JP2015509138A5 - - Google Patents
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- Publication number
- JP2015509138A5 JP2015509138A5 JP2014546160A JP2014546160A JP2015509138A5 JP 2015509138 A5 JP2015509138 A5 JP 2015509138A5 JP 2014546160 A JP2014546160 A JP 2014546160A JP 2014546160 A JP2014546160 A JP 2014546160A JP 2015509138 A5 JP2015509138 A5 JP 2015509138A5
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- inserts
- insert
- replaceable
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 6
- 229910001220 stainless steel Inorganic materials 0.000 claims 3
- 239000010935 stainless steel Substances 0.000 claims 3
- 239000004677 Nylon Substances 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 229920001778 nylon Polymers 0.000 claims 2
- 229910052779 Neodymium Inorganic materials 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 229910000828 alnico Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/316,358 US9347129B2 (en) | 2011-12-09 | 2011-12-09 | Interchangeable magnet pack |
| US13/316,358 | 2011-12-09 | ||
| PCT/US2012/068635 WO2013086466A1 (en) | 2011-12-09 | 2012-12-07 | Interchangeable magnet pack |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015509138A JP2015509138A (ja) | 2015-03-26 |
| JP2015509138A5 true JP2015509138A5 (cg-RX-API-DMAC7.html) | 2016-01-28 |
| JP6106690B2 JP6106690B2 (ja) | 2017-04-05 |
Family
ID=48570988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014546160A Expired - Fee Related JP6106690B2 (ja) | 2011-12-09 | 2012-12-07 | 交換可能な磁石パック |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9347129B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2788524A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6106690B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20140138597A (cg-RX-API-DMAC7.html) |
| CN (1) | CN104603325A (cg-RX-API-DMAC7.html) |
| SG (1) | SG11201403053UA (cg-RX-API-DMAC7.html) |
| TW (1) | TW201339343A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2013086466A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10573500B2 (en) | 2011-12-09 | 2020-02-25 | Seagate Technology Llc | Interchangeable magnet pack |
| FR3064423B1 (fr) * | 2017-03-22 | 2019-11-15 | Whylot Sas | Rotor pour moteur ou generatrice electromagnetique a structure alveolaire comportant des alveoles pour le logement d'aimants respectifs |
| US11322338B2 (en) * | 2017-08-31 | 2022-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sputter target magnet |
| FR3077414B1 (fr) * | 2018-01-26 | 2022-03-11 | Whylot Sas | Aimant unitaire a configuration ovoide et structure d'aimant a plusieurs aimants unitaires |
| GB201815216D0 (en) * | 2018-09-18 | 2018-10-31 | Spts Technologies Ltd | Apparatus and a method of controlling thickness variation in a material layer formed using physical vapour deposition |
| US11772812B1 (en) * | 2020-09-09 | 2023-10-03 | United States Of America As Represented By The Secretary Of The Air Force | Magnetic mobile aircraft cover |
| US12014912B2 (en) * | 2021-05-05 | 2024-06-18 | Taiwan Semiconductor Manufacturing Company Limited | Apparatus and method for physical vapor deposition |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3386568A (en) * | 1967-06-22 | 1968-06-04 | Ruby L. Harmon | Magnet kit |
| DE3727901A1 (de) | 1987-08-21 | 1989-03-02 | Leybold Ag | Zerstaeubungskathode nach dem magnetronprinzip |
| JPH04218905A (ja) | 1990-03-23 | 1992-08-10 | Unitika Ltd | 薄膜状磁性材料及びその製造方法 |
| US5407551A (en) | 1993-07-13 | 1995-04-18 | The Boc Group, Inc. | Planar magnetron sputtering apparatus |
| JP3834111B2 (ja) * | 1996-10-16 | 2006-10-18 | 松下電器産業株式会社 | マグネトロンスパッタ方法、マグネトロンスパッタ装置及びそれに使用するマグネットユニット |
| GB9718947D0 (en) * | 1997-09-05 | 1997-11-12 | Nordiko Ltd | Vacuum sputtering apparatus |
| US6287435B1 (en) | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
| US6306265B1 (en) | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
| US6299740B1 (en) * | 2000-01-19 | 2001-10-09 | Veeco Instrument, Inc. | Sputtering assembly and target therefor |
| KR100345924B1 (ko) * | 2000-01-24 | 2002-07-27 | 한전건 | 평판 마그네트론 스퍼터링 장치 |
| US6406599B1 (en) * | 2000-11-01 | 2002-06-18 | Applied Materials, Inc. | Magnetron with a rotating center magnet for a vault shaped sputtering target |
| JP4411512B2 (ja) | 2003-08-07 | 2010-02-10 | アイシン精機株式会社 | 超電導磁場発生装置、その励磁方法、超電導磁場発生装置を用いたスパッタリング成膜装置、強磁性体着脱治具 |
| US7018515B2 (en) * | 2004-03-24 | 2006-03-28 | Applied Materials, Inc. | Selectable dual position magnetron |
| JP4924835B2 (ja) | 2005-02-02 | 2012-04-25 | 日立金属株式会社 | マグネトロンスパッタリング用磁気回路装置及びその製造方法 |
| DE102005019100B4 (de) | 2005-04-25 | 2009-02-12 | Steag Hamatech Ag | Magnetsystem für eine Zerstäubungskathode |
| US20070108041A1 (en) * | 2005-11-11 | 2007-05-17 | Guo George X | Magnetron source having increased usage life |
| US8557094B2 (en) * | 2006-10-05 | 2013-10-15 | Applied Materials, Inc. | Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum |
| JP5717444B2 (ja) * | 2008-06-26 | 2015-05-13 | 株式会社アルバック | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
| WO2010023952A1 (ja) * | 2008-08-29 | 2010-03-04 | 株式会社アルバック | マグネトロンスパッタカソード及び成膜装置 |
| US8721796B2 (en) * | 2008-10-23 | 2014-05-13 | Applied Materials, Inc. | Plasma cleaning apparatus and method |
| CN101851746A (zh) * | 2009-04-03 | 2010-10-06 | 鸿富锦精密工业(深圳)有限公司 | 磁控式溅镀靶及磁控式溅镀系统 |
-
2011
- 2011-12-09 US US13/316,358 patent/US9347129B2/en not_active Expired - Fee Related
-
2012
- 2012-12-07 JP JP2014546160A patent/JP6106690B2/ja not_active Expired - Fee Related
- 2012-12-07 KR KR1020147018954A patent/KR20140138597A/ko not_active Withdrawn
- 2012-12-07 EP EP12856309.5A patent/EP2788524A4/en not_active Withdrawn
- 2012-12-07 CN CN201280069500.XA patent/CN104603325A/zh active Pending
- 2012-12-07 WO PCT/US2012/068635 patent/WO2013086466A1/en not_active Ceased
- 2012-12-07 TW TW101146177A patent/TW201339343A/zh unknown
- 2012-12-07 SG SG11201403053UA patent/SG11201403053UA/en unknown
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