JP2015212378A - 下層のための芳香族樹脂 - Google Patents
下層のための芳香族樹脂 Download PDFInfo
- Publication number
- JP2015212378A JP2015212378A JP2015092544A JP2015092544A JP2015212378A JP 2015212378 A JP2015212378 A JP 2015212378A JP 2015092544 A JP2015092544 A JP 2015092544A JP 2015092544 A JP2015092544 A JP 2015092544A JP 2015212378 A JP2015212378 A JP 2015212378A
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- Prior art keywords
- reaction product
- layer
- alkyl
- polymer
- based reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000003118 aryl group Chemical group 0.000 title claims description 151
- 229920005989 resin Polymers 0.000 title description 55
- 239000011347 resin Substances 0.000 title description 55
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 54
- 239000000178 monomer Substances 0.000 claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 46
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 41
- 229920002120 photoresistant polymer Polymers 0.000 claims description 33
- 229920000642 polymer Polymers 0.000 claims description 33
- 125000003342 alkenyl group Chemical group 0.000 claims description 30
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 29
- 125000006649 (C2-C20) alkynyl group Chemical group 0.000 claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 239000010703 silicon Substances 0.000 claims description 24
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 16
- 125000003545 alkoxy group Chemical group 0.000 claims description 11
- 125000004414 alkyl thio group Chemical group 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 239000003377 acid catalyst Substances 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 239000003431 cross linking reagent Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 125000003396 thiol group Chemical class [H]S* 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 13
- 150000001875 compounds Chemical class 0.000 abstract description 6
- 230000003667 anti-reflective effect Effects 0.000 abstract description 4
- 125000000524 functional group Chemical group 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 106
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 20
- 239000002253 acid Substances 0.000 description 18
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 16
- 239000002904 solvent Substances 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 14
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 12
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 10
- -1 pyrenol compound Chemical class 0.000 description 9
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 8
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 8
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- GYFAGKUZYNFMBN-UHFFFAOYSA-N Benzo[ghi]perylene Chemical group C1=CC(C2=C34)=CC=C3C=CC=C4C3=CC=CC4=CC=C1C2=C43 GYFAGKUZYNFMBN-UHFFFAOYSA-N 0.000 description 4
- 239000004971 Cross linker Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 125000000304 alkynyl group Chemical group 0.000 description 4
- TXVHTIQJNYSSKO-UHFFFAOYSA-N benzo[e]pyrene Chemical compound C1=CC=C2C3=CC=CC=C3C3=CC=CC4=CC=C1C2=C34 TXVHTIQJNYSSKO-UHFFFAOYSA-N 0.000 description 4
- VPUGDVKSAQVFFS-UHFFFAOYSA-N coronene Chemical compound C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 150000002596 lactones Chemical class 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 210000002381 plasma Anatomy 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000003460 sulfonic acids Chemical class 0.000 description 3
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 2
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 description 2
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 2
- CHLICZRVGGXEOD-UHFFFAOYSA-N 1-Methoxy-4-methylbenzene Chemical compound COC1=CC=C(C)C=C1 CHLICZRVGGXEOD-UHFFFAOYSA-N 0.000 description 2
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FMMWHPNWAFZXNH-UHFFFAOYSA-N Benz[a]pyrene Chemical compound C1=C2C3=CC=CC=C3C=C(C=C3)C2=C2C3=CC=CC2=C1 FMMWHPNWAFZXNH-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 description 2
- GMACPFCYCYJHOC-UHFFFAOYSA-N [C].C Chemical group [C].C GMACPFCYCYJHOC-UHFFFAOYSA-N 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 2
- WZJYKHNJTSNBHV-UHFFFAOYSA-N benzo[h]quinoline Chemical compound C1=CN=C2C3=CC=CC=C3C=CC2=C1 WZJYKHNJTSNBHV-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- LHRCREOYAASXPZ-UHFFFAOYSA-N dibenz[a,h]anthracene Chemical compound C1=CC=C2C(C=C3C=CC=4C(C3=C3)=CC=CC=4)=C3C=CC2=C1 LHRCREOYAASXPZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- BHIWKHZACMWKOJ-UHFFFAOYSA-N methyl isobutyrate Chemical compound COC(=O)C(C)C BHIWKHZACMWKOJ-UHFFFAOYSA-N 0.000 description 2
- 125000006574 non-aromatic ring group Chemical group 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
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- 239000002244 precipitate Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
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- 239000008096 xylene Substances 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical class NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- MTAHTQMQAFEQTQ-UHFFFAOYSA-N 12h-dibenzo[b,h]fluorene Chemical compound C1=CC=C2C=C3CC4=CC5=CC=CC=C5C=C4C3=CC2=C1 MTAHTQMQAFEQTQ-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- 229940077398 4-methyl anisole Drugs 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
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- BNCADMBVWNPPIZ-UHFFFAOYSA-N COCN(COC)c1nc(N(COC)COC)nc(N(COC)COC)n1 Chemical compound COCN(COC)c1nc(N(COC)COC)nc(N(COC)COC)n1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RAASUWZPTOJQAY-UHFFFAOYSA-N Dibenz[a,c]anthracene Chemical compound C1=CC=C2C3=CC4=CC=CC=C4C=C3C3=CC=CC=C3C2=C1 RAASUWZPTOJQAY-UHFFFAOYSA-N 0.000 description 1
- KLIHYVJAYWCEDM-UHFFFAOYSA-N Dibenz[a,j]anthracene Chemical compound C1=CC=CC2=C(C=C3C4=CC=CC=C4C=CC3=C3)C3=CC=C21 KLIHYVJAYWCEDM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000005042 acyloxymethyl group Chemical group 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
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- 239000011737 fluorine Substances 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- 239000012454 non-polar solvent Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
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- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- LISFMEBWQUVKPJ-UHFFFAOYSA-N quinolin-2-ol Chemical compound C1=CC=C2NC(=O)C=CC2=C1 LISFMEBWQUVKPJ-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
Description
の1種以上の第1のモノマーと、
式(2)
の1種以上の第2のモノマーと、
場合によっては、式(3)
の1種以上の第3のモノマーとのポリマー系反応生成物を提供する。
の1種以上の第1のモノマーと、
式(2)
の1種以上の第2のモノマーと、
場合によっては、式(3)
の1種以上の第3のモノマーとを、溶媒中でかつ酸の存在下で反応させることを含む、前記ポリマー系反応生成物を製造する方法も提供される。本発明は、上述の方法によって製造されるポリマー系反応生成物も提供する。
の1種以上の第1のモノマーと、
式(2)
の1種以上の第2のモノマーと、
場合によっては、式(3)
の1種以上の第3のモノマーとの反応生成物である。
第1のモノマー(1e)(0.3g、0.0011mol)、第2のモノマー(2a)(4.0g、0.011mol)、pTSA(0.09g、0.0005mol)、および18mLのPGMEが、磁気攪拌棒および凝縮器を備えた三ツ口丸底フラスコに入れられた。次いで、この混合物は90℃で8時間にわたって攪拌された。次いで、この反応混合物は室温まで冷却され、そして芳香族樹脂反応生成物(試料1)がメタノール(230mL)およびDI水(18mL)の混合物を用いて沈殿させられた。沈殿物は濾過され、真空オーブン内で乾燥させられた。
式(6)に示される繰り返し単位を有するポリマーのサンプル(比較例1)が群栄化学工業株式会社から得られ、そしてそのまま使用された。このサンプルの分子量はMw=6066、およびMn=2362であった。
モノマー(2a)(4.40g、0.0118mol)、pTSA(0.1g、0.0006mol)、およびPGME(18mL)が、磁気攪拌棒および凝縮器を備えた三ツ口丸底フラスコに入れられた。次いで、この混合物は90℃で7時間にわたって攪拌された。次いで、この反応混合物は室温まで冷却され、そして芳香族樹脂反応生成物(比較例2)がメタノール(252mL)およびDI水(20mL)の混合物を用いて沈殿させられた。沈殿物(比較例2)は濾過され、真空オーブン内で乾燥させられた。比較例2はGPCで分析されて、2726のMw、1920の数平均分子量(Mn)、および1.42の多分散度を有することが認められた。
以下の第1のモノマー(2f)および第2のモノマー(2b)が同じ相対モル量で使用される以外は、酸触媒としてpTSAを用いて実施例1の手順が繰り返されて、試料2を製造する。
以下の第1のモノマー(1e)および第2のモノマー(2b)が同じ相対モル量で使用される以外は、酸触媒としてpTSAを用いて実施例1の手順が繰り返されて、試料3を製造する。
以下の第1のモノマー(1f)および第2のモノマー(2a)が同じ相対モル量で使用される以外は、酸触媒としてpTSAを用いて実施例1の手順が繰り返されて、試料4を製造する。
以下の第1のモノマー(1a)が使用される以外は実施例1の手順が繰り返されて、試料5を製造する。
以下の第1のモノマー(1d)が使用される以外は実施例1の手順が繰り返されて、試料6を製造する。
第1のモノマーおよび第2のモノマーが表1および2に報告されるもので置き換えられる以外は実施例1の手順が繰り返されて、表3のサンプルを製造する。
実施例6の手順が繰り返されて表3に列挙されたサンプルを製造する。
Claims (11)
- 式(1)
の1種以上の第1のモノマーと、
式(2)
の1種以上の第2のモノマーと、
場合によっては、式(3)
の1種以上の第3のモノマーとのポリマー系反応生成物。 - Ar1がAr2と同じである、請求項1に記載のポリマー系反応生成物。
- Ar3がAr4と異なっている、請求項1に記載のポリマー系反応生成物。
- Ar3が3〜7個の縮合芳香環を有するアリール部分を表し、およびAr4が2〜4個の縮合芳香環を有するアリール部分を表す、請求項3に記載のポリマー系反応生成物。
- Ar3およびAr4の少なくとも1つが少なくとも4個の縮合芳香環を有するアリール部分を表す、請求項1に記載のポリマー系反応生成物。
- n1およびn2のそれぞれが独立して0〜2から選択される、請求項1に記載のポリマー系反応生成物。
- 前記1種以上の第1のモノマーと、前記1種以上の第2のモノマーとを酸触媒の存在下で有機溶媒中で反応させることを含む請求項1のポリマー系反応生成物を製造する方法。
- 請求項1のポリマー系反応生成物、および有機溶媒を含み、並びに場合によっては、硬化剤、架橋剤および界面活性剤から選択される1種以上の添加剤を含む組成物。
- 基体上に請求項8に記載の組成物の層を配置し、有機溶媒を除去してポリマー系反応生成物層を形成し、前記ポリマー系反応生成物層上にフォトレジストの層を配置し、前記フォトレジスト層をマスクを通して化学線に露光し、露光された前記フォトレジスト層を現像してレジストパターンを形成し、および前記パターンを前記ポリマー系反応生成物層に転写して、前記基体の部分を露出させることを含む、パターン形成された層を形成する方法。
- 前記基体をパターン形成する工程、および次いで前記パターン形成されたポリマー系反応生成物層を除去する工程をさらに含む請求項9に記載の方法。
- 前記パターン形成されたポリマー系反応生成物層および前記基体の露出した部分の上に共形的なケイ素含有層を配置する工程、前記ケイ素含有層を部分的にエッチングして、前記パターン形成されたポリマー系反応生成物層の頂部表面、および前記基体の一部分を露出させる工程をさらに含む、請求項9に記載の方法。
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KR102345567B1 (ko) * | 2014-04-30 | 2021-12-29 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 하부층용 방향족 수지 |
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US20150315333A1 (en) | 2015-11-05 |
US20160215090A1 (en) | 2016-07-28 |
US9334357B2 (en) | 2016-05-10 |
TWI599593B (zh) | 2017-09-21 |
KR20150125624A (ko) | 2015-11-09 |
KR102345567B1 (ko) | 2021-12-29 |
TW201609855A (zh) | 2016-03-16 |
JP6453153B2 (ja) | 2019-01-16 |
TWI579317B (zh) | 2017-04-21 |
CN105175689A (zh) | 2015-12-23 |
TW201718696A (zh) | 2017-06-01 |
US10377848B2 (en) | 2019-08-13 |
CN105175689B (zh) | 2018-04-13 |
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