JP2015029177A - Crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device which reduces short circuits between a metal sealing lid and a wiring pattern provided on an upper surface of a substrate.SOLUTION: A crystal device includes: a rectangle substrate 110; an electrode pad 111 provided on an upper surface of the substrate 110; an external terminal 112 provided on a lower surface of the substrate 110; a crystal element 120 provided on the electrode pad 111; a metal sealing lid 130 joined to the substrate 110; a glass protection member 150 provided on a lower surface of the sealing lid; and a glass joint member 160 provided on a lower surface of the glass protection member 150. In the structure, even if pressure is applied to the sealing lid 130 and the substrate 110, a wiring pattern provided on the upper surface of the substrate 110 and the glass protection member 150 contact with each other and thus short circuits between the metal sealing lid 130 and the wiring pattern are reduced.

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal device generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a crystal element mounted on a pair of electrode pads provided along one side of the upper surface of a rectangular substrate via a conductive adhesive, and bonded to the upper surface of the substrate via a bonding member, A crystal resonator provided with a metal sealing lid for hermetically sealing has been proposed (see, for example, Patent Document 1 below). Glass is used for the bonding member, and by applying heat, the metal sealing lid and the upper surface of the substrate can be bonded. In addition, external terminals are provided at the four corners of the lower surface of the substrate constituting the crystal device, and are mounted on a motherboard such as an electronic device.

JP 2009-141234 A

  In the crystal device described above, the metal sealing lid and the wiring pattern of the substrate are insulated by the bonding member. In such a crystal device, when the sealing lid and the substrate are bonded, pressure is applied to the sealing lid and the substrate, and the sealing lid and the substrate are brought into close contact with each other in a state where the bonding member is thinned. In such a case, the wiring pattern provided on the upper surface of the substrate may come into contact with the metal sealing lid to cause a short circuit.

  This invention is made | formed in view of the said subject, and is providing the crystal device which can reduce the short circuit with a metal sealing lid body and the wiring pattern provided in the upper surface of the board | substrate. is there.

  A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, an electrode pad provided on the top surface of the substrate, an external terminal provided on the bottom surface of the substrate, a crystal element provided on the electrode pad, A metal sealing lid bonded to the substrate, a glass protective member provided on the lower surface of the sealing lid, and a glass bonding member provided on the lower surface of the glass protective member. It is what.

  A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, an electrode pad provided on the top surface of the substrate, an external terminal provided on the bottom surface of the substrate, a crystal element provided on the electrode pad, A metal sealing lid bonded to the substrate, a glass protection member provided on the lower surface of the sealing lid, and a glass bonding member provided on the lower surface of the glass protection member are provided. By doing in this way, when the crystal device is bonded to the sealing lid and the substrate, even if pressure is applied to the sealing lid and the substrate, the wiring pattern provided on the upper surface of the substrate, Since the glass protective member comes into contact, it is possible to reduce the short circuit between the metal sealing lid and the wiring pattern.

It is a disassembled perspective view which shows the crystal device in this embodiment. (A) It is sectional drawing in AA of the quartz crystal device shown in FIG. 1, (b) It is sectional drawing in BB of the quartz crystal device shown in FIG. 1, (c) It is shown in FIG. It is sectional drawing in CC of the obtained quartz crystal device. It is a top view which shows the state which mounted the crystal element of the crystal device in this embodiment. (A) It is the top view which looked at the board | substrate which comprises the crystal device in this embodiment from the upper surface, (b) The top view which looked at the board | substrate which comprises the crystal device in this embodiment from the lower surface. It is a disassembled perspective view which shows the quartz crystal device in the 1st modification of this embodiment. It is a top view which shows the state which mounted the crystal element of the crystal device in the 1st modification of this embodiment. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 1st modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 1st modification of this embodiment is seen from a lower surface. FIG. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 2nd modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 2nd modification of this embodiment is seen from a lower surface. FIG. (A) It is a top view which shows the state which mounted the crystal device crystal element in the 3rd modification of this embodiment, (b) The board | substrate which comprises the crystal device in the 3rd modification of this embodiment was seen from the lower surface. It is a top view.

  As shown in FIGS. 1 and 2, the crystal device according to the present embodiment includes a substrate 110, a crystal element 120 bonded to the upper surface of the substrate 110, and a lid for hermetically sealing the crystal element 120. 130. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110 has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. A pair of electrode pads 111 for bonding the crystal element 120 are provided at diagonal positions on the upper surface of the substrate 110, and external terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the four external terminals 112 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120.

  The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one using an insulating layer or may be a laminate of a plurality of insulating layers. Wiring patterns 113 for electrically connecting the electrode pads 111 provided on the upper surface and the external terminals 112 on the lower surface are provided on the upper surface and the lower surface of the substrate 110, respectively.

The electrode pads 111 of the substrate 110 are used for mounting the crystal element 120 as shown in FIG. As shown in FIG. 3, the electrode pads 111 are provided at diagonal positions on the upper surface of the substrate 110. The electrode pad 111 is externally provided at a position overlapping the electrode pad 111 in a plan view via a wiring pattern 113 provided on the upper and lower surfaces of the substrate 110 and a conductor portion 114 provided on a corner portion of the substrate 110. The terminal 112 is electrically connected.
The external terminals 112 are provided along the outer peripheral edge of the substrate 110 at the four corners of the lower surface of the substrate 110.

  As shown in FIG. 4A, the electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. As shown in FIG. 4B, the external terminal 112 includes a first external terminal 112a, a second external terminal 112b, a third external terminal 112c, and a fourth external terminal 112d. As shown in FIG. 4, the wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b, and the conductor portion 114 is composed of a first conductor portion 114a and a second conductor portion 114b. The first electrode pad 111 a and the first external terminal 112 a are connected by a first wiring pattern 113 a provided on the upper surface and the lower surface of the substrate 110 and a first conductor portion 114 a provided at a corner of the substrate 110. The second electrode pad 111b and the third external terminal 112c are connected by the second wiring pattern 113b provided on the upper surface and the lower surface of the substrate 110 and the second conductor portion 114b provided on the corner portion of the substrate 110. Yes. The second external terminal 112b and the fourth external terminal 112d are not connected anywhere and are used as connection terminals.

  The external terminal 112 is used for mounting on a mounting board constituting an external electronic device or the like. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110, respectively. Further, the external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110.

  Further, the electrode pad 111 and the external terminal 112 have a shape provided along the substrate 110. Here, taking the case where the long side dimension of the substrate 110 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 111 is taken as an example. The size of the external terminal 112 will be described. The long side length of the electrode pad 111 is 0.30 to 0.90 mm, and the short side length is 0.20 to 0.60 mm. The long side length of the external terminal 112 is 0.30 to 0.90 mm, and the short side length is 0.20 to 0.60 mm.

  The wiring pattern 113 is provided on the upper and lower surfaces of the substrate 110 and is drawn out from the electrode pads 111 and the external terminals 112 toward the corners of the substrate 110 in the vicinity. The length of the first wiring pattern 113a and the length of the second wiring pattern 113b are substantially equal. Here, the substantially equal length means that the difference between the length of the first wiring pattern 113a provided on the upper and lower surfaces of the substrate 110 and the length of the second wiring pattern 113b provided on the upper and lower surfaces of the substrate 110 is different by 0 to 200 μm. Including things. As for the length of the wiring pattern 113, the length of a straight line passing through the center of each wiring pattern 113 is measured. Moreover, the thickness of the wiring pattern in the vertical direction is 10 to 25 μm.

  The conductor portion 114 is provided inside a notch provided in a corner portion of the substrate 110. Both ends of the conductor portion 114 are connected to the wiring pattern 113. By doing so, the electrode pad 111 is electrically connected to the external terminal 112 via the wiring pattern 113 and the conductor portion 114.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, it is manufactured by applying nickel plating, gold plating, silver palladium, or the like to a predetermined portion of the conductor pattern, specifically, the portion that becomes the electrode pad 111, the external terminal 112, the wiring pattern 113, and the conductor portion 114. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIG. 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to an upper surface and a lower surface of a crystal base plate 121, respectively. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on the upper and lower surfaces of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward the opposite sides of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward the other side of the crystal base plate 121.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing. Further, the crystal element 120 is fixed on the substrate 110 by a both-end support structure in which both ends of the crystal element 120 connected to the electrode pad 111 are connected to the upper surface of the substrate 110.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the electrode pad 111 by, for example, a dispenser. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a and the second extraction electrode 123b of the crystal element 120 are joined to the first electrode pad 111a and the second electrode pad 111b. As a result, the first external terminal 112 a and the third external terminal 112 c are electrically connected to the crystal element 120.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The sealing lid 130 includes a rectangular sealing base portion 130a and a sealing frame portion 130b provided along the outer peripheral edge of the lower surface of the sealing base portion. An accommodation space K is formed with the inner side surface of the sealing frame portion 130b. The sealing frame part 130b is for forming the accommodation space K on the lower surface of the sealing base part 130a. The sealing frame part 130b is provided along the outer edge of the lower surface of the sealing base part 130a.

  The sealing base portion 130a and the sealing frame portion 130b are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a sealing lid 130 is for hermetically sealing the housing space K in a vacuum state or the housing space K filled with nitrogen gas or the like. Specifically, the sealing lid 130 is placed on the upper surface of the substrate 110 in a predetermined atmosphere, and the glass bonding member 160 provided between the upper surface of the substrate 110 and the lower surface of the glass protection member 150 is heated. Is applied to melt-bond. A glass protective member 150 is annularly provided on the lower surface of the sealing frame portion 130b.

  The glass protection member 150 is used to reduce the short circuit caused by the wiring pattern 113 coming into contact with the metal sealing lid 130. Further, as shown in FIGS. 1 and 3, the glass protection member 150 is provided in an annular shape on the lower surface of the sealing frame portion 130 b of the sealing lid 130. The glass protective member 150 is provided so that the melting point is higher than that of the glass bonding member 160, and the one having a melting point of 500 to 800 ° C. is used. Thereby, when joining by the glass joining member 160, the glass protective member 150 can maintain the shape at the time of formation, without melt | dissolving, and can ensure the thickness of an up-down direction. Therefore, even if pressure is applied to the metal sealing lid 130 or the substrate 110 and the glass protective member 150 is secured in the vertical direction, the glass protective member 150 and the wiring pattern 113 of the substrate 110 are secured. Will come into contact. By doing so, the metal sealing lid 130 and the wiring pattern 113 of the substrate 110 are prevented from coming into contact with each other, and a short circuit between the metal sealing lid 130 and the wiring pattern 113 due to this contact is prevented. It becomes possible to reduce.

  Moreover, the thickness of the glass protective member 150 in the vertical direction is 10 to 30 μm. By doing in this way, even if a pressure is applied and pressed to the metal sealing lid 130 or the substrate 110, it is possible to reduce the exposure of the lower surface of the sealing frame portion 130b. Further, the glass protection member 150 is provided by, for example, applying glass frit paste in a ring shape along the outer peripheral edge of the lower surface of the sealing frame portion 130b by screen printing and drying. Since the glass protective member 150 is provided on the lower surface of the sealing frame portion 130b of the sealing lid body 130, the glass protective member 150 serves as a buffer when the sealing lid body is placed on the upper surface of the substrate. As a result, the occurrence of chipping in the sealing frame portion 130b can be reduced.

  The glass bonding member 160 is used to bond the lower surface of the sealing lid 130 and the outer peripheral edge of the upper surface of the substrate 110. As shown in FIG. 2, the glass bonding member 160 is provided from the lower surface of the glass protection member 150 to the outer peripheral edge on the substrate 110. The glass bonding member 160 is made of, for example, low melting glass or lead oxide glass containing vanadium that is a glass that melts at 300 ° C to 400 ° C. Glass is pasty with a binder and a solvent added, and is melted and then solidified to adhere to other members. The glass bonding member 160 is provided by, for example, applying glass frit paste along the outer peripheral edge of the substrate 110 by a screen printing method and drying it. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide. Moreover, the thickness of the glass bonding member 160 in the vertical direction is 10 to 50 μm. By using this thickness, the hermetic sealability in the accommodation space can be maintained.

  The crystal device according to the present embodiment includes a rectangular substrate 110, an electrode pad 111 provided on the upper surface of the substrate 110, an external terminal 112 provided on the lower surface of the substrate 110, and a crystal provided on the electrode pad 111. The element 120, a metal sealing lid 130 bonded to the substrate 110, a glass protection member 150 provided on the lower surface of the sealing lid 130, and a glass bonding member provided on the lower surface of the glass protection member 150 160. By doing so, the crystal device is provided on the upper surface of the substrate 110 even when pressure is applied to the sealing lid 130 or the substrate 110 when the sealing lid 130 and the substrate 110 are joined. Since the wiring pattern 113 and the glass protective member 150 provided on the lower surface of the sealing frame portion 130b are in contact with each other, the short circuit between the metal sealing lid 130 and the wiring pattern 113 is reduced. can do.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 5 to 7, in the crystal device according to the first modification of the present embodiment, the electrode pads 211 are provided at the four corners of the upper surface of the substrate 210, and the external terminals 212 are the substrate 210. The present embodiment is different from the present embodiment in that it is provided at the four corners of the lower surface.

  Electrode pads 211 for bonding the crystal element 120 are provided at the four corners of the upper surface of the substrate 210, and external terminals 212 are provided at the four corners of the lower surface of the substrate 210. Further, two of the four external terminals 212 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120.

  The electrode pads 211 are provided at the four corners of the upper surface of the substrate 210 as shown in FIGS. The electrode pad 211 is electrically connected to the external terminal 212 provided at a position overlapping the electrode pad 211 in plan view via the wiring pattern 213 provided on the upper and lower surfaces of the substrate 210 and the conductor portion 214 provided on the side surface. It is connected to the.

  As shown in FIG. 7A, the electrode pad 211 includes a first electrode pad 211a, a second electrode pad 211b, a third electrode pad 211c, and a fourth electrode pad 211d. Further, as shown in FIG. 7B, the external terminal 212 includes a first external terminal 212a, a second external terminal 212b, a third external terminal 212c, and a fourth external terminal 212d. As shown in FIG. 7, the wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, a third wiring pattern 213c, and a fourth wiring pattern 213d. As shown in FIG. 7, the conductor portion 214 is composed of a first conductor portion 214a, a second conductor portion 214b, a third conductor portion 214c, and a fourth conductor portion 214d. The first electrode pad 211 a and the first external terminal 212 a are connected by a first wiring pattern 213 a provided on the upper and lower surfaces of the substrate 210 and a first conductor portion 214 a provided at one corner of the substrate 210. The second electrode pad 211b and the second external terminal 212b are connected by a second wiring pattern 213b provided on the upper and lower surfaces of the substrate 210 and a second conductor portion 214b provided at one corner of the substrate 210. Has been. The third electrode pad 211 c and the third external terminal 212 c are connected by a third wiring pattern 213 c provided on the upper and lower surfaces of the substrate 210 and a third conductor portion 214 c provided on one corner of the substrate 210. The fourth electrode pad 211d and the fourth external terminal 212d are connected by a fourth wiring pattern 213d provided on the upper and lower surfaces of the substrate 210 and a fourth conductor portion 214d provided at one of the corners of the substrate 210. Has been.

  Further, the electrode pad 211 and the external terminal 212 are arranged at positions where they overlap each other in plan view, and the electrode pad 211 and the external terminal 212 at the overlapping positions are electrically connected. By doing so, the thermal expansion coefficients of the upper surface and the lower surface of the substrate 210 are approximated, so that the warpage of the substrate 210 can be reduced. Even if the substrate 210 is warped, by holding the crystal element 120 diagonally, the stress applied to the crystal element 120 can be equalized by both holding. Therefore, it is possible to reduce fluctuations in the oscillation frequency of the crystal element 120 caused by the stress applied to the conductive adhesive 140 being transmitted to the crystal element 120.

  In addition, the substrate 210 formed in the quartz device is provided at a position where the electrode pads 211 provided on the upper surface and the lower surface overlap with the external terminals 212 in a plan view. Further, the upper surface and the lower surface of the substrate 210 are symmetric with respect to an axis passing through the midpoint of the long side of the substrate 210. When the substrate 210 is carried into the manufacturing apparatus, it is not necessary to confirm the upper and lower surfaces of the substrate 210 and the direction of the substrate 210 by image processing if they are aligned with an alignment jig. If a substrate used in a conventional crystal device is used, when the substrate is aligned with an alignment jig when it is carried into a manufacturing apparatus, confirmation of the upper and lower surfaces of the substrate and confirmation of the direction of the substrate is possible. It is necessary to carry out by processing etc., and productivity will fall. By doing so, it is not necessary to confirm the aligned substrates 210 by image processing, so that the productivity of the crystal device can be improved.

  In addition, even if the first lead electrode 123a and the second lead electrode 123b of the crystal element 120 are inclined about the place where the first electrode pad 211a and the third electrode pad 211c are joined, the crystal element 120 is bonded. Since the corners that are not in contact with the second electrode pad 211b or the fourth electrode pad 211d, it is possible to prevent the corners of the crystal element 120 that are not bonded from coming into contact with the upper surface of the substrate 210. If a drop test or the like is performed in a state where the corner where the crystal element 120 is not bonded is in contact with the substrate 210, the corner where the crystal element 120 is not bonded may be lost. By doing in this way, it can suppress that the angle | corner of the crystal element 120 is missing, and can reduce that the oscillation frequency of the crystal element 120 fluctuates.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. In the crystal device according to the second modification of the present embodiment, as illustrated in FIG. 8, the electrode pad 311 has a rectangular shape, and the electrode pad 311 in a position overlapping the excitation electrode 122 in a plan view. The present embodiment is different from the present embodiment in that a chamfered portion 315 is provided.

  The chamfered portion 315 is provided in a straight line at a corner facing the excitation electrode 122 side so as to cross from one side of the electrode pad 311 to one side adjacent to the one side. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 311, so that the contact between the excitation electrode 122 and the electrode pad 311 can be reduced.

  The electrode pad 311 has a shape provided along the substrate 310. Here, taking the case where the long side dimension of the substrate 310 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 311 is taken as an example. Explain the size of. The long side length of the electrode pad 311 is 0.40 to 0.90 mm, and the short side length is 0.30 to 0.60 mm. The chamfered portion 315 is obtained by removing the corners of the rectangular electrode pad 311 in a triangular shape, and the dimension parallel to the vertical dimension when the electrode pad 311 is viewed in plan is 0.05 to 0.15 mm. Yes, and the horizontal dimension when viewed in plan is 0.05 to 0.15 mm. Further, the electrode pad 311 provided with the chamfered portion 315 is formed to have an area of 97 to 99% as compared with the rectangular electrode pad 311.

  In the crystal device according to the second modification of the present embodiment, the electrode pad 311 and the external terminal 312 are rectangular, and the electrode pad 311 is provided with a chamfered portion 315. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 311, so that the contact between the excitation electrode 122 and the electrode pad 311 can be reduced. Therefore, the crystal device can reduce the fluctuation of the oscillation frequency of the crystal element 120.

(Third modification)
Hereinafter, the quartz crystal device according to the third modification of the present embodiment will be described. Note that, in the quartz crystal device according to the third modification of the present embodiment, the same parts as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 9, in the crystal device in the third modification of the present embodiment, the crystal element 220 has a cantilever support structure, and the electrode pad 411 of the substrate 410 is adjacent to the short side of the substrate 410. It differs from the present embodiment in that it is provided.

  A pair of electrode pads 411 are provided on the upper surface of the substrate 410, and are provided adjacently along one side of the substrate 410. The electrode pad 411 is electrically connected to the external terminal 412 via a wiring pattern 413 provided on the upper and lower surfaces of the substrate 410 and a conductor portion 414 provided on the side surface of the substrate 410. The external terminals 412 are provided along the outer peripheral edge of the substrate 410 at the four corners of the lower surface of the substrate 410.

  As shown in FIG. 9, the crystal element 220 has a structure in which the excitation electrode 222 and the extraction electrode 223 are attached to the upper surface and the lower surface of the crystal base plate 221, respectively. The excitation electrode 222 is formed by depositing and forming a metal in a predetermined pattern on each of the upper and lower surfaces of the quartz base plate 221. The extraction electrode 223 extends from the excitation electrode 222 toward the short side of the crystal base plate 221 and is provided in a shape along the long side or the short side of the crystal base plate 221. In the present embodiment, one end of the crystal element 220 connected to the electrode pad 411 is a fixed end connected to the upper surface of the substrate 410, and the other end is a free end spaced from the upper surface of the substrate 410. The crystal element 220 is fixed on the substrate 410 by a holding support structure.

  Even if pressure is applied to the metal sealing lid 130 and the substrate 410, the quartz device in the third modification of the present embodiment has a vertical thickness of the glass protection member 150. The sealing lid body 130 and the glass protective member 150 are brought into close contact with each other, and a short circuit between the metallic sealing lid body 130 and the wiring pattern 413 provided on the upper surface of the substrate 410 is reduced. can do.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bending having a base and two flat-plate-shaped vibrating arms extending in the same direction from the side surface of the base is described. A crystal element may be used.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where the glass bonding member 160 is provided on the substrate 110 has been described. However, the glass bonding member 160 may be provided on the lower surface of the sealing frame portion 130 b of the sealing lid 130. Absent. Such a glass joining member 160 is provided by, for example, applying glass frit paste in a ring shape along the lower surface of the sealing frame portion 130b by a screen printing method and drying it.

110, 210, 310, 410 ... substrate 111, 211, 311, 411 ... electrode pads 112, 212, 312, 412 ... external terminals 113, 213, 313, 413 ... wiring patterns 114, 214 314, 414 ... Conductor part 315 ... Chamfered part 120 ... Crystal element 121 ... Crystal base plate 122 ... Excitation electrode 123 ... Lead-out electrode 130 ... Sealing lid 130a ... Sealing base part 130b ... Sealing frame part 140 ... Conductive adhesive 150 ... Glass protective member 160 ... Glass bonding member K ... Storage space

Claims (3)

A rectangular substrate;
An electrode pad provided on the upper surface of the substrate;
An external terminal provided on the lower surface of the substrate;
A crystal element provided on the electrode pad;
A metal sealing lid bonded to the substrate;
A glass protective member provided on the lower surface of the sealing lid;
And a glass bonding member provided on the lower surface of the glass protective member. The crystal device according to claim 1,
The sealing lid includes a rectangular sealing base and a sealing frame provided along an outer peripheral edge of the sealing base,
The crystal device, wherein the glass protective member is provided along a lower surface of the sealing frame portion. A quartz crystal device according to claim 1 or 2, wherein
The electrode pad has a rectangular shape,
A crystal device, wherein a chamfered portion is provided at a corner of the electrode pad in plan view.

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