JP2015088556A - Electronic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic module which stably secures the ability of conducting heat from an electronic component to a radiator.SOLUTION: An electronic module 1 includes a radiator 10 and a power semiconductor device 20 (an electronic component) which is fastened to the radiator 10 through thermal grease 2 by a screw member 6 (screw fastening means). Spacers 3A which hold the power semiconductor device 20 separated from the radiator 10 is provided between the radiator 10 and the power semiconductor device 20.

Description

  The present invention relates to an electronic module, and more particularly to a technique that is effective when applied to an electronic module having a heat dissipation structure in which an electronic component is fastened and fixed with thermal grease interposed in a heat radiator.

  As an electronic component mounted on an electronic module, for example, a semiconductor device (hereinafter referred to as a power semiconductor device) including a power transistor such as an IGBT (Insulated Gate Bipolar Transistor) is known. This power semiconductor device has a high heat generation density because it handles a large amount of power. Therefore, various heat dissipation structures have been proposed and put to practical use in electronic modules equipped with electronic components with high heat generation density such as power semiconductor devices in order to improve heat dissipation.

For example, Patent Document 1 discloses a heat dissipation structure in which an auxiliary plate is fastened (fastened) with a screw member with thermal grease interposed in a recess of a module case, and an electronic component is installed on the auxiliary plate. .
Patent Document 2 discloses a heat dissipation structure in which an exothermic electronic component is fastened and fixed with a screw member with an oil compound (heat conducting material) interposed in the heat dissipation member.

  In the present application, paste-like thermally conductive materials such as thermal grease (thermal grease), thermal paste, silicon grease, and heat sink compound are collectively referred to as thermal grease.

JP 2013-89672 A Japanese Patent Laid-Open No. 2004-221111

  By the way, as a heat dissipation structure in an electronic module, a structure in which an electronic component is attached to a heat radiating body such as a finned heat radiating member or a heat radiating plate and the heat of the electronic component is transmitted to the heat radiating body to escape is a typical heat radiating structure. One. In such a heat dissipation structure, there are fine irregularities on the joint surfaces of the radiator and the electronic component, and air with low thermal conductivity is included between the joint surfaces due to the influence of the gaps due to the fine irregularities. When the heat generation density of the electronic component is high, a desired heat dissipation effect cannot be obtained.

Therefore, as disclosed in Patent Document 1 and Patent Document 2, a heat dissipation structure in which thermal grease is interposed between the heat dissipation body and the electronic component is employed in the electronic module. Since this heat dissipation structure can fill the gaps due to fine irregularities present on the joint surfaces of the heat dissipation body and the electronic component with thermal grease, air can be expelled from between them.
However, in the conventional heat dissipation structure, as in Cited Document 1 and Cited Document 2, when electronic components are fastened and fixed by screw members with thermal grease interposed in the heat dissipating body, the electronic components are held away from the heat dissipating body. Therefore, the thickness of the thermal grease is likely to fluctuate depending on the fluctuation of the tightening torque of the screw member, that is, the tightening condition of the screw member, and is not stable. For this reason, there is a portion where the heat sink and the electronic component are in contact with each other and a portion where thermal grease is interposed between the heat sink and the electronic component, and the heat sink and the electronic component are in contact with the thermal grease. Variations occur.

This contact variation means a variation in thermal resistance between the radiator and the electronic component. If there is such a variation in thermal resistance, the heat conduction performance from the electronic component to the radiator will be reduced. It is necessary to keep the thickness of the thermal grease interposed between the electronic components stable.
The objective of this invention is providing the electronic module which can ensure stably the heat-conduction performance from an electronic component to a heat sink.

(1) The electronic module which concerns on 1 aspect of this invention is an electronic module which has a heat radiator and the electronic component fastened and fixed with the screw fastening means via the thermal grease in the said heat sink, The said heat sink And a spacer for separating and holding the electronic component from the radiator.
According to the above-mentioned means (1), when the electronic component is fastened and fixed by the screw tightening means with the thermal grease interposed in the heat sink, the electronic component is held away from the heat sink. The thickness of the thermal grease interposed between the radiator and the electronic component can be stably maintained without being affected by the torque fluctuation. As a result, contact variation between the heat radiator and the electronic component and the thermal grease can be suppressed, so that the heat transfer performance from the electronic component to the heat radiator can be stably secured.

  In addition, the thickness of the thermal grease can be managed to be a required value by defining the spacer height dimension and setting the distance between the radiator and the electronic component. For this reason, by determining the height dimension of the spacer according to the thermal design conditions of the electronic module, it is possible to design the amount of heat dissipated from the electronic component to the radiator.

(2) In the electronic module according to the means (1), the electronic component includes a heating element, an element mounting portion on which the heating element is mounted, and a screw-fastening and fixing arranged side by side with the element mounting portion. A heat transfer portion in which the element mounting portion is connected via the thermal grease, and a screw tightening fixing in which the screw tightening fixing portion is fastened and fixed by the screw tightening means. Preferably, the spacer is provided between the screw tightening fixing portion of the radiator and the screw tightening fixing portion of the electronic component.
According to the above-described means (2), since the screw tightening fixing portion is supported by the screw tightening fixing portion via the spacer, it is possible to suppress warping of the electronic component due to tightening of the screw tightening means.

(3) In the electronic module according to the means (2), the radiator has a recess, the heat transfer portion and the screw fastening portion are provided on a bottom surface of the recess, and the electronic component is in the recess. It is preferable that they are arranged.
According to the means (3) described above, when the electronic component is fastened and fixed by the screw fastening means with the thermal grease interposed in the heat sink, a part of the thermal grease protrudes between the heat sink and the electronic component. In addition, since the spread of the thermal grease can be suppressed by the concave portion, the work of removing the protruding thermal grease can be omitted, and the production efficiency of the electronic module can be improved.

(4) In the electronic module according to the means (2) or the means (3), it is preferable that the spacer is provided in the screw tightening fixing portion so as to protrude from the heat transfer portion.
According to the above-mentioned means (4), when the electronic component is fastened and fixed by the screw fastening means with the thermal grease interposed in the radiator, it is possible to save the trouble of arranging the spacers individually. Can be easily.

(5) In the electronic module according to the means (2) or the means (3), it is preferable that the spacer is provided in the screw tightening fixing portion so as to protrude from the element mounting portion. .
Even with the means (5) described above, when the electronic components are fastened and fixed by the screw fastening means with the thermal grease interposed in the radiator, it is possible to save the trouble of arranging the spacers individually, so that the electronic parts can be easily attached. Can be.

(6) In the electronic module according to any one of the means (2) to the means (5), the screw tightening fixing portion and the screw tightening fixing portion sandwich the heat transfer portion and the element mounting portion. It is preferable that they are arranged at least in the respective regions located on opposite sides.
According to the means (6) described above, since the electronic component is held at a plurality of locations, the electronic component can be stably attached to the radiator and the thickness of the thermal grease can be more stably maintained. .

(7) In the electronic module according to any one of the means (1) to the means (6), a separation distance between the heat radiator and the electronic component is preferably 0.01 mm to 3 mm. .

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.
According to the electronic module of the present invention, it is possible to stably ensure the heat conduction performance from the electronic component to the heat radiator.

It is a top view which shows schematic structure of the electronic module which is Embodiment 1 of this invention. FIG. 2 is a plan view showing a state where a mounting board is removed in the electronic module of FIG. 1. It is sectional drawing along the AA line of FIG. It is sectional drawing to which a part of FIG. 3 was expanded. It is sectional drawing which shows schematic structure of the electronic module which is Embodiment 2 of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments of the invention, and the repetitive description thereof is omitted.
(Embodiment 1)
In the first embodiment, an example in which the present invention is applied to an electronic module having a power semiconductor device as an electronic component will be described. In the first embodiment, an example in which a spacer that holds the power semiconductor device away from the radiator is provided on the radiator will be described.

Hereinafter, an electronic module according to Embodiment 1 of the present invention will be described with reference to FIGS.
1 to 4, the electronic module 1 according to the first embodiment includes a heat radiator 10 and a power semiconductor device 20 as an electronic component that is fastened and fixed to the heat radiator 10 with a screw member 6 with a thermal grease 2 interposed therebetween. And have. In addition, the electronic module 1 according to the first embodiment includes a mounting substrate 30 on which the power semiconductor device 20 is mounted. The screw member 6 corresponds to the screw fastening means of the present invention. That is, the electronic module 1 of the first embodiment has a heat dissipation structure in which the power semiconductor device 20 is fastened and fixed by the screw member 6 as a screw tightening means with the thermal grease 2 interposed in the heat dissipating body 10. In the first embodiment, the radiator 10 has a recess 11, and the power semiconductor device 20 is disposed in the recess 11 of the radiator 10. The recess 11 is formed in a slightly larger planar size than the power semiconductor device 20 when viewed in plan.

The power semiconductor device 20 includes a base member 21, a cap 25, a plurality of lead pins 26, and a plurality of heating elements 27.
The base member 21 has an element mounting portion 22 on which a plurality of heat generating elements 27 are mounted, and a screw tightening fixing portion 23 arranged alongside the element mounting portion 22. That is, in the first embodiment, in the power semiconductor device 20, the element mounting portion 22 and the screw tightening fixing portion 23 are formed of the same member. Although not limited to this, the base member 21 is mainly composed of, for example, a metal plate made of a copper material having good thermal conductivity. Although not shown, a wiring layer insulated from the metal plate is provided on one main surface side of the metal plate.

The cap 25 has a concave shape in which the center of the ceiling is surrounded by legs, and is fixed to the base member 21 so as to cover the plurality of heating elements 27. Although not shown, the cap 25 has a wiring layer.
The plurality of lead pins 26 are provided on the ceiling portion of the cap 25 so as to protrude from the cap 25. Although not shown, the plurality of lead pins 26 are electrically connected to a wiring layer provided on the cap 25.

Each of the plurality of heating elements 27 is a semiconductor chip in which a power transistor such as an IGBT is incorporated. Each of the plurality of heating elements 27 is electrically connected to the plurality of lead pins 26 via the wiring layer of the base member 21 and the wiring layer of the cap 25.
In the radiator 10, the heat transfer portion 12 in which the element mounting portion 22 of the power semiconductor device 20 is connected via the thermal grease 2 and the screw tightening fixing portion 23 of the power semiconductor device 20 are fastened and fixed by the screw member 6. And a screw tightening fixing portion 13. In the first embodiment, the heat transfer portion 12 and the screw tightening fixing portion 23 are provided on the bottom surface of the recess 11. The radiator 10 is made of, for example, aluminum or alumina having good thermal conductivity.

  The screw member 6 has a configuration in which a head portion and a male screw portion are provided. The male screw portion of the screw member 6 is fitted into the female screw portion provided in the screw tightening fixing portion 13 of the radiator 10 through the through hole 24 provided in the screw tightening fixing portion 23 of the base member 21. The power semiconductor device 20 is fastened and fixed (fastened) to the heat radiating body 10 by a fastening force by fitting the male screw portion of the screw member 6 and the female screw portion of the heat radiating body 10.

The screw tightening fixing portion 13 of the radiator 10 and the screw tightening fixing portion 23 of the power semiconductor device 20 are positioned at least on opposite sides of the heat transfer portion 12 of the heat radiator 10 and the element mounting portion 22 of the power semiconductor device 20. It is arranged in each area.
The mounting board 30 is formed of, for example, a printed wiring board. The power semiconductor device 20 is mounted on the mounting substrate 30. The lead pin 26 of the power semiconductor device 20 is inserted into a through-hole wiring of the mounting substrate 30 and is electrically and mechanically connected to the through-hole wiring by solder.

  The mounting board 30 is fastened and fixed by a screw member 33 to a support body 32 disposed between the heat sink 10 and the power semiconductor device 20 so that the power semiconductor device 20 is disposed between the mount board 30 and the support body 32. And is supported by the radiator 10. The mounting substrate 30 is provided with a through-hole 31 for inserting a tool for turning the screw member 6 when the power semiconductor device 20 is fastened and fixed to the radiator 10 with the screw member 6.

In addition to the power semiconductor device 20, other electronic components such as a resistance element and a capacitor element are also mounted on the mounting substrate 30.
In the electronic module 1 of Embodiment 1, a spacer 3 </ b> A that holds the power semiconductor device 20 away from the heat radiator 10 is provided between the heat radiator 10 and the power semiconductor device 20. In the first embodiment, the spacer 3 </ b> A is provided between the screw tightening fixing portion 13 of the radiator 10 and the screw tightening fixing portion 23 of the power semiconductor device 20. In addition, the spacer 3 </ b> A is provided on the screw tightening fixing portion 13 of the heat radiator 10 so as to protrude from the heat transfer portion 12 of the heat radiator 10 toward the power semiconductor device 20. The spacer 3 </ b> A is formed in a floating island shape that partially protrudes from the bottom surface of the recess 11. The spacer 3A protrudes so that the separation distance t between the heat conducting portion 12 of the radiator 10 and the element mounting portion 22 of the power semiconductor device 20 is about 0.01 mm to 3 mm.

  Here, in order to obtain a high heat dissipation effect, it is effective to reduce the separation distance t and reduce the thickness of the thermal grease 2, but the lower limit of the separation distance t that can be secured by a general processing method that does not increase the cost. The value is about 0.01 mm. Further, by setting the separation distance t so that the thickness of the thermal grease 2 becomes a required value in accordance with the thermal design conditions of the electronic module 1, the heat conducting portion 12 of the radiator 10 from the element mounting portion 22 of the power semiconductor device 20. However, when the thickness of the thermal grease 2 is increased, not only is the heat dissipation reduced, but the amount of the thermal grease 2 used is increased, which is not economical. Considering this economy, the upper limit value of the separation distance t is set to about 3 mm. Note that the range of the separation distance t in the first embodiment is not limited to the above range.

  In the electronic module 1 according to the first embodiment, the power semiconductor device 20 has a high heat generation density because it handles a large amount of power. The heat generated in the power semiconductor device 20 is mainly transmitted from the element mounting portion 22 of the base member 21 to the heat transfer portion 12 of the radiator 10 via the thermal grease 2. 23 to the screw tightening fixing portion 13 of the heat radiating body 10 through the spacer 3A.

  The electronic module 1 configured in this manner is manufactured by applying the thermal grease 2 to the heat radiating body 10 and then fastening the power semiconductor device 20 with the screw member 6 with the thermal grease 2 interposed in the heat radiating body 10. Is done. The thermal grease 2 applied to the heat radiating body 10 is formed into a layer by being stretched by a tightening force when the power semiconductor device 20 is fastened and fixed to the heat radiating body 10 with the screw member 6.

  Here, the conventional heat dissipation structure will be described with reference to the drawings of the first embodiment. In the conventional heat dissipation structure, the power semiconductor device 20 is fastened and fixed by the screw member 6 with the thermal grease 2 interposed in the heat dissipation body 10. At this time, since the power semiconductor device 20 is not held away from the heat radiating body 10, the thickness of the thermal grease 2 is easily changed and stable due to fluctuations in the tightening torque of the screw member 6, that is, the tightening condition of the screw member 6. do not do. For this reason, between the heat radiator 10 and the power semiconductor device 20, there are portions where the heat radiator 10 and the power semiconductor device 20 are in contact with each other and portions where the thermal grease 2 is interposed. Variation occurs in contact between the semiconductor device 20 and the thermal grease 2. This contact variation means a variation in thermal resistance between the radiator 10 and the power semiconductor device 20, and if there is such a variation in thermal resistance, the heat conduction performance from the power semiconductor device 20 to the radiator 10 decreases. To do.

On the other hand, according to the electronic module 1 of the first embodiment, the following effects can be obtained.
(1) In the electronic module 1 of the first embodiment, a spacer 3 </ b> A that holds the power semiconductor device 20 away from the heat radiator 10 is provided between the heat radiator 10 and the power semiconductor device 20.
Therefore, according to the electronic module 1 of the first embodiment, when the power semiconductor device 20 is fastened and fixed by the screw member 6 with the thermal grease 2 interposed in the radiator 10, the power semiconductor device 20 is separated from the radiator 10. Therefore, the thickness of the thermal grease 2 interposed between the radiator 10 and the power semiconductor device 20 can be stably maintained without being affected by fluctuations in the tightening torque of the screw member 6. As a result, it is possible to suppress the contact variation between the heat radiating body 10 and the power semiconductor device 20 and the thermal grease 2, and thus it is possible to stably ensure the heat transfer performance from the power semiconductor device 20 to the heat radiating body 10.

  Moreover, the thickness of the thermal grease 2 is required by defining the height dimension of the spacer 3A and setting the separation distance t between the heat conducting portion 12 of the radiator 10 and the element mounting portion 22 of the power semiconductor device 20. It can be managed to be a value. For this reason, the amount of heat transferred from the element mounting portion 22 of the power semiconductor device 20 to the heat conducting portion 12 of the radiator 10 is designed by determining the height dimension of the spacer 3A according to the thermal design conditions of the electronic module 1. can do.

(2) In the electronic module 1 of the first embodiment, the power semiconductor device 20 includes the heat generating element 27, the element mounting portion 22 on which the heat generating element 27 is mounted, and the screwed tightening arranged side by side with the element mounting portion 22. And a fixing portion 23. The heat radiating body 10 includes the heat transfer portion 12 in which the element mounting portion 22 of the power semiconductor device 20 is connected via the thermal grease 2, and the screw tightening fixing portion 23 of the power semiconductor device 20 is fastened by the screw member 6. And a fixed screw fastening portion 13. The spacer 3 </ b> A is provided between the screw tightening fixing portion 13 of the radiator 10 and the screw tightening fixing portion 23 of the power semiconductor device 20.
Therefore, according to the electronic module 1 of the first embodiment, the screw tightening fixing portion 23 of the power semiconductor device 20 is supported by the screw tightening fixing portion 13 of the radiator 10 via the spacer 3A. Warpage of the power semiconductor device 20 due to tightening can be suppressed.

(3) In the electronic module 1 according to the first embodiment, the radiator 10 has the recess 11. The heat transfer portion 12 and the screw tightening fixing portion 13 of the radiator 10 are provided on the bottom surface of the recess 11. The power semiconductor device 20 is disposed in the recess 11 of the radiator 10.
Therefore, according to the electronic module 1 of the first embodiment, when the power semiconductor device 20 is fastened and fixed by the screw member 6 with the thermal grease 2 interposed between the heat sink 10 and the power semiconductor device 20, Since the spread of the thermal grease 2 can be suppressed by the recess 11 even if part of the thermal grease 2 protrudes from the surface, the removal work of the protruding thermal grease 2 can be omitted, and the electronic module 1 is produced. Efficiency can be improved.

(4) In the electronic module 1 of the first embodiment, the spacer 3 </ b> A is provided on the screw tightening fixing portion 13 of the radiator 10 so as to protrude from the heat transfer portion 12 of the radiator 10.
Therefore, according to the electronic module 1 of the first embodiment, when the power semiconductor device 20 is fastened and fixed by the screw member 6 with the thermal grease 2 interposed in the heat radiating body 10, it is possible to save the trouble of separately arranging the spacers 3A. Therefore, the power semiconductor device 20 can be easily attached.

(5) In the electronic module 1 of the first embodiment, the screw tightening fixing portion 13 of the radiator 10 and the screw tightening fixing portion 23 of the power semiconductor device 20 are the same as those of the heat transfer unit 12 and the power semiconductor device 20 of the heat radiator 10. They are arranged in respective regions located at least on opposite sides with respect to the element mounting portion 22.
Therefore, according to the electronic module 1 of the first embodiment, since the power semiconductor device 20 is held at a plurality of locations, the power semiconductor device 20 can be stably attached to the radiator 10 and the thermal grease 2 The thickness can be kept more stable.

(Embodiment 2)
In the first embodiment, the example in which the spacer 3A that holds the power semiconductor device 20 away from the radiator 10 is provided in the radiator 10 has been described, but in the second embodiment, the power semiconductor device is provided from the radiator 10. An example in which a spacer 3B that holds 20 apart from each other is provided in the power semiconductor device 20 will be described.

In FIG. 5, the electronic module 40 according to the second embodiment has substantially the same configuration as the electronic module 1 according to the first embodiment described above, but the spacer 3 </ b> B that holds the power semiconductor device 20 apart from the radiator 10. The configuration is different.
That is, the spacer 3 </ b> B is provided in the power semiconductor device 20. In the second embodiment, the spacer 3 </ b> B is provided on the screw tightening fixing portion 23 of the power semiconductor device 20 so as to protrude from the element mounting portion 22 of the power semiconductor device 20 toward the radiator 10. The spacer 3B is formed in a floating island shape that partially protrudes from the surface of the base member 21 on the side of the radiator 10. The spacer 3B protrudes so that the separation distance t between the heat conducting portion 12 of the radiator 10 and the element mounting portion 22 of the power semiconductor device 20 is about 0.01 mm to 3 mm. Here, the grounds for setting the above range of the separation distance t in the second embodiment are the same as those in the first embodiment. Note that the range of the separation distance t in the second embodiment is not limited to the above range.

Also in the electronic module 40 of the second embodiment configured as described above, the same effects as those of the electronic module 1 of the first embodiment described above can be obtained.
In the first and second embodiments described above, the power semiconductor device 20 having a built-in power transistor such as an IGBT is described as an example of the electronic component that is fastened and fixed to the radiator 10 with the thermal grease 2 interposed therebetween. For example, the component may be a semiconductor device in which a power transistor, a logic circuit, a memory circuit, and the like are mixed. That is, the present invention can be applied to all electronic components that are fastened and fixed to a heat radiating body with thermal grease interposed therebetween.

In the first and second embodiments described above, the screw member 6 is described as an example of the screw fastening means for fastening and fixing the power semiconductor device 20 to the heat radiating body 10, but the screw fastening means may be, for example, a fastening made of a bolt and a nut. A member may be used.
In the first and second embodiments described above, in the power semiconductor device 20, the case where the element mounting portion 22 and the screw tightening fixing portion 23 are provided on the same member (base member 21) has been described. The fixing part 23 may be formed of a member different from the element mounting part 22.

  As described above, the electronic module of the present invention has an effect that the heat transfer performance from the electronic component to the heat radiating body can be stably secured, and the electronic component is screwed with the thermal grease interposed in the heat radiating body. This is useful for an electronic module having a heat dissipation structure that is fastened and fixed by a fastening means.

DESCRIPTION OF SYMBOLS 1 ... Electronic module, 2 ... Thermal grease, 3A, 3B ... Spacer, 6 ... Screw member (screw fastening means),
DESCRIPTION OF SYMBOLS 10 ... Radiator, 11 ... Concave part, 12 ... Heat conduction part, 13 ... Screw clamping | tightening fixing | fixed part 20 ... Power semiconductor device (electronic component), 21 ... Base member, 22 ... Chip mounting part, 23 ... Screw fastening fixing | fixed part, 24 ... through hole, 25 ... cap, 26 ... lead pin, 27 ... heating element 30 ... mounting substrate, 31 ... through hole, 32 ... support, 33 ... screw member 40 ... electronic module, t ... separating distance

Claims (7)

An electronic module having a radiator and an electronic component fastened and fixed by screw fastening means with thermal grease interposed in the radiator,
An electronic module, wherein a spacer is provided between the heat radiator and the electronic component to hold the electronic component away from the heat radiator. The electronic module according to claim 1,
The electronic component includes a heat generating element, an element mounting portion on which the heat generating element is mounted, and a screw tightening fixing portion arranged side by side with the element mounting portion,
The heat radiator includes a heat transfer portion in which the element mounting portion is connected via the thermal grease, and a screw tightening fixing portion in which the screw tightening fixing portion is fastened and fixed by the screw tightening means,
The electronic module according to claim 1, wherein the spacer is provided between the screw tightening fixing portion of the radiator and the screw tightening fixing portion of the electronic component. The electronic module according to claim 2,
The radiator has a recess,
The heat transfer portion and the screw tightening fixing portion are provided on the bottom surface of the recess,
The electronic module is characterized in that the electronic component is disposed in the recess. The electronic module according to claim 2 or claim 3,
The electronic module according to claim 1, wherein the spacer is provided on the screw tightening fixing portion so as to protrude from the heat transfer portion. The electronic module according to claim 2 or claim 3,
The electronic module according to claim 1, wherein the spacer is provided in the screw tightening fixing portion so as to protrude from the element mounting portion. The electronic module according to any one of claims 2 to 5,
The electronic module according to claim 1, wherein the screw tightening fixing portion and the screw tightening fixing portion are disposed in respective regions located at least on opposite sides of the heat transfer portion and the element mounting portion. The electronic module according to any one of claims 1 to 6,
The electronic module according to claim 1, wherein a separation distance between the radiator and the electronic component is 0.01 mm to 3 mm.

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