JP2015035560A5 - - Google Patents

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Publication number
JP2015035560A5
JP2015035560A5 JP2013166974A JP2013166974A JP2015035560A5 JP 2015035560 A5 JP2015035560 A5 JP 2015035560A5 JP 2013166974 A JP2013166974 A JP 2013166974A JP 2013166974 A JP2013166974 A JP 2013166974A JP 2015035560 A5 JP2015035560 A5 JP 2015035560A5
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JP
Japan
Prior art keywords
pair
insulator
opening
core substrates
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013166974A
Other languages
English (en)
Japanese (ja)
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JP2015035560A (ja
JP6293436B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013166974A priority Critical patent/JP6293436B2/ja
Priority claimed from JP2013166974A external-priority patent/JP6293436B2/ja
Priority to US14/446,794 priority patent/US9420696B2/en
Publication of JP2015035560A publication Critical patent/JP2015035560A/ja
Publication of JP2015035560A5 publication Critical patent/JP2015035560A5/ja
Application granted granted Critical
Publication of JP6293436B2 publication Critical patent/JP6293436B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013166974A 2013-08-09 2013-08-09 配線基板の製造方法 Active JP6293436B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013166974A JP6293436B2 (ja) 2013-08-09 2013-08-09 配線基板の製造方法
US14/446,794 US9420696B2 (en) 2013-08-09 2014-07-30 Method of manufacturing wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013166974A JP6293436B2 (ja) 2013-08-09 2013-08-09 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015035560A JP2015035560A (ja) 2015-02-19
JP2015035560A5 true JP2015035560A5 (enExample) 2016-07-21
JP6293436B2 JP6293436B2 (ja) 2018-03-14

Family

ID=52447575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013166974A Active JP6293436B2 (ja) 2013-08-09 2013-08-09 配線基板の製造方法

Country Status (2)

Country Link
US (1) US9420696B2 (enExample)
JP (1) JP6293436B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102268388B1 (ko) * 2014-08-11 2021-06-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2016076658A (ja) * 2014-10-08 2016-05-12 イビデン株式会社 電子部品内蔵配線板及びその製造方法
CN109637981B (zh) * 2018-11-20 2021-10-12 奥特斯科技(重庆)有限公司 制造部件承载件的方法、部件承载件以及半制成产品
US10624213B1 (en) * 2018-12-20 2020-04-14 Intel Corporation Asymmetric electronic substrate and method of manufacture
CN114582729A (zh) * 2022-01-20 2022-06-03 珠海越亚半导体股份有限公司 封装基板制作方法及封装基板
EP4576950A1 (en) * 2023-12-19 2025-06-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with stacks connected by intermediate layer, and manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064583A (en) * 1989-08-01 1991-11-12 Zycon Corporation Method for applying mold release coating to separator plates for molding printed circuit boards
US6391220B1 (en) * 1999-08-18 2002-05-21 Fujitsu Limited, Inc. Methods for fabricating flexible circuit structures
JP4648230B2 (ja) 2006-03-24 2011-03-09 日本特殊陶業株式会社 配線基板の製造方法
KR100796523B1 (ko) * 2006-08-17 2008-01-21 삼성전기주식회사 전자부품 내장형 다층 인쇄배선기판 및 그 제조방법
KR100999531B1 (ko) * 2008-10-20 2010-12-08 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101058621B1 (ko) * 2009-07-23 2011-08-22 삼성전기주식회사 반도체 패키지 및 이의 제조 방법
JP5001395B2 (ja) 2010-03-31 2012-08-15 イビデン株式会社 配線板及び配線板の製造方法
WO2011145490A1 (ja) * 2010-05-17 2011-11-24 太陽誘電株式会社 基板内蔵用電子部品および部品内蔵型基板
JP2013030603A (ja) * 2011-07-28 2013-02-07 Hitachi Chem Co Ltd 配線基板の製造方法
JP2013105992A (ja) * 2011-11-16 2013-05-30 Casio Comput Co Ltd 半導体装置内蔵基板モジュール及びその製造方法

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