CN103958079B - 具有环形塌陷区域的预塌陷电容式微机械换能器元件 - Google Patents

具有环形塌陷区域的预塌陷电容式微机械换能器元件 Download PDF

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Publication number
CN103958079B
CN103958079B CN201280056554.2A CN201280056554A CN103958079B CN 103958079 B CN103958079 B CN 103958079B CN 201280056554 A CN201280056554 A CN 201280056554A CN 103958079 B CN103958079 B CN 103958079B
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China
Prior art keywords
region
electrode
collapsed
unit
annular
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Expired - Fee Related
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CN201280056554.2A
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English (en)
Chinese (zh)
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CN103958079A (zh
Inventor
A·L·鲁滨逊
J·D·弗雷泽
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
CN201280056554.2A 2011-11-17 2012-11-05 具有环形塌陷区域的预塌陷电容式微机械换能器元件 Expired - Fee Related CN103958079B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161560836P 2011-11-17 2011-11-17
US61/560,836 2011-11-17
PCT/IB2012/056152 WO2013072803A1 (en) 2011-11-17 2012-11-05 Pre-collapsed capacitive micro-machined transducer cell with annular-shaped collapsed region

Publications (2)

Publication Number Publication Date
CN103958079A CN103958079A (zh) 2014-07-30
CN103958079B true CN103958079B (zh) 2016-08-24

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CN201280056554.2A Expired - Fee Related CN103958079B (zh) 2011-11-17 2012-11-05 具有环形塌陷区域的预塌陷电容式微机械换能器元件

Country Status (9)

Country Link
US (2) US9762148B2 (enExample)
EP (1) EP2747905B1 (enExample)
JP (1) JP6265906B2 (enExample)
CN (1) CN103958079B (enExample)
BR (1) BR112014011644A2 (enExample)
IN (1) IN2014CN03656A (enExample)
MX (1) MX2014005795A (enExample)
RU (1) RU2609917C2 (enExample)
WO (1) WO2013072803A1 (enExample)

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JP6513674B2 (ja) * 2013-08-27 2019-05-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． デュアルモードｃｍｕｔトランスデューサ
CN105658343A (zh) * 2013-08-30 2016-06-08 皇家飞利浦有限公司 电容性微机械超声换能器单元
JP6534190B2 (ja) 2013-09-27 2019-06-26 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスデューサアセンブリ並びに超音波を送信及び受信するための方法
EP3317026B1 (en) 2015-06-30 2023-12-20 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10656255B2 (en) * 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
WO2018041658A2 (en) * 2016-08-30 2018-03-08 Koninklijke Philips N.V. Imaging device with ultrasound transducer array
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
US10936841B2 (en) 2017-12-01 2021-03-02 Invensense, Inc. Darkfield tracking
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
EP3533386A1 (en) 2018-02-28 2019-09-04 Koninklijke Philips N.V. Pressure sensing with capacitive pressure sensor
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
CN108793061B (zh) * 2018-05-25 2020-11-27 岭南师范学院 一种全电极凸纹结构cmut器件的制备方法
US20210298617A1 (en) * 2018-08-09 2021-09-30 Koninklijke Philips N.V. Intraluminal device with capacitive pressure sensor
CN109530194B (zh) * 2018-10-18 2020-07-14 天津大学 一种多电极cmut单元及多频式电容微机械超声换能器
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
CN109909140B (zh) * 2019-03-06 2021-06-04 中国工程物理研究院电子工程研究所 一种压电微机械超声换能器及其制备方法
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
US11216681B2 (en) 2019-06-25 2022-01-04 Invensense, Inc. Fake finger detection based on transient features
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
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CN115551650A (zh) 2020-03-09 2022-12-30 应美盛公司 具有非均匀厚度的接触层的超声指纹传感器
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
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TWI814403B (zh) * 2022-05-26 2023-09-01 佳世達科技股份有限公司 超聲波換能器
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Publication number Publication date
EP2747905A1 (en) 2014-07-02
RU2014124363A (ru) 2015-12-27
WO2013072803A1 (en) 2013-05-23
RU2609917C2 (ru) 2017-02-07
CN103958079A (zh) 2014-07-30
US9762148B2 (en) 2017-09-12
JP2014533907A (ja) 2014-12-15
US10128777B2 (en) 2018-11-13
MX2014005795A (es) 2014-05-30
US20170353129A1 (en) 2017-12-07
BR112014011644A2 (pt) 2017-05-02
EP2747905B1 (en) 2021-10-20
IN2014CN03656A (enExample) 2015-10-16
US20140265721A1 (en) 2014-09-18
JP6265906B2 (ja) 2018-01-24

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Granted publication date: 20160824