JP2014534615A5 - - Google Patents
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- Publication number
- JP2014534615A5 JP2014534615A5 JP2014533684A JP2014533684A JP2014534615A5 JP 2014534615 A5 JP2014534615 A5 JP 2014534615A5 JP 2014533684 A JP2014533684 A JP 2014533684A JP 2014533684 A JP2014533684 A JP 2014533684A JP 2014534615 A5 JP2014534615 A5 JP 2014534615A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hump
- brush
- contact
- rounded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 37
- 238000004140 cleaning Methods 0.000 description 3
- 241000512259 Ascophyllum nodosum Species 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161539342P | 2011-09-26 | 2011-09-26 | |
| US61/539,342 | 2011-09-26 | ||
| PCT/US2012/057337 WO2013049207A2 (en) | 2011-09-26 | 2012-09-26 | Post-cmp cleaning apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014534615A JP2014534615A (ja) | 2014-12-18 |
| JP2014534615A5 true JP2014534615A5 (cg-RX-API-DMAC7.html) | 2015-11-19 |
Family
ID=47996722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014533684A Pending JP2014534615A (ja) | 2011-09-26 | 2012-09-26 | Ｃｍｐ後クリーニング装置および方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140230170A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2014534615A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20140069043A (cg-RX-API-DMAC7.html) |
| CN (1) | CN103918063A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201318779A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2013049207A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10504753B2 (en) * | 2013-12-13 | 2019-12-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method |
| US10790167B2 (en) | 2014-02-20 | 2020-09-29 | Entegris, Inc. | Nodule ratios for targeted enhanced cleaning performance |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| JP6545261B2 (ja) | 2014-10-17 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造 |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| JP6316730B2 (ja) * | 2014-10-31 | 2018-04-25 | 株式会社荏原製作所 | ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置 |
| KR102389613B1 (ko) | 2015-05-06 | 2022-04-22 | 삼성전자주식회사 | 기판 세정 장치 |
| US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| JP6643942B2 (ja) * | 2016-04-12 | 2020-02-12 | 株式会社荏原製作所 | 洗浄部材、基板洗浄装置及び基板処理装置 |
| US11923208B2 (en) | 2017-05-19 | 2024-03-05 | Illinois Tool Works Inc. | Methods and apparatuses for chemical delivery for brush conditioning |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| US11694910B2 (en) * | 2019-09-10 | 2023-07-04 | Illinois Tool Works Inc. | Brush with non-constant nodule density |
| US11470956B2 (en) | 2020-03-06 | 2022-10-18 | Applied Materials, Inc. | Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| JP2022134658A (ja) * | 2021-03-03 | 2022-09-15 | アイオン株式会社 | ブラシローラ |
| JP7714819B2 (ja) * | 2022-05-31 | 2025-07-29 | インテグリス・インコーポレーテッド | 半導体作製プロセスのための洗浄ブラシ |
| JP2024047416A (ja) * | 2022-09-26 | 2024-04-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板洗浄ブラシおよび基板洗浄装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596974A (ja) * | 1982-07-05 | 1984-01-14 | カネボウ株式会社 | 洗浄方法 |
| US6299698B1 (en) * | 1998-07-10 | 2001-10-09 | Applied Materials, Inc. | Wafer edge scrubber and method |
| JP4554011B2 (ja) * | 1999-08-10 | 2010-09-29 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| US6467120B1 (en) * | 1999-09-08 | 2002-10-22 | International Business Machines Corporation | Wafer cleaning brush profile modification |
| JP2001358110A (ja) * | 2000-06-13 | 2001-12-26 | Hitachi Ltd | スクラブ洗浄装置およびそれを用いた半導体装置の製造方法 |
| JP2003051481A (ja) * | 2001-08-07 | 2003-02-21 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| KR101158137B1 (ko) * | 2003-08-08 | 2012-06-19 | 엔테그리스, 아이엔씨. | 회전식 기부 상에 주조된 일체형 다공성 패드를 제조하기위한 방법 및 재료 |
| US7469443B2 (en) * | 2005-01-10 | 2008-12-30 | Intel Corporation | Brush for cleaning wafer |
| JP2008119621A (ja) * | 2006-11-14 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 洗浄用ローラブラシ |
| JP2009117765A (ja) * | 2007-11-09 | 2009-05-28 | Aion Kk | 洗浄用スポンジローラ |
| WO2010001761A1 (ja) * | 2008-06-30 | 2010-01-07 | アイオン株式会社 | 洗浄用スポンジローラ |
| USD682497S1 (en) * | 2010-12-21 | 2013-05-14 | Entegris, Inc. | Substrate cleaning brush |
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2012
- 2012-09-26 US US14/347,170 patent/US20140230170A1/en not_active Abandoned
- 2012-09-26 WO PCT/US2012/057337 patent/WO2013049207A2/en not_active Ceased
- 2012-09-26 KR KR1020147008038A patent/KR20140069043A/ko not_active Withdrawn
- 2012-09-26 JP JP2014533684A patent/JP2014534615A/ja active Pending
- 2012-09-26 TW TW101135344A patent/TW201318779A/zh unknown
- 2012-09-26 CN CN201280045932.7A patent/CN103918063A/zh active Pending