JP2015216281A5 - - Google Patents
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- Publication number
- JP2015216281A5 JP2015216281A5 JP2014099155A JP2014099155A JP2015216281A5 JP 2015216281 A5 JP2015216281 A5 JP 2015216281A5 JP 2014099155 A JP2014099155 A JP 2014099155A JP 2014099155 A JP2014099155 A JP 2014099155A JP 2015216281 A5 JP2015216281 A5 JP 2015216281A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor substrate
- water film
- laminate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 231
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 103
- 239000004065 semiconductor Substances 0.000 claims description 101
- 238000000227 grinding Methods 0.000 claims description 51
- 238000003754 machining Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 11
- 241000960387 Torque teno virus Species 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 239000010703 silicon Substances 0.000 description 19
- 229910052710 silicon Inorganic materials 0.000 description 19
- 229910010271 silicon carbide Inorganic materials 0.000 description 18
- 229910003465 moissanite Inorganic materials 0.000 description 17
- 238000005498 polishing Methods 0.000 description 13
- 239000010432 diamond Substances 0.000 description 11
- 229910003460 diamond Inorganic materials 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive Effects 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- ZXNKRXWFQRLIQG-UHFFFAOYSA-N silicon(4+);tetraborate Chemical compound [Si+4].[Si+4].[Si+4].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] ZXNKRXWFQRLIQG-UHFFFAOYSA-N 0.000 description 4
- 229920001721 Polyimide Polymers 0.000 description 3
- 238000005296 abrasive Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000005385 borate glass Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000002093 peripheral Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N Boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OHORFAFFMDIQRR-UHFFFAOYSA-P Hexafluorosilicic acid Chemical compound [H+].[H+].F[Si-2](F)(F)(F)(F)F OHORFAFFMDIQRR-UHFFFAOYSA-P 0.000 description 1
- 241001024304 Mino Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 241000724291 Tobacco streak virus Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- TWXTWZIUMCFMSG-UHFFFAOYSA-N nitride(3-) Chemical compound [N-3] TWXTWZIUMCFMSG-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052904 quartz Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000452 restraining Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014099155A JP6307753B2 (ja) | 2014-05-13 | 2014-05-13 | 半導体基板の平坦化加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014099155A JP6307753B2 (ja) | 2014-05-13 | 2014-05-13 | 半導体基板の平坦化加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015216281A JP2015216281A (ja) | 2015-12-03 |
| JP2015216281A5 true JP2015216281A5 (ko) | 2017-07-06 |
| JP6307753B2 JP6307753B2 (ja) | 2018-04-11 |
Family
ID=54752906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014099155A Active JP6307753B2 (ja) | 2014-05-13 | 2014-05-13 | 半導体基板の平坦化加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6307753B2 (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6993099B2 (ja) * | 2017-04-27 | 2022-01-13 | 株式会社岡本工作機械製作所 | チャック装置 |
| JP6938084B2 (ja) * | 2017-07-26 | 2021-09-22 | 株式会社ディスコ | ブレード保持具 |
| JP7166730B2 (ja) * | 2018-12-11 | 2022-11-08 | 株式会社ディスコ | 被加工物の加工方法 |
| JP7166729B2 (ja) * | 2018-12-11 | 2022-11-08 | 株式会社ディスコ | 被加工物の加工方法 |
| JP7184621B2 (ja) * | 2018-12-12 | 2022-12-06 | 株式会社ディスコ | 剥離方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152306A (ja) * | 1991-11-28 | 1993-06-18 | Sony Corp | 半導体基板及びその製造方法 |
| JP2014041854A (ja) * | 2012-08-21 | 2014-03-06 | Toshiba Corp | 半導体装置の製造方法および半導体装置 |
-
2014
- 2014-05-13 JP JP2014099155A patent/JP6307753B2/ja active Active
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