JP2014525608A - 集積導波路カプラ - Google Patents
集積導波路カプラ Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/14—Mode converters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/3013—AIIIBV compounds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12061—Silicon
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1223—Basic optical elements, e.g. light-guiding paths high refractive index type, i.e. high-contrast waveguides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1228—Tapered waveguides, e.g. integrated spot-size transformers
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Integrated Circuits (AREA)
- Power Engineering (AREA)
Abstract
【選択図】 図1−1
Description
Claims (21)
- 第1の導波路と、
第2の導波路と、
前記第1の導波路と前記第2の導波路との間に配置された接続導波路と、
を備え、
前記接続導波路が、第1の屈折率を有する第1の材料と、前記第1の屈折率より高い第2の屈折率を有する第2の材料とを備える、集積導波路カプラ。 - 前記第1の導波路、前記第2の導波路及び前記接続導波路に対して垂直に配置された材料をさらに備え、前記材料が、前記第1の導波路、前記第2の導波路及び前記接続導波路の有効屈折率より低い屈折率によって特徴付けられる、請求項1に記載の導波路カプラ。
- 前記材料が不動態化酸化物を備える、請求項2に記載の導波路カプラ。
- 前記第1の導波路の有効屈折率が、前記第2の導波路の有効屈折率に実質的に等しい、請求項1に記載の導波路カプラ。
- 前記第1の導波路及び前記第2の導波路が、長手方向に沿って結合され、前記接続導波路が、前記長手方向に沿ってテーパ状である幅によって特徴付けられる、請求項1に記載の導波路カプラ。
- 第1の導波路と第2の導波路とを含む基板であって、前記第1の導波路及び前記第2の導波路が、どちらも長手方向に沿って光を導くように動作可能であり、底部表面を有する間隙によって空間的に分離される、基板を準備するステップと、
前記間隙に第1の屈折率を有する第1の材料を形成するステップと、
前記間隙に前記第1の屈折率より高い屈折率を有する第2の材料を形成するステップと、
を備える、導波路カプラを製作する方法。 - 前記第1の屈折率が、前記第1の導波路及び前記第2の導波路の有効屈折率より低い、請求項6に記載の方法。
- 前記第1の導波路が、リッジガイド構造を含むシリコン材料を備える、請求項6に記載の方法。
- 前記第2の導波路が、III−V材料を備える、請求項6に記載の方法。
- 前記第1の材料が、酸化シリコン材料を備える、請求項6に記載の方法。
- 前記第2の材料が、アモルファスシリコン材料を備える、請求項6に記載の方法。
- 前記間隙に前記第1の材料を形成するステップが、前記第1の材料の堆積と、平坦化工程と、後続の前記第1の材料のエッチングとを含む、請求項6に記載の方法。
- 前記間隙に前記第2の材料を形成するステップが、前記第2の材料の堆積と、平坦化工程とを含む、請求項6に記載の方法。
- 前記間隙に前記第2の材料を形成するステップが、前記第2の材料の堆積のみ、又は前記第2の材料の堆積及び前記第2の材料のエッチングのうち少なくとも一方を備える、請求項6に記載の方法。
- 前記導波路カプラが、前記長手方向に沿って幅がテーパ状である、請求項6に記載の方法。
- ピーク振幅を有する光学モードを補助するように動作可能な第1の導波路領域と、
分離領域によって前記第1の導波路領域から空間的に分離される第2の導波路領域と、
前記分離領域に配置される多層導波路領域とを備え、
前記多層導波路領域が、前記光学モードより下位に位置する第1の屈折率を有する第1の材料と、前記ピーク振幅に調整された、前記第1の屈折率より高い第2の屈折率を有する第2の材料とを備える、光学素子。 - 前記第1の導波路領域と、前記第2の導波路領域と、前記多層導波路領域とを支持する基板をさらに備える、請求項16に記載の光学素子。
- 前記基板が、シリコン基板を備える、請求項17に記載の光学素子。
- 前記第1の導波路領域が、シリコンオンインシュレータ構造を備える、請求項16に記載の光学素子。
- 前記第2の導波路領域が、III−V材料構造を備える、請求項16に記載の光学素子。
- 前記第1の材料が酸化シリコン又は窒化シリコンのうち少なくとも1つを備え、前記第2の材料が、アモルファスシリコンを備える、請求項16に記載の光学素子。
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US201161528938P | 2011-08-30 | 2011-08-30 | |
US61/528,938 | 2011-08-30 | ||
US13/597,117 US9097846B2 (en) | 2011-08-30 | 2012-08-28 | Integrated waveguide coupler |
US13/597,117 | 2012-08-28 | ||
PCT/US2012/052913 WO2013033252A1 (en) | 2011-08-30 | 2012-08-29 | Integrated waveguide coupler |
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Also Published As
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US20150378097A1 (en) | 2015-12-31 |
US9268088B2 (en) | 2016-02-23 |
JP6799035B2 (ja) | 2020-12-09 |
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US20160246016A1 (en) | 2016-08-25 |
US10330871B2 (en) | 2019-06-25 |
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US11002925B2 (en) | 2021-05-11 |
US20130051727A1 (en) | 2013-02-28 |
WO2013033252A1 (en) | 2013-03-07 |
US9097846B2 (en) | 2015-08-04 |
US20220075130A1 (en) | 2022-03-10 |
EP2751603B1 (en) | 2020-02-12 |
US20200041732A1 (en) | 2020-02-06 |
KR102059891B1 (ko) | 2019-12-27 |
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KR20140060547A (ko) | 2014-05-20 |
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