JP2015510847A5 - - Google Patents
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- Publication number
- JP2015510847A5 JP2015510847A5 JP2015501730A JP2015501730A JP2015510847A5 JP 2015510847 A5 JP2015510847 A5 JP 2015510847A5 JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015501730 A JP2015501730 A JP 2015501730A JP 2015510847 A5 JP2015510847 A5 JP 2015510847A5
- Authority
- JP
- Japan
- Prior art keywords
- insoluble polymer
- polymer foam
- particles
- coated
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261613398P | 2012-03-20 | 2012-03-20 | |
| US61/613,398 | 2012-03-20 | ||
| PCT/US2013/030353 WO2013142134A1 (en) | 2012-03-20 | 2013-03-12 | A self-conditioning polishing pad and a method of making the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015510847A JP2015510847A (ja) | 2015-04-13 |
| JP2015510847A5 true JP2015510847A5 (https=) | 2016-03-31 |
| JP6078631B2 JP6078631B2 (ja) | 2017-02-08 |
Family
ID=49212255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015501730A Expired - Fee Related JP6078631B2 (ja) | 2012-03-20 | 2013-03-12 | セルフコンディショニング研磨パッドおよびその作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9050697B2 (https=) |
| JP (1) | JP6078631B2 (https=) |
| KR (1) | KR101532896B1 (https=) |
| CN (1) | CN104302446B (https=) |
| TW (1) | TWI574782B (https=) |
| WO (1) | WO2013142134A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6078631B2 (ja) | 2012-03-20 | 2017-02-08 | ジェイエイチ ローデス カンパニー， インコーポレイテッド | セルフコンディショニング研磨パッドおよびその作製方法 |
| US10813444B2 (en) | 2018-05-16 | 2020-10-27 | Jh Rhodes Company, Inc. | Porous polymeric polishing bristles and methods for their manufacture |
| KR101783406B1 (ko) * | 2016-12-07 | 2017-10-10 | 엠.씨.케이 (주) | 연마 패드 및 이의 제조방법 |
| US11551936B2 (en) * | 2018-07-31 | 2023-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-healing polishing pad |
| CN112080209B (zh) * | 2020-09-11 | 2022-04-12 | 宁波江丰电子材料股份有限公司 | 一种冷却水盘和冷却管的粘结方法 |
| WO2023034573A1 (en) * | 2021-09-02 | 2023-03-09 | Cmc Materials, Inc. | Textured cmp pad comprising polymer particles |
| CN118927171A (zh) * | 2024-09-19 | 2024-11-12 | 郑州磨料磨具磨削研究所有限公司 | 一种研抛一体化复合磨具及其制备方法和应用 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3925041B2 (ja) * | 2000-05-31 | 2007-06-06 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| JP4155790B2 (ja) * | 2002-10-18 | 2008-09-24 | 株式会社東芝 | 化学機械研磨方法及び素子微細化分離用研磨パッド |
| JP4039214B2 (ja) | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| US20050176251A1 (en) | 2004-02-05 | 2005-08-11 | Duong Chau H. | Polishing pad with releasable slick particles |
| EP1739729B1 (en) | 2004-04-23 | 2012-03-28 | JSR Corporation | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| JP4897238B2 (ja) * | 2005-05-17 | 2012-03-14 | 東洋ゴム工業株式会社 | 研磨パッド |
| US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
| JP4379462B2 (ja) * | 2006-10-31 | 2009-12-09 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| US8491360B2 (en) * | 2007-10-26 | 2013-07-23 | Innopad, Inc. | Three-dimensional network in CMP pad |
| KR100955032B1 (ko) | 2008-05-20 | 2010-04-28 | (주)피에스텍 | 연마용 폴리우레탄 흡착 패드 조성물, 연마용 폴리우레탄흡착 패드 및 그 제조방법 |
| CN102271867B (zh) * | 2009-01-05 | 2015-07-01 | 音诺帕德股份有限公司 | 多层的化学机械平面化垫体 |
| WO2010138724A1 (en) * | 2009-05-27 | 2010-12-02 | Rogers Corporation | Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer |
| WO2011087737A2 (en) * | 2009-12-22 | 2011-07-21 | 3M Innovative Properties Company | Polishing pad and method of making the same |
| WO2012138705A2 (en) | 2011-04-05 | 2012-10-11 | Universal Photonics, Inc. | A self-conditioning polishing pad and a method of making the same |
| JP6078631B2 (ja) | 2012-03-20 | 2017-02-08 | ジェイエイチ ローデス カンパニー， インコーポレイテッド | セルフコンディショニング研磨パッドおよびその作製方法 |
-
2013
- 2013-03-12 JP JP2015501730A patent/JP6078631B2/ja not_active Expired - Fee Related
- 2013-03-12 WO PCT/US2013/030353 patent/WO2013142134A1/en not_active Ceased
- 2013-03-12 CN CN201380015440.8A patent/CN104302446B/zh not_active Expired - Fee Related
- 2013-03-12 KR KR1020147029262A patent/KR101532896B1/ko not_active Expired - Fee Related
- 2013-03-12 US US13/797,121 patent/US9050697B2/en active Active
- 2013-03-14 TW TW102108998A patent/TWI574782B/zh not_active IP Right Cessation
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