JP2015011002A - 複合センサ - Google Patents
複合センサ Download PDFInfo
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- JP2015011002A JP2015011002A JP2013138648A JP2013138648A JP2015011002A JP 2015011002 A JP2015011002 A JP 2015011002A JP 2013138648 A JP2013138648 A JP 2013138648A JP 2013138648 A JP2013138648 A JP 2013138648A JP 2015011002 A JP2015011002 A JP 2015011002A
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
Description
PV=nRT (1)
そのため、本発明の図1の構造では、角速度のセンシング空間5内で微量発生ガスが発生した場合でもセンシング空間5内の気体の圧力Pの変化率は小さくなる。
Claims (7)
- 固定基板、デバイス基板、電極基板の少なくとも3つの基板が積層された3層構造を有し、加速度を測定するセンシング部と角速度を測定するセンシング部とがそれぞれ密閉された構造を有し、加速度を測定するセンシング部および角速度を測定するセンシング部を前記デバイス基板によって形成した固定梁と可動梁とを有する静電容量式センサとして構成し、角速度センシング部の室内圧力を加速度センシング部の室内圧力よりも低くした複合センサにおいて、
角速度センシング部の固定梁および可動梁に対して電極基板側に形成されたギャップ長の寸法D1又は固定基板側に形成されたギャップ長の寸法D2の少なくともいずれか一方は、前記角速度センシング部の可動梁の厚さ寸法T1よりも大きく、
かつ加速度センシング部の固定梁および可動梁に対して電極基板側に形成されたギャップ長の寸法G1および固定基板側に形成されたギャップ長の寸法G2は、加速度センシング部の可動梁の厚さ寸法T2よりも小さいことを特徴とする複合センサ。 - 請求項1に記載の複合センサにおいて、
ギャップ長の寸法D1およびギャップ長の寸法D2は、前記角速度センシング部の可動梁の厚さ寸法T1よりも大きいことを特徴とする複合センサ。 - 請求項2に記載の複合センサにおいて、
固定基板、デバイス基板、電極基板の3層構造は全てシリコン材料から構成されたことを特徴とする複合センサ。 - 請求項3に記載の複合センサにおいて、
角速度センシング部の可動梁および加速度センシング部の可動梁と、固定基板および電極基板との間の各ギャップを構成する固定基板および電極基板に形成された溝は、シリコンのドライエッチング加工によって形成されたものであることを特徴とする複合センサ。 - 請求項4に記載の複合センサにおいて、
固定基板、デバイス基板、電極基板の少なくとも2枚の基板が、シリコンの直接接合により接合されたことを特徴とする複合センサ - 請求項5に記載の複合センサにおいて、
制御用LSIと一体化されて一つのパッケージに配置されたことを特徴とする複合センサ。 - 請求項6に記載の複合センサにおいて、
角速度センシング部と加速度センシング部とが分割された状態で制御用LSIと一体化されたことを特徴とする複合センサ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013138648A JP2015011002A (ja) | 2013-07-02 | 2013-07-02 | 複合センサ |
PCT/JP2014/052828 WO2015001813A1 (ja) | 2013-07-02 | 2014-02-07 | 複合センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013138648A JP2015011002A (ja) | 2013-07-02 | 2013-07-02 | 複合センサ |
Publications (1)
Publication Number | Publication Date |
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JP2015011002A true JP2015011002A (ja) | 2015-01-19 |
Family
ID=52143411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013138648A Pending JP2015011002A (ja) | 2013-07-02 | 2013-07-02 | 複合センサ |
Country Status (2)
Country | Link |
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JP (1) | JP2015011002A (ja) |
WO (1) | WO2015001813A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107032290A (zh) * | 2016-01-21 | 2017-08-11 | 台湾积体电路制造股份有限公司 | 半导体器件及其形成方法 |
JP2018031714A (ja) * | 2016-08-26 | 2018-03-01 | 日立オートモティブシステムズ株式会社 | 物理量センサ |
JP2018069395A (ja) * | 2016-10-31 | 2018-05-10 | 株式会社豊田中央研究所 | Mems装置 |
CN112265956A (zh) * | 2020-09-25 | 2021-01-26 | 华东光电集成器件研究所 | 一种不同真空度封装的mems圆片级真空封装方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107399711A (zh) * | 2016-05-19 | 2017-11-28 | 苏州明皜传感科技有限公司 | 微机电系统装置及其制造方法 |
JP6787304B2 (ja) * | 2017-12-19 | 2020-11-18 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器、および移動体 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002005950A (ja) * | 2000-06-23 | 2002-01-09 | Murata Mfg Co Ltd | 複合センサ素子およびその製造方法 |
JP2006084327A (ja) * | 2004-09-16 | 2006-03-30 | Denso Corp | 容量式力学量センサ装置 |
US20090282917A1 (en) * | 2008-05-19 | 2009-11-19 | Cenk Acar | Integrated multi-axis micromachined inertial sensing unit and method of fabrication |
JP2010107325A (ja) * | 2008-10-30 | 2010-05-13 | Hitachi Automotive Systems Ltd | センサ装置およびその製造方法 |
JP2010153406A (ja) * | 2008-12-23 | 2010-07-08 | Denso Corp | 半導体装置およびその製造方法 |
JP2010217170A (ja) * | 2009-02-17 | 2010-09-30 | Seiko Epson Corp | 複合センサー、電子機器 |
JP2011242371A (ja) * | 2010-05-21 | 2011-12-01 | Hitachi Automotive Systems Ltd | 複合センサおよびその製造方法 |
JP2012154802A (ja) * | 2011-01-26 | 2012-08-16 | Denso Corp | 加速度角速度センサ装置の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5605347B2 (ja) * | 2011-11-01 | 2014-10-15 | 株式会社デンソー | 半導体装置の製造方法 |
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2013
- 2013-07-02 JP JP2013138648A patent/JP2015011002A/ja active Pending
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2014
- 2014-02-07 WO PCT/JP2014/052828 patent/WO2015001813A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002005950A (ja) * | 2000-06-23 | 2002-01-09 | Murata Mfg Co Ltd | 複合センサ素子およびその製造方法 |
JP2006084327A (ja) * | 2004-09-16 | 2006-03-30 | Denso Corp | 容量式力学量センサ装置 |
US20090282917A1 (en) * | 2008-05-19 | 2009-11-19 | Cenk Acar | Integrated multi-axis micromachined inertial sensing unit and method of fabrication |
JP2010107325A (ja) * | 2008-10-30 | 2010-05-13 | Hitachi Automotive Systems Ltd | センサ装置およびその製造方法 |
JP2010153406A (ja) * | 2008-12-23 | 2010-07-08 | Denso Corp | 半導体装置およびその製造方法 |
JP2010217170A (ja) * | 2009-02-17 | 2010-09-30 | Seiko Epson Corp | 複合センサー、電子機器 |
JP2011242371A (ja) * | 2010-05-21 | 2011-12-01 | Hitachi Automotive Systems Ltd | 複合センサおよびその製造方法 |
JP2012154802A (ja) * | 2011-01-26 | 2012-08-16 | Denso Corp | 加速度角速度センサ装置の製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107032290A (zh) * | 2016-01-21 | 2017-08-11 | 台湾积体电路制造股份有限公司 | 半导体器件及其形成方法 |
US10981779B2 (en) | 2016-01-21 | 2021-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS devices and methods of forming the same |
CN107032290B (zh) * | 2016-01-21 | 2022-01-04 | 台湾积体电路制造股份有限公司 | 半导体器件及其形成方法 |
JP2018031714A (ja) * | 2016-08-26 | 2018-03-01 | 日立オートモティブシステムズ株式会社 | 物理量センサ |
JP2018069395A (ja) * | 2016-10-31 | 2018-05-10 | 株式会社豊田中央研究所 | Mems装置 |
CN112265956A (zh) * | 2020-09-25 | 2021-01-26 | 华东光电集成器件研究所 | 一种不同真空度封装的mems圆片级真空封装方法 |
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