JP2015510277A - 基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法 - Google Patents

基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法 Download PDF

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JP2015510277A
JP2015510277A JP2014559986A JP2014559986A JP2015510277A JP 2015510277 A JP2015510277 A JP 2015510277A JP 2014559986 A JP2014559986 A JP 2014559986A JP 2014559986 A JP2014559986 A JP 2014559986A JP 2015510277 A JP2015510277 A JP 2015510277A
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Prior art keywords
substrate
semiconductor laser
laser chip
wire bond
chip
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Pending
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JP2014559986A
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English (en)
Japanese (ja)
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JP2015510277A5 (enExample
Inventor
ジュ，ジン，ハン
ブルマン，ロバート
デレオン，ジェリー
Original Assignee
エクセリタス カナダ，インコーポレイテッド
エクセリタス カナダ，インコーポレイテッド
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Priority claimed from US13/411,275 external-priority patent/US8791492B2/en
Application filed by エクセリタス カナダ，インコーポレイテッド, エクセリタス カナダ，インコーポレイテッド filed Critical エクセリタス カナダ，インコーポレイテッド
Publication of JP2015510277A publication Critical patent/JP2015510277A/ja
Publication of JP2015510277A5 publication Critical patent/JP2015510277A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2014559986A 2012-03-02 2013-02-27 基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法 Pending JP2015510277A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/411,275 US8791492B2 (en) 2009-10-01 2012-03-02 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
US13/411,275 2012-03-02
PCT/US2013/027987 WO2013130580A2 (en) 2012-03-02 2013-02-27 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Publications (2)

Publication Number Publication Date
JP2015510277A true JP2015510277A (ja) 2015-04-02
JP2015510277A5 JP2015510277A5 (enExample) 2015-06-11

Family

ID=47846203

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JP2014559986A Pending JP2015510277A (ja) 2012-03-02 2013-02-27 基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法

Country Status (6)

Country Link
EP (1) EP2820726B1 (enExample)
JP (1) JP2015510277A (enExample)
KR (1) KR20140131974A (enExample)
HK (1) HK1204158A1 (enExample)
TW (1) TW201344994A (enExample)
WO (1) WO2013130580A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018525826A (ja) * 2015-08-27 2018-09-06 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ レーザ部品およびその製造方法
JP2019507376A (ja) * 2016-02-04 2019-03-14 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス照明装置の製造方法およびオプトエレクトロニクス照明装置
DE112021005241T5 (de) 2020-11-13 2023-09-07 Rohm Co., Ltd. Lichtemittierende halbleitervorrichtung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019190676A1 (en) * 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
CN113972554A (zh) * 2020-07-24 2022-01-25 上海禾赛科技有限公司 激光器封装结构、激光器芯片的封装方法及激光雷达

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120372U (enExample) * 1986-01-23 1987-07-30
JP2002042365A (ja) * 2000-07-21 2002-02-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置の光源装置
JP2002217479A (ja) * 2001-01-17 2002-08-02 Sankyo Seiki Mfg Co Ltd レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置
WO2011039509A1 (en) * 2009-10-01 2011-04-07 Perkinelmer Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193083A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd フアイバ装着用半導体レ−ザ装置
JPS61272987A (ja) * 1985-05-29 1986-12-03 Hitachi Ltd 半導体レ−ザ素子
JPH10505433A (ja) * 1994-06-29 1998-05-26 ブリテイッシュ・テレコミュニケーションズ・パブリック・リミテッド・カンパニー パッケージした光デバイス
US5627851A (en) * 1995-02-10 1997-05-06 Ricoh Company, Ltd. Semiconductor light emitting device
WO2002103866A1 (en) * 2001-06-15 2002-12-27 Nichia Corporation Semiconductor laser element, and its manufacturing method
US8791492B2 (en) * 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120372U (enExample) * 1986-01-23 1987-07-30
JP2002042365A (ja) * 2000-07-21 2002-02-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置の光源装置
JP2002217479A (ja) * 2001-01-17 2002-08-02 Sankyo Seiki Mfg Co Ltd レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置
WO2011039509A1 (en) * 2009-10-01 2011-04-07 Perkinelmer Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018525826A (ja) * 2015-08-27 2018-09-06 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ レーザ部品およびその製造方法
US10511138B2 (en) 2015-08-27 2019-12-17 Osram Opto Semiconductors Gmbh Laser component and method of producing same
JP2019507376A (ja) * 2016-02-04 2019-03-14 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス照明装置の製造方法およびオプトエレクトロニクス照明装置
US10931081B2 (en) 2016-02-04 2021-02-23 Osram Oled Gmbh Method of producing an optoelectronic lighting device and optoelectronic lighting device
DE112021005241T5 (de) 2020-11-13 2023-09-07 Rohm Co., Ltd. Lichtemittierende halbleitervorrichtung
DE112021005241B4 (de) 2020-11-13 2024-05-08 Rohm Co., Ltd. Lichtemittierende halbleitervorrichtung

Also Published As

Publication number Publication date
TW201344994A (zh) 2013-11-01
WO2013130580A8 (en) 2014-01-03
HK1204158A1 (en) 2015-11-06
WO2013130580A2 (en) 2013-09-06
EP2820726A2 (en) 2015-01-07
KR20140131974A (ko) 2014-11-14
EP2820726B1 (en) 2018-05-02
WO2013130580A3 (en) 2013-11-14

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