-23 Charles Eugene Gafford, III System for sharing musical preferences
DE102017203643A1 (de) 2017-03-07 2018-09-13 Mahle International Gmbh Verfahren zum Herstellen von thermoelektrischen Bausteinen
DE102017115168B4 (de) * 2017-07-06 2019-02-14 Mahle International Gmbh Thermoelektrisches Modul
DE102017217123A1 (de) * 2017-09-26 2019-03-28 Mahle International Gmbh Verfahren zum Herstellen eines thermoelektrischen Wandlers
DE102021209656B3 (de) * 2021-09-02 2022-09-29 Nikolay Iosad Thermoelektrisches Element, thermoelektrischer Generator und Verfahren zu deren Herstellung

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554815A (en) * 1963-04-30 1971-01-12 Du Pont Thin,flexible thermoelectric device
JPH0599759A (ja) * 1991-10-09 1993-04-23 Agency Of Ind Science & Technol 温度センサー
JPH0629581A (ja) * 1992-07-09 1994-02-04 Matsushita Electric Ind Co Ltd 熱電素子
JPH06188464A (ja) * 1992-12-17 1994-07-08 Matsushita Electric Ind Co Ltd 薄膜熱電素子及びその製造方法
JPH10173110A (ja) * 1996-12-13 1998-06-26 Nissan Motor Co Ltd 電子冷却モジュールおよびその製造方法
WO2005047560A1 (ja) * 2003-11-17 2005-05-26 Matsushita Electric Industrial Co., Ltd. 結晶膜の製造方法、結晶膜付き基体の製造方法、熱電変換素子の製造方法、および熱電変換素子
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
JP2009158760A (ja) * 2007-12-27 2009-07-16 Daikin Ind Ltd 熱電素子
US20100163090A1 (en) * 2008-12-31 2010-07-01 Industrial Technology Research Institute Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure
JP2011222873A (ja) * 2010-04-13 2011-11-04 Fujitsu Ltd 熱電変換素子及びその製造方法

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US4538464A (en) * 1983-10-04 1985-09-03 The United States Of America As Represented By The United States Department Of Energy Method of measuring reactive acoustic power density in a fluid
RU2113035C1 (ru) * 1988-02-22 1998-06-10 Миговски Фридрих-Карл Термогенератор
US5554819A (en) * 1992-01-22 1996-09-10 Baghai-Kermani; A. Method and apparatus for the thermoelectric generation of electricity
US6046398A (en) * 1998-11-04 2000-04-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Micromachined thermoelectric sensors and arrays and process for producing
US6281120B1 (en) * 1998-12-18 2001-08-28 National Semiconductor Corporation Temperature control structure for integrated circuit
JP2001332773A (ja) * 2000-05-19 2001-11-30 Yamaha Corp 熱電モジュール用多層基板およびその製造方法ならびにこの多層基板を用いた熱電モジュール
CA2443691A1 (en) * 2001-04-09 2002-10-17 Research Triangle Institute Thermoelectric device for dna genomic and proteonic chips and thermo-optical switching circuits
US7235735B2 (en) * 2002-04-15 2007-06-26 Nextreme Thermal Solutions, Inc. Thermoelectric devices utilizing double-sided Peltier junctions and methods of making the devices
AU2003265988A1 (en) 2002-09-09 2004-03-29 Rosemount Aerospace, Inc. Method for making an infrared detector and infrared detector
DE102004030043B4 (de) * 2004-06-22 2006-05-04 Infineon Technologies Ag Verfahren zum Herstellen eines Thermoelements
WO2007002342A2 (en) * 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures
DE202006002674U1 (de) * 2006-02-20 2006-04-20 Isabellenhütte Heusler Gmbh & Co. Kg Füllstandssensor
US7626114B2 (en) 2006-06-16 2009-12-01 Digital Angel Corporation Thermoelectric power supply
ATE468615T1 (de) * 2006-07-24 2010-06-15 Fiat Ricerche Vorrichtung zur wandlung von elektromagnetischer strahlung in elektrische energie und korrespondierende wandlungsverfahren
TWI338390B (en) * 2007-07-12 2011-03-01 Ind Tech Res Inst Flexible thermoelectric device and manufacturing method thereof
WO2009063911A1 (ja) * 2007-11-14 2009-05-22 Murata Manufacturing Co., Ltd. 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法
KR101063938B1 (ko) * 2008-11-13 2011-09-14 한국전기연구원 중저온용 열전재료
JP5066564B2 (ja) * 2009-07-06 2012-11-07 韓國電子通信研究院 熱電素子及びその製造方法
US20110094556A1 (en) * 2009-10-25 2011-04-28 Digital Angel Corporation Planar thermoelectric generator
KR101097679B1 (ko) * 2010-05-25 2011-12-23 삼성전기주식회사 에너지 변환 소자 및 그 제조 방법, 그리고 상기 에너지 변환 소자를 구비하는 전자 장치
DE102010022668B4 (de) 2010-06-04 2012-02-02 O-Flexx Technologies Gmbh Thermoelektrisches Element und Modul umfassend mehrere derartige Elemente

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554815A (en) * 1963-04-30 1971-01-12 Du Pont Thin,flexible thermoelectric device
JPH0599759A (ja) * 1991-10-09 1993-04-23 Agency Of Ind Science & Technol 温度センサー
JPH0629581A (ja) * 1992-07-09 1994-02-04 Matsushita Electric Ind Co Ltd 熱電素子
JPH06188464A (ja) * 1992-12-17 1994-07-08 Matsushita Electric Ind Co Ltd 薄膜熱電素子及びその製造方法
JPH10173110A (ja) * 1996-12-13 1998-06-26 Nissan Motor Co Ltd 電子冷却モジュールおよびその製造方法
WO2005047560A1 (ja) * 2003-11-17 2005-05-26 Matsushita Electric Industrial Co., Ltd. 結晶膜の製造方法、結晶膜付き基体の製造方法、熱電変換素子の製造方法、および熱電変換素子
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
JP2009158760A (ja) * 2007-12-27 2009-07-16 Daikin Ind Ltd 熱電素子
US20100163090A1 (en) * 2008-12-31 2010-07-01 Industrial Technology Research Institute Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure
JP2011222873A (ja) * 2010-04-13 2011-11-04 Fujitsu Ltd 熱電変換素子及びその製造方法

Also Published As

Publication number Publication date
WO2013124095A1 (de) 2013-08-29
WO2013124094A3 (de) 2013-10-24
CN104137283A (zh) 2014-11-05
CN104137283B (zh) 2018-03-23
EP2805360B1 (de) 2017-06-14
US9899588B2 (en) 2018-02-20
RU2014138379A (ru) 2016-04-10
EP2805360A1 (de) 2014-11-26
DE102012105373B4 (de) 2019-02-07
DE102012105367A1 (de) 2013-08-29
DE102012105373A1 (de) 2013-08-29
WO2013124094A2 (de) 2013-08-29
US20150034140A1 (en) 2015-02-05
RU2606250C2 (ru) 2017-01-10

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