JP2014531708A - 大面積基板の厚膜製造方法及びこれによる厚膜構造、照明装置及びこれを含む液晶表示装置 - Google Patents
大面積基板の厚膜製造方法及びこれによる厚膜構造、照明装置及びこれを含む液晶表示装置 Download PDFInfo
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Abstract
Description
さらに、前記光学パターン(250)は、前記レジン層(240)を通過して出射される光を拡散する機能を有し、特に光の強度が強すぎて光学特性が悪くなったり黄色光が導出(yellowish)される現象を防ぐために、一定部分遮光効果が実現できるように光学パターン(251)を形成することが好ましい。すなわち、光の集中ができないように遮光インキを用いて遮光パターンを印刷することができる。前記光学パターン(251)は基本的に前記拡散板(250)の下部面又は上部面に印刷される方式で実現でき、特に好ましくは、拡散板の下部に配置されるLED光源(210)の位置から光が出射する方向(前方向)に配置することが好ましい。すなわち、前記LED光源の垂直上部面又は光出射方向面に対応する位置の拡散板に配置することができる。より具体的には、光の出射方向に拡散板の下面にTiO2、CaCO3、BaSO4、Al2O3、Siliconから選択されるいずれか一つ以上の物質を含む遮光インキを用いて形成される拡散パターンと、AlまたはAlとTiO2との混合物質を含む遮光インキを用いた遮光パターンとの重畳印刷構造で実現することができる。
120:第1のレジン(第1のレジン領域)
130:第2のレジン(第2のレジン領域)
210: LED
220:印刷回路基板
230:反射パターン
240:レジン層
250:拡散板
251:光学パターン
260:プリズムシート
Claims (21)
- ベース基板上に第1のレジンを塗布してレジン隔壁を形成し、
前記レジン隔壁が形成する内部領域に第2のレジンを塗布することを含む大面積基板の厚膜製造方法。 - 前記ベース基板上に第1のレジンを塗布してレジン隔壁を形成することは、
前記ベース基板に縁部に沿って上部が開口された閉空間を形成する構造でレジンを塗布し、硬化又は半硬化する段階であることを特徴とする請求項1記載の大面積基板の厚膜製造方法。 - 前記レジン隔壁が形成する内部領域に第2のレジンを塗布することは、前記第1のレジンと同一材料で前記第2のレジンを塗布し、硬化する工程である、請求項2記載の大面積基板の厚膜製造方法。
- 前記レジン隔壁が形成する内部領域に第2のレジンを塗布することは、前記第1のレジンと異なる材料で前記第2のレジンを塗布する工程である、請求項2記載の大面積基板の厚膜製造方法。
- 前記レジン隔壁が形成する内部領域に第2のレジンを塗布することは、前記第2のレジンが塗布される領域が前記第1のレジンが塗布される領域よりヘイズ(haze)が低く形成される工程である、請求項4記載の大面積基板の厚膜製造方法。
- 前記レジン隔壁が形成する内部領域に第2のレジンを塗布することは、前記第2のレジン内に光の反射を増加させるビード(bead)を更に含んで塗布する工程である、請求項3記載の大面積基板の厚膜製造方法。
- 前記ビード(bead)は、全体第2のレジンの重量対比0.01〜0.3%含まれているものを用いる、請求項6記載の大面積基板の厚膜製造方法。
- 前記第2のレジンは、オリゴマーと高分子樹脂(polymer type)との混合物及びモノマーを含むものを用いる、請求項3記載の大面積基板の厚膜製造方法。
- ベース基板;該ベース基板上に形成されるレジン層;を備え、前記レジン層は、前記レジン層の縁領域に形成される第1のレジン領域と前記第1のレジン領域の内部に形成される第2のレジン領域とからなる、大面積基板の厚膜構造。
- 前記第1のレジン領域は、前記第2のレジン領域を内部に収容する隔壁構造で全体レジン層の縁部を形成する、請求項9記載の大面積基板の厚膜構造。
- 前記第1のレジン領域及び第2のレジン領域は同一材料で形成され、
前記第1のレジン領域の透明度(A)が第2のレジン領域の透明度(B)より低いことを特徴とする、請求項10記載の大面積基板の厚膜構造。 - 前記第1のレジン領域及び第2のレジン領域は互いに異なる材料で形成され、前記第1のレジン領域の透明度(A)が第2のレジン領域の透明度(B)より低いことを特徴とする、請求項10記載の大面積基板の厚膜構造。
- 前記第2のレジン領域には、光の反射を増加させるビード(bead)を全体第1のレジン領域の重量対比0.01〜0.3%を含むことを特徴とする、請求項10記載の大面積基板の厚膜構造。
- 前記第2のレジン領域の厚さ(T2)は、第1のレジン領域の厚さ(T1)以上に形成されていることを特徴とする、請求項13記載の大面積基板の厚膜構造。
- 前記レジン層は、熱硬化性樹脂又は光硬化性樹脂で形成されていることを特徴とする、請求項13記載の大面積基板の厚膜構造。
- 前記第2のレジン領域は、オリゴマーと高分子樹脂(polymer type)との混合物及びモノマーを含むものを用いる、請求項11記載の大面積基板の厚膜構造。
- 前記第2のレジン領域は、前記オリゴマーとしてウレタンアクリレートオリゴマーを、前記高分子樹脂としてポリアクリル樹脂を含んでいる、請求項16記載の大面積基板の厚膜構造。
- 前記第2のレジン領域は、
前記モノマーとして、IBOA(Isobornyl Acrylate)、HPA(Hydroxypropyl Acrylate)、2−HEA(2−hydroxyethyl Acrylate)の混合物を用いる、請求項17記載の大面積基板の厚膜構造。 - 前記第2のレジン領域は、
光開始剤及び酸化防止剤を更に含んでなる請求項18記載の大面積基板の厚膜構造。 - 反射フィルムが積層された印刷回路基板上に形成される多数のLED光源と、前記LED光源から出射される光を遮光する光学パターンが印刷された拡散板;
前記LED光源上に積層され、出射される光を前方に拡散誘導する請求項11記載の厚膜構造で形成されるレジン層;を含んでなる照明装置。 - 側面型発光ダイオード(side view LED)を光源として利用し、前記光源を収容する構造で積層される第1のレジン領域と第2のレジン領域に区分されるレジン層;
前記レジン層の上部に光学パターンが形成された拡散板を備えた請求項20記載の照明装置を含む液晶表示装置。
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CN110027147B (zh) * | 2018-01-08 | 2021-10-29 | 阳程科技股份有限公司 | 异形光学胶脂的成型方法 |
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Also Published As
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CN103796819B (zh) | 2018-05-29 |
US20150160375A1 (en) | 2015-06-11 |
JP5894278B2 (ja) | 2016-03-23 |
EP2753468A4 (en) | 2015-07-08 |
EP2753468A1 (en) | 2014-07-16 |
WO2013035911A1 (en) | 2013-03-14 |
CN103796819A (zh) | 2014-05-14 |
EP2753468B1 (en) | 2017-03-08 |
US9857502B2 (en) | 2018-01-02 |
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