JP2015059050A5 - - Google Patents
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- Publication number
- JP2015059050A5 JP2015059050A5 JP2013191546A JP2013191546A JP2015059050A5 JP 2015059050 A5 JP2015059050 A5 JP 2015059050A5 JP 2013191546 A JP2013191546 A JP 2013191546A JP 2013191546 A JP2013191546 A JP 2013191546A JP 2015059050 A5 JP2015059050 A5 JP 2015059050A5
- Authority
- JP
- Japan
- Prior art keywords
- heat conductive
- resin composition
- conductive resin
- oxide
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000011342 resin composition Substances 0.000 claims 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims 4
- 239000011231 conductive filler Substances 0.000 claims 4
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims 2
- 239000000292 calcium oxide Substances 0.000 claims 2
- 239000000395 magnesium oxide Substances 0.000 claims 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013191546A JP5993824B2 (ja) | 2013-09-17 | 2013-09-17 | 熱伝導性樹脂組成物及びその製造方法並びに物品 |
| PCT/JP2014/073880 WO2015041110A1 (ja) | 2013-09-17 | 2014-09-10 | 熱伝導性フィラー及びこれを含む熱伝導性樹脂組成物 |
| US15/022,170 US9828538B2 (en) | 2013-09-17 | 2014-09-10 | Thermally conductive filler and thermally conductive resin composition containing same |
| CN201480051032.2A CN105579506B (zh) | 2013-09-17 | 2014-09-10 | 热传导性填料及含有其的热传导性树脂组成物 |
| KR1020167009950A KR101981636B1 (ko) | 2013-09-17 | 2014-09-10 | 열전도성 필러 및 이것을 포함하는 열전도성 수지 조성물 |
| TW103131527A TWI630188B (zh) | 2013-09-17 | 2014-09-12 | Thermal conductive filler and thermally conductive resin composition containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013191546A JP5993824B2 (ja) | 2013-09-17 | 2013-09-17 | 熱伝導性樹脂組成物及びその製造方法並びに物品 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016082033A Division JP6312735B2 (ja) | 2016-04-15 | 2016-04-15 | 樹脂用の熱伝導性フィラー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015059050A JP2015059050A (ja) | 2015-03-30 |
| JP2015059050A5 true JP2015059050A5 (enExample) | 2016-05-26 |
| JP5993824B2 JP5993824B2 (ja) | 2016-09-14 |
Family
ID=52688761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013191546A Active JP5993824B2 (ja) | 2013-09-17 | 2013-09-17 | 熱伝導性樹脂組成物及びその製造方法並びに物品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9828538B2 (enExample) |
| JP (1) | JP5993824B2 (enExample) |
| KR (1) | KR101981636B1 (enExample) |
| CN (1) | CN105579506B (enExample) |
| TW (1) | TWI630188B (enExample) |
| WO (1) | WO2015041110A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6507214B1 (ja) * | 2017-12-01 | 2019-04-24 | 宇部マテリアルズ株式会社 | 酸化マグネシウム粉末、その製造方法、熱伝導性樹脂組成物、熱伝導性グリス、及び熱伝導性塗料 |
| EP4269346A4 (en) * | 2020-12-25 | 2025-04-23 | Ube Material Industries, Ltd. | Magnesium oxide powder, thermally conductive filler, resin composition, and manufacturing process for magnesium oxide powder |
| JP7769914B2 (ja) | 2022-12-27 | 2025-11-14 | 東洋紡エムシー株式会社 | ポリアミド組成物および成形品 |
| KR102856333B1 (ko) * | 2023-06-21 | 2025-09-09 | 주식회사 인텍 | 열계면 소재용 세라믹 필러 및 이의 제조 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62296303A (ja) | 1986-06-16 | 1987-12-23 | 新日本化学工業株式会社 | 電気絶縁用マグネシア焼結粉体 |
| JP3466754B2 (ja) * | 1995-03-02 | 2003-11-17 | タテホ化学工業株式会社 | 酸化マグネシウムの精製方法 |
| JP2000243225A (ja) | 1999-02-22 | 2000-09-08 | Canon Inc | 電子放出素子及びそれを用いた電子源，画像形成装置 |
| JP3850371B2 (ja) * | 2001-12-25 | 2006-11-29 | タテホ化学工業株式会社 | 酸化マグネシウム粉末を含む樹脂組成物 |
| DE102008049849A1 (de) * | 2008-10-01 | 2010-04-08 | Tesa Se | Wärmeleitungszusammensetzung |
| JP5501629B2 (ja) * | 2009-01-30 | 2014-05-28 | 宇部マテリアルズ株式会社 | マグネシアクリンカー |
| JP5152108B2 (ja) * | 2009-06-18 | 2013-02-27 | Ｊｓｒ株式会社 | 熱伝導性樹脂組成物および熱伝導性フィルム |
| JP5972179B2 (ja) | 2013-01-15 | 2016-08-17 | タテホ化学工業株式会社 | 被覆酸化マグネシウム粉末及びその製造方法 |
| WO2014119462A1 (ja) | 2013-01-30 | 2014-08-07 | Dic株式会社 | 熱伝導性フィラー、その製造方法、これを用いる樹脂組成物、その成形体及び高熱伝導材料 |
-
2013
- 2013-09-17 JP JP2013191546A patent/JP5993824B2/ja active Active
-
2014
- 2014-09-10 KR KR1020167009950A patent/KR101981636B1/ko active Active
- 2014-09-10 US US15/022,170 patent/US9828538B2/en active Active
- 2014-09-10 WO PCT/JP2014/073880 patent/WO2015041110A1/ja not_active Ceased
- 2014-09-10 CN CN201480051032.2A patent/CN105579506B/zh active Active
- 2014-09-12 TW TW103131527A patent/TWI630188B/zh active
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