JP2015122422A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015122422A5 JP2015122422A5 JP2013265652A JP2013265652A JP2015122422A5 JP 2015122422 A5 JP2015122422 A5 JP 2015122422A5 JP 2013265652 A JP2013265652 A JP 2013265652A JP 2013265652 A JP2013265652 A JP 2013265652A JP 2015122422 A5 JP2015122422 A5 JP 2015122422A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- semiconductor element
- adherend
- thickness
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- 239000002313 adhesive film Substances 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- 239000011256 inorganic filler Substances 0.000 claims 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013265652A JP6074357B2 (ja) | 2013-12-24 | 2013-12-24 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013265652A JP6074357B2 (ja) | 2013-12-24 | 2013-12-24 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015122422A JP2015122422A (ja) | 2015-07-02 |
| JP2015122422A5 true JP2015122422A5 (enExample) | 2016-06-16 |
| JP6074357B2 JP6074357B2 (ja) | 2017-02-01 |
Family
ID=53533801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013265652A Active JP6074357B2 (ja) | 2013-12-24 | 2013-12-24 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6074357B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018207920A1 (ja) * | 2017-05-12 | 2018-11-15 | 日産化学株式会社 | 半導体装置密着層形成用エポキシ樹脂組成物 |
| JP2020043258A (ja) * | 2018-09-12 | 2020-03-19 | キオクシア株式会社 | 半導体メモリおよびその製造方法 |
| JP2022115581A (ja) * | 2021-01-28 | 2022-08-09 | 昭和電工マテリアルズ株式会社 | 半導体装置及びその製造方法、並びに、熱硬化性樹脂組成物、接着フィルム及びダイシング・ダイボンディング一体型フィルム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005327789A (ja) * | 2004-05-12 | 2005-11-24 | Sharp Corp | ダイシング・ダイボンド兼用粘接着シートおよびこれを用いた半導体装置の製造方法 |
| JP2010118554A (ja) * | 2008-11-13 | 2010-05-27 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| JP2011102383A (ja) * | 2009-10-14 | 2011-05-26 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
| CN102842541A (zh) * | 2011-06-22 | 2012-12-26 | 日东电工株式会社 | 层叠膜及其使用 |
| JP5930625B2 (ja) * | 2011-08-03 | 2016-06-08 | 日東電工株式会社 | ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置 |
| JP6094031B2 (ja) * | 2012-01-05 | 2017-03-15 | 日立化成株式会社 | 接着剤組成物、接着シート及び半導体装置 |
-
2013
- 2013-12-24 JP JP2013265652A patent/JP6074357B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2012040215A3 (en) | Stacked die assemblies including tsv die | |
| JP2017204656A5 (enExample) | ||
| JP2010199541A5 (enExample) | ||
| JP2010171402A5 (enExample) | ||
| JP2010199542A5 (enExample) | ||
| TW201613760A (en) | Composite sheet for resin film formation | |
| JP2011228450A5 (enExample) | ||
| JP2015527736A5 (enExample) | ||
| EP2770032A3 (en) | Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device | |
| JP2012039090A5 (enExample) | ||
| TWI456645B (zh) | 半導體裝置用膜以及半導體裝置 | |
| JP2019523994A5 (enExample) | ||
| WO2017137796A8 (ja) | 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム | |
| WO2014112954A8 (en) | Substrate for semiconductor packaging and method of forming same | |
| WO2009131405A3 (ko) | 에폭시계 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치 | |
| JP2011233552A5 (enExample) | ||
| JP2014504663A5 (enExample) | ||
| JP2014150253A5 (enExample) | ||
| JP2013131669A5 (enExample) | ||
| TW200727446A (en) | Stack type semiconductor device manufacturing method and stack type electronic component manufacturing method | |
| JP2015195266A5 (ja) | ダイシングシート付きダイボンドフィルム、及び、半導体装置の製造方法 | |
| WO2017034644A3 (en) | Method of providing an electronic device and electronic device thereof | |
| JP2017220543A5 (enExample) | ||
| JP2017022017A5 (enExample) | ||
| JP2015122422A5 (enExample) |