JP2015075734A - 光モジュール及び光モジュール製造方法。 - Google Patents
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- 238000000034 method Methods 0.000 claims description 9
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
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- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/14—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
- H01L31/147—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12173—Masking
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
【解決手段】光モジュールは、基板305の表面に設けられた光導波路310と、基板305の表面に対して垂直な面及び傾斜した面から成る複数の溝325と、光導波路310の複数の溝325に位置合わせされ、光導波路310の上に複数の異なる波長の光にそれぞれ対応して設けられた、複数の発光及び受光素子対335a−335dと、光導波路310の複数の溝325の傾斜した面に設けられ、それぞれ、対応する発光及び受光素子対335a−335dの発光素子からの対応する波長の光を反射して光導波路310に入れ、光導波路310を伝播する伝播光から対応する波長の光を選択して対応する発光及び受光素子対335a−335dの受光素子に反射する、複数の光選択フィルター330a−330dとを含む。
【選択図】図3
Description
305 基板
310 光導波路
325 溝
330a−330d 光選択フィルター
335a−335d 発光及び受光素子対
Claims (12)
- 基板の表面に設けられた少なくとも1つの光導波路と、
前記基板の表面で前記光導波路に設けられ、前記基板の表面に対して垂直な面及び傾斜した面から成る複数の溝と、
前記光導波路の前記複数の溝に位置合わせされ、前記光導波路の上に複数の異なる波長の光にそれぞれ対応して設けられた、複数の発光及び受光素子対と、
前記光導波路の前記複数の溝の前記傾斜した面に設けられ、それぞれ、対応する前記発光及び受光素子対の発光素子からの対応する波長の光を反射して前記光導波路に入れ、前記光導波路を伝播する伝播光から対応する波長の光を選択して対応する前記発光及び受光素子対の受光素子に反射する、複数の光選択フィルターと、
を含む、光モジュール。 - 前記複数の異なる波長の光は、少なくとも20nmの波長間隔を有する異なる波長の光である、請求項1に記載の光モジュール。
- 前記傾斜した面は、前記基板の表面に対して45度に傾斜した面である、請求項1又は2に記載の光モジュール。
- 前記光選択フィルターは、DBR(Distributed Bragg Reflector:分布ブラッグ反射)フィルターである、請求項1、2又は3に記載の光モジュール。
- 前記複数の発光及び受光素子対は、それぞれ対応する前記複数の光選択フィルターの反射面に対向して設けられている、請求項1、2、3又は4に記載の光モジュール。
- 前記複数の溝及び前記複数の光選択フィルターは、光透過性のアンダーフィルで覆われている、請求項1、2、3、4又は5に記載の光モジュール。
- 基板の表面に設けられた少なくとも1つの光導波路に、前記基板の表面に対して垂直な面及び傾斜した面から成る複数の溝を形成することと、
複数の異なる波長の光のうちの対応する波長の光をそれぞれが反射する複数の光選択フィルターを、前記複数の溝の前記傾斜した面に対応させて形成することと、
を含む、光モジュール製造方法。 - 前記光導波路の前記複数の溝に位置合わせして、前記光導波路の上に前記複数の異なる波長の光にそれぞれ対応した複数の発光及び受光素子対を設けることをさらに含む、請求項7に記載の光モジュール製造方法。
- 前記複数の溝を形成することは、前記基板の表面に対して垂直な面及び45度に傾斜した面から成る複数の溝を形成することである、請求項7又は8に記載の光モジュール製造方法。
- 前記複数の光選択フィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、複数のDBR(Distributed Bragg Reflector:分布ブラッグ反射)フィルターを前記複数の溝の前記傾斜した面に対応させて形成することである、請求項7、8又は9に記載の光モジュール製造方法。
- 前記複数のDBRフィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、前記複数の溝の各々の大きさに対応する開口が1つ形成されたマスクを用いて、順次、前記マスクの前記開口を前記複数の溝の各々に位置合わせし、前記複数の溝の前記傾斜した面に前記DBRフィルターを蒸着することを含む、請求項10に記載の光モジュール製造方法。
- 前記複数のDBRフィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、前記複数の溝の各々に対して位置合わせされ大きさが対応する複数の開口が形成された第1マスクと、全ての前記複数の溝をカバーする大きさの開口及びそれぞれ全ての前記複数の溝から溝を1つずつ少なくカバーして1つの溝をカバーするまでの異なる大きさの複数の開口が形成された第2マスクとを用いて、前記第1マスクは前記複数の開口をそれぞれ前記複数の溝に位置合わせして固定し、前記第2マスクは順次前記複数の開口の各々を移動させて前記第1マスクの前記複数の開口の各々に一回ずつ位置合わせし、前記複数の溝の前記傾斜した面に前記DBRフィルターを蒸着することを含む、請求項10に記載の光モジュール製造方法。
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US14/483,596 US9341797B2 (en) | 2013-10-11 | 2014-09-11 | Optical module and method for manufacturing optical module |
US15/064,072 US9720190B2 (en) | 2013-10-11 | 2016-03-08 | Optical module and method for manufacturing optical module |
US15/470,978 US9952392B2 (en) | 2013-10-11 | 2017-03-28 | Optical module and method for manufacturing optical module |
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US9341797B2 (en) | 2013-10-11 | 2016-05-17 | International Business Machines Corporation | Optical module and method for manufacturing optical module |
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US9341797B2 (en) | 2013-10-11 | 2016-05-17 | International Business Machines Corporation | Optical module and method for manufacturing optical module |
US9720190B2 (en) | 2013-10-11 | 2017-08-01 | International Business Machines Corporation | Optical module and method for manufacturing optical module |
US9952392B2 (en) | 2013-10-11 | 2018-04-24 | International Business Machines Corporation | Optical module and method for manufacturing optical module |
Also Published As
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US9952392B2 (en) | 2018-04-24 |
JP6319985B2 (ja) | 2018-05-09 |
US20160209608A1 (en) | 2016-07-21 |
US20150104129A1 (en) | 2015-04-16 |
US9341797B2 (en) | 2016-05-17 |
US9720190B2 (en) | 2017-08-01 |
US20170199343A1 (en) | 2017-07-13 |
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