JP2014510416A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014510416A5 JP2014510416A5 JP2014501281A JP2014501281A JP2014510416A5 JP 2014510416 A5 JP2014510416 A5 JP 2014510416A5 JP 2014501281 A JP2014501281 A JP 2014501281A JP 2014501281 A JP2014501281 A JP 2014501281A JP 2014510416 A5 JP2014510416 A5 JP 2014510416A5
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- ceramic
- diameter
- high dielectric
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims 42
- 239000002131 composite material Substances 0.000 claims 38
- 239000002245 particle Substances 0.000 claims 35
- 239000000203 mixture Substances 0.000 claims 17
- 229920000642 polymer Polymers 0.000 claims 13
- 238000000034 method Methods 0.000 claims 11
- 239000000843 powder Substances 0.000 claims 9
- 238000009472 formulation Methods 0.000 claims 7
- 239000012530 fluid Substances 0.000 claims 6
- 239000002243 precursor Substances 0.000 claims 6
- 239000002861 polymer material Substances 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 238000011065 in-situ storage Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000002156 mixing Methods 0.000 claims 3
- 239000002904 solvent Substances 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 238000006116 polymerization reaction Methods 0.000 claims 2
- 229920000734 polysilsesquioxane polymer Polymers 0.000 claims 2
- 239000011800 void material Substances 0.000 claims 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- -1 alkylene carbonates Chemical class 0.000 claims 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000003921 oil Substances 0.000 claims 1
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims 1
- 239000012466 permeate Substances 0.000 claims 1
- 239000012704 polymeric precursor Substances 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 150000004756 silanes Chemical class 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161466604P | 2011-03-23 | 2011-03-23 | |
| US61/466,604 | 2011-03-23 | ||
| PCT/US2012/030379 WO2012145122A1 (en) | 2011-03-23 | 2012-03-23 | High dielectric constant composite materials and methods of manufacture |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014510416A JP2014510416A (ja) | 2014-04-24 |
| JP2014510416A5 true JP2014510416A5 (https=) | 2015-05-07 |
| JP6158784B2 JP6158784B2 (ja) | 2017-07-05 |
Family
ID=46877826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014501281A Expired - Fee Related JP6158784B2 (ja) | 2011-03-23 | 2012-03-23 | 高誘電定数複合材料およびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8889776B2 (https=) |
| EP (1) | EP2694454A4 (https=) |
| JP (1) | JP6158784B2 (https=) |
| KR (1) | KR20140019808A (https=) |
| CN (1) | CN103547548A (https=) |
| CA (1) | CA2830269A1 (https=) |
| WO (1) | WO2012145122A1 (https=) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8441965B2 (en) * | 2010-08-05 | 2013-05-14 | Apple Inc. | Methods and apparatus for reducing data transmission overhead |
| CN103547548A (zh) | 2011-03-23 | 2014-01-29 | 密苏里大学学监 | 高介电常数复合材料和制造方法 |
| US8912460B2 (en) * | 2011-05-23 | 2014-12-16 | The Curators Of The University Of Missouri | Dielectric loaded fluids for high voltage switching |
| CA2843415C (en) | 2011-07-29 | 2019-12-31 | University Of Saskatchewan | Polymer-based resonator antennas |
| JP5970288B2 (ja) * | 2012-08-09 | 2016-08-17 | 株式会社豊田中央研究所 | 酸化物誘電体材料／ポリマー複合膜の製造方法 |
| WO2014117259A1 (en) | 2013-01-31 | 2014-08-07 | Tayfeh Aligodarz Mohammadreza | Meta-material resonator antennas |
| DE102013104621A1 (de) * | 2013-05-06 | 2014-11-06 | Epcos Ag | Elektronisches Bauelement und Verfahren zu dessen Passivierung |
| WO2015000057A1 (en) * | 2013-07-03 | 2015-01-08 | University Of Saskatchewan | Composite materials for dielectric-based microwave applications |
| US10784583B2 (en) | 2013-12-20 | 2020-09-22 | University Of Saskatchewan | Dielectric resonator antenna arrays |
| US9224412B2 (en) * | 2014-01-31 | 2015-12-29 | HGST Netherlands B.V. | Perpendicular magnetic recording disk with template layer formed of a blend of nanoparticles |
| WO2016089387A1 (en) * | 2014-12-03 | 2016-06-09 | Halliburton Energy Services, Inc. | Smart fracturing fluid |
| WO2016157954A1 (ja) * | 2015-03-27 | 2016-10-06 | 株式会社村田製作所 | 誘電体材料の製造方法 |
| CA2982556C (en) * | 2015-05-14 | 2021-03-02 | Paul F. Rodney | Downhole fluids with high dielectric constant and high dielectric strength |
| MY189875A (en) * | 2015-05-14 | 2022-03-16 | Halliburton Energy Services Inc | Downhole fluids with a particular impedance |
| CN104985896B (zh) * | 2015-06-26 | 2017-03-08 | 广东工业大学 | 高介电常数的陶瓷‑聚合物复合材料及其制备方法 |
| US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US10355361B2 (en) | 2015-10-28 | 2019-07-16 | Rogers Corporation | Dielectric resonator antenna and method of making the same |
| US10601137B2 (en) | 2015-10-28 | 2020-03-24 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US10374315B2 (en) | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| CN105529121B (zh) * | 2015-12-02 | 2017-03-22 | 泰州钰明新材料有限公司 | 柔性复合绝缘材料生产工艺流程 |
| US11431100B2 (en) * | 2016-03-25 | 2022-08-30 | Commscope Technologies Llc | Antennas having lenses formed of lightweight dielectric materials and related dielectric materials |
| US11283186B2 (en) * | 2016-03-25 | 2022-03-22 | Commscope Technologies Llc | Antennas having lenses formed of lightweight dielectric materials and related dielectric materials |
| US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
| US11876295B2 (en) | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
| GB2575946B (en) | 2017-06-07 | 2022-12-14 | Rogers Corp | Dielectric resonator antenna system |
| WO2019055134A1 (en) | 2017-09-15 | 2019-03-21 | Commscope Technologies Llc | METHODS FOR PREPARING COMPOSITE DIELECTRIC MATERIAL |
| EP3462507A1 (en) * | 2017-09-29 | 2019-04-03 | Koninklijke Philips N.V. | Actuator member and method for forming the same |
| KR102469185B1 (ko) * | 2017-10-27 | 2022-11-18 | 삼성전자주식회사 | 세라믹 전자 부품 및 그 제조 방법과 전자장치 |
| US10892544B2 (en) | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US10910722B2 (en) | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11198263B2 (en) | 2018-03-22 | 2021-12-14 | Rogers Corporation | Melt processable thermoplastic composite comprising a multimodal dielectric filler |
| CN108546415A (zh) * | 2018-04-03 | 2018-09-18 | 西南科技大学 | 一种高储能密度聚合物复合电介质材料的制备方法 |
| US12163005B2 (en) * | 2018-04-27 | 2024-12-10 | The Hong Kong Polytechnic University | Multilayer and flexible capacitors with metal-ion doped TIO2 colossal permittivity material/polymer composites |
| US11844881B2 (en) | 2018-05-17 | 2023-12-19 | The Curators Of The University Of Missouri | Composite material with high dielectric constant and use in biocompatible devices |
| US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
| CN109233263A (zh) * | 2018-10-15 | 2019-01-18 | 上海安费诺永亿通讯电子有限公司 | 陶瓷树脂复合材料及制备方法及提纯陶瓷粉体的方法 |
| US11031697B2 (en) | 2018-11-29 | 2021-06-08 | Rogers Corporation | Electromagnetic device |
| US11637377B2 (en) | 2018-12-04 | 2023-04-25 | Rogers Corporation | Dielectric electromagnetic structure and method of making the same |
| CN113645917A (zh) * | 2019-03-29 | 2021-11-12 | 康曼德公司 | 高介电常数电外科电极涂层 |
| US11404976B2 (en) * | 2019-09-06 | 2022-08-02 | Wisconsin Alumni Research Foundation | Dielectric nano-fluid for electrostatic machines and actuators |
| WO2021060764A1 (ko) * | 2019-09-23 | 2021-04-01 | 주식회사 아모그린텍 | Rf 방열플라스틱 및 이를 포함하여 구현된 중계기 함체 |
| CN114787101B (zh) * | 2019-12-13 | 2024-04-09 | 奥卢大学 | 电陶瓷复合材料及其制造方法 |
| KR102908320B1 (ko) | 2019-12-18 | 2026-01-05 | 삼성전기주식회사 | 유전체 자기 조성물의 제조 방법 및 이로부터 제조된 유전체 자기 조성물 |
| CN111342184A (zh) * | 2020-02-24 | 2020-06-26 | 西安交通大学 | 一种可调的柔性微波器件及其制备方法 |
| US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
| EP3926841A1 (en) | 2020-06-15 | 2021-12-22 | Nokia Technologies Oy | Tuning radio frequency elements |
| CN114070235A (zh) | 2020-08-06 | 2022-02-18 | 联华电子股份有限公司 | 半导体模块及其制造方法 |
| FI129896B (en) * | 2021-09-01 | 2022-10-31 | Oulun Yliopisto | Impregnation of ceramic composite material |
| JP2023087747A (ja) * | 2021-12-14 | 2023-06-26 | 国立研究開発法人物質・材料研究機構 | キャパシタ型蓄電デバイス |
| DE202021106863U1 (de) | 2021-12-16 | 2022-03-10 | Maheswar Panda | Ein System zur Entwicklung verbesserter ferroelektrischer Polymer-Dielektrika aus PVDF-Metall/PVDF-Keramik-Kompositen/Nanokompositen |
| CN115206683B (zh) * | 2022-07-27 | 2024-02-13 | 北京八度阳光科技有限公司 | 一种电子线路板用电容复合隔膜制作方法 |
| CN117521421B (zh) * | 2024-01-04 | 2024-04-23 | 广东大湾区空天信息研究院 | 介电复合材料设计方法、装置、设备、计算系统及介质 |
| CN121410308B (zh) * | 2025-12-30 | 2026-03-20 | 安盈半导体技术(常州)有限公司 | 一种阻抗自适应高频探针、探针卡及测试方法 |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388198A (en) * | 1977-01-13 | 1978-08-03 | Toshiba Corp | Complex dielectric for capacitor |
| US5320910A (en) * | 1991-12-09 | 1994-06-14 | Ngk Spark Plug Co., Ltd. | Piezoelectric composite material |
| JPH0660719A (ja) * | 1992-08-04 | 1994-03-04 | Murata Mfg Co Ltd | 複合誘電体 |
| EP0722920B9 (en) * | 1994-08-09 | 2002-06-12 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Composite material and production method therefor |
| US5702629A (en) | 1996-03-21 | 1997-12-30 | Alliedsignal Inc. | Piezeoelectric ceramic-polymer composites |
| US6268054B1 (en) * | 1997-02-18 | 2001-07-31 | Cabot Corporation | Dispersible, metal oxide-coated, barium titanate materials |
| US6891138B2 (en) | 1997-04-04 | 2005-05-10 | Robert C. Dalton | Electromagnetic susceptors with coatings for artificial dielectric systems and devices |
| US6265058B1 (en) | 1998-03-11 | 2001-07-24 | Tpl, Inc. | Polymer/paper capacitor film |
| US20020062924A1 (en) | 1998-05-04 | 2002-05-30 | Hartman William F. | Definable integrated passives for circuitry |
| US6608760B2 (en) | 1998-05-04 | 2003-08-19 | Tpl, Inc. | Dielectric material including particulate filler |
| US20040109298A1 (en) * | 1998-05-04 | 2004-06-10 | Hartman William F. | Dielectric material including particulate filler |
| US6616794B2 (en) | 1998-05-04 | 2003-09-09 | Tpl, Inc. | Integral capacitance for printed circuit board using dielectric nanopowders |
| WO2001089827A1 (en) | 2000-05-18 | 2001-11-29 | Georgia Tech Research Corporation | High dielectric constant nano-structure polymer-ceramic composite |
| AU2001268428A1 (en) | 2000-06-16 | 2002-01-02 | Paratek Microwave, Inc. | Electronically tunable dielectric composite thick films |
| US6864306B2 (en) | 2001-04-30 | 2005-03-08 | Georgia Tech Research Corporation | High dielectric polymer composites and methods of preparation thereof |
| US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
| US6600645B1 (en) | 2002-09-27 | 2003-07-29 | Ut-Battelle, Llc | Dielectric composite materials and method for preparing |
| KR100455890B1 (ko) * | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
| JP4334247B2 (ja) * | 2003-03-07 | 2009-09-30 | ビットワレット株式会社 | 携帯端末装置および電子マネーサーバ |
| JP3680854B2 (ja) * | 2003-04-04 | 2005-08-10 | 東レ株式会社 | ペースト組成物およびこれを用いた誘電体組成物 |
| EP1612810A4 (en) * | 2003-04-04 | 2009-12-16 | Toray Industries | PULP COMPOSITION AND DIELECTRIC COMPOSITION CONTAINING SAME |
| TW200427809A (en) * | 2003-05-19 | 2004-12-16 | Hitachi Chemical Co Ltd | Insulating material, film, circuit board and method for manufacture thereof |
| EP1630834A1 (en) | 2003-05-30 | 2006-03-01 | Sanyo Electric Co., Ltd. | Electric double layer capacitor and electrolytic cell |
| KR20050019214A (ko) * | 2003-08-18 | 2005-03-03 | 한국과학기술원 | 내장형 커패시터용 폴리머/세라믹 복합 페이스트 및 이를이용한 커패시터 제조방법 |
| JP4491214B2 (ja) * | 2003-09-29 | 2010-06-30 | 富士通株式会社 | キャパシタ素子 |
| US20060074164A1 (en) | 2003-12-19 | 2006-04-06 | Tpl, Inc. | Structured composite dielectrics |
| US20060074166A1 (en) | 2003-12-19 | 2006-04-06 | Tpl, Inc. Title And Interest In An Application | Moldable high dielectric constant nano-composites |
| JP2006019621A (ja) * | 2004-07-05 | 2006-01-19 | Rikogaku Shinkokai | キャパシタ用ポリマーセラミックコンポジット材料、多層配線板及びモジュール基板 |
| US20060083694A1 (en) | 2004-08-07 | 2006-04-20 | Cabot Corporation | Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same |
| US7400490B2 (en) * | 2005-01-25 | 2008-07-15 | Naturalnano Research, Inc. | Ultracapacitors comprised of mineral microtubules |
| US7579397B2 (en) * | 2005-01-27 | 2009-08-25 | Rensselaer Polytechnic Institute | Nanostructured dielectric composite materials |
| KR100576882B1 (ko) | 2005-02-15 | 2006-05-10 | 삼성전기주식회사 | Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체 |
| US20060258327A1 (en) | 2005-05-11 | 2006-11-16 | Baik-Woo Lee | Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials |
| CN1269903C (zh) * | 2005-05-27 | 2006-08-16 | 东南大学 | 纳米钛酸钡/聚氨酯弹性体复合材料的合成方法 |
| CN1908063A (zh) * | 2005-08-01 | 2007-02-07 | 财团法人工业技术研究院 | 具挠曲性、高耐热性的高介电有机/无机混成材料组成物及其硬化物 |
| CN100338140C (zh) * | 2005-10-24 | 2007-09-19 | 浙江大学 | 一种高介电常数聚酰亚胺/陶瓷复合膜及制备方法 |
| CN101375644A (zh) | 2005-11-14 | 2009-02-25 | 劳伦斯利弗莫尔国家安全有限公司 | 铸造的电介质复合材料线性加速器 |
| US20070145453A1 (en) * | 2005-12-23 | 2007-06-28 | Xerox Corporation | Dielectric layer for electronic devices |
| TWI412506B (zh) * | 2006-05-12 | 2013-10-21 | 電氣化學工業股份有限公司 | 陶瓷粉末及其用途 |
| KR100846998B1 (ko) * | 2006-09-19 | 2008-07-17 | 한국화학연구원 | 결정성 바륨티타네이트 나노입자를 함유한 고 유전율의무/유기 하이브리드 막의 제조방법 |
| US20080165472A1 (en) | 2006-12-19 | 2008-07-10 | Liang-Chy Chien | High dielectric composites as capacitive materials |
| US8747637B2 (en) * | 2007-07-09 | 2014-06-10 | Shantanu Bhattacharya | Agarose nano-platinum composite |
| US20090043398A1 (en) * | 2007-08-09 | 2009-02-12 | Zimmer, Inc. | Method of producing gradient articles by centrifugation molding or casting |
| JP5401805B2 (ja) * | 2008-02-29 | 2014-01-29 | 富士通株式会社 | 成膜方法 |
| US7989270B2 (en) * | 2009-03-13 | 2011-08-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors |
| US7911029B2 (en) * | 2009-07-11 | 2011-03-22 | Ji Cui | Multilayer electronic devices for imbedded capacitor |
| US8263515B2 (en) | 2009-08-29 | 2012-09-11 | Fatih Dogan | Nanostructured dielectric materials for high energy density multi layer ceramic capacitors |
| CN103547548A (zh) | 2011-03-23 | 2014-01-29 | 密苏里大学学监 | 高介电常数复合材料和制造方法 |
-
2012
- 2012-03-23 CN CN201280024626.5A patent/CN103547548A/zh active Pending
- 2012-03-23 WO PCT/US2012/030379 patent/WO2012145122A1/en not_active Ceased
- 2012-03-23 EP EP12774897.8A patent/EP2694454A4/en not_active Withdrawn
- 2012-03-23 CA CA2830269A patent/CA2830269A1/en not_active Abandoned
- 2012-03-23 US US13/428,950 patent/US8889776B2/en active Active
- 2012-03-23 KR KR1020137027770A patent/KR20140019808A/ko not_active Ceased
- 2012-03-23 JP JP2014501281A patent/JP6158784B2/ja not_active Expired - Fee Related
-
2014
- 2014-10-20 US US14/518,503 patent/US9556321B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014510416A5 (https=) | ||
| JP6158784B2 (ja) | 高誘電定数複合材料およびその製造方法 | |
| CN101518744B (zh) | 蜂窝结构体用密封材料、蜂窝结构体及其制造方法 | |
| CN106242507B (zh) | 一种直接成型3d陶瓷打印用粘土泥料及其制备方法和应用 | |
| CN108028138B (zh) | 正极前体 | |
| RU2017144428A (ru) | Способ изготовления пористых тел с улучшенными свойствами | |
| CN111225795B (zh) | 一种制造填充有颗粒的纤维预制件的方法 | |
| US10450914B2 (en) | Manufacturing method of plugged honeycomb structure | |
| JP2019043804A (ja) | 熱伝導性フィラー、熱伝導性複合材料、及び熱伝導性フィラーの製造方法 | |
| WO2017157747A1 (de) | Keramische suspension | |
| JP2015522093A5 (https=) | ||
| JP2020045457A (ja) | 熱伝導性複合材料及びその製造方法 | |
| CN103241989A (zh) | 压电复合材料的制法及压电发电装置 | |
| WO2016159063A1 (ja) | ハニカム構造体の製造方法、及び接合材 | |
| WO2000016937A1 (en) | Alloy powder, alloy sintered compact and method for their production | |
| JPWO2018074373A1 (ja) | 立体造形用組成物および立体造形物の製造方法並びに立体造形物 | |
| US9610606B2 (en) | Method for applying sealing material paste to peripheral surface of ceramic block | |
| JP6901720B2 (ja) | 積層造形用粒子、成形体、及び、成形体の製造方法 | |
| KR20170078760A (ko) | 고밀도 탄소 전극들을 위한 고밀도 탄소 물질 | |
| JPH0967112A (ja) | 固体活性炭及びその製造方法 | |
| CN105601219B (zh) | 古建筑材料及其制备方法 | |
| CN103286848B (zh) | 用于制备复合透水砖的设备 | |
| Mezdar et al. | Direct Ink writing of dense and complex shaped doped-BaTiO3 ceramics for acoustic transducer applications | |
| CN101533710A (zh) | 超高功率多层复合膜电容器的制备方法 | |
| CN120736903B (zh) | 一种基于增材制造技术制备的陶瓷复杂构件生坯增密方法 |