JP2015228531A - Semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a management method which can quickly investigate a cause of a failure that occurs in a manufacturing process of a semiconductor product.SOLUTION: A semiconductor device manufacturing method comprises: storing manufacturing conditions in each manufacturing process of a QFP in a main server (MS) in association with an identification number of the QFP; and impressing a two-dimensional barcode (BC2) corresponding to the identification number on a surface of the QFP. By doing this, when a fault occurs in the QFP, the manufacturing conditions of the QFP stored in the main server (MS) can be instantaneously tracked by reading the two-dimensional barcode (BC2) of the QFP and identifying the identification number.

Description

  The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a semiconductor manufacturing technique capable of quickly investigating the cause of a defect that has occurred in a semiconductor device manufacturing process.

  The manufacturing process of a semiconductor device is a pre-process (wafer) in which an integrated circuit is formed by combining a photolithography technique, a CVD technique, a sputtering technique, an etching technique, and the like on the main surface (integrated circuit forming surface) of a semiconductor wafer made of single crystal silicon or the like Process), and the semiconductor wafer on which the integrated circuit is formed is diced into a plurality of semiconductor chips, and then the individual semiconductor chips are sealed in a package made of resin, ceramic, or the like (assembly process) ).

  A semiconductor manufacturer performs product management by displaying product information such as a product type name, a customer logo, and a manufacturing code on the surface of a semiconductor product (semiconductor package) manufactured through such a process.

  Patent Document 1 (Japanese Patent Laid-Open No. 11-008327) discloses a semiconductor chip identification imparting method that enables each of a plurality of semiconductor chips to be managed even after the plurality of semiconductor chips are separated from the semiconductor wafer by dicing. Yes. Specifically, first, for a plurality of semiconductor chips formed on a semiconductor wafer, the wafer number and the position of the chip in the wafer are determined as a chip identification code. Next, when a plurality of semiconductor chips to which a chip identification code is assigned are separated from a semiconductor wafer by dicing and mounted on a lead frame, a bar corresponding to the identification code is placed on a lead frame frame portion in the vicinity of each semiconductor chip. A code is attached. The bar code is read by a bar code reader, the IC package is assembled, and a bar code corresponding to the bar code read by the bar code reader is attached to the back surface of the IC package. According to this semiconductor chip identification code assigning method, by reading the barcode on the back surface of the IC package, the manufacturing lot and wafer number of the semiconductor chip built in the IC package can be identified even after the IC package is assembled. Therefore, follow-up surveys such as manufacturing stage conditions are possible.

  Patent Document 2 (Japanese Patent Application Laid-Open No. 2004-022981) discloses that a chip mounting portion of a lead frame is a package, such as QFN (Quad Fat No lead package) and TSSOP (Thin Shrink Small Outline Package), among small semiconductor packages. In a product exposed from the back surface of the chip, a technology for displaying product information visible from the outside on the front surface of the package and the back surface of the chip mounting portion is disclosed. In this document, product information that is less common between product types is displayed on the front surface of the package, such as a customer logo, product type name, manufacturing code, and lot trace code. Product information that is highly common among products, such as a country code, is displayed. The product information on the front surface of the package is formed by printing, stamping or laser marking after the package is molded, and the product information on the back surface of the chip mounting portion is formed by pressing or etching in advance before starting the assembly of the package. .

JP-A-11-008327 JP 2004-022981 A

  As described above, a semiconductor manufacturer performs product management by displaying product information on the surface of a finished semiconductor product (semiconductor package).

  However, in recent years, the variety of semiconductor products has been diversified, and the manufacturing process of each semiconductor product has also become diversified and complicated. Therefore, when a defect occurs in a semiconductor product, the conventional product management method causes the cause of the defect. It is difficult to investigate quickly.

  For example, in Patent Document 1, a semiconductor chip identification code is assigned to the back surface of a semiconductor package in the form of a bar code, thereby making it possible to follow up the manufacturing conditions of the previous process. However, since this identification code does not include information on the manufacturing conditions of the subsequent process (assembly process), it cannot be used for the follow-up investigation of the cause of the defect that occurred in the subsequent process.

  An object of the present invention is to provide a management method capable of quickly investigating the cause of defects in semiconductor products.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

A manufacturing method of a semiconductor device which is a preferred embodiment of the present invention includes the following steps:
(A) preparing a substrate having a device region having a chip mounting portion and an outer frame portion located around the device region;
(B) After the step (a), a step of assigning a first identification number to the outer frame portion of the base material;
(C) After the step (b), a step of mounting a semiconductor chip on the chip mounting portion of the base material;
(D) After the step (c), the step of sealing the semiconductor chip with a resin so as to expose the outer frame portion and forming a sealing body;
(E) After the step (d), the first identification number is read, and the first in-server information corresponding to the read first identification number among the plurality of in-server information stored in the server is The process of giving to the said sealing body as 2 identification number.

  The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

  According to a preferred aspect of the present invention, the manufacturing conditions of the semiconductor package stored in the computer can be tracked instantaneously by reading the barcode attached to the surface of the semiconductor package, so that countermeasures against defects can be quickly taken. Can be taken.

It is a whole flowchart which shows the manufacturing process of QFP which is Embodiment 1 of this invention. It is a whole top view of the lead frame used for manufacture of QFP. It is a whole top view of the semiconductor wafer used for manufacture of QFP. It is a top view of a lead frame showing an ID marking process. It is a top view of the lead frame which shows another example of ID marking process. It is a top view of a lead frame showing the process of supplying adhesives to the surface of a die pad part. It is a top view of a lead frame showing a die bonding process. It is a top view of the lead frame which shows another example of a die bonding process. It is a partial enlarged plan view of a lead frame showing a wire bonding process. It is a top view of a lead frame showing a molding process. It is a partial enlarged plan view of a lead frame showing a tie bar cutting step. It is a top view of the lead frame which shows a laser marking process. It is a figure which shows the method of marking a two-dimensional barcode on the surface of a mold resin, (a) is a side view seen from the direction parallel to the conveyance direction of a lead frame, (b) is orthogonal to the conveyance direction of a lead frame. It is the side view seen from the direction. It is a top view of the lead frame which shows another example of a laser marking process. It is a partially enlarged plan view of the lead frame after the exterior plating process. It is a top view which shows the sealing body after a lead frame cutting process. It is sectional drawing which shows the completion state of QFP. It is a whole flowchart which shows the manufacturing process of CSP which is Embodiment 2 of this invention. It is a whole top view which shows the surface of the map board used for manufacture of CSP. It is a whole top view which shows the back surface of the map board used for manufacture of CSP. It is a top view of the map board | substrate which shows ID marking process. It is a top view of the map board | substrate which shows a die bonding process. It is a partial enlarged plan view of the map board | substrate which shows a wire bonding process. It is a top view of the map board | substrate which shows a mold process. It is a top view of the map board | substrate which shows a laser marking process. It is a top view of the map board | substrate which shows another example of a laser marking process. It is a partial cross section figure of the map board | substrate which shows a ball | bowl mount process. It is sectional drawing which shows the completion state of CSP.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted. Also, in the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary. Further, in the drawings for explaining the following embodiments, hatching may be given even in a plan view for easy understanding of the configuration.

(Embodiment 1)
The present embodiment is applied to the manufacture of a QFP (Quad Flat Package) which is a kind of semiconductor package, and FIG. 1 is an overall flowchart showing the manufacturing process of the QFP.

  To manufacture QFP, first, as a base material (chip mounting member), a lead frame shown in FIG. 2 and a semiconductor wafer shown in FIG. 3 are prepared.

<Lead frame>
The lead frame LF shown in FIG. 2 is made of copper (Cu) or a copper alloy, and includes a plurality of device regions (regions to be a semiconductor device) and an outer frame portion 8 positioned around the plurality of device regions. Each device area is formed integrally with a chip mounting area (die pad, chip mounting portion) 4 which is a part for mounting a semiconductor chip, a plurality of leads 5 formed around the chip mounting area 4, and a chip mounting area 4. The plurality of suspension leads 6, the leads 5, and the suspension leads 6 are each provided with a tie bar 7 formed integrally with the suspension leads 6. Each of the lead 5, the suspension lead 6, and the tie bar 7 has a structure supported by the outer frame portion 8, and the chip mounting area 4 has a structure supported by the outer frame portion 8 through the suspension lead 6. ing.

  The actual lead frame includes a large number of die pads 4. Here, in order to make the drawing easy to see, a lead frame LF including three device regions is illustrated. That is, since this lead frame LF has a structure in which three semiconductor chips are mounted, three QFPs can be obtained from one lead frame LF.

  In this embodiment, the lead frame LF used is made of copper or a copper alloy. However, a lead frame made of iron (Fe) metal may be used.

<About semiconductor wafers>
Next, the semiconductor wafer 1 </ b> A shown in FIG. 3 is the one after the previous process and the subsequent dicing process are completed, and is divided into a large number of semiconductor chips 1. In the present embodiment, as shown in FIG. 3, a plurality of semiconductor chips 1 are formed in a matrix with reference to notches formed in the peripheral edge of the semiconductor wafer 1A. The pre-process is formed on the main surface of each semiconductor chip 1 and a plurality of processes for forming an integrated circuit by combining photolithography technology, CVD technology, sputtering technology, etching technology, and the like on each semiconductor chip 1 of the semiconductor wafer 1A. In addition, a probe needle is brought into contact with the surface of the bonding pad 2 and an electrical characteristic inspection step is performed for determining whether the elements constituting the integrated circuit are good or bad and the conduction / non-conduction of the wiring connecting the elements.

  In the present embodiment, in the preceding step, each semiconductor chip 1 has a manufacturing lot number of the semiconductor wafer 1A, a semiconductor wafer number, a position of the semiconductor chip 1 in the semiconductor wafer 1A, and whether or not the semiconductor chip 1 is a good product. A chip identification number (ID) including information such as a non-defective product is created, and after receiving the semiconductor wafer 1A in a later process, the chip identification number is stored in the server (wafer map data management server WS) shown in FIG. Storing. Therefore, by referring to the wafer map data management server (WS), it is possible to easily identify in which manufacturing lot each semiconductor chip 1 is manufactured and in which semiconductor wafer 1A.

  Next, the QFP manufacturing method of the present embodiment will be described in the order of steps with reference to the overall flow shown in FIG. 1 and FIGS. 4 to 17.

<ID stamping process>
First, a predetermined number of lead frames LF shown in FIG. 2 are prepared. As shown in FIG. 4, an identification number (ID) for identifying the lead frame LF is provided on the surface (upper surface, main surface) of the outer frame portion 8 located outside the device region in each lead frame LF. Give. The shape of the identification number (ID) in the present embodiment is a two-dimensional barcode (BC1). For example, if the number of prepared lead frames LF is 100, 00, Numbers 01,..., 99 are imprinted in the form of a two-dimensional barcode (BC1).

  The two-dimensional barcode (BC1) is a barcode having information in two vertical and horizontal directions, and has a feature that the amount of information that can be recorded is extremely large compared to a one-dimensional barcode having information only in one direction. Further, since the area can be reduced as compared with the one-dimensional barcode, the outer frame portion 8 can be marked on the surface of the lead frame LF having a narrow width. When the area of the outer frame portion 8 of the lead frame LF is sufficiently large, a one-dimensional barcode may be engraved instead of the two-dimensional barcode (BC1).

  As described above, the identification number of the lead frame LF can be automatically specified by marking the identification number of the lead frame LF in the barcode format on the surface of the lead frame LF.

  A laser beam is used to imprint a two-dimensional barcode (BC1) on the surface of the lead frame LF. Here, as conditions for the laser used in the present embodiment, the power is 160 to 170 W, the pulse generation frequency (Qsw) is 27 to 35 kHz, and the polygon mirror rotational speed is 100 to 120 rpm. In particular, when the lead frame LF is made of copper (Cu) or a copper alloy, it is desirable to use a laser beam (so-called green laser) having a wavelength of about 532 nm or its vicinity. Since the green laser has a higher absorption rate with respect to copper than a laser beam having another wavelength (for example, infrared light having a wavelength of about 1064 nm), the laser output can be easily controlled. Therefore, by using the green laser, the two-dimensional barcode (BC1) can be marked on the surface of the lead frame LF with high accuracy. Further, since the amount of foreign matter generated from the surface of the lead frame LF at the time of marking can be reduced, contamination of the surface of the lead frame LF is reduced.

  When marking the two-dimensional barcode (BC1) on the lead frame LF, as shown in FIG. 5, in order to prevent the two-dimensional barcode (BC1) from being damaged and becoming unreadable in the subsequent manufacturing process, The same two-dimensional barcode (BC1) may be stamped at a plurality of locations on the frame portion 8.

  Next, using the barcode reader (R0) shown in FIG. 1, the two-dimensional barcode (BC1) imprinted on each lead frame LF is read, and the identification number is read to the server (lead frame map data management server LS). Store. Thereby, in the lead frame map data management server (LS), the preparation for recording the conditions of each process performed on the base material corresponding to each identification number is completed.

  Further, the appearance of each lead frame LF is inspected by image recognition using the camera (C0), and the presence / absence of defects (defects or deformation of the leads 5) is checked. If a defect is detected, the identification number of the lead frame LF is associated with the defective portion, and the information is stored in the lead frame map data management server (LS).

<Die bonding process>
Next, the lead frame LF engraved with the two-dimensional barcode (BC1) is conveyed to a die bonder (die bonding apparatus) used in a die bonding process. Then, as shown in FIG. 6, after supplying the adhesive 9 to the surface of each chip mounting area (die pad, chip mounting portion) 4 of the lead frame LF, as shown in FIG. 7, the semiconductor wafer shown in FIG. The semiconductor chips 1 acquired from 1A are picked up one by one and mounted on each die pad 4. That is, the semiconductor chip 1 is mounted on the chip mounting area 4 via the adhesive 9.

  When the semiconductor chip 1 is mounted on each chip mounting area 4 of the lead frame LF, the semiconductor chip 1 and the die pad 4 are aligned using the position recognition camera (C1) shown in FIG. Further, the two-dimensional barcode (BC1) stamped on the lead frame LF is read using the recognition means (barcode reader R1), and the server (lead frame map data management) is performed in the previous process (here, the ID stamping process). Among the plurality of base material information (in-server information) stored in the server LS), information (identification number) corresponding to the lead frame LF recognized by the barcode reader (R1) of the die bonder (die bonding apparatus) is stored in the server. Pull out from inside. Then, it is confirmed whether or not a part of the recognized lead frame LF is defective. As a result, when a part of the lead frame LF to which the identification number is assigned has a defect (for example, a chip mounting region 4 is missing or deformed), as shown in FIG. In this case, the semiconductor chip 1 is not mounted in the chip mounting area 4 in the central portion.

  Further, when the semiconductor chip 1 is mounted on each chip mounting area 4 of the lead frame LF, the identification information of the semiconductor chip 1 stored in the wafer map data management server (WS) is referred to, and the identification information corresponds to the identification information. It is confirmed whether the semiconductor chip 1 to be manufactured is a good product or a defective product. If the semiconductor chip 1 is defective, it is not mounted on the chip mounting area 4.

  Next, the identification number of the lead frame LF obtained from the two-dimensional barcode (BC1) is associated with the identification number of the semiconductor chip 1 mounted on the lead frame LF, and the information (corrected in-server information) ) In the server (main server MS). Further, the relationship between the conditions when the semiconductor chip 1 is mounted on the die pad 4 of the lead frame LF (manufacturing conditions: the model number of the die bonding apparatus used, the type of the adhesive 9, etc.) and the identification number of the lead frame LF And store the information in the main server (MS).

  In this way, the semiconductor chip 1 is mounted on each die pad 4 of each lead frame LF, and the identification number of each lead frame LF is associated with the identification number of the semiconductor chip 1 mounted on each lead frame LF. Is stored in the main server (MS). Further, the condition when the semiconductor chip 1 is mounted on each die pad 4 of each lead frame LF is associated with the identification number of each lead frame LF, and the information is stored in the main server (MS).

  Thereafter, each lead frame LF is accommodated in a single wafer baking furnace, and the adhesive 9 is thermally cured to fix the semiconductor chip 1 on the die pad 4.

<Wire bonding process>
Next, the lead frame LF that has completed the die bonding process is transported to a wire bonder (wire bonding apparatus) used in the wire bonding process. Then, after positioning the lead frame LF on the stage of the wire bonding apparatus using the position recognition camera (C2) shown in FIG. 1, it is shown in FIG. 9 (a plan view showing an enlarged part of the lead frame LF). Thus, the bonding pad 2 and the lead 5 of the semiconductor chip 1 are electrically connected by the conductive member 3. The conductive member in the present embodiment is a wire made of gold (Au).

  Next, using the recognition means (barcode reader R2), the two-dimensional barcode (BC1) stamped on the lead frame LF is read and stored in the server (lead frame map data management server LS) in the previous step. Among the plurality of base material information (in-server information), information (identification number) corresponding to the lead frame LF recognized by the bar code reader (R2) of the wire bonder (wire bonding apparatus) is extracted from the server. Then, it is confirmed whether or not a part of the recognized lead frame LF is defective. As a result, if there is a defect in a part of the lead frame LF to which the identification number is assigned, the wire 3 is not bonded to the defective part.

  Next, the wire 3 bonding conditions (manufacturing conditions: model number of wire bonding apparatus used, wire 3 diameter, etc.) are associated with the identification number of the lead frame LF obtained from the two-dimensional barcode (BC1). The information (corrected in-server information) is stored in the server (main server MS).

  In this way, the bonding pads 2 of the semiconductor chip 1 mounted on each lead frame LF and the leads 5 are electrically connected by the wires 3, and the bonding conditions of the wires 3 are associated with the identification numbers of the lead frames LF. And store the information in the server (main server MS).

  Thereafter, an appearance inspection of each lead frame LF is performed to check whether the wire 3 is disconnected or short-circuited. If a defect is detected, the identification number of the lead frame LF obtained from the two-dimensional barcode (BC1) and the defective portion are associated with each other and stored in the lead frame map data management server (LS).

<Molding process>
Next, the lead frame LF that has completed the wire bonding step (or appearance inspection step) is conveyed into a molding apparatus (mold) used in the molding step (resin sealing step). Then, the lead frame LF is placed in a mold (not shown) of the molding apparatus, and if necessary, a two-dimensional bar stamped on the lead frame LF using a recognition means (bar code reader R3) of the molding apparatus. The code (BC1) was read and recognized by the barcode reader (R3) of the molding apparatus among the plurality of base material information (in-server information) stored in the server (lead frame map data management server LS) in the previous step. Information (identification number) corresponding to the lead frame LF is extracted from the server. Then, as shown in FIG. 10, the semiconductor chip 1, the wire 3, the chip mounting area (die pad) 4, each part of the lead 5 (inner lead) and each part of the suspension lead 6 are sealed with resin (mold resin). The sealing body (resin sealing body) 10 is formed. At this time, the device region (semiconductor chip 1 mounted in the device region) is placed so that the identification number (ID, two-dimensional barcode BC1) formed on the outer frame 8 is exposed to the outside of the sealing body 10. Seal with resin. Also, the resin filling property and the like are monitored using the camera (C3) shown in FIG.

  Next, after reading the two-dimensional barcode (BC1) engraved on the lead frame LF using the barcode reader (R3), the molding conditions (manufacturing conditions: the model number of the molding apparatus used, the sealing body 10 Type) and the identification number of the lead frame LF obtained from the two-dimensional barcode (BC1), and the information (corrected in-server information) is stored in the server (main server MS).

  In this way, each lead frame LF is mounted on the mold of the molding apparatus, and each of the semiconductor chip 1, the wire 3, the chip mounting area (die pad) 4, each part of the lead 5 (inner lead) and each of the suspension leads 6. A part is sealed with resin. Further, the mold condition is associated with the identification number of each lead frame LF, and the information is stored in the main server (MS).

<Tie bar cutting process>
Next, as shown in FIG. 11, the tie bar 7 of the lead frame LF exposed to the outside of the sealing body 10 is cut, and each lead (outer lead) 5 is electrically separated. The tie bar 7 is used to prevent the resin from leaking outside from the region where the sealing body 10 is formed in the previous resin sealing step. In this step, the cutting status is monitored using the camera (C4) shown in FIG.

  Next, after the two-dimensional barcode (BC1) engraved on the lead frame LF is read using the recognition means (barcode reader R4), the cutting conditions of the tie bar 7 (manufacturing conditions: the model number of the cutting device used, etc.) ) And the identification number of the lead frame LF obtained from the two-dimensional barcode (BC1), and the information (corrected in-server information) is stored in the server (main server MS).

  In this manner, the tie bar 7 of each lead frame LF is cut, the cutting condition of the tie bar 7 is associated with the identification number of each lead frame LF, and the information is stored in the main server (MS).

  Thereafter, each lead frame LF is accommodated in a single wafer baking furnace, and the resin constituting the sealing body 10 is completely cured.

<Laser marking process>
Next, the lead frame LF that has been subjected to the molding process (or baking process) is transferred to an apparatus that is used in the laser marking process, and as shown in FIG. 12, each sealing body 10 formed on the lead frame LF A two-dimensional barcode (BC2) is imprinted on the surface.

  In the process of forming the two-dimensional barcode (BC2), first, the recognition means (barcode reader R5) of the laser marking device is used to mark the outer side (outer frame portion 8) of the device region of the base material (lead frame LF). Read the two-dimensional barcode (BC1). Then, among the plurality of base material information (in-server information) stored in the server (lead frame map data management server LS) in the previous step, the lead frame LF recognized by the barcode reader (R5) of the laser marking device is used. Corresponding information (in-server information, chip position information, wafer production lot number, semiconductor wafer number, assembly lot number, product type name, etc.) is extracted from the server. Next, the extracted information is formed as a new identification number (two-dimensional barcode BC2) on the surface side of the sealing body 10.

  The information stored in the two-dimensional barcode (BC2) formed on the surface of the sealing body 10 can be given to the two-dimensional barcode by selectively calling information managed by the server. The information is not limited to the above. Therefore, the information stored in the two-dimensional barcode (BC2) may be the same information as the two-dimensional barcode (BC1) stamped on the outer frame portion 8 of the lead frame LF. In this case, after recognizing with the barcode reader, the information of the corresponding base material (lead frame LF) is collated from the plurality of base material information stored in the lead frame map data management server (LS). Each information described above can be extracted. In the present embodiment, the laser conditions used in the laser marking process are the same as those used in the ID marking process, but are not limited thereto.

  13A and 13B are diagrams illustrating a method of marking a two-dimensional bar code (BC2), where FIG. 13A is a side view seen from a direction parallel to the lead frame LF transport direction, and FIG. 13B is a lead frame LF transport direction. It is the side view seen from the direction orthogonal to Moreover, the code | symbol 11 in a figure is a guide rail of a laser marking apparatus, and 12 is a conveyance nail | claw.

  In order to engrave the two-dimensional bar code (BC2) on the surface of the sealing body 10 formed on the lead frame LF, first, the outer frame portion 8 of the lead frame LF was engraved using the bar code reader (R5). The two-dimensional bar code (BC1) is read and the identification number of the lead frame LF is specified. As shown in FIG. 13, when the lead frame LF is held by the guide rail 11 and transported, only the lower surface of the lead frame LF is held, so the barcode reader (R5) is disposed above the lead frame LF. By doing so, the two-dimensional barcode (BC1) can be easily read. Further, when reading the two-dimensional barcode (BC1) using the barcode reader (R5), it is preferable to stop the guide rail 11 or to convey (move) the lead frame LF at a slow (slow) speed. .

  Next, the surface of each sealing body 10 is sequentially irradiated with a laser beam LB, and a two-dimensional barcode (BC2) corresponding to the identification number of the lead frame LF is marked. Although illustration is omitted, in the present embodiment, when the two-dimensional barcode (BC2) is engraved on the surface of the sealing body 10, product information (product model name, customer logo mark, manufacturing code, etc.) is also marked. Also engraved together. Thereby, since the marking process can be completed once, the manufacturing process can be simplified.

  Further, when imprinting the two-dimensional barcode (BC2) and the mark, the lead frame map data management server (LS) is referred to and whether or not a defect has occurred in a part of the lead frame LF in the steps so far. Confirm. If a defect has occurred in a part of the lead frame LF, as shown in FIG. 14, a two-dimensional bar is formed on the surface of the sealing body 10 at the defective portion (in this example, the central portion). The code (BC2) and the mark are not stamped. In the present embodiment, the example in which the two-dimensional barcode (BC2) is formed on the front surface side of the sealing body 10 has been described, but it may be formed on the back surface side of the sealing body 10.

  Next, the camera (C5) is used to check whether the two-dimensional barcode (BC2) and the mark are securely engraved, and the result is stored in the main server (MS) in association with the identification number of the lead frame LF. To do.

<Exterior plating process>
Next, the two-dimensional barcode (BC2) and the lead frame LF on which the marking of the mark has been completed are immersed in an electrolytic plating bath, and a so-called lead-free solder is formed on the surface of the lead frame LF exposed to the outside of the sealing body 10. A plating layer (plating film) made of a lead (Pb) content of 1000 ppm (0.1 wt% or less in the RoHS directive) is formed. Note that the material of the lead-free solder in this embodiment is tin (Sn) or an alloy containing tin (Sn) as a main component, and more specifically, a tin (Sn) -bismuth (Bi) alloy.

  Here, when this exterior plating process is performed, a plating layer is also formed on the surface of the two-dimensional barcode (BC1) engraved on the outer frame portion 8 of the lead frame LF. Therefore, as shown in FIG. A plating layer is deposited in the groove of the two-dimensional barcode (BC1) stamped on the outer frame portion 8 of the frame LF. This makes it difficult to recognize the two-dimensional barcode (BC1) formed on the outer frame portion 8 with a barcode reader.

  However, in the present embodiment, prior to the exterior plating process, based on the two-dimensional barcode (BC1) stamped on the outer frame 8 and information stored in the lead frame map data management server (LS), Since the two-dimensional barcode (BC2) is engraved on the surface of the sealing body 10, the above problems can be avoided.

  Further, when the two-dimensional barcode (BC2) is formed by, for example, the ink mark method, the formed information (two-dimensional barcode) may be deformed (dissolved) by the plating solution used in the exterior plating process. is there. However, in this embodiment, since the two-dimensional barcode (BC2) is formed by engraving, even if the exterior plating process is performed after the two-dimensional barcode (BC2) is formed, the two-dimensional barcode ( BC2) is not deformed by the plating solution.

<Lead frame cutting process>
Next, the lead frame LF for which the exterior plating has been completed is conveyed to a lead frame cutting step. Then, as shown in FIG. 16, unnecessary portions (tie bar 7 and outer frame portion 8) of lead frame LF exposed to the outside of sealing body 10 are cut and removed. Subsequently, as shown in FIG. 17, the QFP is completed by forming the leads 5 (outer leads) exposed outside the sealing body 10 into a gull wing shape.

  Next, the two-dimensional barcode (BC2) of each QFP is read using the barcode reader (R6) shown in FIG. Then, the QFP in which the two-dimensional barcode (BC2) is not engraved on the surface of the sealing body 10 is removed as a defective product, and only the QFP determined to be good is picked up and stored in the tray.

<Test process>
Next, the good QFP stored in the tray is transported to the test process, and a burn-in test and an electrical property test are performed. In the burn-in test process, the QFP is mounted on the burn-in socket using the camera (C6) shown in FIG. 1, and in the electrical characteristic test process, the QFP is mounted on the test socket using the camera (C7).

  Next, the barcode reader (R7) is used to read the two-dimensional barcode (BC2) of each QFP. Then, the test result is associated with the identification number of each QFP, and the information is stored in the main server (MS).

<Final appearance inspection process>
Next, the QFP determined as a non-defective product in the test process is transported to the final appearance inspection process. Here, the appearance of the QFP is inspected by image recognition using the camera (C8) shown in FIG. 1, and the presence or absence of a defect or deformation of the lead 5 (outer lead) is examined.

  Next, the two-dimensional barcode (BC2) of each QFP is read using a barcode reader (R8). Then, the inspection result is associated with the identification number of each QFP, and the information is stored in the main server (MS).

  The QFP manufactured through the above steps is shipped from the manufacturer to the customer, and is used by being mounted on a predetermined wiring board. Note that the shipment status from the manufacturer to the customer is managed in association with the two-dimensional barcode (BC2).

  Further, in the present embodiment, an identification number (ID, two-dimensional barcode) is engraved on the outer frame portion 8 of the base material (lead frame LF), and this identification number is read in the molding process to obtain lead frame map data. Among a plurality of pieces of information (in-server information) stored in the management server (LS), information (in-server information) corresponding to the read base material identification number (first identification number) is replaced with a new identification number ( ID (two-dimensional barcode) is encrypted, and the encrypted identification number (second identification number) is given (formed) to the sealing body 10.

  Therefore, after shipping the completed semiconductor device (QFP), if a defect occurs in the QFP at the customer site, the manufacturer can use a two-dimensional barcode stamped on the QFP sealing body 10 where the defect has occurred. The identification number of the QFP is specified by reading (BC2) with a barcode reader.

  In the manufacturer's main server (MS), the pre-process information such as from which semiconductor wafer of which manufacturing lot the semiconductor chip sealed in the QFP is obtained and in which position of the semiconductor wafer is associated with the identification number of the QFP. Stored. In addition, in the aforementioned die bonding process, wire bonding process, molding process, tie bar cutting process, laser marking process, exterior plating process, lead frame cutting process, etc. Post-process information such as corresponding operator information and used materials is also stored in association with the identification number of the QFP.

  Therefore, by reading the two-dimensional barcode (BC2) of the QFP and specifying the identification number of the QFP, the manufacturing conditions of the QFP stored in the main server (MS) can be tracked instantaneously. As a result, the cause of the defect in QFP can be quickly determined, and the countermeasure for the defect can be taken quickly by feeding back the cause of the defect to the manufacturing process.

  In addition, the above-described manufacturing method can be applied not only to countermeasures for defects in QFP shipped to customers, but also to countermeasures for defects that occur during the manufacturing process. That is, when a defect is found during the QFP manufacturing process, the two-dimensional barcode (BC1) stamped on the lead frame LF or the two-dimensional barcode (BC2) stamped on the sealing body 10 is read. Thus, the manufacturing conditions in the preceding process of the semi-finished product to which the identification number is assigned can be tracked instantaneously, and the cause of the defect can be investigated quickly during the manufacturing process.

  In the present embodiment, the QFP is exemplified as the semiconductor package assembled using the lead frame. However, it is needless to say that the semiconductor package can be applied to other semiconductor packages using the lead frame, such as QFN and TSSOP.

(Embodiment 2)
This embodiment is applied to the manufacture of a CSP (Chip Size Package) which is a kind of semiconductor package, and FIG. 18 is an overall flowchart showing the manufacturing process of the CSP. The description of the same contents (configuration, conditions, effects, etc.) as those of the first embodiment will be omitted.

  To manufacture a CSP, first, as a base material (chip mounting member), a wiring board (map board) 20 having a plurality of device regions formed as shown in FIGS. 19 and 20 and a semiconductor wafer are prepared. . 19 is an overall plan view showing the surface (upper surface, main surface) of the map substrate 20, and FIG. 20 is an overall plan view showing the back surface (lower surface, mounting surface) of the map substrate 20.

<About the map board>
The map board 20 is a large-sized wiring board that becomes a base of a CSP wiring board 25 described later, and a plurality of map boards 20 are diced along a dicing line L indicated by a one-dot chain line in FIG. In this structure, the individual wiring boards 25 are obtained. The map substrate 20 is divided into six blocks along the dicing line L in the long side direction and is divided into three blocks in the short side direction. Each block is an area that becomes one wiring board 25 when the map board 20 is diced. Therefore, 3 × 6 = 18 CSPs can be acquired from the map board 20.

  A number of conductor patterns made of copper (Cu) are formed in each block of the map substrate 20. 19 shows a land (electrode pad, bonding lead) 21 among these conductor patterns, and FIG. 20 shows an electrode (electrode pad, bump land) 22. Although illustration is omitted, a wiring electrically connected to the land 21 is formed on the surface of the map substrate 20. In addition, these wirings are electrically connected to the electrodes 22 on the back surface of the map substrate 20 through conductive members (via wirings) formed in via holes that penetrate the map substrate 20. Further, the surface of the map substrate 20 is covered with an insulating film (solder resist) except for the region where the land 21 is formed, and the back surface of the map substrate 20 is excluded except for the region where the electrode 22 is formed. It is covered with an insulating film (solder resist). On the surface of the land 21 and the surface of the electrode 22, for example, a plating layer in which a gold (Au) layer is stacked on a nickel (Ni) layer is formed.

<About semiconductor wafers>
The semiconductor wafer used for manufacturing the CSP is not particularly limited, but is, for example, the semiconductor wafer 1A (see FIG. 3) used in the first embodiment. As described above, the semiconductor wafer 1 </ b> A is divided into a large number of semiconductor chips 1. Each semiconductor chip 1 includes a manufacturing lot number of the semiconductor wafer 1A, a wafer number, a position of the semiconductor chip 1 in the semiconductor wafer 1A, and a chip identification number including information such as whether the semiconductor chip 1 is a good product or a defective product. (ID) is assigned, and this chip identification number is managed by a server (wafer map data management server WS).

  Next, the manufacturing method of the CSP of this embodiment will be described in the order of steps with reference to the overall flow shown in FIG. 18 and FIGS. 21 to 28.

<ID stamping process>
First, a predetermined number of map substrates 20 shown in FIGS. 19 and 20 are prepared. Then, as shown in FIG. 21, a two-dimensional barcode (BC3) corresponding to the identification number (ID) of the map substrate 20 is imprinted on the surface (upper surface, main surface) of the outer frame portion 8 of each map substrate 20. . As shown in FIGS. 19 to 26, the outer frame portion 8 of the map substrate 20 is an area outside the 18 blocks described above, and is outside the device area (area where the sealing body 23 is formed) described later. Is located.

  In order to imprint a two-dimensional barcode (BC3) on the surface (upper surface, main surface) of the map substrate 20, a laser beam (for example, infrared light having a wavelength of about 1064 nm) is used. Further, instead of engraving with a laser beam, for example, a seal printed with a two-dimensional barcode (BC3) may be attached to the surface of the outer frame portion 8. Furthermore, the same two-dimensional barcode (BC3) may be engraved at a plurality of locations on the outer frame portion 8. When the area of the outer frame portion 8 is sufficiently large, the primary frame is replaced with the two-dimensional barcode (BC3). The original barcode may be engraved.

  As described above, the identification number of the map substrate 20 can be automatically specified by imprinting the identification number of the map substrate 20 in the barcode format on the surface of the map substrate 20.

  Next, using the barcode reader (R0) shown in FIG. 18, the two-dimensional barcode (BC3) imprinted on each map board 20 is read, and the identification number is stored in the map board data management server (BS). . Thereby, in the map board data management server (BS), the preparation for recording the conditions of each process performed on the base material corresponding to each identification number is completed.

  Further, the appearance of each map board 20 is inspected by image recognition using the camera (C0) to check for defects. When a defect is detected, the identification number of the map board 20 is associated with the defective block, and the information is stored in the map board data management server (BS).

  Thereafter, the surface of each map substrate 20 is subjected to plasma cleaning or chemical cleaning to clean the surfaces of the lands 21 and the surfaces of the electrodes 22. As described above, this is because an insulating film (solder resist) is formed on the surface of the map substrate 20, and is insulated by the influence of heat generated by irradiating the base material (map substrate 20) with a laser beam. This is because contaminants (outgas) are generated from the film. Therefore, in this embodiment, after performing the ID marking process, a process for cleaning the substrate is performed before the die bonding process.

<Die bonding process>
Next, the map substrate 20 engraved with the two-dimensional barcode (BC3) is transported to an apparatus (die bonding apparatus) used in a die bonding process. Then, after supplying an adhesive (not shown) for each block to the surface of the map substrate 20, as shown in FIG. 22, the semiconductor chips 1 obtained from the semiconductor wafer 1A shown in FIG. 3 are picked up one by one. Mounted on each block (chip mounting area).

  When the semiconductor chip 1 is mounted on each block (chip mounting region) of the map substrate 20, the position of the semiconductor chip 1 and the block is aligned using the position recognition camera (C1) shown in FIG. Further, the two-dimensional barcode (BC3) imprinted on the map board 20 is read using the bar code reader (R1), and stored in the server (map board data management server BS) in the previous process (ID marking process). Among the plurality of base material information (in-server information), an identification number corresponding to the map substrate 20 recognized by the barcode reader (R1) of the die bonding apparatus is extracted from the server. Then, it is confirmed whether or not a part of the recognized map substrate 20 is defective. As a result, when a part of the map substrate 20 corresponding to the identification number has a defect, the semiconductor chip 1 is not mounted on the defective block.

  When the semiconductor chip 1 is mounted on each block of the map substrate 20, the semiconductor chip 1 corresponding to the identification number is referred to by referring to the identification number of the semiconductor chip 1 stored in the wafer map data management server (WS). Check whether 1 is a good product or a defective product. If the semiconductor chip 1 is a defective product, it is not mounted on the map substrate 20.

  Next, the identification number of the map substrate 20 obtained from the two-dimensional barcode (BC3) is associated with the identification number of the semiconductor chip 1 mounted on the map substrate 20, and the information is stored in the server (main server). MS). Further, the conditions when the semiconductor chip 1 is mounted on the map substrate 20 (the model number of the die bonding apparatus used, the type of adhesive, etc.) are associated with the identification number of the map substrate 20, and the information is stored as main information. Store in the server (MS).

  In this way, the semiconductor chip 1 is mounted on each block of each map substrate 20 and the identification number of each map substrate 20 is associated with the identification number of the semiconductor chip 1 mounted on each map substrate 20. Information is stored in the main server (MS). Further, the condition when the semiconductor chip 1 is mounted on each block of each map substrate 20 is associated with the identification number of each map substrate 20, and the information is stored in the main server (MS).

<Wire bonding process>
Next, the map substrate 20 in which the die bonding process is completed is transported to an apparatus (wire bonding apparatus) used in the wire bonding process. And after positioning the map board | substrate 20 on the stage of a wire bonding apparatus using the camera (C2) for position recognition shown in FIG. 18, it shows in FIG. 23 (plan view which expands and shows a part of map board | substrate 20). As described above, the bonding pads 2 of the semiconductor chip 1 and the lands 21 of the map substrate 20 are electrically connected by the conductive member 3. The conductive member 3 used in the present embodiment is a wire made of gold (Au), as in the first embodiment.

  Next, using the barcode reader (R2), the two-dimensional barcode (BC3) imprinted on the map board 20 is read and stored in the map board data management server BS in the previous process (ID marking process). Of the plurality of base material information (in-server information), an identification number corresponding to the map substrate 20 recognized by the barcode reader (R2) is extracted from the server. Then, it is confirmed whether or not a part of the recognized map substrate 20 is defective. As a result, when there is a defect in a part of the map substrate 20 corresponding to the identification number, the wire 3 is not bonded to the land 21 of the defective block.

  Next, the bonding conditions of the wire 3 (the model number of the wire bonding apparatus used, the diameter of the wire 3 etc.) are associated with the identification number of the map substrate 20 obtained from the two-dimensional barcode (BC3). Information is stored in the main server (MS).

  In this manner, the bonding pads 2 of the semiconductor chip 1 mounted on each map substrate 20 and the lands 21 are electrically connected by the wires 3, and the bonding conditions of the wires 3 and the identification numbers of the map substrates 20 are The association is performed and the information is stored in the main server (MS).

  Then, the appearance inspection of each map board | substrate 20 is performed, and the presence or absence of the disconnection of a wire 3 or a short circuit is investigated. When a defect is detected, the identification number of the map board 20 obtained from the two-dimensional barcode (BC3) is associated with the defective block and stored in the map board data management server (BS). .

<Molding process>
Next, the surface of the map substrate 20 on which the wire bonding step (or appearance inspection step) has been completed is plasma-cleaned and then transferred to an apparatus used in the molding step. Then, the map substrate 20 is placed in a mold (not shown) of the molding apparatus, and if necessary, a two-dimensional bar stamped on the map substrate 20 using the recognition means (barcode reader R3) of the molding apparatus. A map read by the code (BC3) and recognized by the barcode reader (R3) of the molding apparatus among the plurality of base material information (in-server information) stored in the server (map board data management server BS) in the previous step. An identification number corresponding to the substrate 20 is extracted from the server.

  Then, as shown in FIG. 24, the semiconductor chip 1, the wires 3, and the lands 21 are sealed with a mold resin to form a sealing body (resin sealing body) 23. At this time, the device region (semiconductor chip 1 mounted in the device region) is made of resin so that the identification number (two-dimensional barcode BC3) formed on the outer frame portion 8 is exposed to the outside of the sealing body 23. Seal. Also, the resin filling property and the like are monitored using the camera (C3) shown in FIG. In this molding step, the semiconductor chip 1, the wires 3 and the lands 21 are not sealed for each block, but all the blocks are collectively sealed with resin. Therefore, the entire surface of the map substrate 20 except the outer frame portion 8 is covered with the sealing body 23.

  Next, after reading the two-dimensional barcode (BC3) engraved on the outer frame portion 8 of the map substrate 20 using the barcode reader (R3), the molding conditions (model number of the molding apparatus used, sealing body) 23) and the identification number of the map board 20 obtained from the two-dimensional barcode (BC3), and the information is stored in the main server (MS).

  In this way, each map substrate 20 is mounted on the mold of the molding apparatus, and the semiconductor chip 1, the wires 3, and the lands 21 are sealed with resin. In addition, the mold condition is associated with the identification number of each map substrate 20, and the information is stored in the main server (MS).

<Laser marking process>
Next, after the map substrate 20 is accommodated in a single wafer baking furnace and the sealing body 23 is completely cured, it is transported to an apparatus used in the laser marking process, and as shown in FIG. A two-dimensional barcode (BC4) is imprinted on the surface for each block.

  In the process of forming the two-dimensional barcode (BC4), first, the two-dimensional barcode (BC3) imprinted on the outer frame portion 8 of the map substrate 20 is read using the barcode reader (R4) of the laser marking device. Of the plurality of base material information (in-server information) stored in the map board data management server (BS) in the previous step, information corresponding to the map board 20 recognized by the barcode reader (R4) (inside the server) Information, chip position information, wafer production lot number, semiconductor wafer number, assembly lot number, product type name, etc.) are extracted from the server. Next, this extracted information is formed as a new identification number (two-dimensional barcode BC4) on the surface side of the sealing body 23. Further, when a two-dimensional barcode (BC4) is engraved on the surface of the sealing body 23, a mark (not shown) of product information (product type name, customer logo mark, manufacturing code, etc.) is also engraved. .

  The information stored in the two-dimensional barcode (BC4) formed on the surface of the sealing body 23 can be selectively called by the information managed by the server and given to the two-dimensional barcode. The information is not limited to the above. Therefore, the information stored in the two-dimensional barcode (BC4) may be the same information as the two-dimensional barcode (BC3) stamped on the outer frame portion 8 of the map substrate 20. In this case, after recognizing with a barcode reader, each information mentioned above is collated by collating the information of the applicable map board | substrate 20 out of the some base material information stored in the map board data management server (BS). Can be pulled out. In the present embodiment, the laser conditions used in the laser marking process are the same as those used in the ID marking process, but are not limited thereto. Further, the method for forming the two-dimensional barcode (BC4) is not limited to the laser beam. For example, a seal printed with a two-dimensional barcode (BC4) may be attached to the surface of the sealing body 23.

  When imprinting the two-dimensional barcode (BC4) and the mark, the map board data management server (BS) is referred to and it is confirmed whether or not a defect has occurred in a part of the map board 20 through the steps so far. . When a defect has occurred in a part of the map substrate 20, as shown in FIG. 26, the two-dimensional barcode (BC4) and the mark are not imprinted on the defective block.

  Next, using the camera (C4), it is confirmed for each block whether or not the two-dimensional barcode (BC4) and the mark are surely engraved, and the result is associated with the identification number of the map board 20 and the main server (MS ).

<Ball mounting process>
Next, the two-dimensional barcode (BC4) and the map substrate 20 on which the marking of the mark has been completed are transported to the ball mounting process. Then, as shown in FIG. 27, solder bumps (ball electrodes) 24 constituting external connection terminals of the CSP are connected to the electrodes 22 on the back surface of the map substrate 20. At that time, the connection state between the electrode 22 and the solder bump 24 is confirmed using the camera (C5) shown in FIG. 18, and the result is stored in the main server (MS) in association with the identification number of the map board 20.

<Dicing process>
Next, the map substrate 20 in which the connection of the solder bumps 24 is completed is conveyed to a dicing process, and the map substrate 20 is diced along the dicing line L in FIG. When dicing the map substrate 20, the camera (C6) shown in FIG. 18 is used to align the dicing blade with the map substrate 20. As a result, as shown in FIG. 28, the semiconductor chip 1 mounted on the upper surface of the wiring board 25 is sealed by the sealing body 23, and the CSP in which the solder bumps 24 are connected to the back surface of the wiring board 25 is completed.

  Next, the two-dimensional barcode (BC4) of each CSP is read using the barcode reader (R5) shown in FIG. Then, the CSP in which the two-dimensional barcode (BC4) is not engraved on the surface of the sealing body 23 is removed as a defective product, and only the CSP determined to be good is picked up and stored in the tray.

<Test process>
Next, the non-defective CSP stored in the tray is transported to the test process, and after the CSP is mounted on the socket using the camera (C7) shown in FIG. 18, a burn-in test and an electrical characteristic test are performed. Subsequently, the two-dimensional barcode (BC4) of each CSP is read using a barcode reader (R6). Then, the test result is associated with the identification number of each CSP, and the information is stored in the main server (MS).

<Final appearance inspection process>
Next, the CSP determined as a non-defective product in the test process is transported to the final appearance inspection process. Here, after checking the connection state of the solder bumps 24 by image recognition using the camera (C8) shown in FIG. 18, the two-dimensional barcode (BC4) of each CSP is read using the barcode reader (R7). Then, the inspection result is associated with the identification number of each CSP, and the information is stored in the main server (MS).

  The CSP manufactured through the above steps is shipped from the manufacturer to the customer, mounted on a predetermined wiring board, and used. The shipment status from the manufacturer to the customer is managed in association with the two-dimensional barcode (BC4).

  In the present embodiment, an identification number (ID, two-dimensional barcode) is imprinted on the outer frame portion 8 of the map substrate 20, and this identification number is read in the molding process to obtain a map substrate data management server (BS). Among the plurality of information (information in the server) stored in the server, information (information in the server) corresponding to the read base material identification number (first identification number) is replaced with a new identification number (ID, two-dimensional bar). And the encrypted identification number (second identification number) is given (formed) to the sealing body 23.

  Accordingly, after a completed semiconductor device (CSP) is shipped, if a defect occurs in the CSP at the customer site, the manufacturer can obtain a two-dimensional barcode (BC4) stamped on the sealing body 23 of the CSP in which the defect has occurred. ) Is read by a bar code reader to identify the identification number of the CSP.

  In the manufacturer's main server (MS), the pre-process information such as which semiconductor wafer of the manufacturing lot the semiconductor chip sealed in the CSP is acquired and in which position is associated with the identification number of the CSP. Stored. Also, post-process information such as the conditions under which the CSP is manufactured in the die bonding process, wire bonding process, molding process, laser marking process, ball mounting process, dicing process, etc. described above is also associated with the identification number of the CSP. Stored.

  Therefore, by reading the two-dimensional barcode (BC4) of the CSP and specifying the identification number of the CSP, the manufacturing conditions of the CSP stored in the main server (MS) can be tracked instantaneously. As a result, the cause of the CSP failure can be investigated quickly, and therefore the failure countermeasure can be taken quickly by feeding back the cause of the failure to the manufacturing process.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the first and second embodiments, the example in which the semiconductor chip is mounted on the chip mounting region of the base material by the wire bonding method has been described. However, the chip mounting region of the base material by the flip chip method using the bump electrode as the conductive member. A semiconductor chip can also be mounted on.

  Moreover, in the said embodiment, although the lead frame and the large sized wiring board (map board | substrate) were illustrated as a base material (chip mounting member), a TAB tape and a flexible wiring board can also be used as a base material.

  Further, in the first and second embodiments, the example in which the identification number (ID) is engraved on the base material and the sealing body using the laser is illustrated, but the shape corresponding to the identification number (ID) (two-dimensional barcode) ) May be used for engraving using a mold having an end face or a method for attaching a seal printed with an identification number (ID). However, since the shape of the identification number (ID) is different for each base material, in the forming method using a mold, it is necessary to prepare a mold corresponding to each base material (lead frame, wiring board). Moreover, in the case of the method of sticking a seal | sticker, since a process with which heat is applied with respect to a base material is also included in a post process, there exists a possibility that a seal | sticker may peel. Therefore, as a method for forming an identification number (ID), it is preferable to use a laser as in the above embodiment.

  Further, in the first and second embodiments, the example in which the identification number (ID, two-dimensional barcode) is imprinted on the base material and the sealing body using the laser is exemplified, but only specific UV light (ultraviolet light) is emitted. In this way, printing may be performed with a special light-emitting ink that emits light only when irradiated with a filtered electroluminescent material (black light). This is an effective means for imprinting a two-dimensional barcode having information that you do not want to make public inadvertently for security reasons. However, as described above, in the first embodiment, since the plating process is performed after the laser marking process, the printed special light-emitting ink may be dissolved in the plating solution. Therefore, the identification number (ID, two-dimensional barcode) ) Is preferably formed using a laser.

  In the first and second embodiments, the semiconductor chip 1 is mounted after the adhesive is supplied to the surface of the chip mounting area. However, a film is previously formed on the back surface of the semiconductor chip 1 (semiconductor wafer 1A). A shaped adhesive layer may be formed, and the semiconductor chip 1 may be mounted on the chip mounting region via the adhesive layer.

  In the first and second embodiments, the example of die bonding after referring to the identification information of the semiconductor chip 1 stored in the wafer map data management server (WS) in the die bonding process is described. Means may be used. For example, as another means for determining whether the semiconductor chip 1 is a non-defective product or a defective product, first, a defective mark is formed on a defective product among the plurality of semiconductor chips 1 formed on the semiconductor wafer 1A. Next, in the die bonding process, when the defect mark is image-recognized using the camera (C1) provided in the die bonding apparatus, the defective product is skipped and only the good semiconductor chip is mounted in the chip mounting area. To do. In this die bonding step, the position information of the semiconductor chip 1 in the semiconductor wafer 1A, the non-defective / defective product information, the wafer manufacturing lot number, the chip identification number (ID) is generated in association with the semiconductor wafer number, and the wafer map Store in the data management server (WS). Further, information that associates the chip identification number (ID) with the identification number of the base material (lead frame, wiring board) is also stored in the main server (MS). Thereby, even after the semiconductor device is completed, the identification number formed on the surface of the sealing body, or the identification number and the information stored in the main server (MS) are referred to for sealing. It is possible to easily specify in which manufacturing lot the semiconductor chip 1 disposed in the body is manufactured and in which position of which semiconductor wafer.

  Moreover, in the said embodiment, although it demonstrated that each information in a manufacturing process could be read with reference to the identification number (ID, two-dimensional barcode) formed in the sealing body, this identification number is an index. It may be used as a mark. In addition, when using an identification number as an index mark, the process for forming an index mark separately from this identification number can be omitted.

  The present invention can be applied to the management of defects occurring in the manufacturing process of semiconductor products.

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1A Semiconductor wafer 2 Bonding pad 3 Conductive member (wire)
4 Chip mounting area (die pad)
5 Lead 6 Hanging lead 7 Tie bar 8 Outer frame (outer frame)
9 Adhesive 10 Sealing body (resin sealing body)
11 Guide rail 12 Transport claw 20 Wiring board (map board)
21 land (electrode pad, bonding lead)
22 electrodes (electrode pads, bump lands)
23 Sealed body (resin sealed body)
24 Solder bump (ball electrode)
25 Wiring boards BC1 to BC4 Two-dimensional barcode C0 to C8 Camera R0 to R8 Barcode reader LF Lead frame

Claims (9)

A semiconductor device manufacturing method including the following steps:
(A) a step of preparing a lead frame made of a metal member, comprising: a device region having a chip mounting portion; and an outer frame portion positioned around the device region in plan view;
(B) After the step (a), a step of imprinting a first identification number on the outer frame portion of the lead frame and storing the first identification number in the server as information in the first server;
(C) After the step (b), a step of transporting the lead frame to the first device;
(D) After the step (c), the first identification number engraved on the outer frame portion of the lead frame is read using a recognition unit of the first device, and a plurality of items stored in the server are read. Extracting the first in-server information corresponding to the recognized first identification number among the in-server information;
(E) After the step (d), mounting a semiconductor chip on the chip mounting portion of the lead frame and updating the information in the first server;
(F) After the step (e), a step of transporting the lead frame to a second device;
(G) After the step (f), the first identification number stamped on the outer frame portion of the lead frame is read using the recognition unit of the second device, and the plurality of the plurality of numbers stored in the server Extracting the first in-server information corresponding to the recognized first identification number and updated in the step (e) among the in-server information
(H) After the step (g), the step of sealing the semiconductor chip with resin so that the first identification number stamped on the outer frame portion is exposed, and updating the information in the first server,
(I) After the step (h), a step of transporting the lead frame to a third device;
(J) After the step (i), the first identification number stamped on the outer frame portion of the lead frame is read using a recognition unit of the third device, and the plurality of the plurality of numbers stored in the server Extracting the first in-server information corresponding to the recognized first identification number and updated in the step (h) among the in-server information
(K) After the step (j), the step of applying the first server information extracted in the step (j) as a second identification number to the surface of the sealing body formed in the step (h) ,
(L) A step of forming a plating film on the surface of the lead frame exposed from the sealing body after the step (k).   2. The method of manufacturing a semiconductor device according to claim 1, wherein each of the first and second identification numbers is a two-dimensional barcode.   2. The method of manufacturing a semiconductor device according to claim 1, wherein, in the step (b), the first identification number is engraved by irradiating the outer frame portion of the lead frame with a laser beam. 3.   2. The method of manufacturing a semiconductor device according to claim 1, wherein, in the step (k), the second identification number is engraved by irradiating the surface of the sealing body with a laser beam.   2. The method of manufacturing a semiconductor device according to claim 1, wherein in the step (b), the first identification number is stamped at a plurality of locations of the outer frame portion.   The information in the first server updated in the step (e) is information in which manufacturing conditions in the step (e) are associated with the first identification number. A method for manufacturing a semiconductor device.   The method of manufacturing a semiconductor device according to claim 6, wherein the manufacturing condition associated is the model number of the first device used in the step (e).   The information in the first server updated in the step (h) is information in which manufacturing conditions in the step (h) are associated with the first identification number. A method for manufacturing a semiconductor device.   9. The method of manufacturing a semiconductor device according to claim 8, wherein the manufacturing condition associated is the model number of the second device used in the step (h).