JP2014533907A5 - - Google Patents
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- Publication number
- JP2014533907A5 JP2014533907A5 JP2014541778A JP2014541778A JP2014533907A5 JP 2014533907 A5 JP2014533907 A5 JP 2014533907A5 JP 2014541778 A JP2014541778 A JP 2014541778A JP 2014541778 A JP2014541778 A JP 2014541778A JP 2014533907 A5 JP2014533907 A5 JP 2014533907A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- cell
- electrode
- collapse
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161560836P | 2011-11-17 | 2011-11-17 | |
| US61/560,836 | 2011-11-17 | ||
| PCT/IB2012/056152 WO2013072803A1 (en) | 2011-11-17 | 2012-11-05 | Pre-collapsed capacitive micro-machined transducer cell with annular-shaped collapsed region |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014533907A JP2014533907A (ja) | 2014-12-15 |
| JP2014533907A5 true JP2014533907A5 (enExample) | 2015-12-17 |
| JP6265906B2 JP6265906B2 (ja) | 2018-01-24 |
Family
ID=47324242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014541778A Expired - Fee Related JP6265906B2 (ja) | 2011-11-17 | 2012-11-05 | 円環形状の崩壊領域を持つ崩壊前の静電容量型トランスデューサーセル |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US9762148B2 (enExample) |
| EP (1) | EP2747905B1 (enExample) |
| JP (1) | JP6265906B2 (enExample) |
| CN (1) | CN103958079B (enExample) |
| BR (1) | BR112014011644A2 (enExample) |
| IN (1) | IN2014CN03656A (enExample) |
| MX (1) | MX2014005795A (enExample) |
| RU (1) | RU2609917C2 (enExample) |
| WO (1) | WO2013072803A1 (enExample) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917304B (zh) * | 2011-10-28 | 2016-08-17 | 皇家飞利浦有限公司 | 具有应力层的预塌陷电容式微加工换能器单元 |
| JP6513674B2 (ja) * | 2013-08-27 | 2019-05-15 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | デュアルモードｃｍｕｔトランスデューサ |
| WO2015028325A1 (en) * | 2013-08-30 | 2015-03-05 | Koninklijke Philips N.V. | Capacitive micro-machined ultrasound transducer cell |
| CN105592941B (zh) * | 2013-09-27 | 2018-01-19 | 皇家飞利浦有限公司 | 超声换能器组件和用于发送和接收超声波的方法 |
| WO2017001636A1 (en) * | 2015-06-30 | 2017-01-05 | Koninklijke Philips N.V. | Ultrasound system and ultrasonic pulse transmission method |
| US10670716B2 (en) | 2016-05-04 | 2020-06-02 | Invensense, Inc. | Operating a two-dimensional array of ultrasonic transducers |
| US10445547B2 (en) | 2016-05-04 | 2019-10-15 | Invensense, Inc. | Device mountable packaging of ultrasonic transducers |
| US10315222B2 (en) | 2016-05-04 | 2019-06-11 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10656255B2 (en) * | 2016-05-04 | 2020-05-19 | Invensense, Inc. | Piezoelectric micromachined ultrasonic transducer (PMUT) |
| US10600403B2 (en) | 2016-05-10 | 2020-03-24 | Invensense, Inc. | Transmit operation of an ultrasonic sensor |
| US10562070B2 (en) | 2016-05-10 | 2020-02-18 | Invensense, Inc. | Receive operation of an ultrasonic sensor |
| US10408797B2 (en) | 2016-05-10 | 2019-09-10 | Invensense, Inc. | Sensing device with a temperature sensor |
| US10452887B2 (en) | 2016-05-10 | 2019-10-22 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| US10706835B2 (en) | 2016-05-10 | 2020-07-07 | Invensense, Inc. | Transmit beamforming of a two-dimensional array of ultrasonic transducers |
| US10441975B2 (en) | 2016-05-10 | 2019-10-15 | Invensense, Inc. | Supplemental sensor modes and systems for ultrasonic transducers |
| US10539539B2 (en) | 2016-05-10 | 2020-01-21 | Invensense, Inc. | Operation of an ultrasonic sensor |
| US10632500B2 (en) | 2016-05-10 | 2020-04-28 | Invensense, Inc. | Ultrasonic transducer with a non-uniform membrane |
| US11673165B2 (en) | 2016-05-10 | 2023-06-13 | Invensense, Inc. | Ultrasonic transducer operable in a surface acoustic wave (SAW) mode |
| US11627938B2 (en) * | 2016-08-30 | 2023-04-18 | Koninklijke Philips N.V. | Imaging device with ultrasound transducer array |
| US10891461B2 (en) | 2017-05-22 | 2021-01-12 | Invensense, Inc. | Live fingerprint detection utilizing an integrated ultrasound and infrared sensor |
| US10474862B2 (en) | 2017-06-01 | 2019-11-12 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| US10643052B2 (en) | 2017-06-28 | 2020-05-05 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| US10997388B2 (en) | 2017-12-01 | 2021-05-04 | Invensense, Inc. | Darkfield contamination detection |
| US10936841B2 (en) | 2017-12-01 | 2021-03-02 | Invensense, Inc. | Darkfield tracking |
| US10984209B2 (en) | 2017-12-01 | 2021-04-20 | Invensense, Inc. | Darkfield modeling |
| US11151355B2 (en) | 2018-01-24 | 2021-10-19 | Invensense, Inc. | Generation of an estimated fingerprint |
| EP3533386A1 (en) | 2018-02-28 | 2019-09-04 | Koninklijke Philips N.V. | Pressure sensing with capacitive pressure sensor |
| US10755067B2 (en) | 2018-03-22 | 2020-08-25 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| CN108793061B (zh) * | 2018-05-25 | 2020-11-27 | 岭南师范学院 | 一种全电极凸纹结构cmut器件的制备方法 |
| CN112533529A (zh) * | 2018-08-09 | 2021-03-19 | 皇家飞利浦有限公司 | 具有电容性压力传感器的腔内设备 |
| CN109530194B (zh) * | 2018-10-18 | 2020-07-14 | 天津大学 | 一种多电极cmut单元及多频式电容微机械超声换能器 |
| US10936843B2 (en) | 2018-12-28 | 2021-03-02 | Invensense, Inc. | Segmented image acquisition |
| KR102196437B1 (ko) | 2019-01-29 | 2020-12-30 | 한국과학기술연구원 | 정전용량형 미세가공 초음파 트랜스듀서 |
| CN109909140B (zh) * | 2019-03-06 | 2021-06-04 | 中国工程物理研究院电子工程研究所 | 一种压电微机械超声换能器及其制备方法 |
| US11188735B2 (en) | 2019-06-24 | 2021-11-30 | Invensense, Inc. | Fake finger detection using ridge features |
| WO2020264046A1 (en) | 2019-06-25 | 2020-12-30 | Invensense, Inc. | Fake finger detection based on transient features |
| US11216632B2 (en) | 2019-07-17 | 2022-01-04 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11176345B2 (en) | 2019-07-17 | 2021-11-16 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11232549B2 (en) | 2019-08-23 | 2022-01-25 | Invensense, Inc. | Adapting a quality threshold for a fingerprint image |
| US11392789B2 (en) | 2019-10-21 | 2022-07-19 | Invensense, Inc. | Fingerprint authentication using a synthetic enrollment image |
| EP4100176B1 (en) | 2020-03-09 | 2024-10-09 | InvenSense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11243300B2 (en) | 2020-03-10 | 2022-02-08 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor |
| US11328165B2 (en) | 2020-04-24 | 2022-05-10 | Invensense, Inc. | Pressure-based activation of fingerprint spoof detection |
| US11995909B2 (en) | 2020-07-17 | 2024-05-28 | Tdk Corporation | Multipath reflection correction |
| US12174295B2 (en) | 2020-08-07 | 2024-12-24 | Tdk Corporation | Acoustic multipath correction |
| US12416807B2 (en) | 2021-08-20 | 2025-09-16 | Tdk Corporation | Retinal projection display system |
| US12260050B2 (en) | 2021-08-25 | 2025-03-25 | Tdk Corporation | Differential receive at an ultrasonic transducer |
| TWI814403B (zh) * | 2022-05-26 | 2023-09-01 | 佳世達科技股份有限公司 | 超聲波換能器 |
| DE102022120750A1 (de) * | 2022-08-17 | 2024-02-22 | Infineon Technologies Ag | Vorrichtung mit Ultraschallwandler und Verfahren zur Herstellung derselben |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003009319A1 (en) | 2001-07-17 | 2003-01-30 | Redwood Microsystems, Inc. | Micro-electromechanical sensor |
| WO2005084284A2 (en) * | 2004-02-27 | 2005-09-15 | Georgia Tech Research Corporation | Multiple element electrode cmut devices and fabrication methods |
| US20060004289A1 (en) * | 2004-06-30 | 2006-01-05 | Wei-Cheng Tian | High sensitivity capacitive micromachined ultrasound transducer |
| JP4724505B2 (ja) * | 2005-09-09 | 2011-07-13 | 株式会社日立製作所 | 超音波探触子およびその製造方法 |
| US7615834B2 (en) * | 2006-02-28 | 2009-11-10 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane |
| CN101772383B (zh) * | 2007-07-31 | 2011-11-02 | 皇家飞利浦电子股份有限公司 | 具有高k电介质的cmut |
| WO2009037655A2 (en) * | 2007-09-17 | 2009-03-26 | Koninklijke Philips Electronics, N.V. | Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof |
| WO2009041675A1 (en) * | 2007-09-25 | 2009-04-02 | Canon Kabushiki Kaisha | Electrostatic transducer and manufacturing method therefor |
| JP5408935B2 (ja) | 2007-09-25 | 2014-02-05 | キヤノン株式会社 | 電気機械変換素子及びその製造方法 |
| WO2009073562A1 (en) * | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Dual-mode operation micromachined ultrasonic transducer |
| JP5833312B2 (ja) * | 2007-12-14 | 2015-12-16 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | 輪郭成形基板を含む崩壊モードで動作可能なｃＭＵＴ |
| EP2145696A1 (en) * | 2008-07-15 | 2010-01-20 | UAB Minatech | Capacitive micromachined ultrasonic transducer and its fabrication method |
| US9132693B2 (en) | 2008-09-16 | 2015-09-15 | Koninklijke Philps N.V. | Capacitive micromachine ultrasound transducer |
| EP2400893B1 (en) * | 2009-02-27 | 2017-01-04 | Koninklijke Philips N.V. | Pre-collapsed cmut with mechanical collapse retention |
| EP2269746B1 (en) * | 2009-07-02 | 2014-05-14 | Nxp B.V. | Collapsed mode capacitive sensor |
| JP2012095112A (ja) * | 2010-10-27 | 2012-05-17 | Olympus Corp | 超音波発生ユニット |
-
2012
- 2012-11-05 MX MX2014005795A patent/MX2014005795A/es unknown
- 2012-11-05 RU RU2014124363A patent/RU2609917C2/ru not_active IP Right Cessation
- 2012-11-05 BR BR112014011644A patent/BR112014011644A2/pt not_active Application Discontinuation
- 2012-11-05 IN IN3656CHN2014 patent/IN2014CN03656A/en unknown
- 2012-11-05 JP JP2014541778A patent/JP6265906B2/ja not_active Expired - Fee Related
- 2012-11-05 EP EP12798402.9A patent/EP2747905B1/en active Active
- 2012-11-05 CN CN201280056554.2A patent/CN103958079B/zh not_active Expired - Fee Related
- 2012-11-05 WO PCT/IB2012/056152 patent/WO2013072803A1/en not_active Ceased
- 2012-11-05 US US14/351,888 patent/US9762148B2/en not_active Expired - Fee Related
-
2017
- 2017-08-22 US US15/683,097 patent/US10128777B2/en active Active
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