JP2014517527A5 - - Google Patents

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Publication number
JP2014517527A5
JP2014517527A5 JP2014513275A JP2014513275A JP2014517527A5 JP 2014517527 A5 JP2014517527 A5 JP 2014517527A5 JP 2014513275 A JP2014513275 A JP 2014513275A JP 2014513275 A JP2014513275 A JP 2014513275A JP 2014517527 A5 JP2014517527 A5 JP 2014517527A5
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JP
Japan
Prior art keywords
light emitting
light
emitting module
cavity
base
Prior art date
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Application number
JP2014513275A
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English (en)
Japanese (ja)
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JP2014517527A (ja
JP6045571B2 (ja
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Application filed filed Critical
Priority claimed from PCT/IB2012/052427 external-priority patent/WO2012164426A1/en
Publication of JP2014517527A publication Critical patent/JP2014517527A/ja
Publication of JP2014517527A5 publication Critical patent/JP2014517527A5/ja
Application granted granted Critical
Publication of JP6045571B2 publication Critical patent/JP6045571B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014513275A 2011-06-01 2012-05-15 熱伝導体を有する発光モジュール、ランプ及び照明器具 Expired - Fee Related JP6045571B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11168348 2011-06-01
EP11168348.8 2011-06-01
PCT/IB2012/052427 WO2012164426A1 (en) 2011-06-01 2012-05-15 A light emitting module comprising a thermal conductor, a lamp and a luminaire

Publications (3)

Publication Number Publication Date
JP2014517527A JP2014517527A (ja) 2014-07-17
JP2014517527A5 true JP2014517527A5 (enExample) 2015-06-25
JP6045571B2 JP6045571B2 (ja) 2016-12-14

Family

ID=46208115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014513275A Expired - Fee Related JP6045571B2 (ja) 2011-06-01 2012-05-15 熱伝導体を有する発光モジュール、ランプ及び照明器具

Country Status (7)

Country Link
US (1) US8915619B2 (enExample)
EP (1) EP2715815B1 (enExample)
JP (1) JP6045571B2 (enExample)
KR (1) KR20140040778A (enExample)
CN (1) CN103563111B (enExample)
TW (1) TWI603033B (enExample)
WO (1) WO2012164426A1 (enExample)

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US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
KR101538603B1 (ko) * 2012-08-13 2015-07-21 코니카 미놀타 가부시키가이샤 형광체 분산액의 제조 방법 및 led 장치의 제조 방법
GB2505214A (en) * 2012-08-23 2014-02-26 Thorpe F W Plc Luminaire
KR20150040414A (ko) * 2013-10-07 2015-04-15 삼성디스플레이 주식회사 백라이트 어셈블리 및 그를 포함하는 표시장치
WO2015077369A1 (en) * 2013-11-19 2015-05-28 Qd Vision, Inc. Light emitting device including quantum dots
CN105179984B (zh) * 2014-06-18 2019-03-12 欧司朗有限公司 发光装置和制造发光装置的方法
US9954148B2 (en) 2014-10-24 2018-04-24 Citizen Electronics Co., Ltd. Light-emitting apparatus with optical element and method of manufacturing the same
WO2016093325A1 (ja) * 2014-12-11 2016-06-16 シチズン電子株式会社 発光装置
KR20170097758A (ko) * 2014-12-22 2017-08-28 지이 라이팅 솔루션스, 엘엘씨 야외 조명 시스템용 모듈형 열 관리 장치
CN104966727B (zh) * 2015-07-10 2018-10-02 京东方科技集团股份有限公司 封装方法、显示面板及显示装置
CN105470246B (zh) * 2015-12-21 2016-09-28 福建中科芯源光电科技有限公司 固态荧光体集成光源的双通道导热封装结构及封装方法
JP6789650B2 (ja) * 2016-03-28 2020-11-25 シチズン時計株式会社 Led発光装置
CN109564960A (zh) * 2016-05-11 2019-04-02 华为技术有限公司 量子点发光设备
US10234752B1 (en) 2018-03-31 2019-03-19 Coretronic Corporation Projector and light source module

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192795B2 (en) * 2004-11-18 2007-03-20 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US8071997B2 (en) * 2005-10-07 2011-12-06 Osram Sylvania Inc. LED with light transmissive heat sink
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
US7795600B2 (en) 2006-03-24 2010-09-14 Goldeneye, Inc. Wavelength conversion chip for use with light emitting diodes and method for making same
JP5073973B2 (ja) * 2006-06-21 2012-11-14 株式会社野田スクリーン 発光ダイオードパッケージ
US20090273002A1 (en) 2008-05-05 2009-11-05 Wen-Chih Chiou LED Package Structure and Fabrication Method
EP2277207A1 (en) * 2008-05-07 2011-01-26 Koninklijke Philips Electronics N.V. Illumination device with led with a self-supporting grid containing luminescent material and method of making the self-supporting grid
US8076833B2 (en) * 2008-06-30 2011-12-13 Bridgelux, Inc. Methods and apparatuses for enhancing heat dissipation from a light emitting device
US8410681B2 (en) 2008-06-30 2013-04-02 Bridgelux, Inc. Light emitting device having a refractory phosphor layer
TW201007063A (en) * 2008-08-13 2010-02-16 Eminent Main Ind Co Ltd Illumination lamp and assembling method thereof
JP2010129615A (ja) * 2008-11-25 2010-06-10 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP5327601B2 (ja) * 2008-12-12 2013-10-30 東芝ライテック株式会社 発光モジュールおよび照明装置
JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
JP6164843B2 (ja) * 2009-05-28 2017-07-19 フィリップス ライティング ホールディング ビー ヴィ 光源を囲むエンベロープを具備する照明装置
US8410371B2 (en) 2009-09-08 2013-04-02 Cree, Inc. Electronic device submounts with thermally conductive vias and light emitting devices including the same
KR101906863B1 (ko) * 2011-03-07 2018-10-11 루미리즈 홀딩 비.브이. 발광 모듈, 램프, 조명기구 및 표시 디바이스

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