JP2015208765A - 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法 - Google Patents

無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法 Download PDF

Info

Publication number
JP2015208765A
JP2015208765A JP2014092241A JP2014092241A JP2015208765A JP 2015208765 A JP2015208765 A JP 2015208765A JP 2014092241 A JP2014092241 A JP 2014092241A JP 2014092241 A JP2014092241 A JP 2014092241A JP 2015208765 A JP2015208765 A JP 2015208765A
Authority
JP
Japan
Prior art keywords
power semiconductor
lead
particles
free solder
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014092241A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015208765A5 (enExample
Inventor
隆行 山田
Takayuki Yamada
隆行 山田
範之 別芝
Noriyuki Betsushiba
範之 別芝
加柴　良裕
Yoshihiro Kashiba
良裕 加柴
中島　泰
Yasushi Nakajima
泰 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2014092241A priority Critical patent/JP2015208765A/ja
Publication of JP2015208765A publication Critical patent/JP2015208765A/ja
Publication of JP2015208765A5 publication Critical patent/JP2015208765A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Die Bonding (AREA)
JP2014092241A 2014-04-28 2014-04-28 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法 Pending JP2015208765A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014092241A JP2015208765A (ja) 2014-04-28 2014-04-28 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014092241A JP2015208765A (ja) 2014-04-28 2014-04-28 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2015208765A true JP2015208765A (ja) 2015-11-24
JP2015208765A5 JP2015208765A5 (enExample) 2017-03-09

Family

ID=54611433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014092241A Pending JP2015208765A (ja) 2014-04-28 2014-04-28 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2015208765A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116316047A (zh) * 2023-05-17 2023-06-23 苏州长光华芯光电技术股份有限公司 一种高可靠性半导体封装结构及其制备方法
WO2025254166A1 (ja) * 2024-06-05 2025-12-11 三菱マテリアル株式会社 はんだペースト、はんだ接合体、および、はんだ接合体の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215294A (ja) * 1983-05-24 1984-12-05 Toshiba Corp 半田接合材料とその材料を使用した接合方法
JPS62179889A (ja) * 1986-01-31 1987-08-07 Senjiyu Kinzoku Kogyo Kk クリ−ムはんだ
JPH0639583A (ja) * 1992-07-27 1994-02-15 Toshiba Lighting & Technol Corp 半田ペースト及び回路基板
JP2002254194A (ja) * 2000-06-12 2002-09-10 Hitachi Ltd 電子機器およびはんだ
JP2005167257A (ja) * 2000-12-25 2005-06-23 Tdk Corp はんだ付け方法
JP2009125753A (ja) * 2007-11-20 2009-06-11 Toyota Central R&D Labs Inc はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
WO2013017885A2 (en) * 2011-08-02 2013-02-07 Fry's Metals, Inc. Solder compositions

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215294A (ja) * 1983-05-24 1984-12-05 Toshiba Corp 半田接合材料とその材料を使用した接合方法
JPS62179889A (ja) * 1986-01-31 1987-08-07 Senjiyu Kinzoku Kogyo Kk クリ−ムはんだ
JPH0639583A (ja) * 1992-07-27 1994-02-15 Toshiba Lighting & Technol Corp 半田ペースト及び回路基板
JP2002254194A (ja) * 2000-06-12 2002-09-10 Hitachi Ltd 電子機器およびはんだ
JP2005167257A (ja) * 2000-12-25 2005-06-23 Tdk Corp はんだ付け方法
JP2009125753A (ja) * 2007-11-20 2009-06-11 Toyota Central R&D Labs Inc はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
WO2013017885A2 (en) * 2011-08-02 2013-02-07 Fry's Metals, Inc. Solder compositions
JP2014527466A (ja) * 2011-08-02 2014-10-16 アルファ・メタルズ・インコーポレイテッドＡｌｐｈａ Ｍｅｔａｌｓ，Ｉｎｃ． はんだ組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116316047A (zh) * 2023-05-17 2023-06-23 苏州长光华芯光电技术股份有限公司 一种高可靠性半导体封装结构及其制备方法
CN116316047B (zh) * 2023-05-17 2023-08-15 苏州长光华芯光电技术股份有限公司 一种高可靠性半导体封装结构及其制备方法
WO2025254166A1 (ja) * 2024-06-05 2025-12-11 三菱マテリアル株式会社 はんだペースト、はんだ接合体、および、はんだ接合体の製造方法

Similar Documents

Publication Publication Date Title
JP6773143B2 (ja) 半導体装置用はんだ材
CN1076998C (zh) 软钎料及使用该软钎料的电子器件
KR101773733B1 (ko) 파워 디바이스용의 땜납 합금과 고전류 밀도의 땜납 조인트
JP2014135411A (ja) 半導体装置および半導体装置の製造方法
US9847310B2 (en) Flip chip bonding alloys
JP7215206B2 (ja) 半導体装置の製造方法
JP3827322B2 (ja) 鉛フリーはんだ合金
JP2011138968A (ja) 面実装部品のはんだ付け方法および面実装部品
CN105006471A (zh) 一种igbt模块及焊接方法
JP2008277335A (ja) 半導体装置およびその製造方法
JP6641524B1 (ja) 半導体装置の製造方法
KR102259122B1 (ko) 접합 구조체의 제조 방법
JP2005340268A (ja) トランジスタパッケージ
JP2015208765A (ja) 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法
US20190013308A1 (en) Die bonding to a board
US7413110B2 (en) Method for reducing stress between substrates of differing materials
JP6083451B2 (ja) 面実装部品のはんだ付け方法および面実装部品
CN108284286B (zh) 用于芯片焊接的钎焊合金
JP2012061508A (ja) 接合材料
JP5941036B2 (ja) 面実装部品のはんだ付け方法および面実装部品
JP6036905B2 (ja) 面実装部品のはんだ付け方法および面実装部品
WO2009093335A1 (ja) 熱容量制御材料及び部品実装方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170203

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170203

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180306

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20181002