JP2015010871A - 物理量センサ - Google Patents
物理量センサ Download PDFInfo
- Publication number
- JP2015010871A JP2015010871A JP2013134840A JP2013134840A JP2015010871A JP 2015010871 A JP2015010871 A JP 2015010871A JP 2013134840 A JP2013134840 A JP 2013134840A JP 2013134840 A JP2013134840 A JP 2013134840A JP 2015010871 A JP2015010871 A JP 2015010871A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- physical quantity
- resistivity
- semiconductor layer
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 209
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 52
- 239000010703 silicon Substances 0.000 claims abstract description 52
- 239000004065 semiconductor Substances 0.000 claims description 34
- 239000007769 metal material Substances 0.000 claims description 5
- 230000000737 periodic effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000001133 acceleration Effects 0.000 description 24
- 238000007789 sealing Methods 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000001514 detection method Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013134840A JP2015010871A (ja) | 2013-06-27 | 2013-06-27 | 物理量センサ |
PCT/JP2014/003219 WO2014208043A1 (fr) | 2013-06-27 | 2014-06-17 | Détecteur de grandeur physique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013134840A JP2015010871A (ja) | 2013-06-27 | 2013-06-27 | 物理量センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015010871A true JP2015010871A (ja) | 2015-01-19 |
Family
ID=52141411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013134840A Pending JP2015010871A (ja) | 2013-06-27 | 2013-06-27 | 物理量センサ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2015010871A (fr) |
WO (1) | WO2014208043A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9643125B2 (en) | 2012-03-26 | 2017-05-09 | Fluor Technologies Corporation | Emissions reduction for CO2 capture |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006344934A (ja) * | 2005-05-09 | 2006-12-21 | Denso Corp | 半導体装置およびその製造方法 |
JP2009283900A (ja) * | 2008-04-22 | 2009-12-03 | Denso Corp | 力学量センサの製造方法および力学量センサ |
JP2010171368A (ja) * | 2008-12-25 | 2010-08-05 | Denso Corp | 半導体装置およびその製造方法 |
JP2011017693A (ja) * | 2009-06-09 | 2011-01-27 | Denso Corp | 半導体力学量センサの製造方法及び半導体力学量センサ |
-
2013
- 2013-06-27 JP JP2013134840A patent/JP2015010871A/ja active Pending
-
2014
- 2014-06-17 WO PCT/JP2014/003219 patent/WO2014208043A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006344934A (ja) * | 2005-05-09 | 2006-12-21 | Denso Corp | 半導体装置およびその製造方法 |
JP2009283900A (ja) * | 2008-04-22 | 2009-12-03 | Denso Corp | 力学量センサの製造方法および力学量センサ |
JP2010171368A (ja) * | 2008-12-25 | 2010-08-05 | Denso Corp | 半導体装置およびその製造方法 |
JP2011017693A (ja) * | 2009-06-09 | 2011-01-27 | Denso Corp | 半導体力学量センサの製造方法及び半導体力学量センサ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9643125B2 (en) | 2012-03-26 | 2017-05-09 | Fluor Technologies Corporation | Emissions reduction for CO2 capture |
US10052585B2 (en) | 2012-03-26 | 2018-08-21 | Fluor Technologies Corporation | Emissions reduction for CO2 capture |
US10486104B2 (en) | 2012-03-26 | 2019-11-26 | Fluor Technologies Corporation | Emissions reduction for CO2 capture |
Also Published As
Publication number | Publication date |
---|---|
WO2014208043A1 (fr) | 2014-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151117 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160712 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170124 |