CN104302446B - 自调理抛光垫及其制备方法 - Google Patents

自调理抛光垫及其制备方法 Download PDF

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Publication number
CN104302446B
CN104302446B CN201380015440.8A CN201380015440A CN104302446B CN 104302446 B CN104302446 B CN 104302446B CN 201380015440 A CN201380015440 A CN 201380015440A CN 104302446 B CN104302446 B CN 104302446B
Authority
CN
China
Prior art keywords
insoluble polymer
polymer foam
particles
polishing pad
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380015440.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN104302446A (zh
Inventor
S·B·达斯凯维屈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JH Rhodes Co Inc
Original Assignee
JH Rhodes Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JH Rhodes Co Inc filed Critical JH Rhodes Co Inc
Publication of CN104302446A publication Critical patent/CN104302446A/zh
Application granted granted Critical
Publication of CN104302446B publication Critical patent/CN104302446B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/35—Composite foams, i.e. continuous macromolecular foams containing discontinuous cellular particles or fragments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/10—Water or water-releasing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
    • C08J2203/142—Halogenated saturated hydrocarbons, e.g. H3C-CF3

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201380015440.8A 2012-03-20 2013-03-12 自调理抛光垫及其制备方法 Expired - Fee Related CN104302446B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261613398P 2012-03-20 2012-03-20
US61/613,398 2012-03-20
PCT/US2013/030353 WO2013142134A1 (en) 2012-03-20 2013-03-12 A self-conditioning polishing pad and a method of making the same

Publications (2)

Publication Number Publication Date
CN104302446A CN104302446A (zh) 2015-01-21
CN104302446B true CN104302446B (zh) 2017-10-31

Family

ID=49212255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380015440.8A Expired - Fee Related CN104302446B (zh) 2012-03-20 2013-03-12 自调理抛光垫及其制备方法

Country Status (6)

Country Link
US (1) US9050697B2 (https=)
JP (1) JP6078631B2 (https=)
KR (1) KR101532896B1 (https=)
CN (1) CN104302446B (https=)
TW (1) TWI574782B (https=)
WO (1) WO2013142134A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
US10813444B2 (en) 2018-05-16 2020-10-27 Jh Rhodes Company, Inc. Porous polymeric polishing bristles and methods for their manufacture
KR101783406B1 (ko) * 2016-12-07 2017-10-10 엠.씨.케이 (주) 연마 패드 및 이의 제조방법
US11551936B2 (en) * 2018-07-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Self-healing polishing pad
CN112080209B (zh) * 2020-09-11 2022-04-12 宁波江丰电子材料股份有限公司 一种冷却水盘和冷却管的粘结方法
US12472602B2 (en) 2021-09-02 2025-11-18 Cmc Materials Llc Textured CMP pad comprising polymer particles
CN118927171A (zh) * 2024-09-19 2024-11-12 郑州磨料磨具磨削研究所有限公司 一种研抛一体化复合磨具及其制备方法和应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4155790B2 (ja) * 2002-10-18 2008-09-24 株式会社東芝 化学機械研磨方法及び素子微細化分離用研磨パッド
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050176251A1 (en) * 2004-02-05 2005-08-11 Duong Chau H. Polishing pad with releasable slick particles
WO2005104199A1 (ja) 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP4379462B2 (ja) * 2006-10-31 2009-12-09 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
KR100955032B1 (ko) * 2008-05-20 2010-04-28 (주)피에스텍 연마용 폴리우레탄 흡착 패드 조성물, 연마용 폴리우레탄흡착 패드 및 그 제조방법
TWI520812B (zh) * 2009-01-05 2016-02-11 音諾帕德股份有限公司 化學機械平面化墊體及其製造方法、以及拋光一基板之方法
JP2012528487A (ja) * 2009-05-27 2012-11-12 ロジャーズ コーポレーション 研磨パッド、それを用いた組成物および、その製造と使用方法
JP5728026B2 (ja) 2009-12-22 2015-06-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びこれの製造方法
WO2012138705A2 (en) 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same

Also Published As

Publication number Publication date
JP2015510847A (ja) 2015-04-13
US9050697B2 (en) 2015-06-09
US20130252519A1 (en) 2013-09-26
TWI574782B (zh) 2017-03-21
CN104302446A (zh) 2015-01-21
KR101532896B1 (ko) 2015-06-30
KR20140130240A (ko) 2014-11-07
JP6078631B2 (ja) 2017-02-08
WO2013142134A1 (en) 2013-09-26
TW201347907A (zh) 2013-12-01

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Granted publication date: 20171031