JP2015149428A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2015149428A JP2015149428A JP2014022392A JP2014022392A JP2015149428A JP 2015149428 A JP2015149428 A JP 2015149428A JP 2014022392 A JP2014022392 A JP 2014022392A JP 2014022392 A JP2014022392 A JP 2014022392A JP 2015149428 A JP2015149428 A JP 2015149428A
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- cleaning liquid
- cutting
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- 238000004140 cleaning Methods 0.000 claims abstract description 118
- 239000007788 liquid Substances 0.000 claims abstract description 80
- 239000012530 fluid Substances 0.000 claims abstract description 37
- 238000002347 injection Methods 0.000 claims abstract description 32
- 239000007924 injection Substances 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000007921 spray Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 5
- 239000000243 solution Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 33
- 230000000694 effects Effects 0.000 description 7
- 238000011109 contamination Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
3 チャックテーブル
27 第1の切削手段
28 第2の切削手段
40 洗浄ノズル手段
42 本体部
44 エアー供給路
45 圧縮エアー供給源
46 エアー分岐供給路
51 洗浄液供給路
52 洗浄液供給源
55 噴射口
C ウォーターカーテン
W ウェーハ(被加工物)
Claims (2)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削領域において切削する切削手段と、該チャックテーブルを切削方向に駆動する切削送り手段と、圧縮エアーと洗浄液とが混合された2流体洗浄液を噴射する洗浄ノズル手段とを備えた切削装置であって、
該洗浄ノズル手段は、矩形形状に形成されて該チャックテーブルの移動経路に交差する方向に該矩形形状の長辺側が配設された本体部と、該本体部下端から下方向に向けて洗浄液を噴射するように該長辺の延伸方向に間隔を置いて複数開口した噴射口と、該本体部の矩形形状長辺側に沿って延伸して形成されたエアー供給路と、該エアー供給路内に圧縮エアーを供給する圧縮エアー供給源と、該エアー供給路から各噴射口に向かって垂直に延伸して形成された複数のエアー分岐供給路と、各該エアー分岐供給路と各該噴射口とを連結する複数の混合室と、各該混合室内に洗浄液を供給する洗浄液供給路と、該洗浄液供給路内に洗浄液を供給する洗浄液供給源と、を備え、
各該エアー分岐供給路から供給された圧縮エアーと、各該洗浄液供給路から供給された洗浄液とが該混合室内で混合された2流体洗浄液が、複数の該噴射口から噴射されてウォーターカーテンを形成すること、を特徴とする切削装置。 - 各該噴射口からは、該本体部の矩形形状の長辺側に沿って広がる扇状に2流体洗浄液が噴射されること、を特徴とする請求項1記載の切削装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014022392A JP6317941B2 (ja) | 2014-02-07 | 2014-02-07 | 切削装置 |
KR1020150012780A KR102210283B1 (ko) | 2014-02-07 | 2015-01-27 | 절삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014022392A JP6317941B2 (ja) | 2014-02-07 | 2014-02-07 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015149428A true JP2015149428A (ja) | 2015-08-20 |
JP6317941B2 JP6317941B2 (ja) | 2018-04-25 |
Family
ID=53892557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014022392A Active JP6317941B2 (ja) | 2014-02-07 | 2014-02-07 | 切削装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6317941B2 (ja) |
KR (1) | KR102210283B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018192546A (ja) * | 2017-05-15 | 2018-12-06 | 株式会社ディスコ | 切削装置 |
CN111530649A (zh) * | 2019-02-07 | 2020-08-14 | 株式会社迪思科 | 清洗喷嘴以及被清洗物的清洗方法 |
KR20230153255A (ko) | 2022-04-28 | 2023-11-06 | 가부시기가이샤 디스코 | 가공 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168659A (ja) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | 高圧洗浄ノズルを有するシンギュレーション装置 |
JP2006073828A (ja) * | 2004-09-02 | 2006-03-16 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
US20080230092A1 (en) * | 2007-03-23 | 2008-09-25 | Alexander Sou-Kang Ko | Method and apparatus for single-substrate cleaning |
JP2010118644A (ja) * | 2008-10-15 | 2010-05-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3410385B2 (ja) | 1999-04-19 | 2003-05-26 | 株式会社ディスコ | 洗浄装置及び切削装置 |
JP2003234308A (ja) | 2002-02-08 | 2003-08-22 | Disco Abrasive Syst Ltd | 切削装置 |
-
2014
- 2014-02-07 JP JP2014022392A patent/JP6317941B2/ja active Active
-
2015
- 2015-01-27 KR KR1020150012780A patent/KR102210283B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168659A (ja) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | 高圧洗浄ノズルを有するシンギュレーション装置 |
JP2006073828A (ja) * | 2004-09-02 | 2006-03-16 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
US20080230092A1 (en) * | 2007-03-23 | 2008-09-25 | Alexander Sou-Kang Ko | Method and apparatus for single-substrate cleaning |
JP2010118644A (ja) * | 2008-10-15 | 2010-05-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018192546A (ja) * | 2017-05-15 | 2018-12-06 | 株式会社ディスコ | 切削装置 |
CN111530649A (zh) * | 2019-02-07 | 2020-08-14 | 株式会社迪思科 | 清洗喷嘴以及被清洗物的清洗方法 |
KR20230153255A (ko) | 2022-04-28 | 2023-11-06 | 가부시기가이샤 디스코 | 가공 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20150093587A (ko) | 2015-08-18 |
KR102210283B1 (ko) | 2021-01-29 |
JP6317941B2 (ja) | 2018-04-25 |
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