JP2015210973A5 - - Google Patents
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- Publication number
- JP2015210973A5 JP2015210973A5 JP2014092473A JP2014092473A JP2015210973A5 JP 2015210973 A5 JP2015210973 A5 JP 2015210973A5 JP 2014092473 A JP2014092473 A JP 2014092473A JP 2014092473 A JP2014092473 A JP 2014092473A JP 2015210973 A5 JP2015210973 A5 JP 2015210973A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive substrate
- copper
- polymer dispersant
- less
- substrate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010949 copper Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000002105 nanoparticle Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 8
- 150000003973 alkyl amines Chemical class 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 8
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000002296 dynamic light scattering Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 230000004580 weight loss Effects 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- -1 copper carboxylates Chemical class 0.000 claims 1
- 150000002429 hydrazines Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092473A JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
| PCT/JP2015/060007 WO2015166755A1 (ja) | 2014-04-28 | 2015-03-30 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092473A JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016162615A Division JP2017022125A (ja) | 2016-08-23 | 2016-08-23 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015210973A JP2015210973A (ja) | 2015-11-24 |
| JP2015210973A5 true JP2015210973A5 (cg-RX-API-DMAC7.html) | 2016-03-10 |
| JP5994811B2 JP5994811B2 (ja) | 2016-09-21 |
Family
ID=54358492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014092473A Active JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5994811B2 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2015166755A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107614614B (zh) * | 2015-06-02 | 2020-03-31 | 旭化成株式会社 | 分散体 |
| JP6642218B2 (ja) * | 2016-04-05 | 2020-02-05 | 日油株式会社 | レーザーエッチング用銅ペースト組成物 |
| WO2018003399A1 (ja) * | 2016-06-30 | 2018-01-04 | 株式会社コイネックス | 銅配線およびその製造方法およびそれを用いた電子機器、タッチパッド、タッチパネル |
| US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| EP3598461A4 (en) | 2017-03-16 | 2021-01-13 | Asahi Kasei Kabushiki Kaisha | DISPERSION, METHOD FOR PRODUCING A STRUCTURE EQUIPPED WITH A CONDUCTIVE PATTERN USING A DISPERSION, AND STRUCTURE EQUIPPED WITH A CONDUCTIVE PATTERN |
| JP2018170228A (ja) * | 2017-03-30 | 2018-11-01 | 日立化成株式会社 | 導体形成用組成物、並びに接合体及びその製造方法 |
| JP2018168439A (ja) * | 2017-03-30 | 2018-11-01 | 日立化成株式会社 | 電磁波遮蔽体の製造に用いられる組成物、及び電磁波遮蔽体の製造方法 |
| JP7005625B2 (ja) | 2017-07-18 | 2022-01-21 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
| KR102456821B1 (ko) | 2017-07-27 | 2022-10-19 | 아사히 가세이 가부시키가이샤 | 산화구리 잉크 및 이것을 이용한 도전성 기판의 제조 방법, 도막을 포함하는 제품 및 이것을 이용한 제품의 제조 방법, 도전성 패턴을 갖는 제품의 제조 방법, 및 도전성 패턴을 갖는 제품 |
| JP7430483B2 (ja) * | 2017-11-10 | 2024-02-13 | 旭化成株式会社 | 導電性パターン領域付構造体及びその製造方法 |
| JP2019211243A (ja) * | 2018-05-31 | 2019-12-12 | 旭化成株式会社 | Ｒｆｉｄタグ |
| JP2020084242A (ja) * | 2018-11-20 | 2020-06-04 | 京セラ株式会社 | 接合用銅粒子の製造方法、接合用ペースト及び半導体装置並びに電気・電子部品 |
| JP2020100888A (ja) * | 2018-12-25 | 2020-07-02 | 京セラ株式会社 | 銅粒子、銅粒子の製造方法、銅ペースト及び半導体装置並びに電気・電子部品 |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| JP7434786B2 (ja) * | 2019-09-27 | 2024-02-21 | Dic株式会社 | 銅／酸化銅微粒子ペースト |
| US20240157483A1 (en) * | 2021-03-17 | 2024-05-16 | Kyocera Corporation | Paste composition, semiconductor device, electrical component and electronic component |
| WO2023017747A1 (ja) * | 2021-08-10 | 2023-02-16 | 株式会社ダイセル | 導電性インク |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4865772B2 (ja) * | 2007-08-30 | 2012-02-01 | 三ツ星ベルト株式会社 | 金属コロイド粒子およびその分散液 |
| JP5661273B2 (ja) * | 2008-11-26 | 2015-01-28 | 三ツ星ベルト株式会社 | 金属コロイド粒子及びそのペースト並びにその製造方法 |
| KR20110027487A (ko) * | 2009-09-10 | 2011-03-16 | 삼성전자주식회사 | 금속 패턴 형성용 조성물 및 이를 이용한 금속 패턴 형성방법 |
| JP5623861B2 (ja) * | 2010-10-14 | 2014-11-12 | 株式会社東芝 | 金属ナノ粒子分散組成物 |
| JP5715851B2 (ja) * | 2011-02-24 | 2015-05-13 | 東芝テック株式会社 | ナノ粒子インク組成物を用いた印刷物の製造方法 |
| JP6127433B2 (ja) * | 2012-10-03 | 2017-05-17 | 大日本印刷株式会社 | 金属粒子分散体、及び物品 |
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2014
- 2014-04-28 JP JP2014092473A patent/JP5994811B2/ja active Active
-
2015
- 2015-03-30 WO PCT/JP2015/060007 patent/WO2015166755A1/ja not_active Ceased