JP2015510275A - イメージセンサ及びその製造方法 - Google Patents
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- JP2015510275A JP2015510275A JP2014559814A JP2014559814A JP2015510275A JP 2015510275 A JP2015510275 A JP 2015510275A JP 2014559814 A JP2014559814 A JP 2014559814A JP 2014559814 A JP2014559814 A JP 2014559814A JP 2015510275 A JP2015510275 A JP 2015510275A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000013078 crystal Substances 0.000 claims abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 61
- 229910052710 silicon Inorganic materials 0.000 claims description 61
- 239000010703 silicon Substances 0.000 claims description 61
- 238000012546 transfer Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 86
- 235000012431 wafers Nutrition 0.000 description 50
- 238000000034 method Methods 0.000 description 29
- 230000007547 defect Effects 0.000 description 14
- 239000012535 impurity Substances 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 8
- 238000007667 floating Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
多様なオフ角を有する約300mmの直径を有するシリコンインゴットを成長させた後、これを切断及び研磨工程によりシリコンウェーハとした。以後、四塩化ケイ素をソースガスとし、B2H6をドーパントガスとして、前記シリコンウェーハ上に約1μm〜約20μmの厚さを有するエピ層を形成した。以後、前記エピ層にn型不純物を注入してフォトダイオードを形成した。以後、前記エピ層上にデュアルダマシン工程によって、4つの配線層を形成した。以後、最上の配線層に支持基板であるウェーハが接合され、前記シリコンウェーハが除去された後、前記エピ層の下にカラーフィルタ及びマイクロレンズを形成した。
このように、オフ角に応じて形成されたエピ層及びイメージセンサの欠陥(defect)及び不良率を図9及び図10に示す。図9はエピ層のオフ角に応じた欠陥の数を示す図であり、図10はシリコンウェーハのオフ角に応じたイメージセンサの不良率を示す図である。
Claims (12)
- 支持基板と、
前記支持基板の下に配置される配線層と、
前記配線層の下に配置されるエピ層と、
前記エピ層に形成されるフォトダイオードと、
を含み、
前記エピ層のオフ角は、[001]結晶方位(crystal orientation)に対して0.3°〜1.5°である、イメージセンサ。 - 前記エピ層は、[001]結晶方位に対して0.3°〜0.7°の範囲のオフ角を有する、請求項1に記載のイメージセンサ。
- 前記エピ層に形成され、前記フォトダイオードと連結されるトランスファトランジスタをさらに含む、請求項1に記載のイメージセンサ。
- 前記エピ層の下に配置されるカラーフィルタをさらに含む、請求項1に記載のイメージセンサ。
- 前記カラーフィルタの下に配置されるマイクロレンズをさらに含む、請求項4に記載のイメージセンサ。
- 前記エピ層の抵抗は、1Ω・cm〜10Ω・cmの範囲の値を有する、請求項1に記載のイメージセンサ。
- オフ角が[001]結晶方位に対して0.3°〜1.5°であるシリコンウェーハを提供するステップと、
前記シリコンウェーハ上にエピ層を形成するステップと、
前記エピ層にフォトダイオードを形成するステップと、
前記エピ層上に配線層を形成するステップと、
前記配線層上に支持基板を形成するステップと、
前記シリコンウェーハを除去するステップと、を含むイメージセンサの製造方法。 - 前記シリコンウェーハを除去した後、前記エピ層の下にカラーフィルタを形成するステップをさらに含む、請求項7に記載のイメージセンサの製造方法。
- 前記カラーフィルタの下にマイクロレンズを形成するステップをさらに含む、請求項8に記載のイメージセンサの製造方法。
- 前記シリコンウェーハは、[001]結晶方位に対して0.3°〜0.7°の範囲のオフ角を有する、請求項7に記載のイメージセンサの製造方法。
- 前記シリコンウェーハの抵抗は、0.005Ω・cm〜0.02Ω・cmの範囲の値を有する、請求項7に記載のイメージセンサの製造方法。
- 前記エピ層の抵抗は、1Ω・cm〜10Ω・cmの範囲の値を有する、請求項7に記載のイメージセンサの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120021153A KR101323001B1 (ko) | 2012-02-29 | 2012-02-29 | 이미지 센서 및 이의 제조 방법 |
KR10-2012-0021153 | 2012-02-29 | ||
PCT/KR2012/010241 WO2013129758A1 (ko) | 2012-02-29 | 2012-11-29 | 이미지 센서 및 이의 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015510275A true JP2015510275A (ja) | 2015-04-02 |
Family
ID=49082921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014559814A Pending JP2015510275A (ja) | 2012-02-29 | 2012-11-29 | イメージセンサ及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150014754A1 (ja) |
JP (1) | JP2015510275A (ja) |
KR (1) | KR101323001B1 (ja) |
CN (1) | CN104145337A (ja) |
DE (1) | DE112012005958T5 (ja) |
WO (1) | WO2013129758A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2009350C2 (nl) * | 2012-05-30 | 2013-10-09 | Abc Invest Gmbh | Samenstelling voor drukinkt en werkwijze voor het bedrukken van objecten. |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62226891A (ja) * | 1986-03-28 | 1987-10-05 | Shin Etsu Handotai Co Ltd | 半導体装置用基板 |
JP2008016755A (ja) * | 2006-07-10 | 2008-01-24 | Nec Electronics Corp | 固体撮像装置 |
JP2011035069A (ja) * | 2009-07-30 | 2011-02-17 | Shin Etsu Handotai Co Ltd | 半導体装置の製造方法 |
JP2011082443A (ja) * | 2009-10-09 | 2011-04-21 | Sumco Corp | エピタキシャルウェーハおよびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3109567B2 (ja) * | 1995-12-05 | 2000-11-20 | 住友電気工業株式会社 | Iii−v族化合物半導体ウェハの製造方法 |
KR100790230B1 (ko) * | 2001-11-27 | 2008-01-02 | 매그나칩 반도체 유한회사 | 이미지센서 제조 방법 |
KR100632463B1 (ko) * | 2005-02-07 | 2006-10-11 | 삼성전자주식회사 | 에피택셜 반도체 기판의 제조 방법과 이를 이용한 이미지센서의 제조 방법, 에피택셜 반도체 기판 및 이를 이용한이미지 센서 |
KR100775058B1 (ko) * | 2005-09-29 | 2007-11-08 | 삼성전자주식회사 | 픽셀 및 이를 이용한 이미지 센서, 그리고 상기 이미지센서를 포함하는 이미지 처리 시스템 |
KR100825808B1 (ko) * | 2007-02-26 | 2008-04-29 | 삼성전자주식회사 | 후면 조명 구조의 이미지 센서 및 그 이미지 센서 제조방법 |
KR101033355B1 (ko) * | 2008-09-30 | 2011-05-09 | 주식회사 동부하이텍 | 이미지 센서 및 이의 제조방법 |
JP5347520B2 (ja) * | 2009-01-20 | 2013-11-20 | ソニー株式会社 | 固体撮像装置の製造方法 |
JP2011086706A (ja) * | 2009-10-14 | 2011-04-28 | Sumco Corp | 裏面照射型固体撮像素子用エピタキシャル基板およびその製造方法 |
JP5509962B2 (ja) * | 2010-03-19 | 2014-06-04 | ソニー株式会社 | 固体撮像装置、および、その製造方法、電子機器 |
-
2012
- 2012-02-29 KR KR1020120021153A patent/KR101323001B1/ko active IP Right Grant
- 2012-11-29 JP JP2014559814A patent/JP2015510275A/ja active Pending
- 2012-11-29 DE DE112012005958.1T patent/DE112012005958T5/de not_active Ceased
- 2012-11-29 US US14/379,280 patent/US20150014754A1/en not_active Abandoned
- 2012-11-29 WO PCT/KR2012/010241 patent/WO2013129758A1/ko active Application Filing
- 2012-11-29 CN CN201280070992.4A patent/CN104145337A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62226891A (ja) * | 1986-03-28 | 1987-10-05 | Shin Etsu Handotai Co Ltd | 半導体装置用基板 |
JP2008016755A (ja) * | 2006-07-10 | 2008-01-24 | Nec Electronics Corp | 固体撮像装置 |
JP2011035069A (ja) * | 2009-07-30 | 2011-02-17 | Shin Etsu Handotai Co Ltd | 半導体装置の製造方法 |
JP2011082443A (ja) * | 2009-10-09 | 2011-04-21 | Sumco Corp | エピタキシャルウェーハおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101323001B1 (ko) | 2013-10-29 |
DE112012005958T5 (de) | 2014-11-20 |
WO2013129758A1 (ko) | 2013-09-06 |
CN104145337A (zh) | 2014-11-12 |
US20150014754A1 (en) | 2015-01-15 |
KR20130099556A (ko) | 2013-09-06 |
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