JP2015510847A5 - - Google Patents

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Publication number
JP2015510847A5
JP2015510847A5 JP2015501730A JP2015501730A JP2015510847A5 JP 2015510847 A5 JP2015510847 A5 JP 2015510847A5 JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015510847 A5 JP2015510847 A5 JP 2015510847A5
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JP
Japan
Prior art keywords
insoluble polymer
polymer foam
particles
coated
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015501730A
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English (en)
Japanese (ja)
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JP2015510847A (ja
JP6078631B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/030353 external-priority patent/WO2013142134A1/en
Publication of JP2015510847A publication Critical patent/JP2015510847A/ja
Publication of JP2015510847A5 publication Critical patent/JP2015510847A5/ja
Application granted granted Critical
Publication of JP6078631B2 publication Critical patent/JP6078631B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015501730A 2012-03-20 2013-03-12 セルフコンディショニング研磨パッドおよびその作製方法 Expired - Fee Related JP6078631B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261613398P 2012-03-20 2012-03-20
US61/613,398 2012-03-20
PCT/US2013/030353 WO2013142134A1 (en) 2012-03-20 2013-03-12 A self-conditioning polishing pad and a method of making the same

Publications (3)

Publication Number Publication Date
JP2015510847A JP2015510847A (ja) 2015-04-13
JP2015510847A5 true JP2015510847A5 (https=) 2016-03-31
JP6078631B2 JP6078631B2 (ja) 2017-02-08

Family

ID=49212255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015501730A Expired - Fee Related JP6078631B2 (ja) 2012-03-20 2013-03-12 セルフコンディショニング研磨パッドおよびその作製方法

Country Status (6)

Country Link
US (1) US9050697B2 (https=)
JP (1) JP6078631B2 (https=)
KR (1) KR101532896B1 (https=)
CN (1) CN104302446B (https=)
TW (1) TWI574782B (https=)
WO (1) WO2013142134A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
US10813444B2 (en) 2018-05-16 2020-10-27 Jh Rhodes Company, Inc. Porous polymeric polishing bristles and methods for their manufacture
KR101783406B1 (ko) * 2016-12-07 2017-10-10 엠.씨.케이 (주) 연마 패드 및 이의 제조방법
US11551936B2 (en) * 2018-07-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Self-healing polishing pad
CN112080209B (zh) * 2020-09-11 2022-04-12 宁波江丰电子材料股份有限公司 一种冷却水盘和冷却管的粘结方法
US12472602B2 (en) 2021-09-02 2025-11-18 Cmc Materials Llc Textured CMP pad comprising polymer particles
CN118927171A (zh) * 2024-09-19 2024-11-12 郑州磨料磨具磨削研究所有限公司 一种研抛一体化复合磨具及其制备方法和应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4155790B2 (ja) * 2002-10-18 2008-09-24 株式会社東芝 化学機械研磨方法及び素子微細化分離用研磨パッド
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050176251A1 (en) * 2004-02-05 2005-08-11 Duong Chau H. Polishing pad with releasable slick particles
WO2005104199A1 (ja) 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP4379462B2 (ja) * 2006-10-31 2009-12-09 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
KR100955032B1 (ko) * 2008-05-20 2010-04-28 (주)피에스텍 연마용 폴리우레탄 흡착 패드 조성물, 연마용 폴리우레탄흡착 패드 및 그 제조방법
TWI520812B (zh) * 2009-01-05 2016-02-11 音諾帕德股份有限公司 化學機械平面化墊體及其製造方法、以及拋光一基板之方法
JP2012528487A (ja) * 2009-05-27 2012-11-12 ロジャーズ コーポレーション 研磨パッド、それを用いた組成物および、その製造と使用方法
JP5728026B2 (ja) 2009-12-22 2015-06-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びこれの製造方法
WO2012138705A2 (en) 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same

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