JPS62280039A - Marking method - Google Patents

Abstract

PURPOSE:To enhance a workability to a great extent, by conducting a treatment of removing deposit from the surfaces of arranged two or more materials to be marked and a treatment of applying a mark on the surfaces having deposit removed. CONSTITUTION:At first, a loading jig 5 holding two or more multiple lead frames 4 is loaded on a table 11. After being lowered, a group of nozzles 13 is moved back and forward over the table 11 along a guide rail 12 while forming oxyhydrogen flame. During the travel of the nozzles, the oxyhydrogen flame bakes the surface of each package 3, thereby removing the deposit therefrom. After that, the multiple lead frames 4, in which the deposit are removed from the each package 3, are set to a printer 20 while being held on the loading jig 5, and a mark is printed on the surface of each of the packages 3.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Industrial Application Field] The present invention relates to marking technology, particularly to technology for marking multiple objects to be marked at once. The present invention relates to a technique that can be effectively used to mark a semiconductor device (hereinafter referred to as rc) having a resin-sealed package in the manufacturing process of .

[Conventional technology]

In the manufacturing process of semiconductor devices, a method for marking a resin-sealed package of IC (hereinafter referred to as package) is to cut the multi-lead frame after molding the package and separate it into each IC. In some cases, a pre-cleaning treatment using a chemical such as trichlorethylene, a marking treatment, and a heating drying treatment of the mark ink are performed.

Regarding the above marking technology, please refer to the patent application 1986-1.
74135.

[Problem that the invention seeks to solve]

In this marking method, each IC is separated and various processes are performed, so even if punching is performed, there is a problem in that there is a limit to greatly improving work efficiency and reducing man-hours. The inventor has clarified something.

An object of the present invention is to provide a marking technique that can significantly improve workability.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

An overview of typical inventions disclosed in this application is as follows.

That is, while a plurality of markers are connected in series, the process of removing the deposits on the surface of each object to be marked and the process of displaying a mark on the surface of the object to be marked from which the deposits have been removed are performed. It is.

[Effect]

According to the above-mentioned means, the removal process and the marking process are performed while the plurality of objects to be marked are arranged in a row, so that the workability is greatly improved.

〔Example〕

Fig. 1 is a flowchart showing an rc marking method according to an embodiment of the present invention, Fig. 2 is a plan view showing a loading jig used therein, and Fig. 3 is a diagram showing a device for removing deposits. 4 is a side view thereof, FIG. 5 is a front view showing an apparatus for carrying out marking processing, and FIG. 6 is a side view thereof.

In this embodiment, as shown in FIG. 2, a plurality of ICs 1 as objects to be marked are connected in a multiple lead frame 4. As shown in FIG. That is, the multiple lead frame 4 is formed by integrally connecting a plurality of unit lead frames (hereinafter referred to as lead frames) 2, and the lead frame 2 has a pellet (not shown) into which an integrated circuit is built. As well as being bonded, the package 3 is shaped to non-hermetically seal the pellet.

In the molding of this package 3, as shown in FIG.
While aligned and held, they are set in a mold in a transfer molding device (not shown) and molded all at once.

A plurality of multiple lead frames 4 with packages 3 formed thereon are set in a burning device 10 as shown in FIGS. 3 and 4 while being held in a loading jig 5, and packaged. The mold release agent and foreign matter adhering to the printing surface of step 3 are removed.

That is, the burning device M10 shown in FIG. 3 and FIG. 12 and moves up and down to form an oxyhydrogen flame downward, and a plurality of exhaust pipes 14 that cover the flame from the nozzles 13 when not in use. ing.

First, the loading jig 5 holding a plurality of multiple lead frames 4 is placed on the table 11. continue,
A masking jig 15 is set on the loading jig 5 so as to cover each lead frame 2 except for a portion of each package 3.

After that, the nozzle group 13 descends and is moved back and forth on the table 11 along the guide rail 12 while forming an oxyhydrogen flame. While the nozzle is moving, the surface of each package 3 is burnt by the oxyhydrogen flame, so that the deposits are removed. At this time, since the second group of lead frames is covered with the masking jig 15, it will not be heated by the oxyhydrogen flame. In addition, since the nozzle 13 that has returned to the standby position is covered with flame by the exhaust pipe 14, it may continue to burn, making it easier to control the flame.

Next, the multi-lead frame 4 from which the deposits have been removed from each package 3 is set in the printing device 20 as shown in FIGS. 5 and 6 while being held in the loading jig 5. A mark is printed on the surface of the package 3.

That is, the printing apparatus 20 shown in FIGS. 5 and 6 includes a table 21 on which the loading jig 5 is placed.
A beam 22 is horizontally suspended above the table 21. A guide rail 23 is laid on the beam 22 in the front-rear direction, and a pair of left and right posts 24 are suspended from the guide rail 23 so as to be reciprocated by a drive device (not shown). An ink tank 25 is installed at the lower end of the boss 24, and an ink roller 26 for taking ink from the ink tank 25, and an ink roller 26 for a plurality of rubber stamps arranged corresponding to the packages 3. A rubber stamp roller 27 to which ink is applied and a transfer roller 29 to which a mark is transferred from the rubber stamp roller 27 are rotatably mounted in order from the bottom so as to circumscribe each other. The printing plate 3 is attached to the beam 22.
0 is suspended between the left and right posts 24, 24 so as to be raised and lowered by a drive device (not shown), and the printing plate 30 is configured to further transfer marks from the transfer roller 29.

When the loading jig 5 holding a plurality of multiple lead frames 4 is placed on the table 21, the post 2 is moved so that the lower surface of the printing plate 30 is transferred by the transfer roller 29.
4 is moved, the mark of the roller 29 is transferred to the printing plate 30.

Thereafter, the printing plate 30 is lowered and pressed against the group of packages 3, so that the mark transferred to the printing plate 30 is printed on each package 3 at the same time.

When printing is finished, the printing plate 30 is raised to prepare for the next printing.

Next, the multiple lead frame 4, which has been further marked for each package 3, is placed into a heating furnace (not shown) while being held in the loading jig 5, or while being unloaded from the jig 5. Postcare processing is performed.

By this heating, the resin of the package 5 is completely cured, and the printing ink of the mark is dried.

In this way, the burning process, the marking process, and the post-cure process are performed simultaneously on the plurality of multi-leads that are still connected by the multi-lead frame 4 and set in the loading jig 5. The IC implemented in the package 3 is then subjected to solder plating processing while remaining in the multiple lead frame 4, and then separated from each lead frame 2 and sold separately, or alternatively, the IC is soldered to each lead frame 2. After being separated and separated into individual pieces at step 2, soldering is carried out by solder dipping.

According to the embodiment described above, the following effects can be obtained.

(1) Since the burning process, the marking process, and the post cure process are performed on each package while the package remains connected by the multi-lead frame, work efficiency can be greatly improved.

(2) Workability can be further significantly improved by carrying out the above-mentioned process (i) on a plurality of multiple lead frames that are still set in a loading jig during packaging processing.

(3) By performing post-cure processing after marking processing, it is possible to combine curing processing for packaging and drying processing for mark ink, dramatically improving work efficiency by omitting the process. Can be done.

(4) Regarding the process of removing deposits from the package surface, by using a burning device that is configured to flood the package with oxyhydrogen flame, there is no need to use chemicals such as trichlorethylene. In addition, since the package is heated, curing of the resin can be promoted.

(5) For marking processing, use a printing device configured to print marks on each package at once by pressing a printing plate onto which multiple marks have been transferred from a transfer roller against each pan cage. This allows only the mark ink to adhere to the printing plate, making it possible to achieve clean printing, and also to allow packages to be arranged in a flat manner on multiple multi-lead frames held in a loading jig. Since marks can be affixed at the same time, work efficiency can be greatly improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the process is not limited to performing the process with a plurality of multiple lead frames set in a jig, but the process may be performed for each multiple lead frame.

The process for removing deposits on the package surface is not limited to the use of the burning device described in the above example, but may also use other burning devices, or may include removal treatment using chemicals, etc. .

The marking process is not limited to the printing apparatus shown in the above embodiment, but may be performed using other printing apparatuses or laser marking processes.

In the above explanation, the invention made by the present inventor was mainly applied to the marking method for IC packages, which is the field of application that formed the background of the invention. It can also be applied to marking methods for packages in electronic devices. The present invention can be applied at least to general marking processing when a plurality of products are arranged in series before marking.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By performing the removal process and marking process on multiple objects to be marked in a row, it is possible to process a large amount of material compared to when the objects to be marked are separated, which improves work efficiency. can be significantly improved.

[Brief explanation of drawings]

Fig. 1 is a flowchart showing an IC marking method according to an embodiment of the present invention, Fig. 2 is a plan view showing a loading jig used therein, and Fig. 3 is a front view showing a deposit removal processing device. , FIG. 4 is a side view thereof, FIG. 5 is a front view showing an apparatus for carrying out marking processing, and FIG. 6 is a side view thereof. 1... IC (object to be marked), 2... Unit lead frame, 3... Package (surface to be marked), 4
...Multiple lead frame, 5...Loading jig, 10...Burning device, 11...Table, 1
2... Guide rail, 13... Nozzle, 14...
Exhaust pipe, 15... Masking jig, 20... Printing device, 21... Table, 22... Beam, 23...
- Guide rail, 24... Post, 25... Ink tank, 26... Ink roller, 27... Rubber stamp roller, 28... Rubber stamp, 29... Transfer roller, 30
...Printing board. 54% of tiles

Claims (1)

[Claims] 1. In a state where a plurality of objects to be marked are arranged in a row,
1. A marking method comprising: removing deposits from the surface of each marking object; and displaying a mark on the surface of the marking object from which the deposits have been removed. 2. The marking method according to claim 1, wherein each process is performed while a plurality of objects to be marked are set in a jig. 3. The process of removing deposits on the surface of the object to be marked is carried out using a burning device configured to burn the surface of the package with an oxyhydrogen flame. marking method. 4. A printing device in which the marking process is configured to display a mark on each object to be marked at once by pressing a printing plate onto which a plurality of marks have been transferred from a transfer roller against a group of objects to be marked. The marking method according to claim 1, characterized in that the marking method is carried out by: