JP2014514449A5 - - Google Patents

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Publication number
JP2014514449A5
JP2014514449A5 JP2014502951A JP2014502951A JP2014514449A5 JP 2014514449 A5 JP2014514449 A5 JP 2014514449A5 JP 2014502951 A JP2014502951 A JP 2014502951A JP 2014502951 A JP2014502951 A JP 2014502951A JP 2014514449 A5 JP2014514449 A5 JP 2014514449A5
Authority
JP
Japan
Prior art keywords
conductive
beauty
polymer
target according
tubular target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014502951A
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English (en)
Other versions
JP6328550B2 (ja
JP2014514449A (ja
Filing date
Publication date
Priority claimed from ATGM203/2011U external-priority patent/AT12695U1/de
Application filed filed Critical
Publication of JP2014514449A publication Critical patent/JP2014514449A/ja
Publication of JP2014514449A5 publication Critical patent/JP2014514449A5/ja
Application granted granted Critical
Publication of JP6328550B2 publication Critical patent/JP6328550B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 前記ポリマーが伝熱性及び導電性のいずれか一方又は両方を有することを特徴とする請求項9に記載の管状ターゲット。
JP2014502951A 2011-04-08 2012-04-05 管状ターゲット Active JP6328550B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM203/2011 2011-04-08
ATGM203/2011U AT12695U1 (de) 2011-04-08 2011-04-08 Rohrtarget mit schutzvorrichtung
PCT/AT2012/000094 WO2012135883A1 (de) 2011-04-08 2012-04-05 Rohrtarget mit schutzvorrichtung

Publications (3)

Publication Number Publication Date
JP2014514449A JP2014514449A (ja) 2014-06-19
JP2014514449A5 true JP2014514449A5 (ja) 2015-03-12
JP6328550B2 JP6328550B2 (ja) 2018-05-23

Family

ID=46968455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014502951A Active JP6328550B2 (ja) 2011-04-08 2012-04-05 管状ターゲット

Country Status (8)

Country Link
US (1) US10978279B2 (ja)
EP (1) EP2694697B1 (ja)
JP (1) JP6328550B2 (ja)
KR (1) KR102068366B1 (ja)
CN (2) CN109609917A (ja)
AT (1) AT12695U1 (ja)
TW (1) TWI568870B (ja)
WO (1) WO2012135883A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9992917B2 (en) 2014-03-10 2018-06-05 Vulcan GMS 3-D printing method for producing tungsten-based shielding parts
CN105296944A (zh) * 2015-10-27 2016-02-03 有研亿金新材料有限公司 一种具有抗氧化镀层的靶材组件
TW201911853A (zh) * 2017-08-10 2019-03-16 聚晶半導體股份有限公司 雙攝像頭影像擷取裝置及其攝像方法
CN108517498B (zh) * 2018-04-17 2020-04-21 洛阳科威钨钼有限公司 一种用于磁控溅射的一体式管状钼靶材的制备方法

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* Cited by examiner, † Cited by third party
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US2301559A (en) * 1938-10-21 1942-11-10 Hancock Mfg Company Door latch
US4719035A (en) 1984-01-27 1988-01-12 The United States Of America As Represented By The Secretary Of The Air Force Corrosion inhibitor formulation for molybdenum tungsten and other metals
JPH02301559A (ja) * 1989-05-15 1990-12-13 Kojundo Chem Lab Co Ltd 一体構造型スパッタリングターゲット
JPH0499270A (ja) * 1990-08-11 1992-03-31 Fujitsu Ltd スパッターターゲット及びスパッター成膜方法
JPH0539566A (ja) * 1991-02-19 1993-02-19 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
KR0163981B1 (ko) * 1993-06-29 1999-01-15 사또오 아키오 필름제 액정셀 봉지용 수지조성물
JPH0817763A (ja) * 1994-06-28 1996-01-19 Riyouka Massey Kk スパッタリングターゲット
JP3712553B2 (ja) * 1999-02-19 2005-11-02 忠弘 大見 スパッタリング装置
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
CN1281780C (zh) 2000-09-08 2006-10-25 旭硝子株式会社 圆筒状靶及其制造方法
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
JP2004123874A (ja) * 2002-10-01 2004-04-22 Nippon Steel Chem Co Ltd フィルム形成用樹脂組成物及びフィルム状接着剤
CN1538545A (zh) 2003-04-16 2004-10-20 刘奥宇 可控金属燃料电池
US7688277B2 (en) * 2004-06-04 2010-03-30 Radiall Usa, Inc. Circuit component and circuit component assembly for antenna circuit
US20050279630A1 (en) * 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
DE102005030484B4 (de) 2005-06-28 2007-11-15 Carl Freudenberg Kg Elastischer Vliesstoff, Verfahren zu dessen Herstellung und dessen Verwendung
ATE377098T1 (de) 2005-08-02 2007-11-15 Applied Materials Gmbh & Co Kg Rohrkathode für die verwendung bei einem sputterprozess
AT8697U1 (de) 2005-10-14 2006-11-15 Plansee Se Rohrtarget
WO2007049765A1 (ja) * 2005-10-27 2007-05-03 Mitsubishi Plastics, Inc. 燃料電池用セパレータ、該セパレータを用いた燃料電池及び該セパレータ調製用塗料組成物
CN100511524C (zh) * 2005-12-29 2009-07-08 华晶科技股份有限公司 控制开关连接结构
DE102006003279B4 (de) * 2006-01-23 2010-03-25 W.C. Heraeus Gmbh Sputtertarget mit hochschmelzender Phase
JP2007302981A (ja) * 2006-05-15 2007-11-22 Hitachi Metals Ltd 円筒型Mo合金スパッタリングターゲット材の製造方法
US20080127887A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Vertically mounted rotary cathodes in sputtering system on elevated rails
US20080296352A1 (en) 2007-05-30 2008-12-04 Akihiro Hosokawa Bonding method for cylindrical target
CN101434818A (zh) * 2007-11-15 2009-05-20 郭东明 异氰酸酯改性水性聚合物防水涂料
CN101386719B (zh) * 2008-08-28 2010-12-08 冯守中 多功能涂料及其制备方法
US7785921B1 (en) * 2009-04-13 2010-08-31 Miasole Barrier for doped molybdenum targets
US20110014469A1 (en) * 2009-07-14 2011-01-20 Sakai Chemical Industry Co., Ltd. Magnesium oxide particle, method for producing it, exoergic filler, resin composition, exoergic grease and exoergic coating composition
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JP2012162759A (ja) * 2011-02-04 2012-08-30 Sumitomo Metal Mining Co Ltd 円筒形スパッタリングターゲット

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