JP2015204310A - Substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate holding member, capable of shortening the transportation time of a substrate.SOLUTION: Disclosed is a substrate processing device 10 which processes a substrate. This device includes: a substrate holding member 5 which holds the substrate: a processing part equipped with a plurality of processing units which process the substrate; and transportation means 11 which transports the substrate. The transportation means 11 is constituted so that the substrate holding member 5 is horizontally transported between respective processing units in a state where the substrate holding member 5 holds the substrate. Each processing unit is arranged so as to be accessed to the substrate holding member 5 from the upper side and/or the lower side.

Description

  The present invention relates to a substrate processing apparatus and a substrate holding member used therefor.

  The manufacturing process of a touch panel of a portable terminal includes a process of applying a chemical solution to be a color filter or the like on a glass substrate, and thereafter performing a vacuum drying process, a heating process, and a cooling process. Conventionally, when performing these processes, as shown in Patent Documents 1 and 2, a substrate is transferred to each processing unit using a robot hand.

JP 2010-80856 A JP 2012-2222087 A

  Therefore, in addition to the time for actually processing the substrate, the substrate processing time includes the time for receiving the substrate into each processing unit and taking out the substrate from each processing unit using the robot hand, that is, the time for transporting the substrate. Was to be included.

  Therefore, an object of the present invention is to provide a substrate processing apparatus and a substrate holding member that can shorten the substrate processing time, particularly the substrate transport time.

1st invention of this application is a substrate processing apparatus which processes a board | substrate, Comprising:
A substrate holding member for holding the substrate;
A processing unit comprising a plurality of processing units for processing a substrate;
A transport means for transporting the substrate,
The transport means is configured to transport the substrate holding member horizontally between the processing units in a state where the substrate holding member holds the substrate.
Each processing unit is configured to access the substrate holding member from above and / or below.

  According to the above configuration, since the substrate is horizontally transferred between the processing units while being held by the substrate holding member, the substrate is placed on the substrate holding member by the robot hand in each processing unit, and the substrate The work of removing the substrate from the substrate holding member can be omitted, and the substrate transport time can be shortened.

The first invention preferably further comprises the following configuration.
(1) The substrate holding member includes a frame having an opening, and a film body that covers the opening and is attached to the frame.
The substrate is adapted to be placed on the film body,
The film body is made of a film having air permeability.
(2) The processing unit includes a coating unit for coating the substrate,
The coating unit includes a surface plate that supports the substrate holding member on which the substrate is placed from below,
An application member that applies the application to the substrate from above the substrate,
The surface plate is movable in the vertical direction.
(3) The processing unit includes a vacuum drying unit for vacuum drying the substrate,
The vacuum drying unit is in contact with the substrate holding member from above the substrate holding member on which the substrate is placed, and an upper chamber that covers the upper portion of the substrate holding member;
A lower chamber that contacts the substrate holding member from below the substrate holding member on which the substrate is placed and covers the lower portion of the substrate holding member,
The upper chamber and the lower chamber are movable in the vertical direction.
(4) The processing unit includes a heating unit for heating the substrate,
The heating unit includes a heating member that heats the substrate from above and / or below the substrate holding member on which the substrate is placed.
The heating member is movable in the vertical direction.
(5) The processing unit includes a cooling unit for cooling the substrate,
The cooling unit includes a cooling member that cools the substrate from above and / or below the substrate holding member on which the substrate is placed.
The cooling member is movable in the vertical direction.
(6) In the configuration (1), the substrate processing apparatus further includes removal means for removing the substrate from the substrate holding member,
The film body has elasticity,
The removing means includes a protruding member that pushes the film body and the substrate upward from below the substrate holding member, the film body that is generated when the protruding member pushes the film body and the substrate, and the A mounting member that is inserted into a gap with the substrate and on which the substrate is mounted.
(7) The transport means transports the substrate holding member so as to circulate.
(8) The substrate holding member and / or the processing unit can be detached from the substrate processing apparatus.
(9) In the configuration (7), the transport unit includes a circular or elliptical transport belt, and an operating mechanism that operates the transport belt.
A plurality of substrate holding members are coupled to the transport belt,
A further substrate holding member is connected to the substrate holding member on the outer peripheral side of the substrate holding member.
(10) In the configuration (7), the transport unit includes a circular transport belt, an operation mechanism that rotates the transport belt, and a shaft that serves as a rotation center of the transport belt.
The conveyor belt is detachable from the shaft.
(11) The transport unit includes a plurality of transport belts positioned in the vertical direction, and an operating mechanism that operates the plurality of transport belts.
A plurality of substrate holding members are connected to each of the transport belts,
The substrate holding member connected to the transport belt is arranged at the vertical position of the substrate holding member connected to another transport belt.

  According to the configuration (1), by placing the substrate on a film body made of a film having air permeability, the substrate is transported between the processing units while being held by the substrate holding member. Can do.

  According to said structure (2), it can apply | coat to the board | substrate mounted on the board | substrate holding member by the application unit.

  According to the configuration (3), the substrate placed on the substrate holding member can be vacuum dried by the vacuum drying unit.

  According to the configuration (4), the substrate placed on the substrate holding member can be heated by the heating unit.

  According to the configuration (5), the substrate placed on the substrate holding member can be cooled by the cooling unit.

  According to the configuration (6), the substrate placed on the substrate holding member can be detached from the substrate holding member by the removing means.

  According to the configuration (7), the installation area of the substrate processing apparatus can be reduced by circulating the substrate holding member.

  According to the configuration (8), a necessary substrate holding member and / or processing unit can be attached to the substrate processing apparatus, and an unnecessary substrate holding member and / or processing unit can be removed. A typical substrate processing apparatus can be configured.

  According to the configuration (9), since the substrate processing apparatus further includes the substrate holding member on the outer periphery of the substrate holding member, the substrate processing amount of the substrate processing apparatus can be increased.

  According to the configuration (10), since the conveyor belt is detachable, the production amount and installation area of the substrate processing apparatus can be adjusted by changing the size of the conveyor belt to be attached.

  According to the configuration (11), since the substrate processing apparatus further includes the substrate holding member at the vertical position of the substrate holding member, the substrate processing apparatus hardly increases the installation area of the substrate processing apparatus. The substrate throughput can be increased.

A second invention of the present application is a substrate holding member used in a substrate processing apparatus,
The substrate holding member includes a frame having an opening, and a film body that covers the opening and is attached to the frame.
The substrate is adapted to be placed on the film body,
The film body is made of a film having air permeability.

  According to the said structure, by mounting a board | substrate on the film body made from the film provided with air permeability, it can be made to convey between each processing unit in the state hold | maintained to the board | substrate holding member. As a result, in each processing unit, the operations of placing the substrate on the substrate holding member and removing the substrate from the substrate holding member can be omitted, and the substrate transport time can be shortened.

  In short, according to the present invention, it is possible to provide a substrate processing apparatus and a substrate holding member capable of shortening the substrate transport time.

1 is a schematic top view of a substrate processing apparatus according to an embodiment of the present invention. It is a schematic top view of a substrate holding member. FIG. 3 is a sectional view taken along line III-III in FIG. 2. It is a schematic sectional drawing which shows the operation | work which performs a coating process to a board | substrate with a coating unit. It is a schematic sectional drawing which shows the operation | work which performs a coating process to a board | substrate with a coating unit. It is a schematic sectional drawing which shows the operation | work which performs a vacuum drying process to a board | substrate by a vacuum drying unit. It is a schematic sectional drawing which shows the operation | work which performs a vacuum drying process to a board | substrate by a vacuum drying unit. It is a schematic sectional drawing which shows the operation | work which heat-processes to a board | substrate with a heating unit. It is a schematic sectional drawing which shows the operation | work which heat-processes to a board | substrate with a heating unit. It is a schematic sectional drawing which shows the operation | work which performs a cooling process to a board | substrate with a cooling unit. It is a schematic sectional drawing which shows the operation | work which performs a cooling process to a board | substrate with a cooling unit. It is a schematic sectional drawing which shows the operation | work which removes a board | substrate from a board | substrate holding member by the removal means. It is a schematic sectional drawing which shows the operation | work which removes a board | substrate from a board | substrate holding member by the removal means. It is a schematic perspective view which shows the operation | work which removes a board | substrate from a board | substrate holding member by the removal means. It is a schematic sectional drawing which shows the operation | work which removes a board | substrate from a board | substrate holding member by the removal means. It is a schematic sectional drawing which shows the modification of a vacuum drying unit. It is a schematic top view of the substrate processing apparatus which concerns on another embodiment of this invention. It is a schematic top view of the substrate processing apparatus which concerns on another embodiment of this invention. It is a schematic top view of the substrate processing apparatus which concerns on another embodiment of this invention. It is a schematic side view of the substrate processing apparatus which concerns on another embodiment of this invention.

(overall structure)
FIG. 1 is a schematic top view of a substrate processing apparatus 10 according to an embodiment of the present invention. The substrate processing apparatus 10 includes a processing unit including a plurality of processing units for processing a substrate, and the processing unit applies a processing unit applied to a surface of the substrate and a processing liquid applied to the substrate. A vacuum drying unit 2 for drying, a heating unit 3 for heating the substrate, and a cooling unit 4 for cooling the substrate are provided. Each processing unit can receive the substrate holding member 5 on which the substrate is placed, and can perform a predetermined process on the substrate while the substrate is placed on the substrate holding member 5. Yes.

  The substrate processing apparatus 10 further includes transport means 11 for transporting the substrate holding member 5 on which the substrate is placed horizontally between the processing units. The transport unit 11 includes a circular transport belt 12 and a rotation mechanism (not shown) that rotates the transport belt 12 around a shaft 13 in a certain direction (R direction). A plurality (12) of substrate holding members 5 are connected to the transport belt 12 at equal intervals. That is, the substrate holding member 5 is arranged every 30 degrees in the conveyance line 14 where the conveyance belt 12 rotates. The rotation mechanism rotates the conveyor belt 12 in the R direction, for example, 30 degrees every 20 seconds.

  Each processing unit is arranged along the transport line 14 and in the order of the substrate processing steps toward the rotation direction (R direction) of the transport belt 12. That is, in the transport line 14, the coating unit 1, the vacuum drying unit 2, the heating unit 3, and the cooling unit 4 are arranged in order from the upstream side in the R direction. In addition, on the upstream side in the R direction with respect to the coating unit 1, a placing unit 6 that performs a work of placing the substrate on the substrate holding member 5 is provided. The placing means 6 is, for example, a robot arm. In addition, on the downstream side in the R direction with respect to the cooling unit 4, a removing means 7 for removing the substrate from the substrate holding member 5 is provided. In the present embodiment, the removing means 7 also serves as the robot arm of the placing means 6.

  The processing time of each processing unit is adjusted by the number of stages corresponding to the number of substrate holding members 5. For example, when the coating processing time is 20 seconds, the vacuum drying processing time is 60 seconds, the heating processing time is 120 seconds, and the cooling processing time is 20 seconds, the coating unit 1 occupies one stage, and the vacuum drying unit 2 Three stages are occupied, the heating unit 3 occupies six stages, and the cooling unit 4 occupies one stage. A stage is also required for the mounting stage for mounting the substrate on the substrate holding member 5 and the removal stage for removing the substrate from the substrate holding unit 5. Although the placement stage and the removal stage may be provided separately, in this embodiment, the placement stage and the removal stage are common and occupy one stage. That is, twelve substrate holding members 5 correspond to twelve stages. Hereinafter, for convenience, S0 is a stage for placing the substrate on the substrate holding member, S1 is a stage for performing a coating process on the substrate, S2 to S4 are stages for vacuum drying the substrate, and S5 to S10 are stages for heating the substrate. A stage for cooling the substrate is designated as S11, and a stage for taking out the substrate from the substrate holding member is designated as S12. Because of the circumference of the transfer line 14, the stage S0 and the stage S12 are at the same position. In addition, since each processing unit is arranged in each stage, in this embodiment, the substrate processing apparatus 10 includes one coating unit 1, three vacuum drying units 2, six heating units 3, and one cooling unit. 4 is provided. The processing time includes the access time of each processing unit in each stage, and the actual processing time is shorter than the processing time, but here it is described as processing time for convenience.

(Substrate holding member)
2 is a schematic top view of the substrate holding member 5, and FIG. 3 is a cross-sectional view taken along the line III-III of FIG. As shown in FIGS. 2 and 3, the substrate holding member 5 includes a frame 51 having an opening 51 a and a film body 52 that covers the opening 51 a and is attached to the frame 51. The substrate is placed on the film body 52. The frame 51 is made of metal, and includes a rectangular placement portion 51b and a rod-like support portion 51c extending laterally outward from one side of the placement portion 51b. An opening 51a is formed at the center of the mounting portion 51b. As described above, one end of the support portion 51 c is integrated with the placement portion 51 a, and the other end is connected to the transport belt 12. The film body 52 has air permeability.

(Coating unit)
FIG. 4 and FIG. 5 are schematic cross-sectional views showing the operation of performing the coating process on the substrate 100 by the coating unit 1. As shown in FIGS. 4 and 5, the application unit 1 includes a surface plate 16 that supports the substrate holding member 5 from below, and an application member (nozzle) that applies the substrate 100 from above the substrate holding member 5. 17. The surface plate 16 is provided with a plurality of porous through-holes 161 penetrating in the vertical direction. The coating unit 1 includes a suction member 18 that sucks the substrate holding member 5 and the substrate 100 through the through hole 161 below the surface plate 16. The surface plate 16 and the suction member 18 can move in the vertical direction (Z direction) as a unit. The application member 17 is movable in the vertical direction (Z direction), and is also movable in the application direction (X direction).

  The coating unit 1 performs a coating process on the substrate 100 as follows. When the substrate holding member 5 holding the substrate 100 is positioned on the stage S1, as shown in FIG. 4, the upper surface of the surface plate 16 of the surface plate 16 and the suction member 18 positioned below is the surface of the substrate holding member 5. Move upward until it contacts the lower surface. At the same time, the coating member 17 located above moves downward so as to have a certain gap with respect to the substrate 100 placed on the substrate holding member 5. Then, as illustrated in FIG. 5, the suction member 18 starts sucking the substrate holding member 5 and the substrate 100, and after fixing the substrate 100, the coating member 17 starts the coating process on the substrate 100. The coating member 17 performs a coating process on the substrate 100 while moving in the X direction. When the coating process is completed, the suction member 18 stops suction, and the surface plate 16 and the suction member 18 move downward. At the same time, the application member 17 moves upward.

(Vacuum drying unit)
FIG. 6 and FIG. 7 are schematic cross-sectional views showing an operation of performing a vacuum drying process on the substrate 100 by the vacuum drying unit 2. As shown in FIGS. 6 and 7, the vacuum drying unit 2 is in contact with the frame 51 from above the substrate holding member 5 and covers the upper portion of the substrate holding member 5, and below the substrate holding member 5. And a lower chamber 22 that contacts the frame 51 and covers the lower part of the substrate holding member 5. The upper chamber 21 includes an O-ring 211 on the contact surface with the frame body 51. Similarly, the lower chamber 22 includes an O-ring 221 on the contact surface with the frame body 51. The lower chamber 22 is provided with a through hole 222 penetrating in the vertical direction. The vacuum drying unit 2 includes a suction member 23 that sucks air from the space formed by the upper chamber 21, the substrate holding member 5, and the lower chamber 22 through the through hole 222 below the lower chamber 22. . The upper chamber 21 and the lower chamber 22 are individually movable in the vertical direction (Z direction). Note that the lower chamber 22 and the suction member 23 are movable in the vertical direction (Z direction) as a unit. A heating plate 24 for heating the substrate 100 is provided on the upper surface of the lower chamber 22.

  The vacuum drying unit 2 performs a vacuum drying process on the substrate 100 as follows. When the substrate holding member 5 that holds the substrate 100 is positioned on the stage S2, S3, or S4, as shown in FIG. 6, the lower chamber 22 and the suction member 23 that are positioned below are configured such that the lower chamber 22 is a frame 51. It moves upward until it touches. At the same time, the upper chamber 21 located above moves downward until the upper chamber 21 contacts the frame body 51. Then, as shown in FIG. 7, when the suction member 23 sucks the space formed by the upper chamber 21, the substrate holding member 5, and the lower chamber 22, the vacuum drying unit 2 vacuum-drys the substrate 100. Process. In the vacuum drying process, the inside of the upper chamber 21 is also sucked through the film body 52 having air permeability. Simultaneously with the vacuum drying process, the heating plate 24 heats the substrate 100 from below to promote drying. When the vacuum drying process is completed, the suction member 23 stops the suction, and the lower chamber 22 and the suction member 23 move downward. At the same time, the upper chamber 21 moves upward.

(Heating unit)
FIG. 8 and FIG. 9 are schematic cross-sectional views showing the operation of performing the heat treatment on the substrate 100 by the heating unit 3. As shown in FIGS. 8 and 9, the heating unit 3 includes a heating member 31 that heats the substrate from below the substrate holding member 5. The heating member 31 is, for example, a heater. The heating member 31 is movable in the vertical direction (Z direction).

  The heating unit 3 heats the substrate 100 as follows. When the substrate holding member 5 holding the substrate 100 is positioned on the stages S5, S6, S7, S8, S9, and S10, the heating member 31 that is positioned below is positioned on the upper surface of the heating member 31 as shown in FIG. Moves upward until it contacts the lower surface of the substrate holding member 5. Then, as shown in FIG. 9, the heating member 31 performs a heating process on the substrate 100 via the substrate holding member 5. When the heat treatment ends, the heating member 31 stops heating and moves downward.

(Cooling unit)
FIG. 10 and FIG. 11 are schematic cross-sectional views showing an operation for performing a cooling process on the substrate 100 by the cooling unit 4. As shown in FIGS. 10 and 11, the cooling unit 4 includes a cooling member 41 that cools the substrate from below the substrate holding member 5. The cooling member 41 is, for example, a water cooling plate. The cooling member 41 is movable in the vertical direction (Z direction).

  The cooling unit 4 performs a cooling process on the substrate 100 as follows. When the substrate holding member 5 holding the substrate 100 is positioned on the stage S11, as shown in FIG. 10, the cooling member 41 located below has the upper surface of the cooling member 41 in contact with the lower surface of the substrate holding member 5. Move up to. Then, as illustrated in FIG. 11, the cooling member 31 performs a cooling process on the substrate 100 via the substrate holding member 5. When the cooling process ends, the cooling member 41 stops cooling and moves downward.

(Removal means)
12, 13, and 15 are schematic cross-sectional views illustrating an operation of removing the substrate 100 from the substrate holding member 5 by the detaching means 7. FIG. 14 is a schematic perspective view showing an operation of removing the substrate 100 from the substrate holding member 5 by the removing means 7. As shown in FIGS. 12 to 15, the detaching means 7 includes a protruding member 71 that pushes the film body 52 and the substrate 100 upward from below the substrate holding member 5, and the protruding member 71 includes the film body 52 and the substrate. A mounting member 72 (also used as the mounting means 6 in this embodiment), which is inserted into the gap D1 between the film body 52 and the substrate 100 generated by pushing up 100 and on which the substrate 100 is mounted. Yes. The protrusion member 71 is movable in the vertical direction (Z direction). Further, the mounting member 72 has a U-shape when viewed from above, and is movable in the insertion direction (X direction) and the vertical direction (Z direction).

  The removing means 7 is configured to remove the substrate 100 from the substrate holding member 5 as follows. When the substrate holding member 5 holding the substrate 100 is positioned on the stage S12, the protruding member 71 located below extends the substrate 100 while extending the film body 52 with respect to the frame body 51, as shown in FIG. Move upward until it is pushed up. Then, as shown in FIGS. 13 and 14, the mounting member 72 moves in the insertion direction, and the protrusion member 71 pushes the film body 52 and the substrate 100 up to form the film body 52 and the substrate 100. It is inserted into the gap D1. And as FIG. 15 shows, the mounting member 72 moves upwards. As a result, the substrate 100 is placed on the placement member 72 and removed from the substrate holding member 5. Thereafter, the mounting member 72 moves the substrate 100 to the next step in a state where the substrate 100 is mounted, and the protrusion member 71 moves downward.

  The substrate processing apparatus 10 operates as follows.

  First, on the stage S <b> 0, the robot arm of the placing unit 6 places the substrate on the substrate holding member 5. Thereafter (when the substrate holding member 5 is positioned on the stage S0 for 20 seconds), the rotation mechanism rotates the conveyor belt 12 by 30 degrees in the R direction. Since the substrate holding member 5 is connected to the transport belt 12, the substrate holding member 5 located on the stage S0 moves to the stage S1. In this embodiment, since it is also used as stage S12 described later, stage S0 takes 20 seconds including the time for removing the substrate at stage S12.

  The application unit 1 is disposed on the stage S1. When the substrate holding member 5 is positioned on the stage S <b> 1, the coating unit 1 performs a coating process on the substrate on the substrate holding member 5. When the coating process is completed (the substrate holding member 5 is positioned on the stage S1 for 20 seconds), the rotation mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S1 moves to the stage S2.

  A vacuum drying unit 2 is disposed on the stage S2. As described above, since the vacuum drying process is performed for 60 seconds, the vacuum drying unit 2 is disposed in each of the stages S2 to S4. When the substrate holding member 5 is positioned on the stage S2, the vacuum drying unit 2 performs a vacuum drying process (first time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S2 for 20 seconds, the vacuum drying unit 2 finishes the vacuum drying process, and the rotation mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S2 moves to the stage S3.

  The vacuum drying unit 2 is also arranged on the stage S3. When the substrate holding member 5 is positioned on the stage S3, the vacuum drying unit 2 performs a vacuum drying process (second time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S3 for 20 seconds, the vacuum drying unit 2 finishes the vacuum drying process, and the rotating mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S3 moves to the stage S4.

  The vacuum drying unit 2 is also arranged on the stage S4. When the substrate holding member 5 is positioned on the stage S4, the vacuum drying unit 2 performs a vacuum drying process (third time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S4 for 20 seconds, the vacuum drying unit 2 finishes the vacuum drying process, and the rotation mechanism rotates the transport belt 12 by 30 degrees in the R direction. This completes the entire vacuum drying process. The substrate holding member 5 located on the stage S4 moves to the stage S5.

  The heating unit 3 is disposed on the stage S5. As described above, since the heat treatment is performed for 120 seconds, the heating unit 3 is disposed in each of the stages S5 to S10. When the substrate holding member 5 is positioned on the stage S5, the heating unit 3 performs a heating process (first time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S5 for 20 seconds, the heating unit 3 finishes the heating process, and the rotating mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S5 moves to the stage S6.

  The heating unit 3 is also arranged on the stage S6. When the substrate holding member 5 is positioned on the stage S <b> 6, the heating unit 3 performs a heating process (second time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S6 for 20 seconds, the heating unit 3 finishes the heating process, and the rotating mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S6 moves to the stage S7.

  The heating unit 3 is also arranged on the stage S7. When the substrate holding member 5 is positioned on the stage S7, the heating unit 3 performs a heat treatment (third time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S7 for 20 seconds, the heating unit 3 finishes the heating process, and the rotating mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S7 moves to the stage S8.

  The heating unit 3 is also arranged on the stage S8. When the substrate holding member 5 is positioned on the stage S8, the heating unit 3 performs a heating process (fourth time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S8 for 20 seconds, the heating unit 3 finishes the heating process, and the rotation mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S8 moves to the stage S9.

  The heating unit 3 is also arranged on the stage S9. When the substrate holding member 5 is positioned on the stage S9, the heating unit 3 performs a heating process (fifth time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S9 for 20 seconds, the heating unit 3 finishes the heating process, and the rotating mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S9 moves to the stage S10.

  The heating unit 3 is also arranged on the stage S10. When the substrate holding member 5 is positioned on the stage S <b> 10, the heating unit 3 performs a heating process (sixth time) on the substrate on the substrate holding member 5. When the substrate holding member 5 is positioned on the stage S10 for 20 seconds, the heating unit 3 finishes the heating process, and the rotating mechanism rotates the transport belt 12 by 30 degrees in the R direction. This completes the entire heat treatment. The substrate holding member 5 located on the stage S10 moves to the stage S11.

  The cooling unit 4 is arranged on the stage S11. When the substrate holding member 5 is positioned on the stage S <b> 11, the cooling unit 4 performs a cooling process on the substrate on the substrate holding member 5. When the cooling process ends (the substrate holding member 5 is positioned on the stage S11 for 20 seconds), the rotation mechanism rotates the transport belt 12 by 30 degrees in the R direction. The substrate holding member 5 located on the stage S11 moves to the stage S12.

  Removal means 7 is arranged on stage S12. When the substrate holding member 5 is positioned on the stage S <b> 12, the removing unit 7 removes the substrate from the substrate holding member 5.

  According to the substrate processing apparatus 10 configured as described above, the following effects can be exhibited.

(1) The transport unit 11 is configured to transport the substrate holding member 5 horizontally between the processing units in a state where the substrate holding member 5 holds the substrate. The operations of placing the substrate on the substrate holding member 5 and removing the substrate from the substrate holding member 5 can be omitted, and the time for transporting the substrate can be shortened.

(2) By placing the substrate on the film body 52 made of a film having air permeability, the substrate can be transported between the processing units while being held by the substrate holding member 5. In addition, since the film body 52 has air permeability, the substrate holding property of the substrate holding member 5 can be further improved by sucking the substrate from below the substrate holding member 5. Moreover, since the film body 52 has air permeability, the substrate can be efficiently vacuum-dried, heated, and cooled while being placed on the film body 52.

(3) Since the substrate is merely placed on the film body 52, positioning of the substrate with respect to the substrate holding member 5 is performed along with the raising and lowering pins for raising and lowering the substrate from the substrate holding member 5 and attaching the raising and lowering pins. The substrate positioning mechanism to be performed and the holes for the lift pins in the film body 52 can be eliminated. As a result, as long as the substrate is smaller than the film body 52, the substrate holding member 5 can handle any size substrate.

(4) The coating unit 1 can perform coating on the substrate placed on the substrate holding member 5. In addition, when the coating unit 1 includes the suction member 18, when the substrate is coated, the suction member 18 sucks the substrate from below the substrate holding member 5, thereby further improving the substrate holding property of the substrate holding member 5. Thereby improving the accuracy of the coating thickness.

(5) The substrate placed on the substrate holding member 5 can be vacuum dried by the vacuum drying unit 2.

(6) Since the upper chamber 21 includes the O-ring 211 on the contact surface with the frame 51 and the lower chamber 22 includes the O-ring 221 on the contact surface with the frame 51, the upper chamber 21, the sealing property of the space formed by the substrate holding member 5 and the lower chamber 22 can be easily ensured.

(7) Since the heating plate 24 for heating the substrate 100 is provided on the upper surface of the lower chamber 22, the substrate can be dried more effectively during vacuum drying.

(8) The substrate placed on the substrate holding member 5 can be heated by the heating unit 3.

(9) The substrate placed on the substrate holding member 5 can be cooled by the cooling unit 4.

(10) The substrate placed on the substrate holding member can be removed from the substrate holding member by the removing means 7. In particular, it is possible to remove the substrate from the substrate holding member while eliminating the need for lifting pins that raise and lower the substrate from the substrate holding member and a substrate positioning mechanism that accompanies the attachment of the lifting pins. As a result, any size substrate can be handled as long as it is smaller than the film body.

  The film body provided with air permeability is, for example, an air-permeable resin film or a metal mesh film. Examples of the structure for providing air permeability include that the film body has a large number of small through holes, or that the film body itself is made of a porous material, but is not limited thereto. Alternatively, air permeability may be provided in other configurations. As a material of the resin film, for example, polytetrafluoroethylene (PTFE) can be used. Moreover, a metal mesh film is a metal screen for printing, for example, As a material of a metal mesh film, stainless steel, aluminum, etc. can be used, for example. The thickness of the film body is about 200 to 500 micrometers in the case of a resin film, and about 20 to 100 micrometers in the case of a metal mesh film. When using a resin film as a film body, the cost of a film body can be reduced compared with a metal mesh film. Also, when using a metal mesh film as the film body, it has better thermal conductivity than a resin film and enables thinner processing, so the heat capacity of the film body is reduced, and the substrate is heated and cooled efficiently. be able to. And by using a metal mesh film, a film body can be made thin uniformly, As a result, when performing application | coating to a board | substrate, the precision of application | coating thickness can be improved more.

  The surface of the film body may be anti-slip so that the substrate to be placed does not slide on the film body. When a resin film is used as the film body, an adhesive material may be applied to the surface of the resin film to the extent that air permeability is not hindered.

  In the above embodiment, the substrate processing apparatus 10 includes one coating unit 1, three vacuum drying units 5, six heating units 3, and one cooling unit 4. However, according to the processing time of each processing unit. The number of processing units is changed. For example, when the coating processing time is 20 seconds, the vacuum drying processing time is 40 seconds, the heating processing time is 100 seconds, and the cooling processing time is 60 seconds, the substrate processing apparatus 10 includes one coating unit and two vacuum drying units. Five heating units 3 and three cooling units 4 are provided. When the coating processing time is 20 seconds, the vacuum drying processing time is 40 seconds, the heating processing time is 100 seconds, and the cooling processing time is 40 seconds, the substrate processing apparatus 10 has one coating unit, two vacuum drying units. Five heating units 3 and two cooling units 4 will be provided, and one of the twelve stages will be left over. In this case, no processing unit is arranged on this extra stage.

  In the above embodiment, the single support portion 51c of the substrate holding member 5 is illustrated, but a plurality of support portions may be provided.

  In the above embodiment, the upper chamber 21 and the lower chamber 22 are each in contact with the frame body 51, but may be in contact with the film body 52. In this case, the contact portion of the film body 52 needs to be processed so that air does not leak so that the vacuum can be maintained by contacting the upper chamber 21 and the lower chamber 22. For example, as shown in FIG. 16, it is conceivable that only the contact portion of the film body is made of a metal or resin 25 having no air permeability.

  In the above embodiment, the upper chamber 21 and the lower chamber 22 are individually movable in the vertical direction, but the upper chamber 21 and the lower chamber 22 are movable in the vertical direction in conjunction with each other. Also good. In this case, when the upper chamber 21 moves downward, the lower chamber 22 moves upward, and when the upper chamber 21 moves upward, the lower chamber 22 moves downward.

  In the above embodiment, the lower chamber 22 is provided with the suction through hole 222, and the lower chamber 22 is provided with the suction member 23. The upper chamber 21 has the suction through hole, and the upper chamber 21 is provided with the suction member. May be provided, and both the lower chamber 22 and the upper chamber 21 may be provided with a suction through-hole and a suction member. Further, the suction member 18 and the suction member 23 may be arranged in another place, and suction may be performed by connecting the suction member and the surface plate 16 or the lower chamber 22 with a stretchable pipe.

  In the above embodiment, the heating plate 24 is provided on the upper surface of the lower chamber 22, but a heating plate may be provided on the lower surface of the upper chamber 21, and both the upper surface of the lower chamber 22 and the lower surface of the upper chamber 21 are provided. A heating plate may be provided.

  In the above embodiment, the heating member 31 heats the substrate 100 from below, but it may heat the substrate from above. In this case, the heating member is located above the substrate with a certain gap and heats the substrate so as not to touch the coating surface. Moreover, a heating member may be located both above and below the substrate to heat the substrate from above and below.

  In the above embodiment, the cooling member 41 cools the substrate 100 from below, but it may cool the substrate from above. In this case, the cooling member is positioned above the substrate with a certain gap, and cools the substrate so as not to touch the coating surface. Further, a cooling member may be positioned both above and below the substrate to cool the substrate from above and below.

  In the above embodiment, the substrate is removed from the substrate holding member 5 by the protrusion member 71 and the mounting member 72, but a plurality of insertion holes into which the lifting pins are inserted are formed in the film body of the substrate holding member. Then, the substrate may be removed from the substrate holding member by inserting the lifting pins through the insertion holes and lifting the substrate from the substrate holding member.

  In the above embodiment, the placement of the substrate on the substrate holding member 5 is performed by the robot arm which is the placing means 6, but this operation is not limited to the robot arm, and other various methods. It may be done by.

  In the above embodiment, the conveyance line 14 has a circular shape, but the conveyance line 14 is not limited to a circular shape, and an elliptical shape as shown in FIG. 17, a U shape, a linear shape, etc. Can have various shapes.

  In the above embodiment, the number of processing units and the number of substrate holding members 5 are the same, and all the substrate holding members 5 are rotated by the same angle at a time by the transport unit 11. Not. FIG. 18 is a schematic top view of a substrate processing apparatus according to another embodiment. The same parts and portions as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIG. 18, the number of substrate holding members 5 may be less than the number of stages S, and the substrate holding members 5 may rotate independently of each other. A standby stage P in which no processing unit is present may be provided for adjusting the processing time. In this way, the processing in each processing unit can be batch-type. As a result, the number of units can be reduced, and the installation area of the substrate processing apparatus can be reduced. In addition, the substrate processing apparatus can be manufactured at low cost for small-scale production and experiments.

  Further, as shown in FIG. 18, the stage S0 on which the substrate is placed and the stage S12 from which the substrate is removed may be separated. Further, each processing unit may be movable instead of being fixedly installed on the substrate processing apparatus. As a result, the processing units can be freely rearranged according to the processing content and processing time. An arbitrary processing unit can be kept on standby as the spare processing unit 81. Further, the substrate holding member 5 may be configured to be freely removable with respect to the transport belt 12 and may be kept on standby as a spare substrate holding member 82.

  Further, the transport belt 12 may be detachable from the shaft 13. If the conveyor belt 12 is detachably attached to the shaft 13, the conveyor belt 12 having a large diameter as shown in FIG. 1 can be exchanged with the conveyor belt 12 having a small diameter as shown in FIG. As a result, the production amount and installation area of the substrate processing apparatus can be adjusted by changing the size of the transport belt to be attached.

  FIG. 19 is a schematic top view of a substrate processing apparatus according to another embodiment. The same parts and portions as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIG. 19, the substrate processing apparatus 10 further includes a substrate holding member 5 ′ and a stage S ′ on the outer periphery of the substrate holding member 5 and the stage S. The substrate holding member 5 ′ is connected to the substrate holding member 5, and when the transport belt 12 is rotated by the operating mechanism (rotation mechanism), the substrate holding member 5 connected to the transport belt 12 is rotated to hold the substrate. When the member 5 rotates, the substrate holding member 5 ′ connected to the substrate holding member 5 rotates. According to this configuration, the substrate processing amount of the substrate processing apparatus can be increased.

  FIG. 20 is a schematic side view of a substrate processing apparatus according to another embodiment. The same parts and portions as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIG. 20, the substrate processing apparatus 10 includes a transport belt 12 ″ above the transport belt 12. The operation mechanism (rotation mechanism) has the transport belt 12 and the transport belt around the shaft 13. 12 ″ is rotated in a certain direction. A substrate holding member 5 ″ is coupled to the transport belt 12 ″, and the substrate holding member 5 ″ is positioned above the substrate holding member 5. According to this configuration, the substrate processing apparatus includes: The substrate processing amount of the substrate processing apparatus can be increased without substantially increasing the installation area. In this configuration, the additional substrate holding member 5 ″ is positioned above the substrate holding member 5. However, it may be positioned below the substrate holding member 5. In this case, the conveyor belt 12 ″ is positioned below the conveyor belt 12. Also, three or more conveyor belts are provided at intervals in the vertical direction, and three or more substrate holding members are arranged in the vertical direction. Also good.

  The substrate processing apparatus of the said embodiment can also be utilized as an apparatus which manufactures the various board | substrate for flat panel displays, and a semiconductor substrate.

  Various modifications and changes can be made without departing from the spirit and scope of the invention as set forth in the appended claims.

  In the present invention, a substrate processing apparatus and a substrate holding member capable of shortening the substrate transport time can be provided, and thus the industrial utility value is great.

DESCRIPTION OF SYMBOLS 1 Application | coating unit 2 Vacuum drying unit 21 Upper chamber 22 Lower chamber 211 O-ring 221 O-ring 222 Through-hole 23 Suction member 24 Heating plate 25 Non-breathable resin or metal 3 Heating unit 31 Heating member 4 Cooling unit 41 Cooling member 5 Substrate Holding member 51 Frame body 52 Film body 51a Opening portion 51b Placement portion 51c Support portion 6 Placement means 7 Removal means 71 Projection member 72 Placement member 81 Preliminary processing unit 82 Preliminary substrate holding member 10 Substrate processing apparatus 11 Conveying means 12 Conveying belt 13 Shaft 14 Conveying line 16 Surface plate 17 Coating member 18 Suction member 100 Substrate

Claims (13)

A substrate processing apparatus for processing a substrate,
A substrate holding member for holding the substrate;
A processing unit comprising a plurality of processing units for processing a substrate;
A transport means for transporting the substrate,
The transport means is configured to transport the substrate holding member horizontally between the processing units in a state where the substrate holding member holds the substrate.
Each of the processing units is configured to access the substrate holding member from above and / or below. The substrate holding member has a frame body having an opening and a film body that covers the opening and is attached to the frame body, and the substrate is placed on the film body by placing the substrate on the film body. To hold,
The substrate processing apparatus according to claim 1, wherein the film body is made of a film having air permeability. The processing unit includes a coating unit that coats a substrate as the processing unit,
The coating unit includes a surface plate that supports the substrate holding member from below;
An application member that performs application on the substrate from above the substrate holding member,
The substrate processing apparatus according to claim 1, wherein the surface plate is movable in a vertical direction. The processing unit includes, as the processing unit, a vacuum drying unit that vacuum-drys the substrate,
The vacuum drying unit is in contact with the substrate holding member from above the substrate holding member, and covers the upper portion of the substrate holding member;
A lower chamber that comes into contact with the substrate holding member from below the substrate holding member and covers the lower portion of the substrate holding member,
The substrate processing apparatus according to claim 1, wherein the upper chamber and the lower chamber are movable in a vertical direction. The processing unit includes a heating unit that heats the substrate as the processing unit,
The heating unit includes a heating member that heats the substrate from above and / or below the substrate holding member,
The substrate processing apparatus according to claim 1, wherein the heating member is movable in a vertical direction. The processing unit includes a cooling unit that cools the substrate as the processing unit.
The cooling unit includes a cooling member that cools the substrate from above and / or below the substrate holding member,
The substrate processing apparatus according to claim 1, wherein the cooling member is movable in a vertical direction. The substrate processing apparatus further includes removal means for removing the substrate from the substrate holding member,
The film body has elasticity,
The removing means includes a protruding member that pushes the film body and the substrate upward from below the substrate holding member, the film body that is generated when the protruding member pushes the film body and the substrate, and the The substrate processing apparatus according to claim 2, further comprising: a mounting member that is inserted into a gap between the substrate and the substrate.   The substrate processing apparatus according to claim 1, wherein the transport unit transports the substrate holding member so as to circulate.   The substrate processing apparatus according to claim 1, wherein the substrate holding member and / or the processing unit is removable from the substrate processing apparatus. The transport means includes a circular or elliptical transport belt, and an operating mechanism that operates the transport belt.
A plurality of substrate holding members are coupled to the transport belt,
The substrate processing apparatus according to claim 8, wherein a further substrate holding member is coupled to the substrate holding member on an outer peripheral side of the substrate holding member. The transport means includes a circular transport belt, an operating mechanism for rotating the transport belt, and a shaft serving as a rotation center of the transport belt,
The substrate processing apparatus according to claim 8, wherein the transport belt is detachably attached to the shaft. The transport means includes a plurality of transport belts positioned in the vertical direction with respect to each other, and an operation mechanism that operates the plurality of transport belts.
A plurality of substrate holding members are connected to each of the transport belts,
The substrate processing apparatus according to claim 1, wherein the substrate holding member connected to the transport belt is arranged at a vertical position of a substrate holding member connected to another transport belt. A substrate holding member that is used in a substrate processing apparatus for processing a substrate and holds a substrate,
The substrate holding member includes a frame body having an opening and a film body that covers the opening and is attached to the frame body, and the substrate is placed on the film body by placing the substrate on the film body. To hold,
The substrate holding member, wherein the film body is made of a film having air permeability.

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