JP2015501537A5 - - Google Patents
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- Publication number
- JP2015501537A5 JP2015501537A5 JP2014537089A JP2014537089A JP2015501537A5 JP 2015501537 A5 JP2015501537 A5 JP 2015501537A5 JP 2014537089 A JP2014537089 A JP 2014537089A JP 2014537089 A JP2014537089 A JP 2014537089A JP 2015501537 A5 JP2015501537 A5 JP 2015501537A5
- Authority
- JP
- Japan
- Prior art keywords
- tubular body
- ring
- diameter
- inner periphery
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161549604P | 2011-10-20 | 2011-10-20 | |
| US61/549,604 | 2011-10-20 | ||
| PCT/US2012/058232 WO2013058970A1 (en) | 2011-10-20 | 2012-10-01 | Substrate support bushing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015501537A JP2015501537A (ja) | 2015-01-15 |
| JP2015501537A5 true JP2015501537A5 (enExample) | 2015-08-13 |
| JP5896387B2 JP5896387B2 (ja) | 2016-03-30 |
Family
ID=48136043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014537089A Active JP5896387B2 (ja) | 2011-10-20 | 2012-10-01 | 基板支持ブッシング |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8911151B2 (enExample) |
| JP (1) | JP5896387B2 (enExample) |
| KR (1) | KR101549854B1 (enExample) |
| CN (1) | CN103828035B (enExample) |
| TW (1) | TWI507617B (enExample) |
| WO (1) | WO2013058970A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9068262B2 (en) * | 2010-05-21 | 2015-06-30 | Applied Materials, Inc. | Tightly fitted ceramic insulator on large area electrode |
| US9991153B2 (en) * | 2013-03-14 | 2018-06-05 | Applied Materials, Inc. | Substrate support bushing |
| US9887478B2 (en) * | 2015-04-21 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Thermally insulating electrical contact probe |
| US9899193B1 (en) | 2016-11-02 | 2018-02-20 | Varian Semiconductor Equipment Associates, Inc. | RF ion source with dynamic volume control |
| CN108242419A (zh) * | 2016-12-26 | 2018-07-03 | 北京北方华创微电子装备有限公司 | 一种腔室及半导体设备 |
| CN106894002A (zh) * | 2017-03-31 | 2017-06-27 | 昆山国显光电有限公司 | 一种pecvd成膜装置及其成膜方法 |
| TWI749231B (zh) * | 2017-05-25 | 2021-12-11 | 日商日本碍子股份有限公司 | 晶圓基座 |
| WO2019090331A1 (en) | 2017-11-06 | 2019-05-09 | Cold Spring Harbor Laboratory | Method and compositions for forming a copper-containing complex and uses thereof |
| US11121010B2 (en) | 2018-02-15 | 2021-09-14 | Tokyo Electron Limited | Plasma processing apparatus |
| CN108251821B (zh) * | 2018-04-13 | 2020-04-10 | 昆山国显光电有限公司 | 一种应用于pecvd成膜的基座 |
| US10889894B2 (en) * | 2018-08-06 | 2021-01-12 | Applied Materials, Inc. | Faceplate with embedded heater |
| JP7465733B2 (ja) * | 2019-09-26 | 2024-04-11 | 東京エレクトロン株式会社 | 基板支持器及びプラズマ処理装置 |
| CN113652673B (zh) * | 2021-09-15 | 2023-11-24 | 福建华佳彩有限公司 | 一种化学气相沉积台板结构及其控制方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4003245C2 (de) * | 1990-02-03 | 1997-08-21 | Stabilus Gmbh | Führung für teleskopartig ineinander verschiebbare zylindrische Teile |
| US5313865A (en) | 1992-10-13 | 1994-05-24 | Advanced Turret Engineering Co. | Turret station restoration apparatus |
| US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
| JP4111703B2 (ja) | 2001-10-19 | 2008-07-02 | アプライド マテリアルズ インコーポレイテッド | ウエハリフト機構 |
| DE10232478A1 (de) * | 2002-07-17 | 2004-02-12 | Infineon Technologies Ag | Waferhubvorrichtung |
| US6887317B2 (en) * | 2002-09-10 | 2005-05-03 | Applied Materials, Inc. | Reduced friction lift pin |
| CN100427780C (zh) * | 2004-04-22 | 2008-10-22 | Thk株式会社 | 轴承衬套以及使用它的复合运动装置 |
| US20060016398A1 (en) * | 2004-05-28 | 2006-01-26 | Laurent Dubost | Supporting and lifting device for substrates in vacuum |
| KR101218570B1 (ko) * | 2005-05-24 | 2013-01-18 | 주성엔지니어링(주) | 리프트핀 어셈블리 |
| US7638003B2 (en) * | 2006-01-12 | 2009-12-29 | Asm Japan K.K. | Semiconductor processing apparatus with lift pin structure |
| JP5022855B2 (ja) * | 2007-10-05 | 2012-09-12 | 古河機械金属株式会社 | リフトピン機構、加熱処理装置、減圧乾燥装置 |
| KR101305139B1 (ko) * | 2007-12-28 | 2013-09-05 | 주식회사 원익아이피에스 | 리프트핀조립체 및 그를 가지는 진공처리장치 |
| US20100013626A1 (en) * | 2008-07-15 | 2010-01-21 | Applied Materials, Inc. | Substrate lift pin sensor |
| US20110014396A1 (en) * | 2009-07-14 | 2011-01-20 | Applied Materials, Inc. | Recirculating linear rolling bushing |
| KR20130040805A (ko) * | 2010-04-07 | 2013-04-24 | 가부시키가이샤 야스카와덴키 | θＺ 구동 장치 및 스테이지 장치 |
-
2012
- 2012-10-01 KR KR1020147013407A patent/KR101549854B1/ko active Active
- 2012-10-01 WO PCT/US2012/058232 patent/WO2013058970A1/en not_active Ceased
- 2012-10-01 CN CN201280046491.2A patent/CN103828035B/zh active Active
- 2012-10-01 JP JP2014537089A patent/JP5896387B2/ja active Active
- 2012-10-05 TW TW101136923A patent/TWI507617B/zh active
- 2012-10-09 US US13/648,082 patent/US8911151B2/en active Active