JP2015012184A - 半導体素子 - Google Patents
半導体素子 Download PDFInfo
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- JP2015012184A JP2015012184A JP2013137229A JP2013137229A JP2015012184A JP 2015012184 A JP2015012184 A JP 2015012184A JP 2013137229 A JP2013137229 A JP 2013137229A JP 2013137229 A JP2013137229 A JP 2013137229A JP 2015012184 A JP2015012184 A JP 2015012184A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 146
- 239000012535 impurity Substances 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000010365 information processing Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/045—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere
- H02H9/046—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere responsive to excess voltage appearing at terminals of integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/866—Zener diodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
【解決手段】半導体素子は、電流を流す信号線に第1カソード8が電気的に接続された第1ダイオードと、第2アノード11と第2カソード9を有し、前記第1ダイオードと並列に接続され、且つ前記第2アノード11が前記信号線に接続された第2ダイオードと、前記第2ダイオードと直列に接続されるように、前記第2カソード9に第3カソード4が接続され、且つ前記第1ダイオード及び前記第2ダイオードよりも高い静電容量を有する第3ダイオードと、前記第1ダイオードと直列に接続されるように、前記第1カソード8に第4アノード15が接続された第4ダイオードと、を有する。
【選択図】図2
Description
図1〜図3を用いて、本発明の第1の実施型態に係る半導体素子100について説明する。図1は第1の実施型態に係る半導体素子の等価回路、図2は第1の実施型態に係る半導体素子の平面図、及び図3は図2のA−A’線における断面を示す断面図を示している。図2の平面図では、絶縁層12と第2電極14を省略して図示している。
第2の実施型態に係る半導体素子200について、図4、5を用いて説明する。図4は第2の実施型態に係る半導体素子の等価回路、図5は第2の実施型態に係る半導体素子の断面図を示している。なお、第1の実施型態で説明した構成と同じ構成の部分には同じ参照番号または記号を用いその説明は省略する。第1の実施型態との相異点について主に説明する。
Claims (3)
- 第1アノード層と、
前記第1アノード層上に設けられた第1カソード層と、
前記第1カソード層を囲み、前記第1アノード層上に設けられた第1導電型の第2半導体層と、
前記第1カソード層の表面に設けられた第4カソード層と、
前記第1カソード層と前記第4カソード層との間に設けられた第4アノード層と、
前記第1アノード層上に設けられた第2カソード層と、
前記第2カソード層を囲み、前記第1アノード層上に設けられた第2導電型の第3半導体層と、
前記第2カソード層及び前記第3半導体層と前記第1アノード層との間に設けられ、前記第2カソード層の第2導電型不純物濃度よりも高い第2導電型不純物濃度を有する第3カソード層と、
前記第2カソード層上に設けられた第2アノード層と、
前記第1アノード層と電気的に接続された第1電極と、
前記第4カソード層と前記第2アノード層と電気的に接続された第2電極と、
を有する半導体素子。 - 第1アノード層と、
前記第1アノード層上に設けられた第1カソード層と、
前記第1アノード層上に設けられた第2カソード層と、
前記第2カソード層を囲み、前記第1アノード層上に設けられた第1導電型の第2半導体層と、
前記第2カソード層の表面に設けられた第4カソード層と、
前記第2カソード層と前記第4カソード層との間に設けられた第4アノード層と、
前記第2カソード層及び前記第3半導体層と前記第1アノード層との間に設けられ、前記第2カソード層の第2導電型不純物濃度よりも高い第2導電型不純物濃度を有する第3カソード層と、
前記第2カソード層上に設けられた第2アノード層と、
前記第1アノード層と電気的に接続された第1電極と、
前記第1カソード層と前記第2アノード層と電気的に接続された第2電極と、
を有する半導体素子。 - 電流を流す信号線に第1カソードが電気的に接続された第1ダイオードと、
第2アノードと第2カソードを有し、前記第1ダイオードと並列に接続され、且つ前記第2アノードが前記信号線に接続された第2ダイオードと、
前記第2ダイオードと直列に接続されるように、前記第2カソードに第3カソードが接続され、且つ前記第1ダイオード及び前記第2ダイオードよりも高い静電容量を有する第3ダイオードと、
前記第1ダイオードまたは前記第2ダイオードと直列に接続されるように、前記第1カソードまたは前記第2カソードに第4アノードが接続された第4ダイオードと、
を有する半導体素子。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013137229A JP2015012184A (ja) | 2013-06-28 | 2013-06-28 | 半導体素子 |
CN201410169264.XA CN104253125A (zh) | 2013-06-28 | 2014-04-25 | 半导体元件 |
US14/306,507 US20150002967A1 (en) | 2013-06-28 | 2014-06-17 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013137229A JP2015012184A (ja) | 2013-06-28 | 2013-06-28 | 半導体素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015012184A true JP2015012184A (ja) | 2015-01-19 |
Family
ID=52115372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013137229A Pending JP2015012184A (ja) | 2013-06-28 | 2013-06-28 | 半導体素子 |
Country Status (3)
Country | Link |
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US (1) | US20150002967A1 (ja) |
JP (1) | JP2015012184A (ja) |
CN (1) | CN104253125A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10032762B1 (en) | 2017-03-23 | 2018-07-24 | Kabushiki Kaisha Toshiba | Semiconductor device |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9819176B2 (en) * | 2014-01-17 | 2017-11-14 | Silergy Semiconductor Technology (Hangzhou) Ltd | Low capacitance transient voltage suppressor |
US9425266B2 (en) * | 2014-10-13 | 2016-08-23 | Semiconductor Components Industries, Llc | Integrated floating diode structure and method therefor |
US9922970B2 (en) * | 2015-02-13 | 2018-03-20 | Qualcomm Incorporated | Interposer having stacked devices |
TWI600222B (zh) | 2015-08-18 | 2017-09-21 | Molex Llc | 連接器系統 |
US9748330B2 (en) | 2016-01-11 | 2017-08-29 | Semiconductor Component Industries, Llc | Semiconductor device having self-isolating bulk substrate and method therefor |
FR3054373A1 (fr) | 2016-07-20 | 2018-01-26 | St Microelectronics Tours Sas | Dispositif de protection contre des surtensions |
US10026728B1 (en) | 2017-04-26 | 2018-07-17 | Semiconductor Components Industries, Llc | Semiconductor device having biasing structure for self-isolating buried layer and method therefor |
US10224323B2 (en) | 2017-08-04 | 2019-03-05 | Semiconductor Components Industries, Llc | Isolation structure for semiconductor device having self-biasing buried layer and method therefor |
US10141300B1 (en) | 2017-10-19 | 2018-11-27 | Alpha And Omega Semiconductor (Cayman) Ltd. | Low capacitance transient voltage suppressor |
KR20200065165A (ko) * | 2018-11-29 | 2020-06-09 | 주식회사 다이얼로그 세미컨덕터 코리아 | 정전기 방전 보호회로 |
FR3089679A1 (fr) * | 2018-12-11 | 2020-06-12 | Stmicroelectronics (Tours) Sas | Dispositif de commutation et procédé de fabrication d'un tel dispositif |
JP2022111601A (ja) * | 2021-01-20 | 2022-08-01 | セイコーエプソン株式会社 | 静電気保護回路、半導体装置、電子機器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011077484A (ja) * | 2009-10-02 | 2011-04-14 | Sanyo Electric Co Ltd | 半導体装置 |
JP2012004350A (ja) * | 2010-06-17 | 2012-01-05 | On Semiconductor Trading Ltd | 半導体装置及びその製造方法 |
US20120012973A1 (en) * | 2010-07-15 | 2012-01-19 | Che-Hao Chuang | Lateral transient voltage suppressor with ultra low capacitance |
US20120068299A1 (en) * | 2010-09-22 | 2012-03-22 | Amazing Microelectronic Corp. | Transient voltage suppressors |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7544545B2 (en) * | 2005-12-28 | 2009-06-09 | Vishay-Siliconix | Trench polysilicon diode |
US8431958B2 (en) * | 2006-11-16 | 2013-04-30 | Alpha And Omega Semiconductor Ltd | Optimized configurations to integrate steering diodes in low capacitance transient voltage suppressor (TVS) |
US7538395B2 (en) * | 2007-09-21 | 2009-05-26 | Semiconductor Components Industries, L.L.C. | Method of forming low capacitance ESD device and structure therefor |
US8378411B2 (en) * | 2009-05-18 | 2013-02-19 | Force Mos Technology., Ltd. | Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation |
US20120080769A1 (en) * | 2010-10-01 | 2012-04-05 | Umesh Sharma | Esd device and method |
-
2013
- 2013-06-28 JP JP2013137229A patent/JP2015012184A/ja active Pending
-
2014
- 2014-04-25 CN CN201410169264.XA patent/CN104253125A/zh active Pending
- 2014-06-17 US US14/306,507 patent/US20150002967A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011077484A (ja) * | 2009-10-02 | 2011-04-14 | Sanyo Electric Co Ltd | 半導体装置 |
JP2012004350A (ja) * | 2010-06-17 | 2012-01-05 | On Semiconductor Trading Ltd | 半導体装置及びその製造方法 |
US20120012973A1 (en) * | 2010-07-15 | 2012-01-19 | Che-Hao Chuang | Lateral transient voltage suppressor with ultra low capacitance |
US20120068299A1 (en) * | 2010-09-22 | 2012-03-22 | Amazing Microelectronic Corp. | Transient voltage suppressors |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10032762B1 (en) | 2017-03-23 | 2018-07-24 | Kabushiki Kaisha Toshiba | Semiconductor device |
Also Published As
Publication number | Publication date |
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US20150002967A1 (en) | 2015-01-01 |
CN104253125A (zh) | 2014-12-31 |
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